CN203932110U - 一种高可靠性led封装结构 - Google Patents

一种高可靠性led封装结构 Download PDF

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Publication number
CN203932110U
CN203932110U CN201420201574.0U CN201420201574U CN203932110U CN 203932110 U CN203932110 U CN 203932110U CN 201420201574 U CN201420201574 U CN 201420201574U CN 203932110 U CN203932110 U CN 203932110U
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luminescence chip
ppa support
support
ppa
high reliability
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CN201420201574.0U
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龚文
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SHENZHEN JINGTAI CO Ltd
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SHENZHEN JINGTAI CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种高可靠性LED封装结构，包括有PPA支架、发光芯片、金线、固晶胶和封装胶体，其特征在于，所述金线设于PPA支架上且分别与发光芯片表面电极和PPA支架连接，所述PPA支架上安装有底座及散热装置，所述发光芯片与金线采用透明封装胶体保护密封，所述发光芯片通过固晶胶固定在PPA支架上，其中发光芯片固定在PPA支架上的固晶区域设计为粗糙面。本实用新型在固晶前将支架固红光芯片的固晶功能区域做了粗糙面处理，这样就使胶水可以浸透到粗糙面的缝隙中，提高了固晶胶与支架功能区的咬合程度和结合力，进而提升了产品的可靠性能以及使用寿命。

Description

一种高可靠性LED封装结构
技术领域
本实用新型涉及LED照明领域，具体地说是涉及一种高可靠性LED封装结构。
背景技术
近年来，随着LED技术的发展，LED在各行业中的应用也越来越广泛，LED的封装方法、材料、结构和工艺的选择主要由晶片结构、光电/机械特性、具体应用和成本等因素决定。目前现有技术提供的全彩SMD(表面贴装型，SurfaceMounted Devices)支架功能区(固晶区)是光滑面且红光单电极需通过底部固晶胶与支架结合并进行导通，而光滑面由于无缝隙可让胶水渗入结合，产晶在使用过程中固晶胶易与支架底部发生分离而造成失效，尤其在产品吸湿受潮后，失效率急剧增加，严重影响到了产品的可靠性能以及使用寿命，因此如何解决这一问题，成为本领域技术人员急需解决的一个问题。
发明内容
本实用新型要解决的技术问题是克服上述缺陷，提供一种使用寿命长的高可靠性LED封装结构。
为解决上述问题，本实用新型所采用的技术方案是：
一种高可靠性LED封装结构，包括有PPA支架、发光芯片、金线、固晶胶和封装胶体，其特征在于，所述金线设于PPA支架上且分别与发光芯片表面电极和PPA支架连接，所述PPA支架上安装有底座及散热装置，所述发光芯片与金线采用透明封装胶体保护密封，所述发光芯片通过固晶胶固定在PPA支架上，其中发光芯片固定在PPA支架上的固晶区域设计为粗糙面。
优选地，所述PPA支架整体长度为3.mm，宽度为2.8mm，厚度为1.8mm。
优选地，所述PPA支架的底座设于PPA支架的下方且整体长于PPA支架。
优选地，所述发光芯片为红光芯片。
优选地，所述PPA支架为白色表面刷墨PPA支架。
本实用新型与现有技术相比，在固晶前将支架固红光芯片的固晶功能区域做了粗糙面处理，这样就使胶水可以浸透到粗糙面的缝隙中，提高了固晶胶与支架功能区的咬合程度和结合力，进而提升了产品的可靠性能以及使用寿命。
同时下面结合附图和具体实施方式对本实用新型作进一步说明。
附图说明
图1为本实用新型一种高可靠性LED封装结构的整体结构示意图。
图2为现有技术的芯片封装示意图。
图3为本实用新型改进后的芯片封装示意图。
其中，图中：1-PPA支架；2-发光芯片；3-金线；4-固晶胶；5-封装胶体；6-光滑面；7-粗糙面；8-底座。
具体实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述。
如图1、2、3所示，本实用新型提供了一种高可靠性LED封装结构，包括有PPA支架1、发光芯片2、金线3、固晶胶4和封装胶体5，所述金线3设于PPA支架1上且分别与发光芯片2表面电极和PPA支架1连接，所述PPA支架1上安装有底座8及散热装置，所述发光芯片2与金线3采用透明封装胶体5保护密封，所述发光芯片2通过固晶胶4固定在PPA支架1上，其中发光芯片2固定在PPA支架1上的固晶区域设计为粗糙面7。
本实用新型中所述PPA支架1上安装有底座8及散热装置，起到了导热、导电及支撑作用；设于PPA支架1上的金线3将发光芯片2表面电极和PPA支架1连接在一起，起导线作用；固晶胶4将发光芯片2与金线3密封起来，以保护其不受损害；发光芯片2固定在PPA支架1上的固晶区域做了粗糙面7处理，该结构使胶水可以浸透到粗糙面7的缝隙中，提高了固晶胶4与支架功能区的咬合程度和结合力，使发光芯片2安装的更为牢固，极大的提升了产品的可靠性，延长了产品的使用寿命，提高了产品的性价比。
对所公开的实施例的上述说明的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本实用新型的精神或范围的情况下，在其它实施例中实现。因此，本实用新型将不会被限制于本文所示的这些实施例，任何人应该得知在本实用新型的启示下做出的结构变化，凡是与本实用新型具有相同或者相近似的技术方案，均属于本实用新型的保护范围。

Claims (5)

1.一种高可靠性LED封装结构，包括有PPA支架、发光芯片、金线、固晶胶和封装胶体，其特征在于，所述金线设于PPA支架上且分别与发光芯片表面电极和PPA支架连接，所述PPA支架上安装有底座及散热装置，所述发光芯片与金线采用透明封装胶体保护密封，所述发光芯片通过固晶胶固定在PPA支架上，其中发光芯片固定在PPA支架上的固晶区域设计为粗糙面。
2.根据权利要求1中一种高可靠性LED封装结构，其特征在于：所述PPA支架整体长度为3.5mm，宽度为2.8mm，厚度为1.88mm。
3.根据权利要求1中一种高可靠性LED封装结构，其特征在于：所述PPA支架的底座设于PPA支架的下方且整体长于PPA支架。
4.根据权利要求1中一种高可靠性LED封装结构，其特征在于：所述发光芯片为红光芯片。
5.根据权利要求1中一种高可靠性LED封装结构，其特征在于：所述PPA支架为白色表面刷墨PPA支架。
CN201420201574.0U 2014-04-24 2014-04-24 一种高可靠性led封装结构 Expired - Lifetime CN203932110U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113809057A (zh) * 2021-05-25 2021-12-17 吉安市木林森显示器件有限公司 一种应用于防电迁移灯珠的固晶胶及防电迁移灯珠

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113809057A (zh) * 2021-05-25 2021-12-17 吉安市木林森显示器件有限公司 一种应用于防电迁移灯珠的固晶胶及防电迁移灯珠

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