CN201191618Y - 一种平凸透镜封装的led - Google Patents

一种平凸透镜封装的led Download PDF

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Publication number
CN201191618Y
CN201191618Y CNU2008200937368U CN200820093736U CN201191618Y CN 201191618 Y CN201191618 Y CN 201191618Y CN U2008200937368 U CNU2008200937368 U CN U2008200937368U CN 200820093736 U CN200820093736 U CN 200820093736U CN 201191618 Y CN201191618 Y CN 201191618Y
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planoconvex spotlight
led
lead frame
lens
encapsulated
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邓维增
黄科
肖从清
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Shenzhen Jiuzhou Optoelectronics Technology Co Ltd
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SHENZHEN JIUZHOU PHOTOELECTRON CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

本实用新型公开了一种平凸透镜封装的LED，包括LED芯片，所述LED芯片由平凸透镜封装在反射杯中，通过银浆粘接在第一引线框架上，并通过金线与第二引线框架电气连接。本实用新型以灌胶工艺而成的平凸透镜形成PLCC封装，从而消除了透镜附着在PLCC封装上的需要，在较大程度上降低了产品封装的故障率，解决了与所附着的透镜相关的品质问题。

Description

一种平凸透镜封装的LED
技术领域：
本实用新型涉及LED封装技术，特别是一种平凸透镜封装的LED。
背景技术：
由于LED光源耗电少、寿命长、反应灵敏、不含有毒物质等特点，使得这种节能环保型的新型光源得到了广泛的应用，如背光源、显示屏、汽车灯以及各种照明场所。
带引线的塑料芯片载体即PLCC(Plastic Leaded Chip Carrier)封装是LED封装形式中的一种。PLCC封装方式，外形呈正方形，32脚封装，四周都有管脚，外形尺寸较小。PLCC封装适合用SMT表面安装技术在PCB上安装布线，具有外形尺寸小、可靠性高的优点。
目前带透镜的PLCC封装通过在平顶PLCC封装上附着透镜而生产，其主要是在PLCC封装的平顶处涂覆材料，接着将透镜粘附在PLCC封装的顶部，从而生产出带透镜的PLCC封装。
当前用于生产透镜PLCC封装的工艺存在的问题是所附着的透镜会倾斜或没有正确地定心，从而降低了光效。另一个问题就是涂覆粘胶的量不易控制而引起的对光效的影响。再有一个就是在制造过程中引起的品质问题，这种工艺流程将在较大程度上导致良品率的降低，而且对它的检测成本也变得较高。
另外，这样粘贴上去的透镜会随着时间的增长而出现分层，从而降低封装的性能。鉴于这些问题，需要一种新的封装工艺来解决。
实用新型内容：
为解决上述问题，本实用新型的目的在于提供一种平凸透镜封装的LED，通过使用灌胶工艺形成PLCC封装，以达到形成带有平凸透镜的LED封装，实现消除将透镜附着在PLCC封装上的需要。
为实现上述目的，本实用新型采用如下技术方案：
一种平凸透镜封装的LED，包括LED芯片，所述LED芯片由平凸透镜封装在反射杯中，通过银浆粘接在第一引线框架上，并通过金线与第二引线框架电气连接。
所述平凸透镜的弧度轴线与反射杯的轴心重合。
所述平凸透镜的弧度位于反射杯之内，且其外延部分包围在第一引线框架和第二引线框架的向上突出部分。
本实用新型以灌胶工艺而成的平凸透镜形成PLCC封装，从而消除了透镜附着在PLCC封装上的需要，在较大程度上降低了产品封装的故障率，解决了与所附着的透镜相关的品质问题。
附图说明：
图1为本实用新型结构示意图。
图中标识说明：LED芯片1、金线2、第二引线框架3、第一引线框架4、平凸透镜5。
具体实施方式：
本实用新型封装的过程中，在已形成的反射杯PLCC封装中用银浆粘接(焊接)LED芯片在第一引线框架上，然后用金线将LED芯片电气连接至第二引线框架上，然后将由灌胶工艺形成平凸透镜封装在已有的PLCC封装的反射杯中，并使平凸透镜的弧度轴线与反射杯的轴心重合，以及使平凸透镜的弧度完全处在反射杯之内，平凸透镜的外延部分包围着已有的PLCC封装在第一引线框架和第二引线框架的向上突出部分。
请参见图1所示，本实用新型为一种平凸透镜封装的LED，包括LED芯片1，所述LED芯片1由平凸透镜5封装在反射杯中，这里的反射杯是由第一引线框架4与第二引线框架3通过PLCC封装而形成的，而在第一引线框架4上则通过银浆粘接或焊接有LED芯片1，而第二引线框架3上则设置有与LED芯片1电气连接的金线2。
其中，平凸透镜5的弧度完全位于反射杯之内，且平凸透镜5的弧度轴线与反射杯的轴心重合，而其外延部分则包围在第一引线框架和第二引线框架的向上突出部分。
以上对本实用新型所提供的一种平凸透镜封装的LED进行了详细介绍，本文中应用了具体个例对本实用新型的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本实用新型的方法及其核心思想；同时，对于本领域的一般技术人员，依据本实用新型的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本实用新型的限制。

Claims (3)

1、一种平凸透镜封装的LED，包括LED芯片(1)，其特征在于：所述LED芯片(1)由平凸透镜(5)封装在反射杯中，通过银浆粘接在第一引线框架(4)上，并通过金线(2)与第二引线框架(3)电气连接。
2、根据权利要求1所述的平凸透镜封装的LED，其特征在于：所述平凸透镜(5)的弧度轴线与反射杯的轴心重合。
3、根据权利要求1所述的平凸透镜封装的LED，其特征在于：所述平凸透镜(5)的弧度位于反射杯之内，且其外延部分包围在第一引线框架(4)和第二引线框架(3)的向上突出部分。
CNU2008200937368U 2008-04-30 2008-04-30 一种平凸透镜封装的led Expired - Fee Related CN201191618Y (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102064267A (zh) * 2010-11-02 2011-05-18 佛山市国星光电股份有限公司 显示屏用的led支架单元、led支架及led支架单元的制造方法
CN101572282B (zh) * 2008-04-30 2012-05-30 深圳市九洲光电科技有限公司 一种平凸透镜封装的led及其制造方法
CN102024710B (zh) * 2009-09-18 2012-08-29 展晶科技(深圳)有限公司 光电元件的制造方法、封装结构及其封装装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101572282B (zh) * 2008-04-30 2012-05-30 深圳市九洲光电科技有限公司 一种平凸透镜封装的led及其制造方法
CN102024710B (zh) * 2009-09-18 2012-08-29 展晶科技(深圳)有限公司 光电元件的制造方法、封装结构及其封装装置
CN102064267A (zh) * 2010-11-02 2011-05-18 佛山市国星光电股份有限公司 显示屏用的led支架单元、led支架及led支架单元的制造方法

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