RU137444U1 - COMPUTER LIQUID COOLING SYSTEM - Google Patents

Abstract

A computer liquid cooling system comprising a radiator connected by means of tubes to form a closed loop, heat-removing elements and a container with at least one pump located in it, characterized in that the container is made in the form of a sealed tank with at least one installed in it one power supply unit, in the tank there are holes for supplying and discharging liquid refrigerant, in which connecting tubes are fixed, an opening for discharging liquid refrigerant is connected by means of a tube to each pump, and the hole for supplying liquid refrigerant is connected to one end of an additionally introduced distribution pipe, the other end of which is intended for supplying liquid refrigerant directly to each power supply, while a filling hole is made in the upper wall of the container and a device is installed to maintain atmospheric pressure, facing protrusions are made into the container, and on the inner surface of each heat-removing element.

Description

The utility model relates to cooling systems of electronic equipment and can be used in the construction of liquid cooling systems of compact supercomputers.

The closest set of essential features to the claimed utility model is a computer heat sink system (RF patent No. 22218591 priority of 03.24.2000 “Computer heat sink system” by DONG Guangzhi (CN), IPC ⁷ G06F 1/20, H05K 7/20, F25D 1 / 02 publ. December 10, 2003 BI No. 34), which includes the fluid circulation system and the radiator system of the power supply, which are installed inside the computer case. In this system, several heat absorption devices are used, connected together in parallel or in series by tubes. Thus, a closed tight circuit is formed, along which the fluid is circulated. These devices are mounted inside the computer case by gluing to the surface of heat-generating elements inside the computer with the formation of a fluid circulation system. There are two flat containers at the top of the computer case. The heat-conducting radiator tube and the radiator panel are inserted into one container, and the power supply radiator system and the radiator panel of the power supply are inserted into the other container. On the bottom, at the bottom of the computer case with the use of a shock absorber, a pump is fixed that ensures the circulation of liquid. The radiator panel is installed on the outside of the computer case wall. The power supply radiator system is characterized by the presence of a high power transistor of the computer power supply, which is in surface contact with the radiator panel through a heat-conducting device.

The disadvantages of this device are:

- the ability to cool a small number of elements that need effective cooling (processor, video card, power supply);

- use of a passive cooling circuit. This radiator does not provide for the installation of fans, which means that the radiated heat will be removed from the radiator less efficiently. The use of passive cooling will not be able to provide optimal temperature conditions for processors to operate in Turbo Boost mode;

- with an increase in the number of elements from which heat is required to be removed, a significant increase in the area of the radiator will be required, which imposes physical restrictions on this device and limits the scope to only home computers;

- the cooling mechanism of the power supply is tied to the specific design of the power supply (dimensions and location of power transistors) and does not imply cooling of all the elements of the power supply, but only power transistors;

- the pressure stabilization system has extra joints, which reduces reliability;

- there is no mechanism for monitoring the fluid flow in the system;

- The pump shock absorber system takes up extra space.

The technical results to which the claimed utility model is aimed are to increase the cooling efficiency of the computer’s fuel elements and the reliability of the liquid cooling system (SJO) without increasing the overall dimensions of the computer and significantly reducing the noise level generated by the computer.

These technical results are achieved by the fact that in a liquid cooling system of a computer containing a radiator connected by means of tubes to form a closed loop, heat-removing elements and a container with at least one pump located in it, the new one is that the container is made in the form of a sealed tank with at least one power supply installed in it, openings for supplying and discharging liquid refrigerant are made in the tank, in which connecting tubes are fixed, an opening for discharging and a liquid refrigerant is connected via a tube to each pump, and an opening for supplying a liquid refrigerant is connected to one end of an additionally introduced distribution pipe, the other end of which is used to supply liquid refrigerant directly to each power supply, while a filling hole is made in the upper wall of the container and fixed a device for maintaining atmospheric pressure, facing the inside of the container, and on the inner surface of each heat-removing element is made projections.

The proposed cooling system is based on the use of power supplies with their complete immersion in a dielectric fluid and the use of this fluid for cooling processor elements according to the traditional liquid cooling scheme for computers. The use of an active cooling scheme significantly affects the increase in cooling efficiency and allows the use of this LSS for more powerful computers (for example, compact supercomputers) with a large number of elements requiring effective cooling. The combination of the cooling system of the power supplies and the pump system in one container, which acts as an expansion tank, allows to achieve a significant increase in the efficiency and reliability of the operation of the SJO system without increasing the overall dimensions of the computer.

The supply of liquid refrigerant in the first place and directly to each power supply unit through an additional distribution pipe allows you to increase the cooling efficiency and reliability of the coolant. Also, the use of devices to maintain atmospheric pressure increases the service life and increases the reliability of the coolant.

The absence of fans in the power supplies, which, when operating at a high frequency of rotation speed, creates noise that reaches 55 dB and their complete immersion in dielectric fluid, will allow significant noise reduction in combination with efficient cooling of thermally loaded power supply elements, which will ensure stability and increase resource life of power supplies. The leakage of dielectric fluid does not cause any damage to the electronics, which also increases the reliability of the coolant.

To increase the surface of heat transfer from the heat-generating elements of the computer, protrusions are made on the inner surface of each heat-removing element.

Figure 1 shows a block diagram of the path of the SJO compact supercomputer. Figure 2 shows the structural arrangement of the components of the container of the liquid cooling system of the computer.

The liquid cooling system (figure 1) contains a radiator 1. heat-removing elements 2, a container 3 and connecting tubes 4.

Radiator 1, heat-removing elements 2 and container 3 are interconnected in series by means of tubes 4. Thus, a single closed tight circuit of the coolant circuit is formed in which liquid refrigerant circulates.

Heat-removing elements 2 are installed on processors and are attached to motherboards 5.

On the inner surface of each heat-removing element 2, protrusions are made, which can be made in the form of a pin field or fins for more efficient removal of radiated heat.

The container 3 (FIG. 2) is made in the form of a sealed reservoir in which power units 6, 7, pumps 8, 9, a device 10 for maintaining atmospheric pressure, a distribution pipe 11 for supplying liquid refrigerant directly to each power unit are placed, and an opening 12 is made for supplying liquid refrigerant and an opening 13 for discharging liquid refrigerant.

Two openings 14, 15 are made in the upper wall of the container, in one 14 of which a device 10 for maintaining atmospheric pressure is fixed, and the second 15 is for pouring liquid refrigerant and is closed by a lid 16.

One end of the distribution pipe 11 is connected to an opening 12 for supplying liquid refrigerant, and the other is intended for supplying liquid refrigerant directly to each power supply unit 6, 7. A hole 13 for discharging liquid refrigerant is connected via tubes to the pumps 8, 9.

In the holes for the inlet 12 and the outlet 13 of the liquid refrigerant are fixed connecting tubes (not shown in figure 2).

Pumps 8, 9 located inside the container, provide a flow of fluid into the liquid cooling liquid.

The device 10 for maintaining atmospheric pressure is designed to maintain the pressure in the tank 3 caused by the thermal expansion of the liquid and can be made in the form of a corrugated glass (RF patent No. 113626 priority from 08/11/2011 "Expansion tank of the liquid cooling system" by V. Stryukov, Logvina Yu.V. et al., IPC9 H05K 7/20, F01P 9/00 published. 02.20.2012 BI No. 5).

To build the contour of the computer’s LLS, standard materials are used:

- hoses, fittings, fittings, angular adapters, tubes;

- as a container can be applied a sealed tank;

- dielectric fluid is used as a refrigerant;

- heat-removing elements are water blocks with fins;

- submersible pumps or pumps. The liquid cooling system of the computer operates as follows.

Pre-fill the cooling system with liquid refrigerant through the filling hole 15 (figure 2). After that, the filling hole 15 is closed hermetically by a lid 16.

The liquid cooling system starts to work simultaneously with turning on the computer. The liquid refrigerant is pumped by pumps 8 and 9 and through the hole 13 is supplied to the circuit of the coolant to the heat-removing elements 2 (figure 1). The heat from the processors through heat-removing elements 2 is transferred to the circulating liquid refrigerant, which is cooled in the radiator 1. Next, the cooled liquid refrigerant enters through the opening 12 (figure 2) of the container into the distribution pipe 11 and flows around the power supply units 6, 7, cooling them. Then again, by means of pumps 8, 9, through the opening 13 of the container, the liquid refrigerant is returned to the circuit.

Claims (1)

A computer liquid cooling system comprising a radiator connected by means of tubes to form a closed loop, heat-removing elements and a container with at least one pump located in it, characterized in that the container is made in the form of a sealed tank with at least one installed in it one power supply unit, in the tank there are holes for supplying and discharging liquid refrigerant, in which connecting tubes are fixed, an opening for discharging liquid refrigerant is connected by means of a tube to each pump, and the hole for supplying liquid refrigerant is connected to one end of an additionally introduced distribution pipe, the other end of which is intended for supplying liquid refrigerant directly to each power supply, while a filling hole is made in the upper wall of the container and a device is installed to maintain atmospheric pressure, facing protrusions are made into the container, and on the inner surface of each heat-removing element.

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