CN103208578A - 一种全角度发光的led光源 - Google Patents

一种全角度发光的led光源 Download PDF

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Publication number
CN103208578A
CN103208578A CN2013100919172A CN201310091917A CN103208578A CN 103208578 A CN103208578 A CN 103208578A CN 2013100919172 A CN2013100919172 A CN 2013100919172A CN 201310091917 A CN201310091917 A CN 201310091917A CN 103208578 A CN103208578 A CN 103208578A
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China
Prior art keywords
light
light source
full
led light
angle
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Pending
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CN2013100919172A
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English (en)
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严钱军
高基伟
李红兰
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HANGZHOU HANGKE PHOTOELECTRIC CO Ltd
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HANGZHOU HANGKE PHOTOELECTRIC CO Ltd
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Priority to CN2013100919172A priority Critical patent/CN103208578A/zh
Publication of CN103208578A publication Critical patent/CN103208578A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开的全角度发光的LED光源包括二根相隔的支架，在其中一根支架上部的固晶平台上固定发光芯片，发光芯片表面的P电极和N电极分别通过键合线与二根支架上的引线相连，在支架上部、发光芯片、键合线和引线外包裹一层混合有荧光粉的外封胶。该LED光源可以实现空间上全角度发光，更接近传统光源的发光形态，更便于进行光源替换和灯具设计。

Description

一种全角度发光的LED光源
技术领域
本发明属于电光源技术领域，具体来说，本发明涉及一种LED光源，尤其是全角度发光的LED光源。
背景技术
LED因其具有体积小、响应速度快、寿命长、可靠性高、功耗低、环保等优点被广泛关注，被认为是将取代白炽灯、荧光灯的第四代照明光源。
和传统白炽灯、荧光灯可以360o全角度发光相比，LED发光的出射角度较小，大多小于120o；这样，LED在原有灯具形式上替代传统光源时，会在发光角度以外的空间位置上出现发光的暗区，也使原有灯具设计中的反射面失效，给LED的推广和应用带来了一定的困扰和难度。
发明内容
本发明目的旨在提供一种全角度发光的LED光源。
本发明的全角度发光的LED光源包括二根相隔的支架，在其中一根支架上部的固晶平台上固定发光芯片，发光芯片表面的P电极和N 电极分别通过键合线与二根支架上的引线相连，在支架上部、发光芯片、键合线和引线外包裹一层混合有荧光粉的外封胶。
上述的外封胶为环氧、有机硅和有机硅改性环氧树脂中的一种或几种，固化前液态状在25℃时的粘度大于2500mPa·s，且粘度随温度升高而降低的变化率小于5mPa·s/℃。
本发明中，所述荧光粉的平均粒径小于28微米，且荧光粉均匀分布在外封胶中。为了使荧光粉悬浮在外封胶中，可在外封胶中添加外封胶总量5~20‰的粒径在5~500nm的氧化硅粉体。
与现有技术相比的有益效果：
本发明的全角度发光的LED光源，可以实现类似传统光源的全角度发光，用于照明领域时，比现有LED光源更接近传统光源的发光形态，可以较为便捷地替换传统光源，无需另行根据LED的发光特征设计新的灯具形式，具有良好的产业化前景和应用前景。
附图说明
图1是全角度发光的LED光源结构示意图。
图2是发光芯片的示意图。
具体实施方式
以下通过实例对本发明作进一步描述。
参照图1、图2，本发明的全角度发光的LED光源包括二根相隔的支架1，在其中一根支架1上部的固晶平台上固定发光芯片2，发光芯片2表面的P电极6和N 电极7分别通过键合线3与二根支架上的引线4相连，在支架上部、发光芯片2、键合线3和引线4外包裹一层混合有荧光粉的外封胶5。具体实例：发光芯片选择台湾Epistar公司Venus款式10*23mil蓝光芯片，所用荧光粉的平均粒径为13微米，外封胶为脂肪族环氧树脂，25℃时的粘度2800mPa·s。此光源相比常见封装方式，抬高了芯片的固定位置，荧光粉颗粒在外封胶中均匀分布，可以散射芯片发出的蓝光，使外封胶中位于芯片下部的荧光粉同样受到激发，因此可以实现类似白炽灯的360°发光。

Claims (4)

1.一种全角度发光的LED光源，其特征在于包括二根相隔的支架（1），在其中一根支架（1）上部的固晶平台上固定发光芯片（2），发光芯片（2）表面的P电极（6）和N 电极（7）分别通过键合线（3）与二根支架上的引线（4）相连，在支架上部、发光芯片（2）、键合线（3）和引线（4）外包裹一层混合有荧光粉的外封胶（5）。
2.根据权利要求1所述的全角度发光的LED光源，其特征在于所述的外封胶（5）为环氧、有机硅和有机硅改性环氧树脂中的一种或几种，固化前液态状在25℃时的粘度大于2500mPa·s，且粘度随温度升高而降低的变化率小于5mPa·s/℃。
3.根据权利要求2所述的全角度发光的LED光源，其特征是在外封胶（5）中添加外封胶总量5~20‰的粒径在5~500nm的氧化硅粉体。
4.根据权利要求1所述的全角度发光的LED光源，其特征在于所述的荧光粉的平均粒径小于28微米。
CN2013100919172A 2013-03-21 2013-03-21 一种全角度发光的led光源 Pending CN103208578A (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150354796A1 (en) * 2014-06-04 2015-12-10 Ningbo Yamao Lighting Electric Appliance Company Ltd. Wide-angle emitting led driven by built-in power and assembly method thereof
CN105870307A (zh) * 2016-04-30 2016-08-17 浙江单色电子科技有限公司 一种低光衰紫光led及其制造方法
CN105047796B (zh) * 2015-09-02 2018-09-04 深圳市瑞隆光电科技有限公司 一种全周光led光源及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1270979A (zh) * 2000-05-10 2000-10-25 吉林大学 纳米硅基氧化物改性的有机硅/环氧树脂封装材料
EP1418630A1 (en) * 2002-11-07 2004-05-12 Matsushita Electric Industrial Co., Ltd. LED lamp
CN1908064A (zh) * 2006-08-09 2007-02-07 李学霖 多用途led用有机荧光树脂
CN102593326A (zh) * 2012-03-12 2012-07-18 江门昊坤光电科技有限公司 基于荧光粉分散激发技术的led封装结构及其封装工艺
CN203179948U (zh) * 2013-03-21 2013-09-04 杭州杭科光电股份有限公司 一种全空间式光发射的白光led器件

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1270979A (zh) * 2000-05-10 2000-10-25 吉林大学 纳米硅基氧化物改性的有机硅/环氧树脂封装材料
EP1418630A1 (en) * 2002-11-07 2004-05-12 Matsushita Electric Industrial Co., Ltd. LED lamp
CN1908064A (zh) * 2006-08-09 2007-02-07 李学霖 多用途led用有机荧光树脂
CN102593326A (zh) * 2012-03-12 2012-07-18 江门昊坤光电科技有限公司 基于荧光粉分散激发技术的led封装结构及其封装工艺
CN203179948U (zh) * 2013-03-21 2013-09-04 杭州杭科光电股份有限公司 一种全空间式光发射的白光led器件

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150354796A1 (en) * 2014-06-04 2015-12-10 Ningbo Yamao Lighting Electric Appliance Company Ltd. Wide-angle emitting led driven by built-in power and assembly method thereof
US9752764B2 (en) * 2014-06-04 2017-09-05 Ningbo Yamao Lighting Electric Appliance Company Ltd. Wide-angle emitting LED driven by built-in power and assembly method thereof
CN105047796B (zh) * 2015-09-02 2018-09-04 深圳市瑞隆光电科技有限公司 一种全周光led光源及其制备方法
CN105870307A (zh) * 2016-04-30 2016-08-17 浙江单色电子科技有限公司 一种低光衰紫光led及其制造方法

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Address after: Hangzhou City, Zhejiang province 311122 Yuhang District Xianlin Street Xian Xing Lu 31, No. 33

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Application publication date: 20130717