CN104241503A - 一种led smd支架防潮结构设计方法 - Google Patents

一种led smd支架防潮结构设计方法 Download PDF

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CN104241503A
CN104241503A CN201410539062.XA CN201410539062A CN104241503A CN 104241503 A CN104241503 A CN 104241503A CN 201410539062 A CN201410539062 A CN 201410539062A CN 104241503 A CN104241503 A CN 104241503A
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led
metal
moisture
metal pins
holder
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龚文
邵鹏睿
周姣敏
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SHENZHEN JINGTAI CO Ltd
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SHENZHEN JINGTAI CO Ltd
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Publication of CN104241503A publication Critical patent/CN104241503A/zh
Priority to TW104104999A priority patent/TW201614868A/zh
Priority to PCT/CN2015/078771 priority patent/WO2016058370A1/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种LED SMD支架防潮结构设计方法，包括：金属支架；包裹所述金属支架的反射杯；键合线；固定在所述金属支架上的LED芯片；塑胶；密封和保护所述LED芯片的封装胶。其中，所述金属支架包括：嵌入所述反射杯内的金属引脚和外露在所述反射杯外作为所述金属支架正负电极的金属管脚；其特征在于，除必要的所述LED芯片的摆放区域和所述键合线焊接区域外，保证所述金属引脚的面积最小化，所述塑胶和所述封装胶结合的最大化。本发明改变了传统LED支架的金属引脚的设计，通过减少金属引脚的面积，从而增大反射杯与封装胶的结合面积，进而增大了两者的结合力，有效地减少了水汽进入反射杯内，起到了防潮的作用，从而提升了LED的可靠性及使用寿命。

Description

一种LED SMD支架防潮结构设计方法
技术领域
本发明涉及LED领域，更具体的说是涉及一种LED SMD支架防潮结构设计方法。 
背景技术
随着社会的发展，LED越来越普遍的同时人们对LED的性能要求也越来越高。显示屏用表面贴装型LED器件，特别是户外用的LED器件对环境适应性要求很高，需要具有较高的防潮性能、耐高低温性能。但目前LED显示屏仍然维持较高的失效率，造成的原因之一是因封装胶体和杯体剥离，从而金线断裂或潮气进入器件内部导致失效。由于金属和胶水的结合性不强，且杯底的金属引脚区域所占面积较大，在吸潮和热胀冷缩时，胶水和金属往往最先发生剥离，导致金线断裂从而导致失效。 
因此如何提供一种LED SMD支架的设计方法，可以减少水汽进入反射杯内，从而提高LED显示屏的可靠性和使用寿命是本领域技术人员亟需解决的问题。 
发明内容
有鉴于此，本发明提供了一种可以减少水汽进入反射杯内，从而提高LED显示屏的可靠性和使用寿命的LED SMD支架的设计方法。 
为实现上述目的，本发明提供如下技术方案： 
一种LED SMD支架防潮结构设计方法，包括：金属支架；包裹所述金属支架的反射杯；键合线；固定在所述金属支架上的LED芯片；塑胶；密封和保护所述LED芯片的封装胶。其中，所述金属支架包括：嵌入所述反射杯内的金属引脚和外露在所述反射杯外作为所述金属支架正负电极的金属管脚；其特征在于，除必要的所述LED芯片的摆放区域和所述键合线焊接区域外，保证所述金属引脚的面积最小化，所述塑胶和所述封装胶结合的最大化。 
优选的，在上述一种LED SMD支架防潮结构设计方法中，所述金属引脚采用镂空或收窄的方式来减少面积，且所述金属引脚的形状是不规则的。 
优选的，在上述一种LED SMD支架防潮结构设计方法中，采用金属切割的方法来达到镂空的效果。 
优选的，在上述一种LED SMD支架防潮结构设计方法中，采用金属切割或使所述金属引脚下沉的方法来达到收窄的效果，且下沉高度低于所述金属引脚总高度。 
优选的，在上述一种LED SMD支架防潮结构设计方法中，所述金属引脚所减少的面积由所述塑胶填充。 
本发明通过减少金属引脚的面积，从而增大了反射杯与封装胶的结合面积，进而增大了两者的结合力，有效地减少了水汽进入反射杯内，起到了防潮的效果，从而提升了LED的可靠性及使用寿命。 
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。 
图1附图为本发明的结构示意图。 
在图1中： 
1为金属支架、2为反射杯、3为键合线、4为LED芯片、5为塑胶、6为封装胶、11为金属引脚、12为金属管脚。 
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。 
本发明实施例公开了一种可以减少水汽进入反射杯内，提高LED显示屏的可靠性和使用寿命的LED SMD支架的设计方法。 
请参阅附图1，为本发明公开的一种LED SMD支架防潮结构设计方法的结构示意图，具体包括： 
金属支架1；包裹金属支架1的反射杯2；键合线3；固定在金属支架1上的LED芯片4；塑胶5；密封和保护LED芯片4的封装胶6。其中，金属支架1包括：嵌入反射杯2内的金属引脚11和外露在反射杯2外作为金属支架1正负电极的金属管脚12；其特征在于，除必要的LED芯片的4摆放区域和键合线3焊接区域外，保证金属引脚11的面积最小化，塑胶5和封装胶6结合的最大化。 
本发明改变了传统LED支架的金属引脚的设计，通过减少金属引脚的面积，从而增大反射杯与封装胶的结合面积，进而增大了两者的结合力，有效地减少了水汽进入反射杯内，起到了防潮的作用，从而提升了LED的可靠性及使用寿命。 
为了进一步优化上述技术方案，金属引脚11采用镂空或收窄的方式来减少面积，且金属引脚11的形状是不规则的，这样减少金属引脚11面积的方式具有随意性。 
为了进一步优化上述技术方案，采用金属切割的方法来达到镂空的效果，采用这种方式切割断面平整光滑，质量好。 
为了进一步优化上述技术方案，采用金属切割或使金属引脚11下沉的方法来达到收窄的效果，且下沉高度低于金属引脚11总高度，这样收窄和下沉的部分可以填充塑胶5。 
为了进一步优化上述技术方案，金属引脚11所减少的面积由塑胶5填充。这样保证了和反射杯2材料的一致性，增大了塑胶5的面积，使反射杯2与封装胶6粘合的更加牢固，防止杯体与封装胶剥离，从而阻止了水汽的进入。 
本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。对于实施例公开的装置而言，由于其与实施例公开的方法相对应，所以描述的比较简单，相关之处参见方法部分说明即可。 
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。 

Claims (5)

1.一种LED SMD支架防潮结构设计方法，包括：金属支架(1)；包裹所述金属支架(1)的反射杯(2)；键合线(3)；固定在所述金属支架(1)上的LED芯片(4)；塑胶(5)；密封和保护所述LED芯片(4)的封装胶(6)。其中，所述金属支架(1)包括：嵌入所述反射杯(2)内的金属引脚(11)和外露在所述反射杯(2)外作为所述金属支架(1)正负电极的金属管脚(12)；其特征在于，除必要的所述LED芯片的(4)摆放区域和所述键合线(3)焊接区域外，保证所述金属引脚(11)的面积最小化，所述塑胶(5)和所述封装胶(6)结合的最大化。
2.根据权利要求1所述的一种LED SMD支架防潮结构设计方法，其特征在于，所述金属引脚(11)采用镂空或收窄的方式来减少面积，且所述金属引脚(11)的形状是不规则的。
3.根据权利要求1或2所述的一种LED SMD支架防潮结构设计方法，其特征在于，采用金属切割的方法来达到镂空的效果。
4.根据权利要求1或2所述的一种LED SMD支架防潮结构设计方法，其特征在于，采用金属切割或使所述金属引脚(11)下沉的方法来达到收窄的效果，且下沉高度低于所述金属引脚(11)总高度。
5.根据权利要求1或2所述的一种LED SMD支架防潮结构设计方法，其特征在于，所述金属引脚(11)所减少的面积由所述塑胶(5)填充。
CN201410539062.XA 2014-10-14 2014-10-14 一种led smd支架防潮结构设计方法 Pending CN104241503A (zh)

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TW104104999A TW201614868A (en) 2014-10-14 2015-02-13 Design method of LED SMD (surface mount device) holder moisture-proof structure
PCT/CN2015/078771 WO2016058370A1 (zh) 2014-10-14 2015-05-12 一种led smd支架防潮结构设计方法

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WO2016058370A1 (zh) * 2014-10-14 2016-04-21 深圳市晶台股份有限公司 一种led smd支架防潮结构设计方法
CN114335310A (zh) * 2021-11-30 2022-04-12 佛山市国星光电股份有限公司 一种led器件

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CN114335299B (zh) * 2021-12-27 2023-06-09 江西瑞晟光电科技有限公司 增强防水性能的全彩smd led

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KR20090003378A (ko) * 2007-06-05 2009-01-12 주식회사 루멘스 발광 다이오드 패키지
JP2011198834A (ja) * 2010-03-17 2011-10-06 Citizen Electronics Co Ltd 半導体発光装置
CN101820045B (zh) * 2010-04-09 2014-02-05 江苏伯乐达光电科技有限公司 Led的封装支架、led封装方法及利用该方法制作的led
CN102956795A (zh) * 2012-07-17 2013-03-06 孙百贵 一种top led金属支架及其制造方法
CN103000620A (zh) * 2012-12-05 2013-03-27 深圳市九洲光电科技有限公司 防潮全彩表面贴装器件
CN104241503A (zh) * 2014-10-14 2014-12-24 深圳市晶台股份有限公司 一种led smd支架防潮结构设计方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016058370A1 (zh) * 2014-10-14 2016-04-21 深圳市晶台股份有限公司 一种led smd支架防潮结构设计方法
CN114335310A (zh) * 2021-11-30 2022-04-12 佛山市国星光电股份有限公司 一种led器件

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