TWI432673B - Ｌｅｄ驅動晶片之整合裝置 - Google Patents

Ｌｅｄ驅動晶片之整合裝置 Download PDF

Info

Publication number
TWI432673B
TWI432673B TW100127714A TW100127714A TWI432673B TW I432673 B TWI432673 B TW I432673B TW 100127714 A TW100127714 A TW 100127714A TW 100127714 A TW100127714 A TW 100127714A TW I432673 B TWI432673 B TW I432673B
Authority
TW
Taiwan
Prior art keywords
led
insulating substrate
chips
driving
chip
Prior art date
Application number
TW100127714A
Other languages
English (en)
Other versions
TW201307737A (zh
Inventor
Yang Kuao Kuo
Chin Peng Wang
Li Hwang Lu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW100127714A priority Critical patent/TWI432673B/zh
Priority to US13/239,569 priority patent/US8829537B2/en
Publication of TW201307737A publication Critical patent/TW201307737A/zh
Application granted granted Critical
Publication of TWI432673B publication Critical patent/TWI432673B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Description

LED驅動晶片之整合裝置
本發明是有關於一種LED驅動晶片之整合裝置，尤指一種可將複數驅動晶片、電源單元及複數LED晶片整合於同一絕緣基板上，而達到易於製作、防止突波、防止雷擊、降低電磁干擾、具有較佳之散熱能力以及防止LED晶片有熱衰竭現象者。
按，隨著全球環保的意識抬頭，節能省電已成為當今的趨勢，其中LED產業是近年來最受矚目的產業之一，且發展至今，LED產品已具有節能、省電、高效率、反應時間快、壽命週期長、不含汞及具有環保效益…等優點。
而以目前高電壓驅動IC散熱基板開發而言，該高亮度LED封裝後之發光晶片通常將設計與驅動IC模組分開，LED晶片與封裝為同一模組，驅動IC為單獨一個模組，傳統的設計與製造方式驅動IC必須模組化，使得製造成本大增且熱散性能不佳。
再者一般之LED高功率產品輸入功率約為20%能轉換成光，剩下80%的電能均轉換為熱能，所以在現階段的整個系統之散熱瓶頸，且多數發生在將熱量從LED傳導至其基板再到系統電路板為主。
然而該LED照明系統通常被要求高亮度、高壽命、高穩定度，現階段所有LED規範大都以路燈為基準，其基準大部分要求3萬小時其光衰小於20%，但是現階段許多LED路燈 測試在未達3萬小時LED燈泡就熄滅，經統計其中三分之一原因來自驅動IC的不穩定，而造成驅動IC不穩定最主要原因來自Power IC所產生的熱能無法順利排出。
因此，本案之發明人特潛心研究，開發出一種LED驅動晶片之整合裝置，以改善目前習用之種種缺失。
本發明之主要目的係在於，可將複數驅動晶片、電源單元及複數LED晶片整合於同一絕緣基板上，而達到易於製作、防止突波、防止雷擊、降低電磁干擾、具有較佳之散熱能力以及防止LED晶片有熱衰竭現象。
為達上述之目的，本發明係一種LED驅動晶片之整合裝置，其第一之技術手段係包含有：一絕緣基板；複數驅動晶片，係設於絕緣基板之一面上；一電源單元，係設於絕緣基板之一面上且與各驅動晶片電性連接；以及複數LED晶片，係設於絕緣基板之另面上且與各驅動晶片電性連接。
於上述之實施例中，該絕緣基板係可為氮化鋁基板。
於上述之實施例中，該絕緣基板之一面上更可進一步設置有散熱鰭片組。
於上述之實施例中，該散熱鰭片組係可為銅、鋁之材質。
於上述之實施例中，該絕緣基板係以矽穿孔技術(TSV)設有電路佈局層，使各驅動晶片與各LED晶片利用電路佈局 層進行電性連接。
於上述之實施例中，各LED晶片係為高亮度LED晶片。
本發明LED驅動晶片之整合裝置，其第二之技術手段係包含有：一絕緣基板；一電源單元，係設於絕緣基板之一面上；以及複數LED晶片，係設於絕緣基板之另面上且與電源單元電性連接。
於上述之實施例中，該絕緣基板係可為氮化鋁基板。
於上述之實施例中，該絕緣基板之一面上更可進一步設置有複數驅動晶片及散熱鰭片組，而該絕緣基板係以矽穿孔技術(TSV)設有電路佈局層，使各驅動晶片與各LED晶片利用電路佈局層進行電性連接。
於上述之實施例中，該散熱鰭片組係可為銅、鋁之材質。
於上述之實施例中，各LED晶片係為高亮度LED晶片。
本發明LED驅動晶片之整合裝置，其第三之技術手段係包含有：一絕緣基板；以及一電源單元，係設於絕緣基板之一面上。
於上述之實施例中，該絕緣基板係可為氮化鋁基板。
於上述之實施例中，該絕緣基板之一面上更可進一步設置有複數驅動晶片及散熱鰭片組，而絕緣基板之另面上係設有複數與電源單元電性連接之LED晶片，且該絕緣基板係以矽穿孔技術(TSV)設有電路佈局層，使各驅動晶片與各LED晶片利用電路佈局層進行電性連接。
於上述之實施例中，該散熱鰭片組係可為銅、鋁之材質。
於上述之實施例中，各LED晶片係為高亮度LED晶片。
請參閱『第1、2及第3圖』所示，係分別為本發明第一實施例之外觀示意圖、本發明第一實施例之分解示意圖及本發明第一實施例之使用狀態示意圖。如圖所示：本發明係一種LED驅動晶片之整合裝置，其至少包含有一絕緣基板1、複數驅動晶片2、一電源單元3以及複數LED晶片4所構成。
上述所提之絕緣基板1係可為氮化鋁基板，且該絕緣基板1之一面上更可進一步設置有散熱鰭片組11，而該散熱鰭片組11係可為銅、鋁之材質。
該驅動晶片2係設於絕緣基板1之一面上。
該電源單元3係設於絕緣基板1之一面上且與各驅動晶片2電性連接。
各LED晶片4係設於絕緣基板1之另面上且與各驅動晶片2電性連接，而各LED晶片4係為高亮度LED晶片，且該絕緣基板1係以矽穿孔技術(TSV)設有電路佈局層12，使各驅動晶片2與各LED晶片4利用電路佈局層12進行電性連接；如此，可將複數驅動晶片2、電源單元3及複數LED晶片4整合於同一絕緣基板1上，而達到易於製作之功效。
當使用時，係可將各驅動晶片2、電源單元3及各LED晶片4整合於同一絕緣基板1上之後，再設置於一所需之殼座5中，並由各驅動晶片2與電源單元3之相互配合，使各LED晶片4發出所需之照明光源，且當各LED晶片4於運作過程 中發出熱源時，係可由該絕緣基板1以及散熱鰭片組11吸收相關之熱源後由大氣環境吸收進行散逸，而不會有積熱之現象發生，藉以達到熱散之效果，進而可防止各LED晶片4有熱衰竭現象，此外，本發明將複數驅動晶片2、電源單元3及複數LED晶片4整合於同一絕緣基板1上，因此，於使用時可同時達到防止突波、防止雷擊、降低電磁干擾之功效。
請參閱『第4圖』所示，係本發明第二實施例之外觀示意圖。如圖所示：本發明除上述第一實施例所提結構型態之外，亦可為本第二實施例之結構型態，而其所不同之處係在於，該絕緣基板1之一面上係可設有一電源單元3，且該於絕緣基板1之另面上係設有複數與電源單元3電性連接之LED晶片4，而使該些驅動晶片可於後續製程中以矽穿孔技術(TSV)與各LED晶片4進行電性連接；藉以使本發明能更符合實際使用時之所需。
請參閱『第5圖』所示，係本發明第三實施例之外觀示意圖。如圖所示：本發明除上述第一及第二實施例所提結構型態之外，亦可為本第三實施例之結構型態，而其所不同之處係在於，該絕緣基板1之一面上係可設有一電源單元3，而使該些驅動晶片、電源單元及複數LED晶片可於後續製程中以矽穿孔技術(TSV)與電源單元3進行電性連接；藉以使本發明能更符合實際使用時之所需。
綜上所述，本發明LED驅動晶片之整合裝置可有效改善習用之種種缺點，可將複數驅動晶片、電源單元及複數LED晶片整合於同一絕緣基板上，而達到易於製作、防止突波、防止雷擊、降低電磁干擾、具有較佳之散熱能力以及防止LED 晶片有熱衰竭現象；進而使本發明之產生能更進步、更實用、更符合消費者使用之所須，確已符合發明專利申請之要件，爰依法提出專利申請。
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍；故，凡依本發明申請專利範圍及發明說明書內容所作之簡單的等效變化與修飾，皆應仍屬本發明專利涵蓋之範圍內。
1‧‧‧絕緣基板
11‧‧‧散熱鰭片組
12‧‧‧電路佈局層
2‧‧‧驅動晶片
3‧‧‧電源單元
4‧‧‧LED晶片
5‧‧‧殼座
第1圖，係本發明第一實施例之外觀示意圖。
第2圖，係本發明第一實施例之分解示意圖。
第3圖，係本發明第一實施例之使用狀態示意圖。
第4圖，係本發明第二實施例之外觀示意圖。
第5圖，係本發明第三實施例之外觀示意圖。
1‧‧‧絕緣基板
11‧‧‧散熱鰭片組
12‧‧‧電路佈局層
2‧‧‧驅動晶片
3‧‧‧電源單元
4‧‧‧LED晶片

Claims (4)

  1. 一種LED驅動晶片之整合裝置，包括有：一絕緣基板，係可為氮化鋁基板；複數驅動晶片，係設於絕緣基板之一面上；一電源單元，係設於絕緣基板之一面上且與各驅動晶片電性連接；以及複數LED晶片，係設於絕緣基板之另面上且與各驅動晶片電性連接，其中，該絕緣基板係以矽穿孔技術(TSV)設有電路佈局層，使各驅動晶片與各LED晶片利用電路佈局層進行電性連接。
  2. 依申請專利範圍第1項所述之LED驅動晶片之整合裝置，其中，該絕緣基板之一面上更可進一步設置有散熱鰭片組。
  3. 依申請專利範圍第2項所述之LED驅動晶片之整合裝置，其中，該散熱鰭片組係可為銅、鋁之材質。
  4. 依申請專利範圍第1項所述之LED驅動晶片之整合裝置，其中，各LED晶片係為高亮度LED晶片。
TW100127714A 2011-08-04 2011-08-04 Ｌｅｄ驅動晶片之整合裝置 TWI432673B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100127714A TWI432673B (zh) 2011-08-04 2011-08-04 Ｌｅｄ驅動晶片之整合裝置
US13/239,569 US8829537B2 (en) 2011-08-04 2011-09-22 Integrated apparatus including driver chips, a power supply and LED chips on an isolative substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100127714A TWI432673B (zh) 2011-08-04 2011-08-04 Ｌｅｄ驅動晶片之整合裝置

Publications (2)

Publication Number Publication Date
TW201307737A TW201307737A (zh) 2013-02-16
TWI432673B true TWI432673B (zh) 2014-04-01

Family

ID=47626409

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100127714A TWI432673B (zh) 2011-08-04 2011-08-04 Ｌｅｄ驅動晶片之整合裝置

Country Status (2)

Country Link
US (1) US8829537B2 (zh)
TW (1) TWI432673B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9560722B2 (en) 2013-03-25 2017-01-31 The Hong Kong University Of Science And Technology Power system-on-chip architecture
JP6653469B2 (ja) * 2015-09-18 2020-02-26 パナソニックＩｐマネジメント株式会社 Ｌｅｄモジュール

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040022038A1 (en) * 2002-07-31 2004-02-05 Intel Corporation Electronic package with back side, cavity mounted capacitors and method of fabrication therefor
DE102005060081B4 (de) * 2005-12-15 2007-08-30 Infineon Technologies Ag Elektronisches Bauteil mit zumindest einer Leiterplatte und mit einer Mehrzahl gleichartiger Halbleiterbausteine und Verfahren
US8057057B2 (en) * 2006-08-11 2011-11-15 Lg Innotek Co., Ltd. Light unit and liquid crystal display device having the same
US7665862B2 (en) * 2006-09-12 2010-02-23 Cree, Inc. LED lighting fixture
KR101545939B1 (ko) * 2008-10-27 2015-08-21 삼성디스플레이 주식회사 광원 모듈, 이의 제조방법 및 이를 갖는 백라이트 어셈블리
US8299488B2 (en) * 2010-12-16 2012-10-30 King Dragon International Inc. LED chip
US20120146539A1 (en) * 2010-12-10 2012-06-14 Scott Arthur Riesebosch Jitter detection and compensation circuit for led lamps

Also Published As

Publication number Publication date
US8829537B2 (en) 2014-09-09
US20130032826A1 (en) 2013-02-07
TW201307737A (zh) 2013-02-16

Similar Documents

Publication Publication Date Title
US7965029B2 (en) Light-emitting diode illumination apparatus
US20100128484A1 (en) Led heat dissipation structure
TWI613391B (zh) 發光二極體組件及應用此發光二極體組件的發光二極體燈泡
CA2610026A1 (en) Light-emitting diode cluster lamp
KR20140118466A (ko) 발광 디바이스 및 이를 포함하는 조명장치
KR20080020668A (ko) 열전달/발산 모듈을 구비한 반도체 발광 장치
US9349930B2 (en) LED module and lighting assembly
JP2006179894A (ja) 発光素子
US7459783B2 (en) Light emitting chip package and light source module
CN201576701U (zh) Led灯芯片金属散热装置
TW201508951A (zh) Ｌｅｄ發光裝置
CN102593317B (zh) 一种高功率高亮度led光源封装结构及其封装方法
TWI432673B (zh) Ｌｅｄ驅動晶片之整合裝置
WO2017020681A1 (zh) 消除光斑增强散热效果的led封装结构
US20120025719A1 (en) LED Tube and Drive Circuit thereof
TWI449226B (zh) 用於發光二極體裝置的散熱結構
CN101676630B (zh) 发光二极管灯泡
TW201445082A (zh) 發光裝置
CN203983277U (zh) 一种车用照明的大功率led cob直接封装结构
KR20100001116A (ko) 방열 ｌｅｄ 마운트 및 램프
CN205424463U (zh) 一种基于软性线路板的led灯
CN103943619B (zh) 一种车用照明的大功率led cob倒装封装结构
TWI526699B (zh) Ｌｅｄ發光裝置及其承載座
WO2012058850A1 (zh) 一种led灯管
WO2007095780A1 (fr) Del haute puissance de type à broches