CN204155933U - A kind of LED luminescence component - Google Patents
A kind of LED luminescence component Download PDFInfo
- Publication number
- CN204155933U CN204155933U CN201420567000.5U CN201420567000U CN204155933U CN 204155933 U CN204155933 U CN 204155933U CN 201420567000 U CN201420567000 U CN 201420567000U CN 204155933 U CN204155933 U CN 204155933U
- Authority
- CN
- China
- Prior art keywords
- substrate
- wafer
- luminescence component
- led luminescence
- die bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model is applicable to lighting field, provide a kind of LED luminescence component, this LED luminescence component comprises substrate, multiple wafer, adhesive and curing agent, multiple described wafer is affixed on described substrate by described adhesive, with the PN junction conducting of described curing agent by the described wafer of described wafer die bond on described substrate and on described substrate, the height of the described wafer of die bond on described substrate is equal, multiple described wafer arranges on the substrate uniformly, and the spacing between two adjacent described wafers is equal.Adopt flip-chip packaged technical matters, do not need gold thread weld conducting, directly by electrode die bond on substrate, make that its LED luminescence component manufacture craft is simple, stable performance, production efficiency be high, with low cost, not easily occur dead lamp, can realize automated production.
Description
Technical field
The utility model belongs to lighting field, particularly relates to a kind of LED luminescence component adopting flip-chip packaged process application to make on MLCOB module.
Background technology
LED(Light Emitting Diode, light-emitting diode) chip is a kind of solid-state semiconductor device, it directly can be converted into light electricity.
Current LED multi-chip adopts single-chip gold thread bonding packaging mostly.The method is on epitaxial wafer, produce multiple LED chip, then the epitaxial wafer made is cut, be divided into single little LED chip, single little LED chip is fixed on substrate by recycling crystal-bonding adhesive, then by forward LED gold thread bonding, each LED chip is electrically connected, finally at the upper surface coating silica gel of each little LED chip, prevent outside moisture and air from destroying LED chip.
First, in the manufacture craft of LED multi-chip, when cutting the LED chip on epitaxial wafer, mechanical damage can be caused to LED chip, and then affect the reliability of LED chip.Secondly, when adopting forward LED gold thread bonding pattern to be electrically connected by multiple LED chip, complex process, easily dead lamp, and the thinner intensity of gold thread is lower, is easy to damage when being subject to external force; Occur gold thread welding post in production, make production efficiency on the low side, production cost is high, and present technique gold thread welding is high to use equipment requirement, and manufacturing technique requirent is high.
Utility model content
The purpose of this utility model is to provide a kind of LED luminescence component, is intended to solve use gold thread to connect chip as bonding line, complex manufacturing technology, easily dead lamp, the problem that production efficiency is low.
The utility model realizes like this, a kind of LED luminescence component, this LED luminescence component comprises substrate, multiple wafer, adhesive and curing agent, multiple described wafer is affixed on described substrate by described adhesive, with the PN junction conducting of described curing agent by the described wafer of described wafer die bond on described substrate and on described substrate, the height of the described wafer of die bond on described substrate is equal, multiple described wafer arranges on the substrate uniformly, and the spacing between two adjacent described wafers is equal.
Further technical scheme of the present utility model is: described curing agent is by described lenses cured in hemisphere.
Further technical scheme of the present utility model is: described substrate comprises conductive layer, insulating barrier and heat-conducting layer, and described insulating barrier is located on described heat-conducting layer, and described conductive layer is located on described heat-conducting layer.
Further technical scheme of the present utility model is: described curing agent adopts glue and fluorescent material to be mixed.
Further technical scheme of the present utility model is: multiple described wafer in a series arrangement or parallel way or series-parallel system die bond on described substrate.
The beneficial effects of the utility model are: adopt flip-chip packaged technical matters, do not need gold thread weld conducting, directly by electrode die bond on substrate, make that its LED luminescence component manufacture craft is simple, stable performance, production efficiency are high, with low cost, not easily occur dead lamp, can realize automated production.
Accompanying drawing explanation
Fig. 1 is the sectional view of the LED luminescence component that the utility model embodiment provides;
Fig. 2 is the front view of the LED luminescence component that the utility model embodiment provides.
Embodiment
Reference numeral: 10-wafer 20-substrate 30-adhesive 40-curing agent 50-LED chip 201-heat-conducting layer 202-insulating barrier 203-conductive layer
Fig. 1 shows the LED luminescence component that the utility model provides, this LED luminescence component comprises substrate 20, multiple wafer 10, adhesive 30 and curing agent 40, multiple described wafer 10 is affixed on described substrate 20 by described adhesive 30, with the PN junction conducting of described curing agent 40 by the described wafer 10 of described wafer 10 die bond on described substrate 20 and on described substrate 20, the height of the described wafer 10 of die bond on described substrate 20 is equal, multiple described wafer 10 is arranged on described substrate 20 uniformly, and the spacing between adjacent two described wafers 10 is equal.Adopt flip-chip packaged technical matters, do not need gold thread to weld conducting, directly by electrode die bond on the base plate 20, make that its LED luminescence component manufacture craft is simple, stable performance, production efficiency are high, with low cost, not easily occur dead lamp, can realize automated production.
Described wafer 10 solidifies in hemisphere by described curing agent 40.
Described substrate 20 comprises conductive layer 203, insulating barrier 202 and heat-conducting layer 201, and described insulating barrier 202 is located on described heat-conducting layer 201, and described conductive layer 203 is located on described heat-conducting layer 203.
Described curing agent 40 adopts glue and fluorescent material to be mixed.
Multiple described wafer 10 in a series arrangement or parallel way or series-parallel system die bond on described substrate 20.
Wafer 10 and adhesive 30, curing agent 40 form hemispheric LED chip 50 on the base plate 20, and uniform difference on the base plate 20, makes LED chip 50 proper alignment on substrate.
By flip chip technology, LED chip 50 die bond is made on substrate the PN junction conducting of LED, after energising, LED can send light, this single LEDs chip 50 can be carried out multiple series-parallel mode die bond now and just form MLCOB required for us so on the base plate 20.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (4)
1. a LED luminescence component, it is characterized in that: this LED luminescence component comprises substrate, multiple wafer, adhesive and curing agent, multiple described wafer is affixed on described substrate by described adhesive, with the PN junction conducting of described curing agent by the described wafer of described wafer die bond on described substrate and on described substrate, the height of the described wafer of die bond on described substrate is equal, multiple described wafer arranges on the substrate uniformly, and the spacing between two adjacent described wafers is equal.
2. LED luminescence component according to claim 1, is characterized in that, described curing agent is by described lenses cured in hemisphere.
3. LED luminescence component according to claim 2, is characterized in that, described substrate comprises conductive layer, insulating barrier and heat-conducting layer, and described insulating barrier is located on described heat-conducting layer, and described conductive layer is located on described heat-conducting layer.
4. the LED luminescence component according to any one of claim 1-3, is characterized in that, multiple described wafer in a series arrangement or parallel way or series-parallel system die bond on described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420567000.5U CN204155933U (en) | 2014-09-29 | 2014-09-29 | A kind of LED luminescence component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420567000.5U CN204155933U (en) | 2014-09-29 | 2014-09-29 | A kind of LED luminescence component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204155933U true CN204155933U (en) | 2015-02-11 |
Family
ID=52514030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420567000.5U Expired - Fee Related CN204155933U (en) | 2014-09-29 | 2014-09-29 | A kind of LED luminescence component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204155933U (en) |
-
2014
- 2014-09-29 CN CN201420567000.5U patent/CN204155933U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103367557A (en) | Manufacturing method of light emitting diode wafer which emits white light directly | |
| CN203312358U (en) | LED chip inverted packaging structure | |
| CN104051603B (en) | A kind of manufacturing process of the LED light bar of double-side | |
| CN203150541U (en) | LED light source based on COB packaging | |
| CN202758885U (en) | Light emitting diode module packaging structure | |
| CN204696126U (en) | Based on the COB structure white light LED light source of ceramic phosphor encapsulation | |
| CN103956356A (en) | Efficient heat conducting large-power LED integration package structure | |
| CN204155933U (en) | A kind of LED luminescence component | |
| CN102214652A (en) | LED (light emitting diode) packaging structure and preparation method thereof | |
| CN203521458U (en) | Flip-chip LED chip capable of emitting light omnibearingly | |
| WO2014086080A1 (en) | Led wafer modularized packaging process | |
| CN202695440U (en) | Led integrated light source | |
| CN202523758U (en) | Wafer structure of light-emitting diode capable of emitting white light directly | |
| CN203055989U (en) | COB package substrate for LED candle lamp | |
| CN202352671U (en) | Light-emitting diode (LED) packaging structure | |
| CN201884982U (en) | Novel LED (light-emitting diode) light source module encapsulation structure | |
| CN102832330B (en) | Wafer level LED packaging structure | |
| CN202549840U (en) | Multi-wafer integration type white-light light emitting diode (LED) packaging structure | |
| CN203707166U (en) | All-metal integrated LED lamp bead packaging structure | |
| CN2798315Y (en) | High power LED packing structure | |
| CN203883044U (en) | Novel surface mounted technology type LED | |
| CN206398403U (en) | A kind of light source die set suitable for LED | |
| CN102222736A (en) | Method for packaging double-side-luminous semiconductor luminous tube | |
| CN201946598U (en) | LED (Light Emitting Diode) wafer chip packaging structure | |
| CN207038556U (en) | A kind of high-power support of achievable plurality of LEDs chip package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150211 Termination date: 20180929 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |