CN203179948U - 一种全空间式光发射的白光led器件 - Google Patents

一种全空间式光发射的白光led器件 Download PDF

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Publication number
CN203179948U
CN203179948U CN2013201305239U CN201320130523U CN203179948U CN 203179948 U CN203179948 U CN 203179948U CN 2013201305239 U CN2013201305239 U CN 2013201305239U CN 201320130523 U CN201320130523 U CN 201320130523U CN 203179948 U CN203179948 U CN 203179948U
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supports
led device
total space
white light
light
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Expired - Fee Related
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CN2013201305239U
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Inventor
严钱军
高基伟
李红兰
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Hangzhou Hangzhou Ke optoelectronic group Limited by Share Ltd
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HANGZHOU HANGKE PHOTOELECTRIC CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch

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Abstract

本实用新型公开的全空间式光发射的白光LED器件包括二根相隔的支架，在其中一根支架上部的固晶平台上固定发光芯片，发光芯片表面的P电极和N电极分别通过键合线与二根支架上的引线相连，在支架上部、发光芯片、键合线和引线外包裹一层混合有荧光粉的外封胶。该白光LED器件可以实现空间上全角度发光，更接近传统光源的发光形态，更便于进行光源替换和灯具设计。

Description

一种全空间式光发射的白光LED器件
技术领域
本实用新型涉及一种白光LED器件，尤其是全空间式光发射的白光LED器件，属于电光源技术领域。
背景技术
LED因其具有体积小、响应速度快、寿命长、可靠性高、功耗低、环保等优点被广泛关注，被认为是将取代白炽灯、荧光灯的第四代照明光源。
和传统白炽灯、荧光灯可以360o全角度发光相比，LED发光的出射角度较小，大多小于120o；这样，LED在原有灯具形式上替代传统光源时，会在发光角度以外的空间位置上出现发光的暗区，也使原有灯具设计中的反射面失效，给LED的推广和应用带来了一定的困扰和难度。
发明内容
本实用新型目的旨在提供一种全空间式光发射的白光LED器件。
本实用新型的全空间式光发射的白光LED器件包括二根相隔的支架，在其中一根支架上部的固晶平台上固定发光芯片，发光芯片表面的P电极和N 电极分别通过键合线与二根支架上的引线相连，在支架上部、发光芯片、键合线和引线外包裹一层混合有荧光粉的外封胶。
上述的外封胶为环氧、有机硅和有机硅改性环氧树脂中的一种或几种，固化前的液态胶水在25℃时的粘度不小于2500mPa·s，且粘度随温度升高而降低的变化率不大于5mPa·s/℃。
上述的荧光粉的平均粒径小于28微米，且荧光粉均匀分布在外封胶中。
与现有技术相比的有益效果：
本实用新型的全空间式光发射的白光LED器件，可以实现类似传统光源的全角度发光，用于照明领域时，比现有LED光源更接近传统光源的发光形态，可以较为便捷地替换传统光源，无需另行根据LED的发光特征设计新的灯具形式，具有良好的产业化前景和应用前景。
附图说明
图1是全空间式光发射的白光LED器件结构示意图。
图2是发光芯片的示意图。
具体实施方式
以下通过实例对本实用新型作进一步描述。
参照图1、图2，本实用新型的全空间式光发射的白光LED器件包括二根相隔的支架1，在其中一根支架1上部的固晶平台上固定发光芯片2，发光芯片2表面的P电极6和N 电极7分别通过键合线3与二根支架上的引线4相连，在支架上部、发光芯片2、键合线3和引线4外包裹一层混合有荧光粉的外封胶5。
此全空间式光发射的白光LED器件相比常见LED器件，抬高了芯片的固定位置，使外封胶中位于芯片下部的荧光粉同样受到激发，因此可以实现类似白炽灯的360°发光。

Claims (1)

1.一种全空间式光发射的白光LED器件，其特征在于包括二根相隔的支架（1），在其中一根支架（1）上部的固晶平台上固定发光芯片（2），发光芯片（2）表面的P电极（6）和N 电极（7）分别通过键合线（3）与二根支架上的引线（4）相连，在支架上部、发光芯片（2）、键合线（3）和引线（4）外包裹一层混合有荧光粉的外封胶（5）。
CN2013201305239U 2013-03-21 2013-03-21 一种全空间式光发射的白光led器件 Expired - Fee Related CN203179948U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103208578A (zh) * 2013-03-21 2013-07-17 杭州杭科光电股份有限公司 一种全角度发光的led光源

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103208578A (zh) * 2013-03-21 2013-07-17 杭州杭科光电股份有限公司 一种全角度发光的led光源

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Address after: Hangzhou City, Zhejiang province 310011 Dengyun Road No. 425 Lilda Building 5 floor

Patentee after: Hangzhou Hangzhou Ke optoelectronic group Limited by Share Ltd

Address before: Hangzhou City, Zhejiang province 310011 Dengyun Road No. 425 Lilda Building 5 floor

Patentee before: Hangzhou Hangke Photoelectric Co., Ltd.

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