CN201946598U - LED (Light Emitting Diode) wafer chip packaging structure - Google Patents
LED (Light Emitting Diode) wafer chip packaging structure Download PDFInfo
- Publication number
- CN201946598U CN201946598U CN2011200267832U CN201120026783U CN201946598U CN 201946598 U CN201946598 U CN 201946598U CN 2011200267832 U CN2011200267832 U CN 2011200267832U CN 201120026783 U CN201120026783 U CN 201120026783U CN 201946598 U CN201946598 U CN 201946598U
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- CN
- China
- Prior art keywords
- led
- metal substrate
- brilliant
- luminous
- emitting diode
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- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 abstract description 6
- 230000004048 modification Effects 0.000 abstract description 2
- 238000012986 modification Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 7
- 239000006185 dispersion Substances 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model discloses an LED (Light Emitting Diode) wafer chip packaging structure which comprises LED wafers and a metal substrate, wherein an insulating and heat-conducting wafer slot is arranged on the surface of the metal substrate; the LED wafers are evenly placed in the wafer slot, connected together in parallel-series through a metal wire and connected to the base points of an anode and a cathode; and high-temperature resins are solidified on the LED wafers. By using multipoint packaging, the structure is small in volume, high in power and easy for the modification of optical angles; a parallel-series structure is adopted for connection, so that the damage of a whole chip is not caused and the condition of a series of dead points due to high voltage and high current is not caused; and the LED wafers in the chip overlay the metal substrate so that the heat conduction is easy and the heat dispersion is good.
Description
Technical field
The utility model relates to LED lamp technology, specifically is the luminous brilliant element chip encapsulating structure of a kind of LED.
Background technology
It is the LED light emitting diode construction that present LED luminous body structure adopts the encapsulation of the luminous brilliant unit of single LEDs, and the optics power output is less, and optical texture is once in package shape, can't revise optical texture on the LED light-emitting diode that is shaped.Luminous brilliant unit encapsulates because the LED light-emitting diode is single LEDs, and it is the problem that the LED light-emitting diode can't use that the brilliant unit of LED is damaged.The LED light-emitting diode can not carry out powerful output, the scope of application of restriction.And, the LED light-emitting diode, heat can only dispel the heat radiating treatment difficulty, weak effect after producing on pin two little thin connection metals.
The utility model content
At the problems referred to above, the utility model aims to provide and a kind of the luminous brilliant unit of plurality of LEDs is encapsulated in the luminous brilliant element chip encapsulation of high density LED in the chip.
For realizing this technical purpose, scheme of the present utility model is: the luminous brilliant element chip encapsulating structure of a kind of LED, comprise luminous brilliant unit of LED and metal substrate, described metal substrate face is laid with the brilliant first groove of insulating heat-conductive, the luminous brilliant unit of LED evenly is positioned over this crystalline substance unit groove, the luminous brilliant unit of each LEDs links together by metal wire by the mode of also series connection, and links on the basic point of both positive and negative polarity; Be solidified with high-temperature resin in the luminous brilliant unit of LED.
The beneficial effect of this structure: use the multiple spot encapsulation, volume is little; Under the phase isomorphous elementary work rate, luminous power output can be high than LED light-emitting diode; On the luminous brilliant identical permutation real estate of LED, lighting angle is 180 degree, the chip after the formation, and only need add optical instrument on chip can revise optical angle, and it is easy to revise optical angle; The brilliant first closeness height of chip internal LED, maximization reduces the current delivery loss, and adopting also, cascaded structure connects, under the brilliant first damaged condition of chip internal list LEDs, can not cause whole chips to damage, can't work, can not produce that voltage is higher, electric current is excessive yet and produce the situation at whole string dead point; And the brilliant first veneer metal substrate of the LED in the chip, the heat conduction is easy, perfect heat-dissipating.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is described in further details.
As shown in Figure 1, the luminous brilliant element chip encapsulating structure of a kind of LED of the present utility model, comprise luminous brilliant unit 3 of LED and metal substrate 1, described metal substrate face is laid with the brilliant first groove 2 of insulating heat-conductive, the luminous brilliant unit 3 of LED evenly is positioned over this crystalline substance unit groove 2, the luminous brilliant unit 3 of each LEDs links together by metal wire by the mode of also series connection, and links on the basic point 4 of both positive and negative polarity; Be solidified with high-temperature resin in the luminous brilliant unit 3 of LED.
Concrete manufacture process:
Open a metal substrate earlier, metal substrate can use metal substrates such as copper alloy, aluminium alloy, the brilliant first groove of insulating heat-conductive on metal substrate face cloth; On the first groove of crystalline substance, evenly place brilliant unit; Link together by the mode of also series connection with each the brilliant unit on metal wire (golden conductive resistance the is little) substrate, and link on the basic point of both positive and negative polarity; Stamp high-temperature resin connecting in the brilliant unit of circuit, and put into the high temperature baking box resin solidification on substrate, finish Chip Packaging.
The above; it only is preferred embodiment of the present utility model; not in order to restriction the utility model, every foundation technical spirit of the present utility model to any trickle modification that above embodiment did, be equal to and replace and improve, all should be included within the protection range of technical solutions of the utility model.
Claims (1)
1. luminous brilliant element chip encapsulating structure of LED, comprise luminous brilliant unit of LED and metal substrate, it is characterized in that: described metal substrate face is laid with the brilliant first groove of insulating heat-conductive, the luminous brilliant unit of LED evenly is positioned over this crystalline substance unit groove, the luminous brilliant unit of each LEDs links together by metal wire by the mode of also series connection, and links on the basic point of both positive and negative polarity; Be solidified with high-temperature resin in the luminous brilliant unit of LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200267832U CN201946598U (en) | 2011-01-26 | 2011-01-26 | LED (Light Emitting Diode) wafer chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200267832U CN201946598U (en) | 2011-01-26 | 2011-01-26 | LED (Light Emitting Diode) wafer chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201946598U true CN201946598U (en) | 2011-08-24 |
Family
ID=44473934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200267832U Expired - Fee Related CN201946598U (en) | 2011-01-26 | 2011-01-26 | LED (Light Emitting Diode) wafer chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201946598U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109519735A (en) * | 2017-09-19 | 2019-03-26 | 盐城金意光电科技有限公司 | A kind of LED polishing mould group production method |
-
2011
- 2011-01-26 CN CN2011200267832U patent/CN201946598U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109519735A (en) * | 2017-09-19 | 2019-03-26 | 盐城金意光电科技有限公司 | A kind of LED polishing mould group production method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Shenzhen Joinstar Electronic Co., Ltd. Document name: Notification to Pay the Fees |
|
| DD01 | Delivery of document by public notice |
Addressee: Shenzhen Joinstar Electronic Co., Ltd. Document name: Notification of Termination of Patent Right |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110824 Termination date: 20120126 |