CN101071812A - Light-emitting diode packaging module - Google Patents
Light-emitting diode packaging module Download PDFInfo
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- CN101071812A CN101071812A CN 200610079187 CN200610079187A CN101071812A CN 101071812 A CN101071812 A CN 101071812A CN 200610079187 CN200610079187 CN 200610079187 CN 200610079187 A CN200610079187 A CN 200610079187A CN 101071812 A CN101071812 A CN 101071812A
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- emitting diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention relates to a LED package module, comprising a substrate, a first LED and an electric crystal, where the first LED is arranged on the substrate, and the electric crystal is connected with the first LED and arranged on the substrate to control on-off of the first LED, and the first LED and the electric crystal are located in the same package body. Thus, as compared with the existing techniques, it can reduce the cost of package manufacturing process.
Description
Technical field
The present invention relates to a kind of diode package module, particularly relate to a kind of light-emitting diode and electric crystal can being packaged in the same packaging body, maybe light-emitting diode, electric crystal and Photosensing Units wherein wantonly two can be packaged in the same packaging body, and can save the LED package module of encapsulation procedure cost.
Background technology
High development along with science and technology, light-emitting diode (Light Emitted Diode, LED) have advantages such as light and handy, power saving and life-span be long, so be widely used on the indicating device and display unit of information, communication, consumption electronic products at present, for example: indicator light, portable type flashlight, LCD backlight, ground light, escape lamp, Medical Devices light source, floor light, key lighting etc., so be one of important electronic component.The application of white light emitting diode at present also launches gradually, and by compact illumination market, bring another boundary into, more be used in LCD (Liquid crystalDisplay, LCD) in the backlight, and the trend that replaces traditional cold cathodouminescence fluorescent tube is gradually arranged.
Please consult Figure 1 and Figure 2 simultaneously, Fig. 1 has the schematic diagram of known light-emitting diode as the module backlight of light source now for showing, Fig. 2 is the profile of the light-emitting diode of displayed map 1.In existing known techniques,, be to have a housing 11, a plurality of LED package module 12, a support plate 13, one drive circuit plate 14 and at least one optical thin film 15 with the module backlight 1 of light-emitting diode as light source.
Each LED package module 12 has a plural light-emitting diode 121 (LEDDevice) and a printed circuit board (PCB) 122 respectively.Each light-emitting diode 121 is to be arranged on the printed circuit board (PCB) 122, each LED package module 12 is fixed on the support plate 13 again, and support plate 13 is and housing 11 locking (not shown); And drive circuit board 14 is in order to driven for emitting lights diode package module 12, it mainly has a driving loop that comprises active member and passive device, and drive circuit board 14 is to be fixed in support plate 13 and relative with LED package module 12 and establish, drive circuit board 14 is provided with electric crystal 141 elements such as grade, with the luminous intensity of drive controlling LED package module 12.
Yet a plurality of light-emitting diodes 121 of each LED package module 12 need be arranged on the printed circuit board (PCB) 122 more in advance in earlier packaged one by one mode usually.In addition, 141 elements such as grade of the electric crystal on the drive circuit board 14 also are to need just can be arranged at drive circuit board 14 through encapsulation earlier.Thus, very waste the cost that encapsulates each element one by one.
This shows that above-mentioned existing LED package module obviously still has inconvenience and defective in structure and use, and demands urgently further being improved.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.How therefore a kind of LED package module of the new structure that addresses the above problem be provided, real one of the current important topic that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing LED package module exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge thereof, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of LED package module of new structure, can improve general existing LED package module, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
The objective of the invention is to, overcome the defective that existing LED package module exists, and light-emitting diode and electric crystal can being packaged in the same packaging body of a kind of new structure is provided, and can save the LED package module of encapsulation procedure cost.
Another object of the present invention is to, light-emitting diode, electric crystal and Photosensing Units wherein wantonly two can being packaged in the same packaging body of a kind of new structure is provided, and can save the LED package module of encapsulation procedure cost, thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of LED package module that the present invention proposes, it comprises: a substrate; One first light-emitting diode is arranged at this substrate; And an electric crystal, be and this first light-emitting diode electrically connects, and be arranged on this substrate, to control the open and close of this first light-emitting diode; Wherein, this first light-emitting diode and this electric crystal are to be positioned at same packaging body.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid LED package module, wherein said first light-emitting diode are to be a LED wafer or a LED crystal particle.
Aforementioned LED package module, it more comprises a Photosensing Units (photosensor), this Photosensing Units is to be positioned at this packaging body.
Aforesaid LED package module, it more comprises a drive controlling loop, be to electrically connect with this first light-emitting diode and this electric crystal respectively, to drive and to control the luminous intensity of this first light-emitting diode, wherein this drive controlling loop is to be positioned at this packaging body.
Aforesaid LED package module, it more comprises a memory body (memory body is storage medium, and memory etc. below all are called memory body), be to be arranged at this substrate and to electrically connect with this drive controlling loop, wherein this memory body is to be positioned at this packaging body.
Aforesaid LED package module, it more comprises one second light-emitting diode, is to electrically connect with this first light-emitting diode, and is arranged at this substrate, this second light-emitting diode is to be positioned at this packaging body.
Aforesaid LED package module, wherein said second light-emitting diode are to be driven by a reverse bias, to form a Photosensing Units.
Aforesaid LED package module, wherein said second light-emitting diode are to connect with this first light-emitting diode.
Aforesaid LED package module, wherein said second light-emitting diode are and the in parallel and reversal connection of this first light-emitting diode.
The object of the invention to solve the technical problems also realizes by the following technical solutions.According to a kind of LED package module that the present invention proposes, it comprises: a substrate; One first light-emitting diode is to be arranged at this substrate; One Photosensing Units is to be arranged at this substrate; And an electric crystal, be and this first light-emitting diode electrically connects, and be arranged on this substrate, to control the open and close of this first light-emitting diode; Wherein, wherein wantonly two of this first light-emitting diode, this Photosensing Units or this electric crystal is to be positioned at same packaging body.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid LED package module, wherein said first light-emitting diode are to be a LED wafer or a LED crystal particle.
Aforesaid LED package module, it more comprises a drive controlling loop, is to electrically connect with this first light-emitting diode, this photo-sensitive cell and this electric crystal respectively, wherein this drive controlling loop is to be positioned at this packaging body.
Aforesaid LED package module, it more comprises a memory body, is to be arranged at this substrate and to electrically connect with this drive controlling loop, wherein this memory body is to be positioned at this packaging body.
Aforesaid LED package module, it more comprises one second light-emitting diode, is to electrically connect with this first light-emitting diode, and is arranged at this substrate, wherein this second light-emitting diode is to be positioned at this packaging body.
Aforesaid LED package module, wherein said second light-emitting diode are to be driven by a reverse bias, to form a Photosensing Units.
Aforesaid LED package module, wherein said second light-emitting diode are to connect with this first light-emitting diode.
Aforesaid LED package module, wherein said second light-emitting diode are and the in parallel and reversal connection of this first light-emitting diode.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, major technique of the present invention thes contents are as follows:
In order to achieve the above object, according to LED package module of the present invention, comprise a substrate, one first light-emitting diode and an electric crystal.First light-emitting diode is to be arranged at substrate, and electric crystal is to electrically connect with first light-emitting diode, and is arranged on the substrate, and to control the open and close of first light-emitting diode, wherein, first light-emitting diode and electric crystal are to be positioned at same packaging body.
In addition, in order to achieve the above object,, comprise a substrate, one first light-emitting diode, a Photosensing Units and an electric crystal according to LED package module of the present invention.First light-emitting diode is to be arranged at substrate, and Photosensing Units is to be arranged at substrate, electric crystal is to electrically connect with first light-emitting diode, and be arranged on the substrate, to control the open and close of first light-emitting diode, wherein, wherein wantonly two of first light-emitting diode, Photosensing Units or electric crystal is to be positioned at same packaging body.
By technique scheme, LED package module of the present invention has following advantage at least:
1, because, be that first light-emitting diode and electric crystal are arranged at substrate respectively, more make first light-emitting diode and electric crystal be positioned at same packaging body according to LED package module of the present invention.Compare with prior art,, can reduce the cost of encapsulation procedure by making first light-emitting diode and electric crystal be arranged in same packaging body.
2, in addition, in an embodiment of the present invention, when this second light-emitting diode when reverse biased drives, then can form Photosensing Units, promptly can be as the sensing luminous intensity, so but feedback adjusting light-emitting diode intensity, and can go less that Photosensing Units additionally is set and come sensor light intensity.
In sum, the LED package module of novelty of the present invention can be packaged in light-emitting diode and electric crystal in the same packaging body, and can save the encapsulation procedure cost.In addition, the present invention also can be packaged in light-emitting diode, electric crystal and Photosensing Units wherein wantonly two in the same packaging body, and can save the encapsulation procedure cost.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing LED package module has the outstanding effect of enhancement, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 has the schematic diagram of known light-emitting diode as the module backlight of light source now for showing.
Fig. 2 is the profile of the light-emitting diode of displayed map 1.
Fig. 3 is for showing the schematic perspective view according to the LED package module of preferred embodiment of the present invention.
Fig. 4 is for showing the profile according to the LED package module of preferred embodiment of the present invention.
Fig. 5 is the LED package module of demonstration according to preferred embodiment of the present invention, and first light-emitting diode, electric crystal and drive controlling loop all are positioned at the schematic diagram of same packaging body.
Fig. 6 is the LED package module of demonstration according to preferred embodiment of the present invention, and has a Photosensing Units, and is positioned at the schematic diagram of packaging body.
Fig. 7 is the LED package module of demonstration according to preferred embodiment of the present invention, and has a Photosensing Units, and is positioned at the outer schematic diagram of packaging body.
Fig. 8 is the LED package module of demonstration according to preferred embodiment of the present invention, and the schematic diagram with a transparent cover body.
Fig. 9 is the LED package module of demonstration according to preferred embodiment of the present invention, and first light-emitting diode, electric crystal, Photosensing Units, memory body and drive controlling loop all are positioned at the schematic diagram of same packaging body.
Figure 10 is the LED package module of demonstration according to preferred embodiment of the present invention, and first light-emitting diode, second light-emitting diode, electric crystal and drive controlling loop all are positioned at the schematic diagram of same packaging body.
Figure 11 is the LED package module of demonstration according to preferred embodiment of the present invention, and first light-emitting diode, second light-emitting diode, a plurality of light-emitting diode, electric crystal and drive controlling loop all are positioned at the schematic diagram of same packaging body.
Figure 12 is for showing the LED package module according to preferred embodiment of the present invention, and first light-emitting diode and electric crystal be positioned at same packaging body, and Photosensing Units is positioned at the schematic diagram of another packaging body.
1: module 11 backlight: housing
12: light emitting diode 121: light-emitting diode
122: printed circuit board (PCB) 13: support plate
14: drive circuit board 15: optical thin film
2: LED package module 21: substrate
Light-emitting diode 23 in 22: the first: electric crystal
24: packaging body 25: the drive controlling loop
25 ': wafer 26: Photosensing Units
27: transparent cover body 28: memory body
Light-emitting diode 3 in 29: the second: the LED package module
31: 32: the first light-emitting diodes of substrate
33: Photosensing Units 34: electric crystal
35: packaging body 35 ': packaging body
36: drive controlling loop A-A ': hatching
B-B ': hatching d: light-emitting diode
P: fixed head
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of LED package module, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Hereinafter with reference to correlative type, the LED package module according to preferred embodiment of the present invention is described, wherein components identical will be illustrated with identical reference marks.
Please consult Fig. 3 and shown in Figure 4 simultaneously, Fig. 3 is for showing the schematic perspective view according to the LED package module of preferred embodiment of the present invention, and Fig. 4 is for showing the profile according to the LED package module of preferred embodiment of the present invention.The LED package module 2 of preferred embodiment of the present invention comprises a substrate 21, one first light-emitting diode 22 and an electric crystal 23, and wherein, first light-emitting diode 22 and electric crystal 23 are to be positioned at same packaging body 24.
In the present embodiment, this substrate 21 is also unrestricted, is to can be a printed circuit board (PCB), a heating panel or a glass substrate; And the material of this packaging body 24 is also unrestricted, can use a transparent resin, for example transparent epoxy resin (epoxy resin), or use a transparent adhesive tape, for example silica gel (silicone) is material.
Please consult shown in Figure 4ly again, first light-emitting diode 22 of present embodiment is can a LED wafer or a LED crystal particle (naked crystalline substance, form die), and directly being arranged on the substrate 21.
23 of the electric crystals and first light-emitting diode 22 electrically connect, and be arranged on the substrate 21, be in order to control the open and close of first light-emitting diode 22, wherein electric crystal 23 can be the element of a switch, for example: a two-carrier electric crystal (BJT), an effect electric crystal (FET) or a metal-oxide semiconductor electric crystal (MOSFET).
Please consult shown in Figure 4 again, LED package module 2 more includes a drive controlling loop 25, be to electrically connect with first light-emitting diode 22 and electric crystal 23 respectively, and by drive controlling loop 25 output one pulse width modulation signal (PWM) to electric crystal 23, so that electric crystal 23 is done open and close actions according to the pulse width modulation signal, and and then control the responsibility cycle (duty cycle) of first light-emitting diode 22.In addition, also can export direct current power supply (DC) signal to the first light-emitting diode 22 by drive controlling loop 25, and by the size of adjusting the DC power supply signal, to control the luminous intensity of first light-emitting diode 22.
The drive controlling loop 25 of present embodiment is the opposite side that can be fixed in substrate 21, and relative with first light-emitting diode 22 and electric crystal 23 and establish and electrically connect; In addition, see also shown in Figure 5, for showing LED package module according to preferred embodiment of the present invention, and first light-emitting diode, electric crystal and drive controlling loop all are positioned at the schematic diagram of same packaging body,, then can be arranged in the packaging body 24 if when being integrated into a wafer 25 ' form when drive controlling loop 25.
Please consult Figure 6 and Figure 7 simultaneously, Fig. 6 is for showing the LED package module according to preferred embodiment of the present invention, and has a Photosensing Units, and be positioned at the schematic diagram of packaging body, Fig. 7 is for showing the LED package module according to preferred embodiment of the present invention, and have a Photosensing Units, and be positioned at the outer schematic diagram of packaging body.LED package module 2 more can comprise a Photosensing Units (photosensor) 26, and it can be positioned at packaging body 24 (as shown in Figure 6), also can be arranged on the substrate 21 but is positioned at (as shown in Figure 7) outside the packaging body 24.In the present embodiment, when Photosensing Units 26 is positioned at packaging body 24, and packaging body 24 is when being light tight, is in order to first light-emitting diode 22 in the sensing packaging body 24 at the same time or separately or the luminous intensity of other a plurality of light-emitting diode (not shown); When Photosensing Units 26 is positioned at outside the packaging body, be luminous intensity in order to the light-emitting diode (not shown) of first light-emitting diode 22 in the contiguous packaging body 24 of sensing at the same time or separately or other LED package modules 2.
Seeing also shown in Figure 8ly, is the LED package module that be to show according to preferred embodiment of the present invention, and the schematic diagram with a transparent cover body.The LED package module 2 of present embodiment more comprises a transparent cover body 27, be to be covered on the Photosensing Units 26, form a transparent window, other are arranged at the luminous intensity of the light-emitting diode the module backlight from the transparent window sensing can to make Photosensing Units 26.In addition, when packaging body 24 used transparent material, 26 of Photosensing Units can not need by transparent cover body 27, got final product the luminous intensity (not shown) of sensing light-emitting diode.
Seeing also shown in Figure 9ly, be the LED package module that be to show according to preferred embodiment of the present invention, and first light-emitting diode, electric crystal, Photosensing Units, memory body and drive controlling loop all is positioned at the schematic diagram of same packaging body.In the present embodiment, LED package module 2 more comprises a memory body 28, it is to be arranged at substrate 21 and to electrically connect with drive controlling loop 25, and the setting of memory body 28 and unrestricted, be to be positioned at packaging body 24, or be positioned at the opposite side of substrate 21 and relative with first light-emitting diode 22 and establish (not shown).The memory body 28 of present embodiment, at this is to be example with a non-volatility memory, can store the table of comparisons (look up table) of complex luminous intensity to the electric current data in it, the table of comparisons in the memory body 28 can be consulted with the reference as the luminous intensity of controlling first light-emitting diode 22 in drive controlling loop 25.
Please consult again shown in Figure 9, with the action of explanation present embodiment LED package module 2.When Photosensing Units 26 is the luminous intensity of sensing first light-emitting diode 22, then the luminous intensity that senses can be converted to an electric current, and deliver to drive controlling loop 25, and drive controlling loop 25 is according to the electric current that receives, the reference value of inquiry and the corresponding luminous intensity of this electric current to the memory body 28, with the luminous intensity of adjusting first light-emitting diode 22 to this reference value.
Seeing also shown in Figure 10ly, be the LED package module that be to show according to preferred embodiment of the present invention, and first light-emitting diode, second light-emitting diode, electric crystal and drive controlling loop all is positioned at the schematic diagram of same packaging body.The LED package module 2 of present embodiment more comprises one second light-emitting diode 29, is to electrically connect with first light-emitting diode 22, and is arranged at substrate 21.And second light-emitting diode 29 also is positioned at packaging body 24, and can be by same drive controlling loop 25, to drive and to control the luminous intensity of second light-emitting diode 29.In the present embodiment, the connected mode of first light-emitting diode 22 and second light-emitting diode 29 is also unrestricted, first light-emitting diode 22 and second light-emitting diode 29 can be and be connected in series or be connected in parallel, and all can be respectively with direct current (DC) power supply or interchange (AC) power drives.In addition, when first light-emitting diode 22 was connected in parallel and mutual reversal connection mode with second light-emitting diode 29, if input AC (AC) power supply, it was luminous then can to drive first light-emitting diode 22 and second light-emitting diode 29 in turn; If during input DC power, then can make a wherein lumination of light emitting diode, another light-emitting diode then reverse biased forms a Photosensing Units 26, in order to the luminous intensity (not shown) around the sensing.
See also shown in Figure 11, be to be the LED package module of demonstration, and first light-emitting diode, second light-emitting diode, a plurality of light-emitting diode, electric crystal and drive controlling loop all are positioned at the schematic diagram of same packaging body according to preferred embodiment of the present invention.The LED package module 2 of present embodiment, when processing procedure, except first light-emitting diode 22 and second light-emitting diode 29 being packaged in same packaging body 24, more a plurality of light-emitting diode d all can be packaged in the same packaging body 24, and by the open and close of electric crystal 23 control first light-emitting diode 22, second light-emitting diode 29 and each light-emitting diode d, and by drive controlling loop 25 to drive and to control the luminous intensity of first light-emitting diode 22 and second light-emitting diode 29 and each light-emitting diode d.In this enforcement, more a plurality of LED package modules 2 can be covered brilliant setting or mounted on surface on a fixed head P, and this fixed head P is also unrestricted at this, it can be housing, a fin or a printed circuit board (PCB) of a module backlight.
Because LED package module 2 is all to be to be arranged at same substrate 21 with first light-emitting diode 22, second light-emitting diode 29, electric crystal 23, Photosensing Units 26 and drive controlling loop 25, more said elements and a plurality of light-emitting diode d all are packaged in the same packaging body 24, this kind mode is saved the encapsulation procedure cost; In addition, when second light-emitting diode 29 when reverse bias drives, then form Photosensing Units 26, promptly can be used as the luminous intensity of other light-emitting diodes of sensing, more can save Photosensing Units 26 numbers of use.
Please consulting shown in Figure 12ly again, is the LED package module that be to show according to preferred embodiment of the present invention, and first light-emitting diode and electric crystal be positioned at same packaging body, and Photosensing Units is positioned at the schematic diagram of another packaging body.The LED package module 3 of another preferred embodiment of the present invention comprises a substrate 31, one first light-emitting diode 32, an electric crystal 33 and a Photosensing Units 34.First light-emitting diode 32 is to be arranged at substrate 31, and Photosensing Units 33 is to be arranged at substrate 31, and electric crystal 34 is to electrically connect with first light-emitting diode 32, and is arranged on the substrate 31, to control the open and close of first light-emitting diode 32; Wherein, wherein wantonly two of first light-emitting diode 32, Photosensing Units 33 and electric crystal 34 is to be positioned at same packaging body 35.At this, then being positioned at same packaging body 35 with first light-emitting diode 32 with Photosensing Units 34 is example, and 33 of electric crystals are positioned at another packaging body 35 '.
First light-emitting diode 32 in the present embodiment, electric crystal 33, Photosensing Units 34, driving loop 36 and packaging body 35,35 ', be to have identical formation, function and action, so do not repeat them here with first light-emitting diode 22, Photosensing Units 26, electric crystal 23, driving loop 25 and the packaging body 24 of above-mentioned preferred embodiment (as shown in Figure 3 and Figure 4).
In sum, because, be that first light-emitting diode and electric crystal are arranged at substrate respectively, more make first light-emitting diode and electric crystal be positioned at same packaging body according to LED package module of the present invention.Therefore, the present invention and existing known techniques are compared, and by making first light-emitting diode and electric crystal be arranged in same packaging body, can reduce the cost of encapsulation procedure.In addition, in an embodiment of the present invention, when second light-emitting diode when reverse biased drives, then form Photosensing Units, promptly can be used as the sensing luminous intensity, so but feedback adjusting light-emitting diode intensity, and can go less that Photosensing Units additionally is set and come sensor light intensity.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (17)
1, a kind of LED package module is characterized in that it comprises:
One substrate;
One first light-emitting diode is arranged at this substrate; And
One electric crystal is to electrically connect with this first light-emitting diode, and is arranged on this substrate, to control the open and close of this first light-emitting diode;
Wherein, this first light-emitting diode and this electric crystal are to be positioned at same packaging body.
2, LED package module according to claim 1 is characterized in that wherein said first light-emitting diode is to be a LED wafer or a LED crystal particle.
3, LED package module according to claim 1 is characterized in that it more comprises a Photosensing Units (photosensor), and this Photosensing Units is to be positioned at this packaging body.
4, LED package module according to claim 1, it is characterized in that it more comprises a drive controlling loop, be to electrically connect with this first light-emitting diode and this electric crystal respectively, to drive and to control the luminous intensity of this first light-emitting diode, wherein this drive controlling loop is to be positioned at this packaging body.
5, LED package module according to claim 4 is characterized in that it more comprises a memory body, is to be arranged at this substrate and to electrically connect with this drive controlling loop, and wherein this memory body is to be positioned at this packaging body.
6, LED package module according to claim 1 is characterized in that it more comprises one second light-emitting diode, is to electrically connect with this first light-emitting diode, and is arranged at this substrate, and this second light-emitting diode is to be positioned at this packaging body.
7, LED package module according to claim 6 is characterized in that wherein said second light-emitting diode is to be driven by a reverse bias, to form a Photosensing Units.
8, LED package module according to claim 6 is characterized in that wherein said second light-emitting diode is to connect with this first light-emitting diode.
9, LED package module according to claim 6 is characterized in that wherein said second light-emitting diode is and the in parallel and reversal connection of this first light-emitting diode.
10, a kind of LED package module is characterized in that it comprises:
One substrate;
One first light-emitting diode is to be arranged at this substrate;
One Photosensing Units is to be arranged at this substrate; And
One electric crystal is to electrically connect with this first light-emitting diode, and is arranged on this substrate, to control the open and close of this first light-emitting diode;
Wherein, wherein wantonly two of this first light-emitting diode, this Photosensing Units or this electric crystal is to be positioned at same packaging body.
11, LED package module according to claim 10 is characterized in that wherein said first light-emitting diode is to be a LED wafer or a LED crystal particle.
12, LED package module according to claim 10, it is characterized in that it more comprises a drive controlling loop, be to electrically connect with this first light-emitting diode, this photo-sensitive cell and this electric crystal respectively, wherein this drive controlling loop is to be positioned at this packaging body.
13, LED package module according to claim 12 is characterized in that it more comprises a memory body, is to be arranged at this substrate and to electrically connect with this drive controlling loop, and wherein this memory body is to be positioned at this packaging body.
14, LED package module according to claim 10, it is characterized in that it more comprises one second light-emitting diode, be to electrically connect with this first light-emitting diode, and be arranged at this substrate, wherein this second light-emitting diode is to be positioned at this packaging body.
15, LED package module according to claim 14 is characterized in that wherein said second light-emitting diode is to be driven by a reverse bias, to form a Photosensing Units.
16, LED package module according to claim 14 is characterized in that wherein said second light-emitting diode is to connect with this first light-emitting diode.
17, LED package module according to claim 14 is characterized in that wherein said second light-emitting diode is and the in parallel and reversal connection of this first light-emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610079187 CN101071812A (en) | 2006-05-12 | 2006-05-12 | Light-emitting diode packaging module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610079187 CN101071812A (en) | 2006-05-12 | 2006-05-12 | Light-emitting diode packaging module |
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| CN101071812A true CN101071812A (en) | 2007-11-14 |
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2006
- 2006-05-12 CN CN 200610079187 patent/CN101071812A/en active Pending
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| CN103390615A (en) * | 2013-07-12 | 2013-11-13 | 广东欧珀移动通信有限公司 | Packaging method of LED (light emitting diode) serving as camera flashlight and correcting method and correcting device for starting LED flashlight for photographing |
| CN108180405A (en) * | 2017-11-30 | 2018-06-19 | 上海亚明照明有限公司 | The LED lamp tube of adaptive mounting height |
| CN111290165A (en) * | 2018-12-10 | 2020-06-16 | Tcl集团股份有限公司 | Light source plate, backlight module and display device |
| CN111290165B (en) * | 2018-12-10 | 2021-06-25 | Tcl科技集团股份有限公司 | Light source plate, backlight module and display device |
| WO2022082755A1 (en) * | 2020-10-23 | 2022-04-28 | 瑞仪(广州)光电子器件有限公司 | Light source structure, backlight module and display device |
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