CN114302038A - Camera structure and electronic equipment - Google Patents
Camera structure and electronic equipment Download PDFInfo
- Publication number
- CN114302038A CN114302038A CN202111594103.1A CN202111594103A CN114302038A CN 114302038 A CN114302038 A CN 114302038A CN 202111594103 A CN202111594103 A CN 202111594103A CN 114302038 A CN114302038 A CN 114302038A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- dissipation fins
- region
- heat
- inner cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 103
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000012782 phase change material Substances 0.000 claims abstract description 29
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 11
- 230000008859 change Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
Images
Landscapes
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The application discloses camera structure and electronic equipment, camera structure includes: a cradle head housing; the camera body is arranged on the holder shell and provided with a substrate; the first heat dissipation piece comprises a first body and a plurality of first heat dissipation fins arranged on the first body, the first body is provided with a first inner cavity, a phase change material is arranged in the first inner cavity, and the first body is arranged on the substrate. In the embodiment of the application, the first heat dissipation part is arranged on the substrate of the camera body, the first body of the first heat dissipation part is arranged on the substrate, the plurality of first heat dissipation fins are arranged on the first body, the first body is provided with the first inner cavity, and the heat dissipation effect of the camera body can be improved through the phase change material in the first inner cavity and the first heat dissipation fins.
Description
Technical Field
The application belongs to the technical field of electronics, concretely relates to camera structure and electronic equipment.
Background
In the related art, a camera on the electronic equipment needs to be provided with the tripod head anti-shaking device, the camera is arranged in the tripod head anti-shaking device, and the camera is driven to move by the tripod head anti-shaking device during working. The camera is installed and is led to the radiating effect variation of camera in the cloud platform anti-shake device, and the heat is difficult to effluvium, has seriously influenced the normal work of camera.
Disclosure of Invention
The application aims at providing a camera structure and electronic equipment, can improve the heat-sinking capability of camera body.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a camera structure, the camera structure includes:
a cradle head housing;
the camera body is arranged on the holder shell and provided with a substrate;
the first heat dissipation piece comprises a first body and a plurality of first heat dissipation fins arranged on the first body, the first body is provided with a first inner cavity, a phase change material is arranged in the first inner cavity, and the first body is arranged on the substrate.
In a second aspect, an embodiment of the present application provides an electronic apparatus, which includes the camera structure according to the first aspect.
In the embodiment of the application, the first heat dissipation part is arranged on the substrate of the camera body, the first body of the first heat dissipation part is arranged on the substrate, the plurality of first heat dissipation fins are arranged on the first body, the first body is provided with the first inner cavity, and the heat dissipation effect of the camera body can be improved through the phase change material in the first inner cavity and the first heat dissipation fins.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is one of schematic structural diagrams of a camera structure according to an embodiment of the present application;
fig. 2 is a second schematic structural diagram of a camera structure according to an embodiment of the present application;
fig. 3 is a third schematic structural diagram of a camera structure according to an embodiment of the present application;
fig. 4 is a fourth schematic structural diagram of a camera structure according to an embodiment of the present application.
Reference numerals:
1. a cradle head housing; 11. a tripod head power assembly; 2. a camera body; 21. a substrate; 22. a flexible circuit board; 31. a first body; 310. a first lumen; 32. a first heat dissipation fin; 320. a second lumen; 41. a second body; 410. a fourth lumen; 42. a second heat dissipation fin; 420. a third lumen; 5. a thermally conductive layer.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
The following describes a camera structure and an electronic device according to an embodiment of the present application with reference to fig. 1 to 4.
As shown in fig. 1-2, a camera structure according to some embodiments of the present application includes:
a tripod head housing 1.
The heat sink comprises a first heat dissipation member, wherein the first heat dissipation member comprises a first body 31 and a plurality of first heat dissipation fins 32 arranged on the first body 31, the first body 31 is provided with a first inner cavity 310, a phase change material is arranged in the first inner cavity 310, and the first body 31 is arranged on the substrate 21.
In this embodiment, a first heat sink is disposed on the substrate 21 of the camera body 2, the first body 31 of the first heat sink is disposed on the substrate 21, a plurality of first heat dissipation fins 32 are disposed on the first body 31, the first body 31 has a first inner cavity 310, and the heat dissipation effect of the camera body can be improved by the phase change material in the first inner cavity 310 and the first heat dissipation fins 32.
Phase Change Material (PCM) refers to a substance that changes its state and provides latent heat at a constant temperature. The process of transforming physical properties is called a phase change process, in which a phase change material absorbs or releases a large amount of latent heat.
In the process of the operation of the camera body 2, the camera body 2 is driven by the holder power assembly 11, so that the camera body 2 can be moved to different positions. In order to meet the moving requirement of the camera body 2, a space is arranged between the camera body 2 and the holder shell 1. For example, the base plate 21 has a space from the head housing 1. First heat dissipation member sets up on base plate 21, makes first heat dissipation member be in high spaced space, need not increase the inside space volume of cloud platform casing 1, avoids increasing the volume that the cloud platform occupy.
The camera body 2 operates to generate heat, which is transferred to the first heat sink through the substrate 21. The phase change material in the first internal cavity 310 can absorb heat to reduce heat accumulation in the camera body 2 itself. The heat absorbed by the phase-change material can be dissipated through the first body 31 and the first heat dissipation fins 32, so that the heat accumulation of the substrate 21 is avoided, and the heat dissipation effect of the substrate 21 is improved.
For example, the substrate 21 is heated during the operation of the camera body 2. The temperature of the substrate 21 increases to increase the temperature of the first body 31, thereby activating the phase change material in the first inner cavity 310 to absorb heat. The first body 31 and the first heat dissipation fins 32 can dissipate heat to the outside, and when the temperature of the substrate 21 is lowered, the phase change material is activated to release heat. This can effectively prevent the substrate 21 from being excessively heated, and improve the heat dissipation effect. The substrate 21 is electrically connected to an external device through the flexible wiring board 22.
In one embodiment, the phase change material is a solid-liquid phase change material. Liquefies when the phase change material absorbs heat and solidifies when the phase change material releases heat.
For example, the phase change material is an inorganic crystalline hydrated salt, an organic paraffin, a fatty acid, or the like.
In one embodiment, the first body 31 is plate-shaped.
In this embodiment, the plate-shaped first body 31 can be attached to the substrate 21 to have a larger contact area, so that the heat of the substrate 21 can be more easily conducted to the first body 31, and the phase change material in the first inner cavity 310 can more easily function.
For example, the heat conductive layer 5 is provided between the substrate 21 and the first heat sink, and the heat conductive layer 5 can improve the heat conduction efficiency between the substrate 21 and the first heat sink.
For example, the heat conductive layer 5 is provided between the first body 31 and the substrate 21. The heat conduction layer 5 may be a heat conduction glue or solder paste, and the first body 31 is adhered to the substrate 21 by the heat conduction glue or solder.
In one embodiment, the first heat dissipating fin 32 has a second internal cavity 320, the first internal cavity 310 is in communication with the second internal cavity 320, and the phase change material is disposed in the first internal cavity 310 and the second internal cavity 320.
In this embodiment, the phase change material is disposed in both the first body 31 and the first heat dissipation fins 32, so that the amount of the phase change material in the first heat dissipation member is increased, and thus more heat can be applied to the first heat dissipation member, thereby improving the heat dissipation effect.
In addition, the phase change material within the first heat dissipating fins 32 enables heat to be concentrated within the first heat dissipating fins 32, thereby enabling heat to be conducted to the first heat dissipating fins 32, increasing the heat dissipating effectiveness of the first heat dissipating fins 32.
In one embodiment, as shown in fig. 1 to 4, a plurality of the first heat dissipation fins 32 are sequentially arranged on the surface of the first body 31, and the surface of the first body 31 has a first region and a second region, and the second region is located on the peripheral side of the first region.
Among the plurality of first heat dissipation fins 32, a portion is located in a first region, and another portion is located in a second region, and in a direction perpendicular to the surface of the first body 31, the size of the first heat dissipation fins 32 located in the first region is larger than the size of the first heat dissipation fins 32 located in the second region.
In this embodiment, the first region is located at a central region of the first body 31, and the second region is located at a peripheral side region of the first region. The first heat dissipation fins 32 in the middle area are smaller in size, so that the first heat dissipation fins 32 can be prevented from being in collision contact with the holder shell 1 in the rotating process of the camera body 2, and the problem of component damage is avoided.
In one embodiment, a plurality of the first heat dissipation fins 32 decreases in size in a direction perpendicular to the surface of the first body 31 in a direction from the first region to the second region.
In this embodiment, there is a decreasing change in size from the first heat dissipation fins 32 located in the central region to the first heat dissipation fins 32 located on the peripheral sides. This causes the ends of the plurality of first heat dissipation fins 32 remote from the first body 31 to collectively exhibit an arc change.
In the process of the camera body 2 rotating, as shown in fig. 1 and 2, the first heat dissipation fin 32 can be effectively prevented from colliding with the pan/tilt head housing 1.
In one embodiment, as shown in fig. 3 and 4, a plurality of second heat dissipation fins 42 are arranged on the pan/tilt head housing 1, the plurality of second heat dissipation fins 42 and the plurality of first heat dissipation fins 32 are arranged in a staggered manner, a third inner cavity 420 is arranged in the second heat dissipation fins 42, and a phase change material is arranged in the third inner cavity 420.
In this embodiment, when the first heat sink absorbs the heat of the substrate 21, the heat radiated through the first heat sink can be radiated onto the second heat radiation fins 42. The second heat dissipation fin 42 is located on the holder housing 1, and heat of the second heat dissipation fin 42 can be dissipated to the outside through the holder housing 1, so that the heat dissipation effect is improved.
The second heat dissipation fins 42 are arranged in a staggered manner with the first heat dissipation fins 32, so that the spacing distance between the first heat dissipation member and the second heat dissipation member is reduced, the efficiency of transferring heat from the first heat dissipation member to the second heat dissipation member is improved, and the heat dissipation effect is improved.
Each second heat dissipation fin 42 and the first heat dissipation fin 32 are arranged in a staggered manner with an interval, and when the camera body 2 rotates, the first heat dissipation fins 32 swing in the interval, so that the second heat dissipation fins 42 are prevented from affecting the rotation of the camera body 2.
In one embodiment, the cradle head housing 1 is further provided with a second body 41, and a plurality of second heat dissipation fins 42 are provided on the second body 41. The second body 41 and the plurality of second heat dissipation fins 42 constitute a second heat dissipation member to which heat of the first heat dissipation member can be dissipated.
A fourth inner cavity 410 is formed in the second body 41, the fourth inner cavity 410 is communicated with the third inner cavity 420, and a phase change material is disposed in the fourth inner cavity 410.
In this embodiment, the second body 41 increases the amount of the phase change material in the second heat dissipation member, thereby improving the heat absorption and conversion capability of the second heat dissipation member and improving the heat dissipation effect.
In one embodiment, as shown in fig. 3 and 4, a portion of the second heat dissipation fins 42 is disposed opposite to the first region, and another portion of the second heat dissipation fins 42 is disposed opposite to the second region, and the size of the second heat dissipation fins 42 disposed opposite to the first region is larger than the size of the second heat dissipation fins 42 disposed opposite to the second region in a direction perpendicular to the surface on which the second heat dissipation fins 42 are disposed.
In this embodiment, of the plurality of second heat dissipation fins 42, the portion of the second heat dissipation fins 42 located in the middle region, which is located opposite to the first region, is larger in size in the direction perpendicular to the surface on which the second heat dissipation fins are located. The second heat dissipation fins 42 of the portion located at the peripheral side region, which is disposed opposite to the second region, are smaller in size.
The plurality of second heat dissipation fins 42 have a distribution structure with a high middle part and two low sides, and the middle area is closer to the first heat dissipation member, so that the heat transfer effect is higher. The size of the peripheral side area is smaller, blocking of the first radiating piece is avoided, and the first radiating piece cannot be influenced to rotate along with the camera body 2.
In one embodiment, the dimension of the plurality of second heat dissipation fins 42 in a direction perpendicular to the surface on which the second heat dissipation fins 42 are located decreases in a direction from the first region to the second region.
In this embodiment, the size decreases from the second heat dissipation fins 42 located in the central region to the second heat dissipation fins 42 located on the peripheral sides. This causes the ends of the plurality of second heat dissipating fins 42 facing the first heat dissipating fins 32 to collectively exhibit an arcuate change.
The end portions of the plurality of second heat dissipating fins 42 exhibit a change in arc shape such that the central regions of the plurality of second heat dissipating fins 42 are projected toward the first heat dissipating fin 32 side. Thus, when the first heat dissipation fin 32 swings with the rotation of the camera body 2, the second heat dissipation fin 42 can be prevented from colliding with the first heat dissipation fin 32.
An electronic device according to some embodiments of the present application includes a camera structure according to any one of the embodiments of the present application.
In this embodiment, in the working process of the camera structure on the electronic device, the heat generated by the camera body 2 can be better dissipated, and the heat dissipation efficiency is improved. Heat accumulation on the substrate 21 is avoided, and the influence on the camera body 2 is reduced.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A camera structure, comprising:
a cradle head housing;
the camera body is arranged on the holder shell and provided with a substrate;
the first heat dissipation piece comprises a first body and a plurality of first heat dissipation fins arranged on the first body, the first body is provided with a first inner cavity, a phase change material is arranged in the first inner cavity, and the first body is arranged on the substrate.
2. The camera structure of claim 1, wherein the first heat-dissipating fin has a second internal cavity, the first internal cavity being in communication with the second internal cavity, the phase change material being disposed in the first internal cavity and the second internal cavity.
3. The camera structure according to claim 1, wherein a plurality of the first heat dissipation fins are sequentially arranged on a surface of the first body, the surface of the first body has a first region and a second region, and the second region is located on a peripheral side of the first region;
in the plurality of first radiating fins, one part is positioned in the first area, the other part is positioned in the second area, and in the direction vertical to the surface of the first body, the size of the first radiating fins positioned in the first area is larger than that of the first radiating fins positioned in the second area.
4. The camera structure of claim 3, wherein a dimension of the plurality of first heat dissipation fins in a direction perpendicular to the surface of the first body decreases in a direction from the first region to the second region.
5. The camera structure according to claim 1, wherein the holder housing is provided with a plurality of second heat dissipation fins, the plurality of second heat dissipation fins and the plurality of first heat dissipation fins are arranged in a staggered manner, a third inner cavity is provided in the second heat dissipation fins, and the third inner cavity is provided with a phase change material.
6. The camera structure according to claim 5, wherein a second body is further disposed on the pan/tilt head housing, and a plurality of second heat dissipation fins are disposed on the second body;
a fourth inner cavity is formed in the second body and communicated with the third inner cavity, and a phase-change material is arranged in the fourth inner cavity.
7. The camera structure of claim 5, wherein a portion of the second heat dissipation fins is disposed opposite to the first region, and another portion of the second heat dissipation fins is disposed opposite to the second region, and a dimension of the second heat dissipation fins disposed opposite to the first region is larger than a dimension of the second heat dissipation fins disposed opposite to the second region in a direction perpendicular to a surface on which the second heat dissipation fins are disposed.
8. The camera structure of claim 7, wherein a dimension of the second heat dissipation fins in a direction perpendicular to a surface on which the second heat dissipation fins are located decreases in a direction from the first region to the second region.
9. The camera structure of claim 1, wherein the first body is plate-shaped.
10. An electronic device, characterized in that it comprises a camera structure according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111594103.1A CN114302038B (en) | 2021-12-22 | 2021-12-22 | Camera structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111594103.1A CN114302038B (en) | 2021-12-22 | 2021-12-22 | Camera structure and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114302038A true CN114302038A (en) | 2022-04-08 |
| CN114302038B CN114302038B (en) | 2024-05-14 |
Family
ID=80970527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111594103.1A Active CN114302038B (en) | 2021-12-22 | 2021-12-22 | Camera structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114302038B (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008131398A (en) * | 2006-11-21 | 2008-06-05 | Sony Corp | Heat dissipation structure of imaging apparatus and imaging apparatus |
| CN101964868A (en) * | 2007-05-01 | 2011-02-02 | 奥林巴斯映像株式会社 | Portable electron device |
| US20110249444A1 (en) * | 2010-04-07 | 2011-10-13 | Seiko Epson Corporation | Heat dissipation member, electro-optical device, and electronic apparatus |
| CN105351899A (en) * | 2015-09-23 | 2016-02-24 | 华南理工大学 | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials |
| CN207947792U (en) * | 2018-01-17 | 2018-10-09 | 泉州市中骁智能科技有限公司 | A kind of security monitoring optical fiber storage area network equipment |
| CN109348090A (en) * | 2018-02-28 | 2019-02-15 | 华核（天津）新技术开发有限公司 | The infrared line-scan digital camera of accurate temperature controller type and control method |
| CN210319741U (en) * | 2019-09-05 | 2020-04-14 | 育笙科技（深圳）有限公司 | High-efficient radiating control street lamp |
| WO2020155900A1 (en) * | 2019-01-29 | 2020-08-06 | 株洲智热技术有限公司 | Phase change heat radiating device |
| CN211791713U (en) * | 2020-04-23 | 2020-10-27 | 维沃移动通信有限公司 | Cloud platform camera and electronic equipment |
| CN112003487A (en) * | 2020-07-24 | 2020-11-27 | 华为技术有限公司 | Heat dissipation device, inverter and electronic equipment |
| WO2021063312A1 (en) * | 2019-09-30 | 2021-04-08 | 长城汽车股份有限公司 | Lighting device and vehicle |
| US20210127477A1 (en) * | 2019-10-28 | 2021-04-29 | Triple Win Technology(Shenzhen) Co.Ltd. | Camera module capable of dissipating heat and electronic device using the same |
-
2021
- 2021-12-22 CN CN202111594103.1A patent/CN114302038B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008131398A (en) * | 2006-11-21 | 2008-06-05 | Sony Corp | Heat dissipation structure of imaging apparatus and imaging apparatus |
| CN101964868A (en) * | 2007-05-01 | 2011-02-02 | 奥林巴斯映像株式会社 | Portable electron device |
| US20110249444A1 (en) * | 2010-04-07 | 2011-10-13 | Seiko Epson Corporation | Heat dissipation member, electro-optical device, and electronic apparatus |
| CN105351899A (en) * | 2015-09-23 | 2016-02-24 | 华南理工大学 | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials |
| CN207947792U (en) * | 2018-01-17 | 2018-10-09 | 泉州市中骁智能科技有限公司 | A kind of security monitoring optical fiber storage area network equipment |
| CN109348090A (en) * | 2018-02-28 | 2019-02-15 | 华核（天津）新技术开发有限公司 | The infrared line-scan digital camera of accurate temperature controller type and control method |
| WO2020155900A1 (en) * | 2019-01-29 | 2020-08-06 | 株洲智热技术有限公司 | Phase change heat radiating device |
| CN210319741U (en) * | 2019-09-05 | 2020-04-14 | 育笙科技（深圳）有限公司 | High-efficient radiating control street lamp |
| WO2021063312A1 (en) * | 2019-09-30 | 2021-04-08 | 长城汽车股份有限公司 | Lighting device and vehicle |
| US20210127477A1 (en) * | 2019-10-28 | 2021-04-29 | Triple Win Technology(Shenzhen) Co.Ltd. | Camera module capable of dissipating heat and electronic device using the same |
| CN211791713U (en) * | 2020-04-23 | 2020-10-27 | 维沃移动通信有限公司 | Cloud platform camera and electronic equipment |
| CN112003487A (en) * | 2020-07-24 | 2020-11-27 | 华为技术有限公司 | Heat dissipation device, inverter and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114302038B (en) | 2024-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100757614B1 (en) | Apparatus and Method for Passive Phase Change Thermal Management | |
| US20120085520A1 (en) | Heat spreader with flexibly supported heat pipe | |
| JP4466644B2 (en) | heatsink | |
| TWI483099B (en) | Phase change type heat dissipating device | |
| JP2006108166A5 (en) | ||
| JPH08255858A (en) | Cooling system of electronic package | |
| KR100939992B1 (en) | Cooling Apparatus, and Electric-Electronic Equipment with the Cooling Apparatus | |
| JP2002198675A (en) | Electronic apparatus | |
| CN114503795A (en) | Thermal control system for mesh network devices and associated mesh network devices | |
| CN107333033B (en) | Camera and mobile terminal | |
| WO2014140098A1 (en) | Heat spreader with flat pipe cooling element | |
| TWI497656B (en) | Electronic device | |
| CN114302038B (en) | Camera structure and electronic equipment | |
| JPWO2019043835A1 (en) | Electronic device | |
| CN218632017U (en) | Heat dissipation device, circuit board and battery module | |
| JP2000332175A (en) | Heat sink with fin | |
| US20070295488A1 (en) | Thermosyphon for operation in multiple orientations relative to gravity | |
| CN111106079B (en) | Heat dissipation chip, manufacturing method thereof and electronic equipment | |
| CN116230657A (en) | Integrated boiling enhanced circuit device for two-phase immersion cooling | |
| JP2008235496A (en) | Cooling board | |
| TWI492341B (en) | Phase change type heat dissipating device | |
| JP2004311464A (en) | Semiconductor device | |
| JP3332858B2 (en) | Plate type heat pipe and cooling structure using it | |
| CN214381564U (en) | Circuit board structure with can accomodate mounting panel | |
| CN221041112U (en) | Heat radiation structure for vehicle-mounted inverter MOS tube |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |