CN206398403U - A kind of light source die set suitable for LED - Google Patents
A kind of light source die set suitable for LED Download PDFInfo
- Publication number
- CN206398403U CN206398403U CN201720113716.1U CN201720113716U CN206398403U CN 206398403 U CN206398403 U CN 206398403U CN 201720113716 U CN201720113716 U CN 201720113716U CN 206398403 U CN206398403 U CN 206398403U
- Authority
- CN
- China
- Prior art keywords
- light source
- led
- die set
- optical module
- reflex reflector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 16
- 230000011514 reflex Effects 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 4
- 235000017060 Arachis glabrata Nutrition 0.000 claims description 3
- 244000105624 Arachis hypogaea Species 0.000 claims description 3
- 235000010777 Arachis hypogaea Nutrition 0.000 claims description 3
- 235000018262 Arachis monticola Nutrition 0.000 claims description 3
- 235000011511 Diospyros Nutrition 0.000 claims description 3
- 244000236655 Diospyros kaki Species 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 235000020232 peanut Nutrition 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 238000002310 reflectometry Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 3
- 239000000084 colloidal system Substances 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 229910002601 GaN Inorganic materials 0.000 description 7
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
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- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of light source die set suitable for LED, it is characterised in that described device includes：One PCB, at least one LED/light source, the light source base of some radiatings, reflex reflector and an optical module, the utility model causes chip-scale LED/light source module to have good mechanical strength, so as to avoid in application process that outside colloid is subject to be damaged the occurrence of, and good heat conductivity, light efficiency are high.
Description
Technical field
The utility model belongs to LED technology field, and in particular to a kind of LED/light source module.
Background technology
The common configuration feature of current LED white chips includes：Flip chip structure, electrode is arranged on bottom, positive upper table
Face and 4 equal coating fluorescent powders in side.The phosphor powder layer of positive upper surface and four sides is generally solid using Molding and pressing half
The fluorescence blade technolgy of change is come what is realized, and the phosphor powder layer of positive upper surface and four sides is the identical integrally formed structure of material.
But, there is following defect in the LED white chips of the structure：First, it is subject to destruction under by extraneous mechanism；
2nd, unfavorable heat conduction.
Utility model content
The purpose of this utility model is to provide a kind of LED/light source module, the LED/light source module have well machinery it is strong
Degree, thus avoid in application process that outside colloid is subject to be damaged the occurrence of, and good heat conductivity, light efficiency
It is high.
To achieve these goals, the technical scheme that the utility model is used is as follows：
A kind of light source die set suitable for LED, it is characterised in that described device includes：One PCB, extremely
A few LED/light source, at least one heat abstractor, reflex reflector and an optical module；The LED/light source, reflex reflector are all
Be arranged in the PCB, wherein, the LED/light source and the PCB are electrically connected with, the reflex reflector with
The side wall connection of the LED/light source, the side wall to surround the LED/light source；The optical module is arranged on the reflective dress
Put, the heat abstractor is arranged in the corresponding groove positions of PCB.
As a kind of specific embodiment, wherein, reflex reflector is more than 95% organosilicon using reflectivity.
Further, wherein, optical module is made up of transparent glue material, and the transparent glue material includes machine silicon, epoxy, propylene
One or more combinations in acid, polyurethane；The optical module passes through mode automatic moulding for dispensing glue；Or injected by mould
Mode, or mould pressing mode, or mould injection and mould press combination shaping.
Further, wherein, optical module is shaped as hemispherical, square, oval, Fresnel shape, honeycombed, peanut
One kind in shape, cone, regular hexagon, dried persimmon shape.
As a kind of specific embodiment, wherein, one end of the heat abstractor is provided with wire through-hole, in wire through-hole
Place is provided with waterproof wiring terminal；The bottom of the waterproof wiring terminal is plugged into wire through-hole, realizes waterproof wiring end
The sealing of son and wire through-hole is installed.
Brief description of the drawings
Fig. 1 is light source module schematic diagram of the present utility model
Embodiment
In order to be fully understood from the purpose of this utility model, feature and effect, below with reference to accompanying drawing to the utility model
Design, the technique effect of concrete structure and generation is described further.
As shown in figure 1, providing a kind of light source die set suitable for LED for the present embodiment, it is characterised in that the dress
Put including：One PCB 1, at least one LED/light source 2, reflex reflector 3 and optical module 4, at least one radiating
Device 5；The LED/light source, reflex reflector are all disposed within the PCB, wherein, the LED/light source and PCB electricity
Road plate is electrically connected with, and the reflex reflector is connected with the side wall of the LED/light source, the side wall to surround the LED/light source；Institute
State optical module to be arranged on the reflex reflector, the heat abstractor is arranged in the corresponding groove positions of PCB.
Wherein, the LED chip part of composition includes epitaxial substrate layer, is grown on the N-type of the epitaxial substrate layer upper surface
Gallium nitride layer, the luminescent layer for being grown on n type gallium nitride layer segment upper surface and the N for being grown on n type gallium nitride layer segment upper surface
Type ohmic contact layer, in addition to be grown on the p-type gallium nitride layer of luminescent layer upper surface, be grown on p-type gallium nitride layer part upper table
The p-type ohmic contact layer in face, in p-type gallium nitride layer, p-type ohmic contact layer, n type gallium nitride layer and N-type ohmic contact layer upper table
Face is provided with insulating barrier, first through hole is offered on the insulating barrier corresponding to p-type ohmic contact layer upper surface, corresponding to N
The second through hole is offered on the insulating barrier of type ohmic contact layer upper surface, surface is provided with P electrode disconnected from each other on the insulating layer
Bonded layer and N electrode bonded layer, the P electrode bonded layer are electrically connected through first through hole with p-type ohmic contact layer, the N electricity
Pole bonded layer is electrically connected through the second through hole with N-type ohmic contact layer.
The light conversion layer is arranged on top and the side wall of the flip LED chips, specifically, and the light conversion layer is set
In the top of the epitaxial substrate layer and the side wall of flip LED chips.
As a kind of specific embodiment, wherein, reflex reflector is more than 95% organosilicon using reflectivity.
Further, wherein, optical module is made up of transparent glue material, and the transparent glue material includes machine silicon, epoxy, propylene
One or more combinations in acid, polyurethane；The optical module passes through mode automatic moulding for dispensing glue；Or injected by mould
Mode, or mould pressing mode, or mould injection and mould press combination shaping.
Further, wherein, optical module is shaped as hemispherical, square, oval, Fresnel shape, honeycombed, peanut
One kind in shape, cone, regular hexagon, dried persimmon shape.
As a kind of specific embodiment, wherein, one end of the heat abstractor is provided with wire through-hole, in wire through-hole
Place is provided with waterproof wiring terminal；The bottom of the waterproof wiring terminal is plugged into wire through-hole, realizes waterproof wiring end
The sealing of son and wire through-hole is installed.
It should be noted that the utility model is the technical scheme being improved on the basis of existing technology, Wen Zhongwei
Special instruction part, is the common knowledge or prior art of the art, this is no longer repeated one by one.It is described above, only
It is preferred embodiment of the present utility model, any formal limitation is not done to the utility model, thus it is all without departing from this
The content of utility model technical scheme, any is simply repaiied according to technical spirit of the present utility model to made for any of the above embodiments
Change, equivalent variations and modification, in the range of still falling within technical solutions of the utility model.
Claims (5)
1. a kind of light source die set suitable for LED, it is characterised in that described device includes：One PCB, at least
One LED/light source, at least one heat abstractor, reflex reflector and an optical module；The LED/light source, reflex reflector are all set
Put in the PCB, wherein, the LED/light source is electrically connected with the PCB, the reflex reflector and institute
State the side wall connection of LED/light source, the side wall to surround the LED/light source；The optical module is arranged on the reflex reflector
On, the light source base for radiating is arranged in the corresponding groove positions of PCB.
2. light source die set according to claim 1, the reflex reflector is the organosilicon that reflectivity is more than 95%.
3. light source die set according to claim 1, it is characterised in that：The optical module is made up of transparent glue material,
The transparent glue material includes one or more combinations in machine silicon, epoxy, acrylic acid, polyurethane；The optical module passes through
Mode automatic moulding for dispensing glue；Or by way of mould is injected, or the mode that mould is pressed, or mould injection and mould pressing
Combination shaping.
4. light source die set according to claim 1, it is characterised in that：The optical module be shaped as hemispherical,
One kind in square, oval, Fresnel shape, honeycombed, peanut shape, cone, regular hexagon, dried persimmon shape.
5. light source die set according to claim 1, it is characterised in that：One end of the heat abstractor is provided with wire
Through hole, is provided with waterproof wiring terminal at wire through-hole；The bottom of the waterproof wiring terminal is plugged into wire through-hole,
Realize that the sealing of waterproof wiring terminal and wire through-hole is installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720113716.1U CN206398403U (en) | 2017-02-07 | 2017-02-07 | A kind of light source die set suitable for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720113716.1U CN206398403U (en) | 2017-02-07 | 2017-02-07 | A kind of light source die set suitable for LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206398403U true CN206398403U (en) | 2017-08-11 |
Family
ID=59515755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720113716.1U Expired - Fee Related CN206398403U (en) | 2017-02-07 | 2017-02-07 | A kind of light source die set suitable for LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206398403U (en) |
-
2017
- 2017-02-07 CN CN201720113716.1U patent/CN206398403U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 516100 Lianhu, left side of Yangping Road, Lianhu group, Licun village, Yangcun Town, BOLUO County, Huizhou City, Guangdong Province Patentee after: CHINA BRILLIANT ELECTRONIC Co.,Ltd. Address before: 516000, Guangdong, Huizhou province Boluo County town of Yang Lake Industrial Zone Patentee before: CHINA BRILLIANT ELECTRONIC Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170811 |