Background technology
Recently, along with the fast development of ICT and the expansion of the market demand, flat panel display equipment has been gone to the forward position of Display Technique.Representational flat panel display equipment has liquid crystal display, Plasmia indicating panel, Organic Light Emitting Diode etc.
In flat panel display equipment; As display device of future generation; Organic Light Emitting Diode is owing to its advantage is given prominence to, these advantages for example be fast the reaction time, with conventional liquid crystal display apparatus mutually specific energy consumption lower, in light weight, owing to not having have ultra-thin thickness, high brightness etc. backlight.
Organic Light Emitting Diode is worked based on the electroluminescence principle, and have following structure: wherein cathodic coating, organic film and anode film are coated on the substrate, and when voltage was applied on negative electrode and the anode, what generation was suitable in the organic film both sides can be poor.Be that electronics and hole are passed negative electrode and anode respectively and on organic film, combined again, thereby remaining excitation energy emit beam after combining again between electronics and hole.At this moment, because the light wavelength that produces from organic film can be controlled according to the amount of the dopant of organic material, therefore can realize whole colors.In this regard, because the increase of the size of the raising of productivity ratio and display device, the glass substrate that is used for making display device tends to increase size.
As for the detailed construction of Organic Light Emitting Diode, it comprises anode, hole injection layer, hole transfer layer, luminescent layer, electron transfer layer, electron injecting layer and negative electrode, and they press this order sequential cascade on substrate.Here, for anode, the main indium tin oxide (ITO) that uses with bottom surface internal impedance and good transmissivity.Organic film is made up of multilayer, for example hole injection layer, hole transfer layer, luminescent layer, electron transfer layer and electron injecting layer, and the organic material that wherein is used for luminescent layer comprises Alq
3, TPD, PBD, m-MTDATA, TCTA etc.As for negative electrode, use the LiF-Al metallic film.In addition and since organic film for the repellence of moisture and oxygen especially a little less than, the packaging film that is used for encapsulating diode is formed on the life-span of the topmost of diode with the increase diode.
Yet although aforesaid multiple advantage is arranged, owing to be used for making the not standardization clearly of device of large tracts of land Organic Light Emitting Diode, current, Organic Light Emitting Diode is not asserted the display device of future generation that substitutes the classic flat-plate display device.Promptly; Consider that the device that is used for making the large tracts of land panel is able to development and standardization along with the quick increase of the size of liquid crystal display or plasma display panel device; Have very strong demand and develop a kind of device that is used to make the large tracts of land Organic Light Emitting Diode, this can make Organic Light Emitting Diode be asserted display device of future generation.
Simultaneously; When the flat panel display equipment made such as Organic Light Emitting Diode etc., display device is formed on the glass substrate according to its characteristic, and in deposition process; Glass substrate must be by maintaining such as maintenance equipment such as glass chuck, thus deposition surface at vacuum state towards downside.
A kind of widely used glass chuck is the folder formula chuck of physically support glass substrate four sides, and other chuck is to use the vacuum chuck and the electrostatic chuck that uses electric field and electrostatic induction of atm difference.
Vacuum chuck uses atm difference as follows: along with the rear side of the flat glass substrate of adsorption plate contact, it maintains glass substrate through suction air from adsorption plate.Therefore, the problem of existence is: vacuum chuck can't be used for deposition process, because deposition process mainly carries out under vacuum state, and it has complicated structure.
That is, for flat panel display equipment, owing to become the principal element that increases percent defective such as foreign matters such as dust, water vapour, oxygen, need under vacuum state, operate, so consider this situation, vacuum chuck can't be applied in the vacuum plant.
Simultaneously; Electrostatic chuck is by means of maintaining flat substrate at the electrostatic force that is produced between the electrostatic chuck peace substrate (thereby the electric field that is produced when being applied to flat substrate rear side when electric current comes electrification to put down the electrostatic force that substrate is produced), and can be used for vacuum state.Yet electrostatic chuck has following several problem.
Under the situation that maintains the flat glass substrate of large tracts of land, electrostatic chuck needs big electric field, has increased power consumption thus.In addition; Can in all kinds of deposition process, supply continuously in order to make electric current; Not only electrostatic chuck needs complicated mechanical structure, and through electric current in the influence that produces on the substrate be deposited on the material on the flat glass substrate---i.e. the compound of deposition, thus reduced performance.
When the clamping glass substrate, the center of substrate is sagging owing to conduct oneself with dignity.At this moment, if the thickness of glass substrate is 370 * 470mm, the sagging about 1mm of substrate is and if the thickness of glass substrate is 600 * 720mm, the sagging about 5mm of substrate.In addition, vacuum chuck can't be used for the deposition process of under vacuum state, carrying out, and under large-area glass substrate situation, electrostatic chuck needs very strong electric field, and when transmission base plate, is difficult to handle electric wire.
The conventional apparatus that is used for depositing organic material comprises: carry out therein deposition process vacuum chamber, be arranged on the chamber top be used for installation base plate substrate loading stand, be arranged on magnetic support on the substrate that is installed on the substrate loading stand, be arranged on mask holding device under the substrate that is installed on the substrate loading stand, the bottom that is arranged on the chamber is used for evaporating organic material and with its organic material evaporating dish that deposits to the heater on the substrate and be arranged on the bottom in chamber.
Here, on the organic material evaporating dish, placed prediction suitable quantity wait to deposit to after the organic material on the substrate, through using vacuum pump vacuum chamber is emptied to 10
-6Under the Torr.Here, the organic material evaporating dish generally is made up of molybdenum.Then, be the heater energising, and accurately control temperature and the temperature of heater is increased to the fusing point of organic material, evaporate until organic material through serviceability temperature controller (not shown).At this moment, along with organic material begins from the organic material evaporating dish, to evaporate, the baffle plate of installing is in advance opened, and allows materials evaporated to deposit on the substrate.Here, baffle plate is used for that the impurity on the remaining organic material evaporating dish is deposited on the substrate before organic material evaporation.
Being used for the problem that the conventional apparatus of depositing organic material has is: in the process that substrate is installed on the substrate loading stand, large-area substrates is because deadweight and sagging, so organic material can't be deposited on the substrate equably.
Embodiment
To illustrate and describe preferred implementation of the present invention now.
Execution mode 1
With reference to Fig. 1, the device that is used for depositing organic material according to first execution mode comprises: chamber 110, wherein loaded substrate S and substrate S will stand deposition process; First drive member 220, it is arranged on 100 inboards, chamber, is used for fixing the sidepiece of substrate S; Second drive member 240 ', its perpendicular to first drive member 220 location applying pulling force to substrate S through using air pressure, thereby stop substrate S sagging; And rotary lifting device 300, the end face that it is assemblied in chamber 110 is used for rotary plate S, thus in the evaporation process of organic material, organic material can be evenly distributed in the chamber on the substrate S.
Here, chamber 110 has: with the inner space of its external isolation; An inlet (not shown), the side that it is formed on chamber 110 is used for allowing substrate S to be transferred in the chamber 110 or 110 transfers out from the chamber; And a door (not shown), be used for opening and closing inlet.Chamber 110 is suitable for allowing substrate S to carry out the deposition of organic material therein.
In addition, vacuum pump P is arranged on the edge of the bottom surface in chamber 110, and is used for reducing the interior pressure in chamber 110.That is, for the pure organic material of deposition on the surface of substrate S, when depositing organic material on substrate S, impurity must be from the chamber 110 inside remove.In this regard, vacuum pump P is through removing air and removal of contamination from deposit cavity 110.
Chamber 110 is provided with plate 202 and is arranged in the substrate loading stand 200 of preset distance under the plate 202 and is positioned at the carriage 120 under the substrate loading stand 200 on the top in chamber 110.Substrate loading stand 200 comprises that substrate shelves holding device 210, compresses holding device 208, first drive member 220 and second drive member 240.
Plate 202 is provided with fixed side 204 in a side, and is provided with the removable side plate 206 that can move horizontally at opposite side.Substrate is shelved each lower end that holding device 210 laterally is set to fixed side 204 and removable side plate 206, and, be parallel to substrate and shelve holding device 210 and be provided with and risen or descend thereby compress holding device 208.
Carriage 120 is in lower openings, and has the C tee section.Carriage 120 comprises: the mask holding device 122 that is horizontally disposed with arbitrary lower end of carriage 120; The a pair of tabular magnetic support 124 that is arranged on carriage 120 tops is used to apply magnetic force; And mask 126 that is shelved on the mask holding device 122.
Magnetic support 124 applies magnetic force to mask 126, and forces the lower surface of mask 126 and substrate S---to be the patterned surface of substrate S---closely to contact.
Substrate is shelved holding device 210 and is had the shape at the plate of central hole, shelve on the perforated portion that holding device 210 limited thereby four sides of substrate S can be shelved on substrate, and a side that allows substrate to shelve holding device 210 is separated with opposite side.
Compress holding device 208 and have the shape of shelving holding device 210 corresponding to substrate, and be arranged on substrate and shelve on the holding device 210, thereby rise or reduce by first drive member 220.When compressing holding device 208 and descend, substrate S is fixed in the both sides that compress the upper surface of holding device 208 through compressing substrate S, and also has the shape at the plate of central hole.Shelve holding device 210 as substrate, a side that compresses holding device 208 can be from opposite side separation and the side conllinear location of shelving holding device 210 with substrate.
That is, thus being arranged on substrate shelves on the holding device 210 holding device 208 that compresses that is risen or descended by first drive member 220 and is used for compressing and is shelved on the both sides that substrate is shelved the upper surface of the substrate S on the holding device 210.
As shown in Figure 2, substrate is shelved the shape that holding device 210 has the plate of central hole, and the boundary between the side surface of the upper surface of substrate and perforated portion is formed with step, allows substrate easily to be shelved on the step thus.
In addition, substrate is shelved holding device 210 and is provided with four positioning cylinders 130, and four at the relative cylinder 132 that aligns of four sides of substrate S and positioning cylinder 130, thereby substrate S is above that shelved in alignment.
Positioning cylinder 130 is driven by air pressure, and is provided with when substrate S is shelved on substrate and shelves on the holding device 210 reference point that is used for substrate S when depositing.
Alignment cylinder 132 is driven by air pressure, and when alignment substrate S, substrate S is moved to the reference point of substrate S.
Here, four positioning cylinders 130 are positioned at two sides adjacent of substrate S, and have confirmed the reference point of substrate S.Simultaneously, four alignment cylinders 132 are positioned at two other sides adjacent of substrate S, thereby relative with four positioning cylinders 130, and through from the sidepiece of substrate S respectively to the positioning cylinder 130 alignment substrate S that exerts pressure.
First drive member 220 that being used for rises or descend compresses holding device 208 is by being arranged on first drive member 220 and compressing driving member 212 reciprocating motions between the holding device 208.Driving member 212 is a rod, and folding in opposite direction at its two ends.
Freedom outwards moves removable side plate 206 by means of being positioned at the guiding piece on plate 202 upper surfaces one side, and this moment, and the linear reciprocal movement of removable side plate 206 is by second drive member, 240 controls that are assemblied in transversely.
With reference to Fig. 3 a and 3b, first drive member 220 comprises: plate shape base portion 222; Be erected at a pair of fixed head 224 of the upper surface both sides of plate shape base portion 222; Thereby reciprocating betwixt movable plate 226 between fixed head 224, and this movable plate has the axle 228 of the center of the front surface that is formed on movable plate 226, thus pass the fixed head 224 that is positioned at movable plate 226 the place aheads and be projected into the outside; Be arranged on movable plate 226 and the bellows 232 between the fixed head 224 at movable plate 226 rear portions; Wherein the two ends of bellows 232 are respectively fixed to movable plate 226 and fixed head 224; And when bellows are filled with when being arranged on the outside compressor (not shown) air supplied in chamber, bellows are suitable for the linear forward shifting axle 228 along with the volume that is increased; And be used to inject the air nozzle 234 that is incorporated into the air in the bellows 232 from the outside; And spring 236; Spring 236 is set to movable plate 226 rear portions around the axle 224 between movable plate that is in mobile status 226 and fixed head 224, thereby in the contraction process of from bellows 232, discharging the bellows 232 that cause owing to air, applies restoring force to bellows 232.Here, be used to compress or the cushion effect control board 238 of retracting spring 236 is fixed to the cushion effect of control spring 236 on the axle 228.
Here, second drive member 240 ' has shape and the function identical with first drive member 220, therefore will omit detailed description here.The difference part is; First drive member 220 vertically is fixed on fixed side 204 and the removable side plate 206; And be used for rising or descend and compress holding device 208; And second drive member 240 ' is provided with the removable side plate 206 perpendicular to the state adjacent plate 202 of first drive member 220, and under the state of the upper end that is fixed to removable side plate 206, comes outwards to move removable side plate 206 by means of air pressure or it is returned to initial position.
Simultaneously, reference number 242,244,246,248,250,252,254,256 and 258 refers to base portion, fixed head, movable plate, axle, anchor clamps, bellows, air injection nozzle, spring, cushion effect control board respectively.
As shown in Figure 1, rotary lifting device 300 is arranged on the upper surface in chamber 110 and rotary plate S, thereby in the depositing organic material process, organic material can be evenly distributed on the substrate S in chamber 110.Rotary lifting device 300 comprises: first quill shaft 306 that extends downwardly into the upper surface of the substrate loading stand 200 in chamber 110 from the inside of rotary lifting device carriage 304; Extend to second quill shaft 308 of the upper surface of magnetic support 124 above first quill shaft 306 in first quill shaft, 306 inside; And the air injector 302 that is arranged on the top of rotary lifting device 300, be used for from compressor to first and second drive member 220 and 240 ', positioning cylinder 130 and alignment cylinder 132 supply air pressure.
The mask holding device 122 that is arranged on the substrate loading stand 200 of first quill shaft, 330 lower ends rises or the decline mask through driving the servo motor (not shown), and the magnetic support that is arranged on second quill shaft, 340 lower ends rises or decline substrate S by means of the cylinder (not shown).
This device also can comprise other slewing (not shown), is used for rotating the substrate loading stand 200 with substrate S mounted thereto.
This device comprises that also a heater 140 and one are arranged on the organic material evaporating dish 142 within the bottom in chamber 110, be used to evaporate organic material and it is deposited to substrate S.
To describe according to this execution mode referring to figs. 1 through 3c below and be used for the operation of device of depositing organic material.At first, substrate S is by means of being arranged on the outside transmitting device (not shown) in chamber 110, passing the substrate that is formed on the inlet on 110 1 sides of chamber and is shelved on substrate loading stand 200 and shelve on the holding device 210.
After the inlet of closing the chamber 110 that has door, the air in the chamber 110 is discharged into the outside by means of a plurality of vacuum pump P of the bottom edge that is arranged on chamber 110.
Then; Air is injected into the bellows 232 that are arranged on first drive member 220 on fixed side 204 and the removable side plate 206 from being arranged on the outside compressor in chamber, can descend and shelves substrate and shelve the substrate S on the holding device 210 to fix thereby compress holding device 208.When the air that comes when bellows 232 because from the compressor supply and volume increase; The axle 228 of movable plate 226 moves forward; The anchor clamps 230 that are set to axle 228 far-ends then force driving member 212 to descend, thereby the holding device 208 that compresses that is set to driving member 230 descends.
When compressing holding device 208 declines; The both sides of its upper surface through compressing substrate S and fixing base S; And as substrate S securely fixedly the time, air is injected into and is used for moving in second drive member 240 of removable side plate 206, thereby; The axle of second drive member 240 248 moves forward, and forces removable side plate 206 to move horizontally towards the other places.
Here; Being inserted in substrate shelves holding device 210 and compresses substrate S between the holding device 208 by secure fixation; And this moment; Second drive member, 240 work that are set to removable side plate 206 are outwards moved and stretching substrate S one side to force removable side plate 206, allow substrate S horizontal location thus, and it is sagging owing to conduct oneself with dignity to stop substrate S simultaneously.
Then, for heater 140 power supplies that are arranged on place, 110 bottom surfaces, chamber, accurately control temperature through the temperature controller (not shown), the temperature of heater rises to the fusing point of organic material, evaporates until organic material.At this moment, along with the organic material start vaporizer in organic material evaporating dish 142, the baffle plate (not shown) of installing is in advance opened, and allows evaporating materials to be deposited on the substrate S.Here, baffle plate is used for stoping the impurity that before the organic material evaporation, remains on the organic material evaporating dish 142 to be deposited on the substrate S.
At this moment, substrate S is by means of 300 rotations of rotary lifting device, thereby in the depositing organic material process, organic material can be evenly distributed on the substrate S in the chamber 110.After the deposition of accomplishing substrate S, the air in second drive member 240 is discharged into the outside.Thus, removable side plate 206 returns its original position owing to be arranged on the restoring force of axle 248 spring 256 on every side, and release is applied to the pulling force on the substrate S.At last, compressing holding device 208 rises by means of first drive member 220---and air is discharged from this first drive member 220, and substrate S is transferred out from chamber 110 by transmitting device.
According to this execution mode, in the deposition process in the chamber that betides device 100 110, the side horizontal stretch of substrate S, and two ends are fixing by compressing holding device 208, thus stoped large-area substrates S sagging owing to the deadweight in installation base plate S.
Execution mode 2
Though do not illustrate in the drawings, comprise according to the device that is used for depositing organic material of second embodiment of the invention: wherein loaded the chamber (not shown) of large-area substrates S, substrate S experiences deposition process in the chamber; Be arranged on the substrate loading stand 400 on the top in chamber, be used to prevent that substrate S is sagging under the fixing state in its two ends; And the rotary lifting machine (not shown) that is coupled to the upper surface in chamber, be used for rotary plate S, thereby in the organic material evaporation process, organic material can be evenly distributed on the substrate S in the chamber.
The device that is used for depositing organic material according to second execution mode waits some parts except for example substrate loading stand 400; Have and first execution mode similarly structure and function, therefore will omit detailed description according to the like configurations of the device of second execution mode.
The device that is used for depositing organic material also comprises: the controller (not shown), when exert pressure and pulling force when stoping substrate S sagging this controller controlled pressure and tensile force through the two ends of the substrate S on being installed to substrate loading stand 400; And the display device (not shown) that is electrically connected to controller, be used to export the numeric results of detection pressure and tensile force.
This device also comprises: the heater (not shown); And the organic material evaporating dish (not shown) that is arranged on the bottom in chamber, be used to evaporate organic material and it is deposited to substrate S.
With reference to Figure 4 and 5, substrate loading stand 400 comprises: plate shape base portion 540; Be set to a pair of substrate fixed part 410 and 510 on plate shape base portion 540 opposite sides respectively; The a pair of guiding piece 542 that moves horizontally, it vertically is set to plate shape base portion 540 upper surfaces, makes substrate fixed part 410 and 510 be positioned at the two ends of the upper surface that moves horizontally guiding piece 542; And the tensile force that vertically is set on the outer surface of one of them substrate fixed part that can move applies portion 550, is used for applying tensile force through outside moving substrate fixed part to substrate.
This device also comprises: drive member fixed side 544; And setting is arranged on the side plate 536 on plate shape base portion 540 opposite sides.
Along continuous straight runs moves substrate fixed part 410 and 510 on the guiding piece 542 moving horizontally, thereby the distance between substrate fixed part 410 and 510 can be according to the size adjustment of substrate S.
Two substrate fixed parts 410 and 510 are of similar shape and function, and the substrate fixed part 410 that only is arranged on plate shape base portion 540 1 sides belongs to fixing type, and the substrate fixed part 510 that is arranged on plate shape base portion 540 opposite sides belongs to movably type.Here, static can both move, thereby the distance between substrate fixed part 410 and 510 can be according to the size adjustment with large-area substrate S, allow thus to deposit having on the substrate of different size with substrate fixed part 410 and 510 movably.
Thereby the static component 412 that substrate fixed part 410 and 510 comprises a side that is separately fixed at horizontal guide 542 be arranged on opposite side can be at the movable member 512 that moves horizontally under the following state: wherein two members 412 with 512 with the upper surface that vertically is arranged on plate shape base portion 540 on a pair of guiding piece 542 that moves horizontally contact.Each substrate fixed part 410 or 510 also comprises: the lower plate 414 or 514 that is arranged on the longitudinal extension on the upper surface of static component 412 or movable member 512; Be positioned at the fixing holding device 416 or 516 of plate shape on lower plate 414 or 514; Wherein riser insert plate shape fixedly holding device 416 or 516 and lower plate 414 or 514 between; To guarantee separating of between; And be suitable for allowing substrate S to be shelved on said plate shape fixedly on the upper surface of holding device, wherein each plate shape fixedly holding device 416 or 516 all have the shape identical with each lower plate 414 or 514; Be arranged on the fixedly position fixed plate 418 or 518 of holding device 416 or 516 1 sides and longitudinal extension of plate shape, wherein position fixed plate 418 or 518 has L shaped cross section; Spaced apart and be positioned at the drive member fixed head 420 or 520 of the center on fixed head 418 or 518 with position fixed plate 418 or 518; Be suitable for drive member fixed head 420 or 520 and plate shape fixedly rise between the holding device 416 or 516 or descend compress holding device 426 or 526; Be used for compressing and be shelved on the fixedly upper surface of the substrate S on the holding device 416 and 516 of plate shape, wherein compress the shape that holding device 420 or 520 has the plate of longitudinal extension; And the vertical drive member 428 or 528 that is arranged on the upper surface center of drive member fixed head 420 or 520, being used for rising or descending compresses holding device 420 or 520, thereby exerts pressure to substrate S.
Compressed part 422 or 522 by compress holding device 426 or 526 be arranged on the movable plate 424 or 524 that compresses on holding device 426 or 526 and constitute; And be provided with a plurality of vertical pivots, with remain on compress holding device 426 or 526 and movable plate 424 or 524 between the interval.
Compressed part 422 or 522 constitutes with movable plate 424 or 524 by compressing holding device 426 or 526.
Here, vertically drive member 428 or 528 is hydraulic cylinder or pneumatic cylinder, uses liquid or air compaction substrate S by the outside supply.
Vertically drive member 428 or 528 is provided with the first pressure gauge L1 that is positioned on its shifting axle.The first pressure gauge L1 can be at least one load cell, and when on it during imposed load, this load cell deforms---for example extend or compression.The degree of distortion is measured with the form of the signal of telecommunication by the distortion detector, convert digital signal then into, thereby pressure outputs on the display device of controller as numeric results.
In addition, connecting plate 430 or 530 is inserted in the first pressure gauge L1 of vertical drive member 428 or 528 and compresses between holding device 426 or 526.
That is, when vertical drive member 428 or 528 descended and compresses substrate S,---to be load---be delivered to load cell to the pressure that compresses substrate S, is digital signal by electrical signal conversion then, and authorized pressure is output as digital form thus.
Tensile force applies portion 550 and is erected to the location.Tensile force applies portion 550 and comprises: the lower plate 514 of movable substrate fixed part 510; Be fixed to plate shape fixedly holding device 516 outer wall and erect the static side plate 552 of location; Spaced apart and be arranged on the drive member fixed side 544 of plate shape base portion 540 1 sides with static side plate 552; And be set on drive member fixed side 544 outer walls, be used for along continuous straight runs and move the horizontal drive member 554 of movable substrate fixed part 510.
Trunnion axis inserts between static side plate 552 and the drive member fixed side 544 to keep at interval betwixt.
Here, horizontal drive member 544 is hydraulic cylinder or pneumatic cylinder, uses the liquid of the supply from the outside or air to compress substrate S through outwards moving movable substrate fixed part 510.
In addition, horizontal drive member 554 shifting axles are provided with the second pressure gauge L2.The second pressure gauge L
2Can be load cell, when on it during imposed load, this load cell deforms, and for example extends or compression.The degree of distortion with electric signal measurement, convert digital signal then into, thereby pressure outputs on the display device of controller by the distortion detector as numeric results.
Promptly; When the shifting axle along continuous straight runs of horizontal drive member 554 outwards moves; Substrate S one side is stretched and the both sides of substrate are fixed, and---being tensile load---is delivered to load cell at this moment, to act on the tensile force of substrate S; Be digital signal by electrical signal conversion then, authorized pressure is output as digital form thus.
Although the first and second pressure gauge L here
1And L
2Can constitute by single load cell respectively, desirably, the first and second pressure gauge L
1And L
2Constitute by a plurality of load cells respectively, so that all even load of measuring exactly.
In addition, vertically drive member 428 or 528 and horizontal drive member 554 can apply different pressure and tensile force to substrate S according to the thickness of substrate S.
Therefore, when using the first and second pressure gauge L
1And L
2Measurement is applied to after the pressure and tensile force on the substrate S, and measured value is processed into the data of pressure and tensile force, is used for feedback loop then, makes that thus deposition process can automation and produce in large quantity.
Shown in Fig. 6 a to 6c, substrate S is being installed in the process on the substrate loading stand 200, substrate S sagging was divided into for three steps.In the first step; Because compressing holding device 426 and 526 does not have fixedly holding device 416 and 516 of pressure strip shape; Substrate S is shelved on plate shape fixedly on the holding device 416 and 516; But do not have load to be applied to substrate S, at this moment, the substrate S with reference number " a " indication in Fig. 6 a is in maximum because of the substrate S sag of chain that deadweight produces.
In second step, shown in Fig. 6 b, substrate S is shelved on plate shape fixedly on the holding device 416 and 516, is positioned at plate shape and fixedly compresses holding device 426 and 526 declines on the holding device 416 and 516, and exert pressure to the two ends of substrate S.Under this state; Because two ends are fixed by compressing holding device 426 and 526; Substrate has the sag of chain by reference number " b " indication; At the sag of chain a that freely shelves under the state, even because because the deadweight of substrate S and sagging in the center of substrate S, the two ends of substrate S are fixed on plate shape fixedly on the holding device 416 and 516 by compressing holding device 426 and 526 to this sag of chain less than substrate S.
In the 3rd step; Shown in Fig. 6 c; Substrate S is fixed on plate shape fixedly on the holding device 416 and 516 by compressing holding device 426 and 526; The plate shape that is positioned at substrate S one side fixedly holding device 516 with compress holding device 526 and outwards move, apply tensile force to substrate S then, stop substrate S sagging thus.That is, because substrate S one side is stretched through apply tensile force to substrate S, simultaneously the two ends of substrate S are fixed on plate shape fixedly on the holding device 416 and 516, so substrate S can not conduct oneself with dignity sagging because of it by compressing holding device 426 and 526.
To be respectively two long sides that substrate S is shown be fixed to the fixedly vertical view on the holding device 416 and 516 of plate shape by compressing holding device 426 and 526 for Fig. 7 a and 7b, and when pressure and tensile force are applied on the substrate simultaneously the chart of the relation between the clamping length of sag of chain and substrate S.Shown in Fig. 7 b, can see that when the clamping length that compresses holding device 426 and 526 couples of substrate S increased, the sag of chain of substrate S reduced.In Fig. 7 b, substrate S freely be shelved on plate shape fixedly holding device 416 and 516 last time its sag of chain variation represent by solid line; When the both sides of substrate S by compressing holding device 426 and 526 fixedly the time, represent by dotted line according to the variation of the sag of chain of the substrate S of the clamping length that compresses holding device 426 and 526; And when the side of substrate S through the fixing holding device 416 and 516 and compress that holding device 426 and 526 is stretched, the two ends of substrate S are fixed on plate shape fixedly holding device 416 and 516 last times by compressing holding device 426 and 526 simultaneously of outside movable plate shape, be illustrated by the broken lines according to the variation of the sag of chain of the substrate S of the clamping length that compresses holding device 426 and 526.
According to the chart shown in Fig. 7 b, can see, when tensile force be applied to substrate S one side, simultaneously two ends by compress holding device 426 and 526 be fixed on plate shape fixedly holding device 416 and 516 last time substrate S the sag of chain minimum.
In addition, be appreciated that along with the increase to the clamping length of substrate S, the sag of chain of substrate S descends.
To be respectively two short sides that substrate S is shown be fixed to the fixedly vertical view of holding device 416 and 516 substrate S of plate shape by compressing holding device 426 and 526 for Fig. 8 a and 8b, and when pressure and tensile force are applied on the substrate simultaneously the chart of the relation between the clamping length of sag of chain and substrate S.Shown in Fig. 8 b, can see that when the clamping length that compresses holding device 426 and 526 couples of substrate S increased, the sag of chain of substrate S reduced.In Fig. 8 b, substrate S freely be shelved on plate shape fixedly holding device 416 and 516 last time its sag of chain variation represent by chain-dotted line; When the both sides of substrate S by compress holding device 426 and 526 fixedly the time variation according to the sag of chain of the substrate S of the clamping length that compresses holding device 426 and 526 represent by solid line; And when the side of substrate S through the fixing holding device 416 and 516 and compress that holding device 426 and 526 is stretched, the two ends of substrate S are fixed on plate shape fixedly holding device 416 and 516 last times by compressing holding device 426 and 526 simultaneously of outside movable plate shape, represent by double dot dash line according to the variation of the sag of chain of the substrate S of the clamping length that compresses holding device 426 and 526.
According to the chart shown in Fig. 8 b, can see, when tensile force is applied to substrate S one side, simultaneously two ends are fixed on plate shape fixedly holding device 416 and 516 last times, the sag of chain minimum of substrate S by compressing holding device 426 and 526.
In addition, be appreciated that along with the increase to the clamping length of substrate S, the sag of chain of substrate S descends.
The result; Can see; Be shelved on the fixedly situation on the holding device 416 and 516 of plate shape for the long side of substrate S; When tensile force is applied to the side of substrate S, simultaneously its both sides are by compressing holding device 426 and 526 fixedly the time, the sag of chain of substrate S is less than being shelved on plate shape fixedly on the holding device 416 and 516 and the sag of chain when not applying any power as substrate S, perhaps less than when the both sides of substrate S by compressing that holding device 426 and 526 is fixed and the sag of chain when not applying tensile force.In addition, when the clamping length to substrate S increased, the sag of chain of substrate S reduced.
In addition; Can also see; Be shelved on the fixedly situation on the holding device 416 and 516 of plate shape for the short side of substrate S; When tensile force is applied to the side of substrate S, simultaneously its both sides are by compressing holding device 426 and 526 fixedly the time, the sag of chain of substrate S is less than being shelved on plate shape fixedly on the holding device 416 and 516 and the sag of chain when not applying any power as substrate S, perhaps less than when the both sides of substrate S by compressing that holding device 426 and 526 is fixed and the sag of chain when not applying tensile force.In addition, when the clamping length to substrate S increased, the sag of chain of substrate S reduced.Simultaneously, when the long side of fixing base, sag of chain is less than the sag of chain when the fixing short side.
Therefore; Substrate loading stand 400 according to second execution mode is operated as follows: the plate shape that shown in Figure 4 and 5, is shelved on the substrate fixed part 410 that is arranged at substrate loading stand 400 both sides and 510 as substrate S is holding device 416 and 516 last times fixedly; Air injects the vertical drive member 428 or 528 that is set to substrate fixed part 410 and 510 both sides respectively; Reduce the shifting axle of vertical drive member 428 or 528 thus; Substrate S is fixed on plate shape fixedly on the holding device 416 and 516, descend and compress holding device 426 and 526, and the both sides of substrate S are fixed on plate shape fixedly on the holding device 416 and 516.Then, both sides are stretched through handling horizontal drive member 554 by a side that compresses holding device 426 and 526 fixing substrate S, and wherein equipment drives unit 554 and is arranged on the substrate fixed part 510 on plate shape base portion one side to move.
Here; Be inserted in plate shape fixedly holding device 416 and 516 and the substrate S that compresses between holding device 426 and 526 firmly fixing betwixt; And the side of substrate S outwards moves through the operation of horizontal drive member 554, and is not sagging because of conducting oneself with dignity thereby it is flatly located.
Therefore, carry out deposition processes and during depositing organic material at the substrate to the chamber that is positioned at device, when substrate S being installed in 400 last times of substrate loading stand, substrate S along continuous straight runs stretches, thereby can stop substrate S sagging because of deadweight.
With reference to figure 9, the method that is used for depositing organic material according to the present invention comprises: with the step S600 of board transport in the chamber; The step S610 of fixing base both sides; The step S620 of stretching substrate one side; The step S630 of depositing organic material on substrate; And the step S640 that substrate is transferred out in the chamber.
With board transport to the step S600 in the chamber be by means of be arranged on the outside transmitting device (not shown) in chamber 110 with board transport to the fixing step on the holding device 416 and 516 of the plate shape of the substrate fixed part 410 of the substrate loading stand that is positioned at chamber 110 400 and 510.
The step S610 of fixing base both sides is the steps that fix the both sides of the substrate S that is shelved on substrate fixed part 410 and 510 by means of vertical drive member 428 and 528.
The step S620 of stretching substrate one side be by means of be set to tensile force on the substrate fixed part 510 apply portion 550 horizontal drive member 554 and outwards stretching substrate S one side, the both sides of substrate S are by substrate fixed part 410 and 510 fixing steps simultaneously.
At the step S630 of depositing organic material on the substrate is to utilize by the heat of heater (not shown) supply to evaporate organic material and the organic material that evaporates is deposited to the step on the substrate S.
The step that the step S640 that substrate is transferred out in the chamber is substrate S that deposition is accomplished transmission is come out in the chamber.
Execution mode 3
Though do not illustrate in the drawings, comprise according to the device that is used for depositing organic material of third embodiment of the invention: wherein loaded the chamber (not shown) of large-area substrates S, substrate S carries out deposition process in the chamber; Be arranged on the substrate loading stand 600 on the top in chamber, be used to prevent that substrate S is sagging under the fixing state in its two ends; And the rotary lifting machine (not shown) that is coupled to the upper surface in chamber, be used for rotary plate S, thereby in the organic material evaporation process, organic material can be evenly distributed on the substrate S in the chamber.
The device that is used for depositing organic material according to the 3rd execution mode waits some parts except for example substrate loading stand 600; Have and first and second execution modes similarly structure and function, therefore will omit detailed description according to the like configurations of the device of the 3rd execution mode.
With reference to Figure 10 a, 10b and 10c; In the 3rd execution mode, substrate loading stand 600 comprises: static holding device 610, removable holding device 612, compress holding device 620 and 622, at least one pair of vertical drive member 630, at least one horizontal drive member 632 and substrate contacts holding device 640.
Static holding device 610 has the plate shape of longitudinal extension, and downwarping at one end.
Removable holding device 612 is positioned at the horizontal side of static holding device 610; And at one end be connected to static holding device 610 by means of horizontal drive member 632; While is in other end downwarping, thereby the bend of removable holding device 612 is facing to the bend of static holding device.Removable holding device 612 is shorter than static holding device 610.
Compressing holding device 620 and 622 can rise or descend, thereby they can contact the lower surface of static holding device 610 and removable holding device 612 or separate from this lower surface, and has the L shaped cross section of symmetry.
Paired vertical drive member 630 can be bolt or pneumatic cylinder.Vertically drive member 630 compresses through manual swivel bolt or the automatic reciprocating motion through pneumatic cylinder piston rod or unclamps the substrate S that is inserted between the substrate contacts holding device 622, thereby makes substrate S can be installed on the substrate loading stand 600.That is, be under the situation of bolt in vertical drive member 630, the screw thread on the operating screw perhaps separates with it with removable holding device 612 contacts with static holding device 610 through swivel bolt thereby compress holding device 622.
Many upper surface one sides that can be set to static holding device 610 and removable holding device 612 to vertical drive member 630 respectively.Simultaneously; In vertical drive member 630 is under the situation of pneumatic cylinder; Piston rod vertically passes the upper surface side of static holding device 610 and removable holding device 612, and its front end is fixed in static holding device and the removable holding device relative to one another.
Vertically drive member 630 can be bolt or pneumatic cylinder.Vertically drive member 630 compresses through manual swivel bolt or the automatic reciprocating motion through pneumatic cylinder piston rod or unclamps the substrate S that is inserted between the substrate contacts holding device 622, allows substrate S to be installed on the substrate loading stand 600 thus.That is, be under the situation of bolt in vertical drive member 630, operate the screw thread that is positioned on the bolt through swivel bolt and perhaps separate with removable holding device 612 contacts thereby compress holding device 622 with it with static holding device 610.
A plurality of horizontal drive members 632 can be set to the top in removable holding device 612 outsides.Simultaneously, be under the situation of pneumatic cylinder at horizontal drive member 632, the piston rod along continuous straight runs passes the top in removable holding device 612 outsides, and fixes at its front end place.
Substrate contacts holding device 640 is set to static holding device 610, removable holding device 612 and compresses on the relative inward flange of holding device 620 and 622.Each substrate contacts holding device 640 is processed by soft silicon pad or rubber that high frictional force is provided, prevents thus damage is caused on the surface of substrate S.
In addition; Each substrate contacts holding device 640 has the surface of downtilt angles θ toward the outer side; Shown in figure 11, thus when originally substrate S being installed in 640 last times of substrate contacts holding device, the fixed in shape that substrate S sentences protrusion at each lay-down position is above that.Yet when the side of substrate S receives when stretching, sagging being able to of substrate S stops, and allows substrate S to remain the surface of general planar thus.
Here, the angle of each substrate contacts holding device 640 is preferably between 0 to 90 degree scope.
Therefore; When the 600 last times of substrate loading stand that substrate S are fixed to according to the 3rd execution mode; By means of the transmitting device (not shown) that is arranged on 110 outsides, chamber substrate S is transferred on the substrate loading stand 600 of device (not shown) being used for depositing organic material, and substrate S shelves and is arranged on the substrate contacts holding device 640 that compresses in holding device 620 and 622.At this moment, the center of substrate S is because its deadweight and sagging.
Then; Shown in Figure 10 b; Operate a plurality of vertical drive member 630---said vertical drive member 630 is arranged on static holding device 610 and upper surface one side facing to the removable holding device 612 of static holding device 610; Compress holding device 620 and 622 in order to rising; Wherein vertically the front end of the piston rod of drive member 630 is fixed, and is fixed at its place, both sides thereby be inserted into to compress between holding device 620 and the static holding device 610 and be inserted into the substrate S that compresses between holding device 622 and the removable holding device 612.At this moment, generation is slightly sagging at substrate S center.Here, when fixing base S, the substrate contacts holding device 640 of processing and be arranged on upper surface and the lower surface place of substrate S by soft material prevents the damaged surfaces of substrate S.
Then; Shown in Figure 10 c; Operation setting to a plurality of horizontal drive members 632 of the outer wall of removable holding device 612 outwards to move removable holding device 612; Thereby separate with static holding device 610, simultaneously, compress the supported underneath substrate S of holding device 622 from removable holding device 612.Promptly; The side of substrate S is fixing with the substrate contacts holding device 640 that compresses on the holding device 620 by being arranged on static holding device 610, and the opposite side of substrate S is fixing with the substrate contacts holding device 640 that compresses on the holding device 622 by being arranged on removable holding device 612.At this moment, when the opposite side by the removable holding device 612 substrate S fixing with compressing holding device 622 outwards moved through the operation of horizontal drive member 63, tensile force was applied to the opposite side of substrate S, thus, allows substrate to receive horizontal support.
Alternatively, shown in Figure 12 a, in all four rear flank of fixing base S, tensile force can be applied to four sides of substrate S along four direction, stops substrate S sagging thus.
Alternatively, shown in Figure 12 b, after compressing all four edges of substrate S, tensile force can be applied to the edge of substrate along diagonal.Like this, owing to the notion of the invention described above can be expanded along any direction, but the present invention's extensive use.
In addition, the present invention also can be applied to flexible base, board, for example plastic base and stainless steel substrate, and frangible glass substrate.
Industrial applicibility
Can be clear that by above description; According to the present invention; After on the substrate loading stand in substrate is installed to the chamber; Through outside moving substrate one side, simultaneously the substrate both sides are fixed and tensile force is applied to substrate, stoped substrate thus because its deadweight and sagging, even substrate has big area.
Although disclose preferred implementation of the present invention for the purpose of illustration, it should be appreciated by those skilled in the art that multiple improvement can be arranged, increase and substitute, and this does not deviate from scope of the present invention and the purport that is disclosed in the accompanying claims.