CN203691741U - 一种柔性线路板的接地结构 - Google Patents
一种柔性线路板的接地结构 Download PDFInfo
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- CN203691741U CN203691741U CN201320865060.0U CN201320865060U CN203691741U CN 203691741 U CN203691741 U CN 203691741U CN 201320865060 U CN201320865060 U CN 201320865060U CN 203691741 U CN203691741 U CN 203691741U
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- hole
- circuit board
- flexible circuit
- ground structure
- glued membrane
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- 229910000831 Steel Inorganic materials 0.000 claims abstract description 29
- 239000010959 steel Substances 0.000 claims abstract description 29
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000012528 membrane Substances 0.000 claims description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000013459 approach Methods 0.000 claims description 2
- 239000002313 adhesive film Substances 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 2
- 101150095744 tin-9.1 gene Proteins 0.000 description 9
- 230000010412 perfusion Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 208000033999 Device damage Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201320865060.0U CN203691741U (zh) | 2013-12-25 | 2013-12-25 | 一种柔性线路板的接地结构 |
Applications Claiming Priority (1)
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CN201320865060.0U CN203691741U (zh) | 2013-12-25 | 2013-12-25 | 一种柔性线路板的接地结构 |
Publications (1)
Publication Number | Publication Date |
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CN203691741U true CN203691741U (zh) | 2014-07-02 |
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CN201320865060.0U Expired - Lifetime CN203691741U (zh) | 2013-12-25 | 2013-12-25 | 一种柔性线路板的接地结构 |
Country Status (1)
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CN (1) | CN203691741U (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106211564A (zh) * | 2016-08-31 | 2016-12-07 | 大连吉星电子股份有限公司 | 一种柔性电路板元件与接地钢片连接装置与方法 |
CN106231782A (zh) * | 2016-08-08 | 2016-12-14 | 江西省天翌光电有限公司 | 一种主动接地的fpc柔性电路板钢片及其加工技术 |
CN107037924A (zh) * | 2017-03-13 | 2017-08-11 | 深圳市骏达光电股份有限公司 | 线路板组件、触感模组及触感模组的制造工艺 |
CN108282954A (zh) * | 2018-01-24 | 2018-07-13 | 维沃移动通信有限公司 | 一种电路板、电子设备和电路板制作方法 |
CN108990322A (zh) * | 2018-08-16 | 2018-12-11 | 鹤山市得润电子科技有限公司 | 一种双面电路板及其制造方法 |
-
2013
- 2013-12-25 CN CN201320865060.0U patent/CN203691741U/zh not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106231782A (zh) * | 2016-08-08 | 2016-12-14 | 江西省天翌光电有限公司 | 一种主动接地的fpc柔性电路板钢片及其加工技术 |
CN106211564A (zh) * | 2016-08-31 | 2016-12-07 | 大连吉星电子股份有限公司 | 一种柔性电路板元件与接地钢片连接装置与方法 |
CN106211564B (zh) * | 2016-08-31 | 2018-11-09 | 大连吉星电子股份有限公司 | 一种柔性电路板元件与接地钢片连接装置与方法 |
CN107037924A (zh) * | 2017-03-13 | 2017-08-11 | 深圳市骏达光电股份有限公司 | 线路板组件、触感模组及触感模组的制造工艺 |
CN108282954A (zh) * | 2018-01-24 | 2018-07-13 | 维沃移动通信有限公司 | 一种电路板、电子设备和电路板制作方法 |
CN108282954B (zh) * | 2018-01-24 | 2020-05-26 | 维沃移动通信有限公司 | 一种电路板、电子设备和电路板制作方法 |
CN108990322A (zh) * | 2018-08-16 | 2018-12-11 | 鹤山市得润电子科技有限公司 | 一种双面电路板及其制造方法 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN XINYU TENGYUE ELECTRONICS CO., LTD. Free format text: FORMER NAME: SHENZHEN ZHONGXING XINYU FPC CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 518105 Guangdong city of Shenzhen province Baoan District Songgang Tantou town in the West Industrial Park building A27-A28 Patentee after: SHENZHEN XINYU TENGYUE ELECTRONICS Co.,Ltd. Address before: 518105 Guangdong city of Shenzhen province Baoan District Songgang Tantou town in the West Industrial Park building A27-A28 Patentee before: SHENZHEN ZHONGXING XINYU FPC Co.,Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20140702 |