WO2017020681A1 - 消除光斑增强散热效果的led封装结构 - Google Patents

消除光斑增强散热效果的led封装结构 Download PDF

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Publication number
WO2017020681A1
WO2017020681A1 PCT/CN2016/089317 CN2016089317W WO2017020681A1 WO 2017020681 A1 WO2017020681 A1 WO 2017020681A1 CN 2016089317 W CN2016089317 W CN 2016089317W WO 2017020681 A1 WO2017020681 A1 WO 2017020681A1
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Prior art keywords
layer
heat dissipation
silicon base
lens
disposed
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PCT/CN2016/089317
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English (en)
French (fr)
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苏文藏
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苏文藏
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Publication of WO2017020681A1 publication Critical patent/WO2017020681A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • the utility model relates to an LED package structure which eliminates the light spot to enhance the heat dissipation effect.
  • the utility model patent publication No. CN202503035U discloses an LED package structure, which comprises a silicon base and an LED chip. a phosphor layer, a light transmissive layer, an insulating layer and a metal reflective conductive layer; an insulating layer is fixed on the silicon base, a metal reflective conductive layer is fixed on the insulating layer, and at least two LEDs are fixed on the metal reflective conductive layer
  • the chip has a light-transmissive layer fixed on the metal reflective conductive layer outside the LED chip, and a phosphor layer is fixed on the inner side of the light-transmitting layer.
  • the structure is improved by the use of the silicon base, the insulating layer and the metal reflective conductive layer to facilitate automation. Pressure welding is beneficial to anti-static integration.
  • the defect lies in the arrangement of the phosphor layer and the light-transmitting layer.
  • the phosphor powder is directly filled so that the phosphor concentrations at different angles are inconsistent and there are spots, and the LED lights are generally installed directly. Soldering on the circuit board, when the LED lamp is working, the heat dissipation effect is relatively poor, which will reduce the service life of the LED lamp, and the defect is worth improving.
  • the purpose of the utility model is to provide an LED package structure for eliminating the light spot enhancement heat dissipation effect for the above technical defects.
  • the technical problem to be solved by the utility model is that the LED package structure is convenient for automatic pressure welding and is beneficial to the foundation of antistatic integration. In the above, through the improvement of the lens, the spot is effectively eliminated, the phosphor layer is effectively protected, and the LED is improved. The heat dissipation performance of the package structure extends the service life.
  • an LED package structure for eliminating a spot-enhanced heat-dissipating effect comprising a silicon base, wherein the silicon base is provided with an insulating layer, the insulating layer A metal reflective conductive layer is disposed thereon, at least three LED chips are fixed on the metal reflective conductive layer, and an inner lens and an outer lens are fixed on the silicon base outside the LED chip from the inside to the outside.
  • a phosphor layer is disposed between the lens and the outer lens, and a transparent adhesive layer is respectively disposed between the phosphor layer and the inner lens and the outer lens.
  • the present invention having the above structure, it is characterized in that a plurality of heat dissipation grooves are arranged side by side at the bottom of the silicon base.
  • the utility model has the advantages that the utility model can facilitate the automatic pressure welding and is beneficial to the anti-static integration, effectively eliminates the light spot by improving the lens, effectively protects the phosphor layer, and simultaneously improves the LED.
  • the heat dissipation performance of the package structure extends the service life.
  • Figure 1 is a schematic view showing the structure of a letter paper of the present invention.
  • silicon base 2, insulating layer; 3, metal reflective conductive layer; 4, LED chip; 5, inner lens; 6, outer lens; 7, phosphor layer; 8, transparent adhesive layer; , heat sink.
  • the LED package structure for eliminating the light spot enhancement heat dissipation effect of the present invention includes a silicon base 1 , wherein the silicon base 1 is provided with an insulation layer 2 .
  • the insulating layer 2 is provided with a metal reflective conductive layer 3, and at least three LED chips 4 are fixed on the metal reflective conductive layer 3, and the silicon base 1 outside the LED chip 4 is from the inside to the outside.
  • the inner lens 5 and the outer lens 6 are fixed at intervals, a phosphor layer 7 is disposed between the inner lens 5 and the outer lens 6, and a transparent rubber layer 8 is disposed between the phosphor layer 7 and the inner lens 5 and the outer lens 6, respectively. .
  • a plurality of heat dissipation grooves 9 are arranged side by side at the bottom of the silicon base 1.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

一种消除光斑增强散热效果的LED封装结构，包括硅基座（1），硅基座（1）上设置有绝缘层（2），绝缘层（2）上设置有金属反光导电层（3），在金属反光导电层（3）上固定有至少三个的LED芯片（4），在LED芯片（4）外侧的硅基座（1）上自内至外间隔固定有内透镜（5）和外透镜（6），在内透镜（5）和外透镜（6）之间设有荧光粉层（7），在荧光粉层（7）与内透镜（5）和外透镜（6）之间分别设有透明胶层（8），在硅基座（1）的底部并排间隔设置有若干个散热槽（9），在便于自动化压焊，有利于防静电集成的基础上，通过对透镜的改进，有效消除光斑和保护荧光粉层，同时提高LED封装结构的散热性能，延长使用寿命。

Description

消除光斑增强散热效果的LED封装结构 技术领域
本实用新型涉及一种消除光斑增强散热效果的LED封装结构。
背景技术
目前LED封装的样式多装多样，但其基座存在不易整体加工和不易实现防静电集成的问题，我国实用新型专利公告号CN202503035U公开了一种LED封装结构，其包括硅基座、LED芯片、荧光粉层、透光层、绝缘层和金属反光导电层；在硅基座上固定有绝缘层，在绝缘层上固定有金属反光导电层，在金属反光导电层上固定有至少两个的LED芯片，在LED芯片外侧的金属反光导电层上固定有透光层，在透光层内侧固定有荧光粉层，该结构改进通过硅基座、绝缘层和金属反光导电层的配合使用，便于自动化压焊，有利于防静电集成，其缺陷在于，荧光粉层和透光层的设置，荧光粉胶直接填充使得各角度的荧光粉浓度不一致而存在光斑，而安装时一般都是将LED灯直接焊接在电路板上，当LED灯工作时，散热效果比较差，这样就会降低LED灯的使用寿命，所述缺陷值得改进。
实用新型内容
本实用新型的目的在于针对上述技术缺陷提供一种消除光斑增强散热效果的LED封装结构，本实用新型需要解决的技术问题是针对LED封装结构，在便于自动化压焊，有利于防静电集成的基础上，通过对透镜的改进，有效消除光斑，有效保护荧光粉层，同时提高LED 封装结构的散热性能，延长使用寿命。
本实用新型所采用的技术方案如下所述：一种消除光斑增强散热效果的LED封装结构，包括硅基座，其特征在于，所述的硅基座上设置有绝缘层，所述的绝缘层上设置有金属反光导电层，在金属反光导电层上固定有至少三个的LED芯片，在所述的LED芯片外侧的硅基座上自内至外间隔固定有内透镜和外透镜，在内透镜和外透镜之间设有荧光粉层，在荧光粉层与内透镜和外透镜之间分别设有透明胶层。
根据上述结构的本实用新型，其特征还在于，在所述硅基座的底部并排间隔设置有若干个散热槽。
根据上述结构的本实用新型，其有益效果在于，本实用新型在便于自动化压焊，有利于防静电集成的基础上，通过对透镜的改进，有效消除光斑，有效保护荧光粉层，同时提高LED封装结构的散热性能，延长使用寿命。
附图说明
下面结合附图以及实施方式对本实用新型进行进一步的描述：
图1为本实用新型公函纸结构示意图。
在图中，1、硅基座；2、绝缘层；3、金属反光导电层；4、LED芯片；5、内透镜；6、外透镜；7、荧光粉层；8、透明胶层；9、散热槽。
具体实施方式
如图1所示，本实用新型的消除光斑增强散热效果的LED封装结构，包括硅基座1，其特征在于，所述的硅基座1上设置有绝缘层2， 所述的绝缘层2上设置有金属反光导电层3，在金属反光导电层3上固定有至少三个的LED芯片4，在所述的LED芯片4外侧的硅基座1上自内至外间隔固定有内透镜5和外透镜6，在内透镜5和外透镜6之间设有荧光粉层7，在荧光粉层7与内透镜5和外透镜6之间分别设有透明胶层8。
如图1所示，在所述硅基座1的底部并排间隔设置有若干个散热槽9。
虽然本实用新型参照上述的实施例来描述,但是本技术领域中的普通技术人员完全能够很清楚的认识到以上的实施例仅是用于说明本实用新型，其中可作各种变化和修改而在广义上并没有脱离本实用新型,所以并非作为对本实用新型的限定,只要在本实用新型的实质精神范围内,对以上所述的实施例的变化、变形都将落入本实用新型要求的保护范围之内。

Claims (2)

  1. 一种消除光斑增强散热效果的LED封装结构，包括硅基座，其特征在于，所述的硅基座上设置有绝缘层，所述的绝缘层上设置有金属反光导电层，在金属反光导电层上固定有至少三个的LED芯片，在所述的LED芯片外侧的硅基座上自内至外间隔固定有内透镜和外透镜，在内透镜和外透镜之间设有荧光粉层，在荧光粉层与内透镜和外透镜之间分别设有透明胶层。
  2. 根据权利要求1所述的消除光斑增强散热效果的LED封装结构，其特征还在于，在所述硅基座的底部并排间隔设置有若干个散热槽。
PCT/CN2016/089317 2015-08-03 2016-07-08 消除光斑增强散热效果的led封装结构 WO2017020681A1 (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107123721A (zh) * 2017-07-06 2017-09-01 厦门多彩光电子科技有限公司 一种带透镜式led封装结构及封装方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204792905U (zh) * 2015-08-03 2015-11-18 苏文藏 消除光斑增强散热效果的led封装结构
CN106784261B (zh) * 2016-11-30 2020-06-09 深圳市聚飞光电股份有限公司 一种分层型量子点led背光源的制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203589079U (zh) * 2013-11-09 2014-05-07 梁文辉 Led封装
CN204792905U (zh) * 2015-08-03 2015-11-18 苏文藏 消除光斑增强散热效果的led封装结构

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203589079U (zh) * 2013-11-09 2014-05-07 梁文辉 Led封装
CN204792905U (zh) * 2015-08-03 2015-11-18 苏文藏 消除光斑增强散热效果的led封装结构

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107123721A (zh) * 2017-07-06 2017-09-01 厦门多彩光电子科技有限公司 一种带透镜式led封装结构及封装方法
CN107123721B (zh) * 2017-07-06 2023-07-07 深圳市永吉光电科技有限公司 一种带透镜式led封装结构及封装方法

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