CN203386811U - LED support - Google Patents
LED support Download PDFInfo
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- CN203386811U CN203386811U CN201320526541.9U CN201320526541U CN203386811U CN 203386811 U CN203386811 U CN 203386811U CN 201320526541 U CN201320526541 U CN 201320526541U CN 203386811 U CN203386811 U CN 203386811U
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- electrode
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Abstract
An LED support relates to the technical field of LED packaging. Metal electrodes (2) include a pair of external electrodes (21) and a pair of internal electrodes (22). The pair of external electrodes (21) are symmetrically arranged on the outer edge of the upper surface of a substrate (1), while the pair of internal electrodes (22) are symmetrically arranged on the inner edge of the upper surface of the substrate (1) and arranged at the outer side of a through hole (11). A die bonding region (12) is arranged between the external electrodes (21) and the internal electrodes (22) on the upper surface of the substrate (1). The external positive electrode (211) and the external negative electrode (212) are insulated and isolated, and the internal positive electrode (221) and the internal negative electrode (222) are also insulated and isolated. The LED support can increase the connecting modes of an LED packaging device and an external power line and expands the application scope of the LED packaging device.
Description
Technical field:
The utility model relates to LED encapsulation technology field, is specifically related to LED support.
Background technology:
Luminous efficiency is high owing to having for the LED packaging, little power consumption, the characteristics such as pollution-free, just is being widely used in the fields such as TV is backlight, advertisement sign, picture and text demonstration, decorative lighting.Along with improving constantly of luminous efficiency, the reduction of the raw material costs such as chip, encapsulation glue, support, the LED packaging has started to enter the room lighting fields such as commercial lighting, lighting of home.In order to reduce the packaging cost of LED packaging, reduce LED packaging quantity required while applying, improve the application flexibility of LED packaging, often adopt the plurality of LEDs chip is positioned in single led support and carries out integration packaging, and, in order to meet the heat radiation requirement of integration packaging form, LED support adopts the good material of thermal conductivity as baseplate material more.
The structure of the LED support that a kind of integration packaging of the prior art is used for being provided with positive and negative metal electrode on the surface of a heat-conducting substrate, positive and negative metal electrode is positioned at the marginal surface of substrate, when application, external power source is by being connected with positive and negative metal electrode the driving of carrying out the LED packaging.Yet the shortcoming that the LED support of this kind of structure has is: owing to only at the edge of substrate surface, being provided with pair of electrodes, external power cord and LED device connected mode are single, cause the electrically driven (operated) mode of LED packaging single, and device application is range limited.
The utility model content:
The purpose of this utility model is to provide LED support, it by being provided with interior electrode and external electrode on substrate, the LED packaging is when application, external power cord both can be realized LED packaging electricity is driven by being connected with external electrode, also can realize LED packaging electricity is driven by being connected with interior electrode, increase LED packaging and external power cord connected mode, enlarged the range of application of LED packaging.
In order to solve the existing problem of background technology, the utility model is by the following technical solutions: it comprises substrate 1, the upper surface of substrate 1 is provided with metal electrode 2, the centre of substrate 1 is provided with through hole 11, described metal electrode 2 comprises electrode 22 in a pair of external electrode 21 and a pair, a pair of external electrode 21 is symmetricly set on the outward flange of substrate 1 upper surface, in one pair electrode 22 be symmetricly set on substrate 1 upper surface inside edge, and in one pair, electrode 22 is arranged on the outside of through hole 11, a pair of external electrode 21 comprises an outer positive electrode 211 and an outer negative electrode 212, in one pair, electrode 22 comprises an interior positive electrode 221 and an interior negative electrode 222, the upper surface of described substrate 1 is provided with crystal bonding area 12 between external electrode 21 and interior electrode 22, insulation isolation between described outer positive electrode 211 and outer negative electrode 212, insulation isolation between interior positive electrode 221 and interior negative electrode 222.
The made substrate of material that described substrate 1 is metal substrate, ceramic substrate or other thermal conductivity and economy equilibrium.
The shape of described through hole 11 can be circular, ellipse, rectangle or other any shape.
Be printed with metallic circuit on described crystal bonding area 12, metallic circuit is generally used for the auxiliary electric connection between the LED wafer that realizes, the mode that for example adopts gold thread and metallic circuit, LED wafer to weld respectively, by each LED wafer serial connection, forms the electric connection between the LED wafer.
The utlity model has following beneficial effect: it by being provided with interior electrode and external electrode on substrate, the LED packaging is when application, external power cord both can be realized LED packaging electricity is driven by being connected with external electrode, also can realize LED packaging electricity is driven by being connected with interior electrode, increase LED packaging and external power cord connected mode, enlarged the range of application of LED packaging.
The accompanying drawing explanation:
The structural representation that Fig. 1 is embodiment one;
The stereogram that Fig. 2 is embodiment one;
The schematic diagram of the connected mode one that Fig. 3 is external power cord and embodiment one;
The schematic diagram of the connected mode two that Fig. 4 is external power cord and embodiment one;
The structural representation that Fig. 5 is embodiment two.
Embodiment:
Embodiment one: referring to Fig. 1-2, this embodiment is by the following technical solutions: it comprises substrate 1, the upper surface of substrate 1 is provided with metal electrode 2, the centre of substrate 1 is provided with through hole 11, described metal electrode 2 comprises electrode 22 in a pair of external electrode 21 and a pair, a pair of external electrode 21 is symmetricly set on the outward flange of substrate 1 upper surface, in one pair electrode 22 be symmetricly set on substrate 1 upper surface inside edge, and in one pair, electrode 22 is arranged on the outside of through hole 11, a pair of external electrode 21 comprises an outer positive electrode 211 and an outer negative electrode 212, in one pair, electrode 22 comprises an interior positive electrode 221 and an interior negative electrode 222, the upper surface of described substrate 1 is provided with crystal bonding area 12 between external electrode 21 and interior electrode 22, insulation isolation between described outer positive electrode 211 and outer negative electrode 212, insulation isolation between interior positive electrode 221 and interior negative electrode 222.
The made substrate of material that described substrate 1 is metal substrate, ceramic substrate or other thermal conductivity and economy equilibrium.
The shape of described through hole 11 can be circular, ellipse, rectangle or other any shape.
Be printed with metallic circuit on described crystal bonding area 12, metallic circuit is generally used for the auxiliary electric connection between the LED wafer that realizes, the mode that for example adopts gold thread and metallic circuit, LED wafer to weld respectively, by each LED wafer serial connection, forms the electric connection between the LED wafer.
Referring to Fig. 3-4, this embodiment by arranging external electrode 21 and interior electrode 22 on substrate 1, when application, external power cord both can be by being connected to realize LED packaging electricity is driven with external electrode 21, also can be by being connected to realize LED packaging electricity is driven with interior electrode 22, increase the electric type of drive of LED packaging, enlarged the scope of application of product.
This embodiment by being provided with interior electrode and external electrode on substrate, the LED packaging is when application, external power cord both can be realized LED packaging electricity is driven by being connected with external electrode, also can realize LED packaging electricity is driven by being connected with interior electrode, increase LED packaging and external power cord connected mode, enlarged the range of application of LED packaging.
Embodiment two: referring to Fig. 5, this embodiment is that with the difference of embodiment one upper surface of described substrate 1 is provided with reflection circle 3, reflection circle 3 comprises internal reflection circle 31 and external reflectance circle 32, crystal bonding area 12 is arranged between internal reflection circle 31 and external reflectance circle 32, and internal reflection circle 31 and external reflectance circle 32 sidewall in opposite directions are set to opaque.
A kind of in PPA reflection circle, silica gel reflection circle, epoxy resin reflection circle or silicones reflection circle of described reflection circle 3.
In this embodiment, at least internal reflection circle 31 and external reflectance circle 32 sidewall in opposite directions are set to opaque.In encapsulation procedure, encapsulation glue is injected between inside and outside reflection circle and by inside and outside reflection corral, and inside and outside reflection circle also plays the effect of the light of reflection LED wafer emission simultaneously.
Claims (5)
1.LED support, it is characterized in that it comprises substrate (1), the upper surface of substrate (1) is provided with metal electrode (2), the centre of substrate (1) is provided with through hole (11), described metal electrode (2) comprises electrode (22) in a pair of external electrode (21) and a pair, a pair of external electrode (21) is symmetricly set on the outward flange of substrate (1) upper surface, electrode in one pair (22) be symmetricly set on substrate (1) upper surface inside edge, and electrode in a pair (22) is arranged on the outside of through hole (11), a pair of external electrode (21) comprises an outer positive electrode (211) and an outer negative electrode (212), electrode in one pair (22) comprises an interior positive electrode (221) and an interior negative electrode (222), the upper surface of described substrate (1) is positioned between external electrode (21) and electrode (22) and is provided with crystal bonding area (12), insulation isolation between described outer positive electrode (211) and outer negative electrode (212), insulation isolation between interior positive electrode (221) and interior negative electrode (222).
2. LED support according to claim 1, is characterized in that described substrate (1) is metal substrate.
3. LED support according to claim 1, is characterized in that described substrate (1) is ceramic substrate.
4. LED support according to claim 1, the upper surface that it is characterized in that described substrate (1) is provided with reflection circle (3), reflection circle (3) comprises internal reflection circle (31) and external reflectance circle (32), and crystal bonding area (12) is arranged between internal reflection circle (31) and external reflectance circle (32).
5. LED support according to claim 4, is characterized in that described reflection circle (3) is for silica gel reflection circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320526541.9U CN203386811U (en) | 2013-08-16 | 2013-08-16 | LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320526541.9U CN203386811U (en) | 2013-08-16 | 2013-08-16 | LED support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203386811U true CN203386811U (en) | 2014-01-08 |
Family
ID=49875265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320526541.9U Expired - Fee Related CN203386811U (en) | 2013-08-16 | 2013-08-16 | LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203386811U (en) |
-
2013
- 2013-08-16 CN CN201320526541.9U patent/CN203386811U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140108 Termination date: 20210816 |