CN214070227U - 电路板及其散热贴片 - Google Patents

电路板及其散热贴片 Download PDF

Info

Publication number
CN214070227U
CN214070227U CN202022780435.6U CN202022780435U CN214070227U CN 214070227 U CN214070227 U CN 214070227U CN 202022780435 U CN202022780435 U CN 202022780435U CN 214070227 U CN214070227 U CN 214070227U
Authority
CN
China
Prior art keywords
layer
hole
heat dissipation
adhesive layer
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202022780435.6U
Other languages
English (en)
Chinese (zh)
Inventor
李东昇
庞规浩
魏兆璟
郭晋村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chipbond Technology Corp
Original Assignee
Chipbond Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipbond Technology Corp filed Critical Chipbond Technology Corp
Application granted granted Critical
Publication of CN214070227U publication Critical patent/CN214070227U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
CN202022780435.6U 2020-11-19 2020-11-26 电路板及其散热贴片 Active CN214070227U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW109140448 2020-11-19
TW109140448A TWI751797B (zh) 2020-11-19 2020-11-19 電路板及其散熱貼片

Publications (1)

Publication Number Publication Date
CN214070227U true CN214070227U (zh) 2021-08-27

Family

ID=77403805

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202022780435.6U Active CN214070227U (zh) 2020-11-19 2020-11-26 电路板及其散热贴片
CN202011351003.1A Pending CN114521045A (zh) 2020-11-19 2020-11-26 电路板及其散热贴片

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202011351003.1A Pending CN114521045A (zh) 2020-11-19 2020-11-26 电路板及其散热贴片

Country Status (4)

Country Link
JP (1) JP7208280B2 (ja)
KR (1) KR102556187B1 (ja)
CN (2) CN214070227U (ja)
TW (1) TWI751797B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI744156B (zh) * 2020-12-31 2021-10-21 頎邦科技股份有限公司 半導體散熱封裝構造及其製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5793195U (ja) * 1980-11-28 1982-06-08
JPH01307253A (ja) * 1988-06-03 1989-12-12 Nec Corp ヒートシンク付半導体装置
JPH0432254A (ja) * 1990-05-29 1992-02-04 Hitachi Ltd 半導体パッケージ
JP3502449B2 (ja) * 1994-08-23 2004-03-02 三菱電機株式会社 半導体装置、及びその製造方法
JPH10229255A (ja) * 1997-02-14 1998-08-25 Iwaki Electron Corp Ltd 平板付きフレキシブルプリント基板
JP4327316B2 (ja) * 1999-12-06 2009-09-09 株式会社イノアックコーポレーション 熱伝導性シート複合体及び熱伝導性シートの取付方法
KR101047923B1 (ko) * 2007-12-27 2011-07-08 주식회사 엘지화학 버 특성 및 신뢰성이 우수한 다이싱 다이 본딩 필름 및반도체 장치
JP2009246032A (ja) 2008-03-28 2009-10-22 Panasonic Corp 半導体装置
KR20100072508A (ko) 2008-12-22 2010-07-01 오리온피디피주식회사 플라즈마 디스플레이 패널의 방열 시트 구조
KR101429514B1 (ko) * 2009-12-28 2014-08-12 삼성테크윈 주식회사 회로 기판
CA2810401A1 (en) 2010-09-16 2012-03-22 Boston Scientific Neuromodulation Corporation Systems and methods for making and using paddle lead assemblies for electrical stimulation systems
JP6363687B2 (ja) * 2016-12-26 2018-07-25 デクセリアルズ株式会社 半導体装置
KR102026561B1 (ko) * 2018-04-27 2019-11-05 매그나칩 반도체 유한회사 칩온필름형 반도체 패키지
US10642098B2 (en) * 2018-07-11 2020-05-05 Sharp Kabushiki Kaisha Illumination device and display device
WO2020044594A1 (ja) * 2018-08-28 2020-03-05 三菱マテリアル株式会社 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、及び、絶縁回路基板の製造方法
TWM598743U (zh) * 2020-04-27 2020-07-21 裕晨科技股份有限公司 散熱裝置

Also Published As

Publication number Publication date
CN114521045A (zh) 2022-05-20
KR20220068878A (ko) 2022-05-26
JP7208280B2 (ja) 2023-01-18
KR102556187B1 (ko) 2023-07-14
TWI751797B (zh) 2022-01-01
TW202221868A (zh) 2022-06-01
JP2022081373A (ja) 2022-05-31

Similar Documents

Publication Publication Date Title
KR100819195B1 (ko) 플렉서블 프린트 배선 기판 및 플렉서블 프린트 배선기판의 제조방법 및 반도체 장치
US7514636B2 (en) Circuit component module, electronic circuit device, and method for manufacturing the circuit component module
KR100793468B1 (ko) 반도체 장치 및 그 제조 방법과, 상기 반도체 장치를 구비한 액정 모듈 및 반도체 모듈
JP4835124B2 (ja) 半導体ｉｃ内蔵基板及びその製造方法
CN108573930B (zh) 薄膜倒装封装及薄膜倒装封装的制造方法
KR20070117991A (ko) 반도체 장치 및 그 제조 방법
CN110798974B (zh) 埋嵌式基板及其制作方法，及具有该埋嵌式基板的电路板
CN214070227U (zh) 电路板及其散热贴片
US20050218491A1 (en) Circuit component module and method of manufacturing the same
KR20090033004A (ko) 배선 기판 및 그 제조 방법
US10356909B1 (en) Embedded circuit board and method of making same
US8603858B2 (en) Method for manufacturing a semiconductor package
CN111295056A (zh) 一种阶梯线路柔性板的制作方法
KR20090041756A (ko) 접착층을 갖는 프린트 배선 기판 및 이를 이용한 반도체패키지
KR101204083B1 (ko) 전기소자 내장 다층 연성 인쇄회로기판 및 그 제조 방법
TWM609090U (zh) 電路板及其散熱貼片
TWM611636U (zh) 覆晶薄膜封裝體用散熱體
JP3624512B2 (ja) 電子部品搭載用基板の製造方法
TWI234254B (en) Method for manufacturing an adhesive substrate with a die-cavity sidewall
KR20040055590A (ko) 회로 장치 및 그 제조 방법
JP4461801B2 (ja) 半導体装置およびその製造方法
JP2770485B2 (ja) 回路基板
JP3789688B2 (ja) 混成集積回路装置
JP3997629B2 (ja) 補強シート付ｔａｂ用フィルムキャリアテープ
CN112543561B (zh) 具空腔结构的线路板的制作方法

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant