CN204885171U - 具有垂直沟道的半导体器件 - Google Patents
具有垂直沟道的半导体器件 Download PDFInfo
- Publication number
- CN204885171U CN204885171U CN201520470368.4U CN201520470368U CN204885171U CN 204885171 U CN204885171 U CN 204885171U CN 201520470368 U CN201520470368 U CN 201520470368U CN 204885171 U CN204885171 U CN 204885171U
- Authority
- CN
- China
- Prior art keywords
- layer
- semiconductor device
- gate metal
- conducting channel
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 137
- 229910052751 metal Inorganic materials 0.000 claims abstract description 152
- 239000002184 metal Substances 0.000 claims abstract description 152
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 229910052710 silicon Inorganic materials 0.000 abstract description 23
- 239000010703 silicon Substances 0.000 abstract description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 22
- 230000000694 effects Effects 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 230000009467 reduction Effects 0.000 abstract description 3
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 48
- 238000000151 deposition Methods 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 16
- 238000002955 isolation Methods 0.000 description 15
- 239000003989 dielectric material Substances 0.000 description 13
- 238000005229 chemical vapour deposition Methods 0.000 description 12
- 230000008021 deposition Effects 0.000 description 12
- 238000005240 physical vapour deposition Methods 0.000 description 12
- 238000012986 modification Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- 239000002210 silicon-based material Substances 0.000 description 9
- 238000000059 patterning Methods 0.000 description 8
- 238000001534 heteroepitaxy Methods 0.000 description 7
- 239000002800 charge carrier Substances 0.000 description 6
- 238000005137 deposition process Methods 0.000 description 5
- 238000001259 photo etching Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 229910001092 metal group alloy Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000005669 field effect Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66666—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7809—Vertical DMOS transistors, i.e. VDMOS transistors having both source and drain contacts on the same surface, i.e. Up-Drain VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
- H01L29/0653—Dielectric regions, e.g. SiO2 regions, air gaps adjoining the input or output region of a field-effect device, e.g. the source or drain region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0856—Source regions
- H01L29/0865—Disposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
- H01L29/0882—Disposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
- H01L29/1037—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure and non-planar channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/781—Inverted VDMOS transistors, i.e. Source-Down VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462020960P | 2014-07-03 | 2014-07-03 | |
US62/020,960 | 2014-07-03 | ||
US14/529,959 US9406793B2 (en) | 2014-07-03 | 2014-10-31 | Semiconductor device with a vertical channel formed through a plurality of semiconductor layers |
US14/529,959 | 2014-10-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204885171U true CN204885171U (zh) | 2015-12-16 |
Family
ID=53483742
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510383193.8A Active CN105322019B (zh) | 2014-07-03 | 2015-07-02 | 具有垂直沟道的半导体器件 |
CN201520470368.4U Withdrawn - After Issue CN204885171U (zh) | 2014-07-03 | 2015-07-02 | 具有垂直沟道的半导体器件 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510383193.8A Active CN105322019B (zh) | 2014-07-03 | 2015-07-02 | 具有垂直沟道的半导体器件 |
Country Status (4)
Country | Link |
---|---|
US (2) | US9406793B2 (zh) |
EP (1) | EP2963688A3 (zh) |
CN (2) | CN105322019B (zh) |
HK (1) | HK1217818A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105322019A (zh) * | 2014-07-03 | 2016-02-10 | 美国博通公司 | 具有垂直沟道的半导体器件 |
CN108231761A (zh) * | 2016-12-09 | 2018-06-29 | 三星电子株式会社 | 半导体器件及制造其的方法 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9583624B1 (en) * | 2015-09-25 | 2017-02-28 | International Business Machines Corporation | Asymmetric finFET memory access transistor |
US9530866B1 (en) * | 2016-04-13 | 2016-12-27 | Globalfoundries Inc. | Methods of forming vertical transistor devices with self-aligned top source/drain conductive contacts |
US9530863B1 (en) * | 2016-04-13 | 2016-12-27 | Globalfoundries Inc. | Methods of forming vertical transistor devices with self-aligned replacement gate structures |
US9799751B1 (en) | 2016-04-19 | 2017-10-24 | Globalfoundries Inc. | Methods of forming a gate structure on a vertical transistor device |
US9911660B2 (en) * | 2016-04-26 | 2018-03-06 | Lam Research Corporation | Methods for forming germanium and silicon germanium nanowire devices |
US9640636B1 (en) | 2016-06-02 | 2017-05-02 | Globalfoundries Inc. | Methods of forming replacement gate structures and bottom and top source/drain regions on a vertical transistor device |
US11088033B2 (en) | 2016-09-08 | 2021-08-10 | International Business Machines Corporation | Low resistance source-drain contacts using high temperature silicides |
US10170616B2 (en) | 2016-09-19 | 2019-01-01 | Globalfoundries Inc. | Methods of forming a vertical transistor device |
US10347745B2 (en) * | 2016-09-19 | 2019-07-09 | Globalfoundries Inc. | Methods of forming bottom and top source/drain regions on a vertical transistor device |
US9882025B1 (en) * | 2016-09-30 | 2018-01-30 | Globalfoundries Inc. | Methods of simultaneously forming bottom and top spacers on a vertical transistor device |
CN106298778A (zh) | 2016-09-30 | 2017-01-04 | 中国科学院微电子研究所 | 半导体器件及其制造方法及包括该器件的电子设备 |
US11081484B2 (en) * | 2016-09-30 | 2021-08-03 | Institute of Microelectronics, Chinese Academy of Sciences | IC unit and method of manufacturing the same, and electronic device including the same |
US9806191B1 (en) * | 2016-10-11 | 2017-10-31 | United Microelectronics Corp. | Vertical channel oxide semiconductor field effect transistor and method for fabricating the same |
US9966456B1 (en) | 2016-11-08 | 2018-05-08 | Globalfoundries Inc. | Methods of forming gate electrodes on a vertical transistor device |
KR102556850B1 (ko) * | 2017-01-19 | 2023-07-18 | 삼성디스플레이 주식회사 | 트랜지스터 표시판 및 그 제조 방법 |
US9935018B1 (en) | 2017-02-17 | 2018-04-03 | Globalfoundries Inc. | Methods of forming vertical transistor devices with different effective gate lengths |
KR20180098446A (ko) * | 2017-02-24 | 2018-09-04 | 삼성전자주식회사 | 반도체 장치 및 이의 제조 방법 |
US10229999B2 (en) | 2017-02-28 | 2019-03-12 | Globalfoundries Inc. | Methods of forming upper source/drain regions on a vertical transistor device |
US10014370B1 (en) | 2017-04-19 | 2018-07-03 | Globalfoundries Inc. | Air gap adjacent a bottom source/drain region of vertical transistor device |
CN111771266A (zh) * | 2018-05-08 | 2020-10-13 | 新加坡优尼山帝斯电子私人有限公司 | 柱状半导体装置的制造方法 |
US11158715B2 (en) * | 2019-06-20 | 2021-10-26 | International Business Machines Corporation | Vertical FET with asymmetric threshold voltage and channel thicknesses |
US11563116B2 (en) * | 2020-03-16 | 2023-01-24 | Samsung Electronics Co., Ltd. | Vertical type transistor, inverter including the same, and vertical type semiconductor device including the same |
CN113629143B (zh) * | 2020-05-06 | 2023-12-22 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构和半导体结构的形成方法 |
CN116230737B (zh) * | 2022-06-30 | 2024-03-29 | 北京超弦存储器研究院 | 半导体器件及其制造方法、电子设备 |
WO2024060021A1 (zh) * | 2022-09-20 | 2024-03-28 | 华为技术有限公司 | 一种三维存储阵列、存储器及电子设备 |
CN116013963B (zh) * | 2023-03-13 | 2023-05-26 | 合肥晶合集成电路股份有限公司 | 一种半导体器件及其制作方法 |
CN115954381B (zh) * | 2023-03-13 | 2023-06-06 | 合肥晶合集成电路股份有限公司 | 一种半导体器件及其制作方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3202223B2 (ja) | 1990-11-27 | 2001-08-27 | 日本電気株式会社 | トランジスタの製造方法 |
US6316807B1 (en) * | 1997-12-05 | 2001-11-13 | Naoto Fujishima | Low on-resistance trench lateral MISFET with better switching characteristics and method for manufacturing same |
US6518622B1 (en) | 2000-03-20 | 2003-02-11 | Agere Systems Inc. | Vertical replacement gate (VRG) MOSFET with a conductive layer adjacent a source/drain region and method of manufacture therefor |
US20030052365A1 (en) * | 2001-09-18 | 2003-03-20 | Samir Chaudhry | Structure and fabrication method for capacitors integratible with vertical replacement gate transistors |
US6759730B2 (en) * | 2001-09-18 | 2004-07-06 | Agere Systems Inc. | Bipolar junction transistor compatible with vertical replacement gate transistor |
US6709904B2 (en) * | 2001-09-28 | 2004-03-23 | Agere Systems Inc. | Vertical replacement-gate silicon-on-insulator transistor |
JP2005064031A (ja) * | 2003-08-12 | 2005-03-10 | Fujio Masuoka | 半導体装置 |
DE102004052610B4 (de) * | 2004-10-29 | 2020-06-18 | Infineon Technologies Ag | Leistungstransistor mit einem Halbleitervolumen |
WO2007043170A1 (ja) * | 2005-10-12 | 2007-04-19 | Fuji Electric Holdings Co., Ltd. | Soiトレンチ横型igbt |
JP2008130896A (ja) * | 2006-11-22 | 2008-06-05 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
US7893499B2 (en) * | 2008-04-04 | 2011-02-22 | Texas Instruments Incorporated | MOS transistor with gate trench adjacent to drain extension field insulation |
WO2009153880A1 (ja) * | 2008-06-20 | 2009-12-23 | 日本ユニサンティスエレクトロニクス株式会社 | 半導体記憶装置 |
US7851856B2 (en) * | 2008-12-29 | 2010-12-14 | Alpha & Omega Semiconductor, Ltd | True CSP power MOSFET based on bottom-source LDMOS |
JP2010171090A (ja) * | 2009-01-20 | 2010-08-05 | Elpida Memory Inc | 半導体装置および半導体装置の製造方法 |
JP2010245196A (ja) * | 2009-04-02 | 2010-10-28 | Elpida Memory Inc | 半導体装置およびその製造方法 |
CN101840935B (zh) * | 2010-05-17 | 2012-02-29 | 电子科技大学 | Soi横向mosfet器件 |
CN103348464B (zh) * | 2011-01-26 | 2016-01-13 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
KR101368191B1 (ko) * | 2013-01-03 | 2014-02-28 | 한국과학기술원 | 수직 구조를 갖는 독립적 및 대칭적인 이중 게이트 구조를 이용한 전자-정공 이중층 터널 전계 효과 트랜지스터 및 그 제조 방법 |
US9406793B2 (en) | 2014-07-03 | 2016-08-02 | Broadcom Corporation | Semiconductor device with a vertical channel formed through a plurality of semiconductor layers |
-
2014
- 2014-10-31 US US14/529,959 patent/US9406793B2/en active Active
-
2015
- 2015-06-24 EP EP15173558.6A patent/EP2963688A3/en not_active Withdrawn
- 2015-07-02 CN CN201510383193.8A patent/CN105322019B/zh active Active
- 2015-07-02 CN CN201520470368.4U patent/CN204885171U/zh not_active Withdrawn - After Issue
-
2016
- 2016-05-22 HK HK16105813.6A patent/HK1217818A1/zh unknown
- 2016-06-27 US US15/193,718 patent/US9680002B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105322019A (zh) * | 2014-07-03 | 2016-02-10 | 美国博通公司 | 具有垂直沟道的半导体器件 |
CN108231761A (zh) * | 2016-12-09 | 2018-06-29 | 三星电子株式会社 | 半导体器件及制造其的方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2963688A2 (en) | 2016-01-06 |
CN105322019A (zh) | 2016-02-10 |
US9680002B2 (en) | 2017-06-13 |
US20160308042A1 (en) | 2016-10-20 |
US20160005850A1 (en) | 2016-01-07 |
CN105322019B (zh) | 2019-04-05 |
HK1217818A1 (zh) | 2017-01-20 |
US9406793B2 (en) | 2016-08-02 |
EP2963688A3 (en) | 2016-04-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN204885171U (zh) | 具有垂直沟道的半导体器件 | |
US11756960B2 (en) | Multi-threshold voltage gate-all-around transistors | |
US10410930B2 (en) | Nonplanar device and strain-generating channel dielectric | |
US10937908B2 (en) | Thin-sheet FinFET device | |
US10355020B2 (en) | FinFETs having strained channels, and methods of fabricating finFETs having strained channels | |
US10418488B2 (en) | Method to form strained channel in thin box SOI structures by elastic strain relaxation of the substrate | |
US10103264B2 (en) | Channel strain control for nonplanar compound semiconductor devices | |
KR102341589B1 (ko) | 반도체 디바이스 및 방법 | |
US9893181B1 (en) | Uniform gate length in vertical field effect transistors | |
US11557652B2 (en) | Metal source/drain-based MOSFET and method for fabricating the same | |
US9202919B1 (en) | FinFETs and techniques for controlling source and drain junction profiles in finFETs | |
US20160260741A1 (en) | Semiconductor devices having fins, and methods of forming semiconductor devices having fins | |
CN113491014A (zh) | 具有通过鳍状桥接区耦合的垂直堆叠的纳米片的晶体管沟道 | |
CN113498555A (zh) | 具有通过鳍状桥接区耦合的垂直堆叠的纳米片的晶体管沟道 | |
US9590101B2 (en) | FinFET with multiple dislocation planes and method for forming the same | |
US11094781B2 (en) | Nanosheet structures having vertically oriented and horizontally stacked nanosheets | |
US20230037719A1 (en) | Methods of forming bottom dielectric isolation layers | |
TWI819254B (zh) | 半導體元件及其製造方法及類比數位轉換器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: Singapore Singapore Patentee after: Avago Technologies Fiber IP Singapore Pte. Ltd. Address before: American California Patentee before: Zyray Wireless Inc. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20181018 Address after: Singapore Singapore Patentee after: Annwa high tech Limited by Share Ltd Address before: Singapore Singapore Patentee before: Avago Technologies Fiber IP Singapore Pte. Ltd. |
|
TR01 | Transfer of patent right | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20151216 Effective date of abandoning: 20190405 |
|
AV01 | Patent right actively abandoned |
Granted publication date: 20151216 Effective date of abandoning: 20190405 |
|
AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned |