200401927 Ο) 玖、發明說明 【發明所屬之技術領域】 本發明是關於是貼合液晶等的基板之裝置，特別是關 於適用於在減壓室內使所貼合之基板彼此間對向把持，縮 小間隔而貼合之液晶顯示面板等的組裝之基板組裝裝置。 【先前技術】 液晶顯示面板的製造，含有隔有數# m程度極接近的 間隔用設在基板周緣部的粘接劑（以下，稱爲密合劑）將 設有透明電極或薄膜電晶體陣列之2片玻璃基板貼合（以 下，將貼合後的基板稱爲晶胞），將液晶封裝到上述過程 所形成的空間之過程。 此液晶的封裝法在日本專利特開2000- 284295號公 報中提案有 不設置注入口，液晶下滴到將密封劑描繪成 封閉的圖案之一者的基板上，在於真空室內將他者的基板 配置在一者的基板上，使上下的基板接近後貼合之方法。 上述日本專利特開2000- 2U29 5號公報中的過去技 術則是基板把持在真空中，下側的基板載置在平坦的機座 上，上側的基板在大氣狀態下以負壓吸引，到達一定的真 空狀態則用靜電力所形成的靜電吸持夾把持基板之構成。 然則，最近已有基板尺寸成日1 ηι X 1 m以上的大型化，且 基板厚度也由3mm轉變爲2mm、1mm的薄型化之傾向。 因而當用加壓板（上載置台）吸持基板之際，基板的中央 部撓曲，基板中央部的基板與加壓板的間隔變大，當基板 (2) (2)200401927 從基板搬運手段轉交到加壓板之際，會發生無法把持基板 的情形。特別是把持大畫面的基板時，由於在基板的中央 部形成有配向膜或TFT等，因而只能支承基板的周邊部 ，對於防止基板的撓曲會造成困難。另外即使能把持，基 板也會發生殘留應力，或呈基板對準標記的位置偏離的狀 態把持基板。另外把持搬運基板的自動機器手爪部也增長 把持基板時，前端側撓曲，自動機器手爪前端側的基板與 加壓板的間隔仍會變大而無法吸收基板。因此，對大型基 板若不能解決上述問題就無法正確進行貼合。 【發明內容】 本發明之目的爲提供即使基板大型化也能有良好精度 把持基板，又能有高精度且高速下進行貼合的高生產性之 基板組裝裝置。 爲了達成上述目的，本發明是針對具有裝設用來形成 減壓氣相的真空室、及一者的基板把持在前述真空室內且 構成爲能往上下移動之加壓板（上側載置台）、及與把持 在前述加壓板上的基板成對向隔有間隔把持他者的基板之 基板把持載置台（下側載置台）、及驅動前述基板把持載 置台，進行前述一者的基板與他者的基板之位置對準，往 上下驅動前述加壓板而縮小基板間的間隔，利用設在前述 基板任何一者之粘接劑在減壓氣相中進行貼合之基板組裝 裝置’其特徵爲：爲了將基板把持在加壓板上而加設用負 壓的複數個吸引孔、及複數個靜電吸持機構，加壓板設有 -7- (3) (3)200401927 可上下作動之複數個可動式吸盤。 【實施方式】 以下，根據圖面說明本發明的實施形態。 第1圖中，基板組裝裝置由下箱室T1部及上箱室T2 部所構成。在上述箱室T2部備有上側載置台2 (以下，也 有稱爲加壓板的情況），該載置台2利用貫穿上箱室T2 的支承部3及複數個調整腳4可往上下方向移動。支承腳 3利用0封圈5而調整腳4利用熔接皺褶管6來阻隔上箱 室T2內部使其不與大氣連通。上側載置台2的支承腳3 及調整腳4固定於加壓基體板7。 進而，此加壓基體板7的中央部固定於中間基體板8 。中間基體板8構成爲經由使由安裝在頂部框架9之驅動 馬達1 〇、減速機1 1以及滾珠螺桿1 2所構成的驅動機構 運轉’以滾珠齒條導引1 3作爲導引而能往上下移動。另 外頂部框架9利用與滾珠齒條導引不同設置之支承性支承 於架台1上。一端固定於加壓基體板7之各調整腳4的他 端側’連結到利用安裝在中間基體板8之驅動馬達1 4驅 動之滾珠螺桿1 5。驅動由驅動馬達1 4及滾珠螺桿1 5所 形成的上下調整機構，使力量加到加壓基體板7就能使上 側載置台2 —面保持平坦度一面往上下移動。 然而’上箱室T2備有結合加壓基體板7間之結合機 構，當上箱室T2與下箱室T2分開時，使結合機構作動而 使加壓基體板與上箱室T2成一體化後，使驅動馬達動 -8- (4) (4)200401927 作而向上方向升起。 另外’往箱室內進行基板的搬入/搬出之門閥1 6設置 在上箱室T2的邊側外壁側。進而在門閥1 6所對向之上箱 室側壁的位置設置電離器1 7使其經由對基板表面噴吹離 子化超音波空氣就可以進行基板的除電。進而也在箱室外 側的門閥1 6附近設置電離器1 7 a，因此在開門的狀態下噴 吹離子化空氣就能提高基板的除電效果。 另外’在上箱室T2的上面外壁設置複數個軸套構造 的副導引1 8，該副導引1 8將中心軸1 9突出到箱室內。此 中心軸1 9與設在上側載置台2外周的突出部上的孔吻合 而能進行上側載置台2水平方向的調整。即是作動副導引 1 8及中心軸1 9，作日上側載置台2的水平調整機構。 在上箱室T2設有基板標記觀測用的複數個觀測窗。 “洛機的Ιε同2 1插入到此観測窗，利用攝影機確認設在 基板上的標記。攝影機的鏡筒2 1設置在備有水平方向（X 、Υ方向）移動軸及垂直方向（Ζ方向）的移動構件之移 動機座上，該移動機座固定於上箱室Τ 2上。進而，在上 側載置台2上與上述觀測窗相對應的位置設置基板標記辨 識用的孔。 本實施形態爲將攝影機配置在箱室之外之構成，不過 若是設成將攝影機直接安裝在上側載置台2上之構成，則 能更接近基板配置攝影機，提高攝影機對標記的辨識精度 ’又能提高基板間的位置對準精度。 進而，爲了測定對基板的加壓力，在支承腳3的中間 (5) (5)200401927 基體板8與滾珠螺桿之間設置測力傳感器22。另外，調 整±載置台的平坦度之際，爲了監視使驅動各調整腳4的 馬達不致於過負載，而在加壓基體板7上的各調整腳分別 設置測力傳感器2 3。 在下箱室T 1內固定有下側載置台24。此下側載置台 24將全面接合固定於下箱室τ 1則當減壓時下箱室τ 1變 形時’會有受到該變形影響而平坦度變差的可能性。因而 只固定周邊部使其不致受到下箱室Τ 1變形的影響。另外 在下箱室Τ1的全周，配置後述的密封環2 5，接觸上箱室 T2 ’且關閉門閥1 6的狀態成爲內部密閉而構成減壓室。 下箱室Τ1設置在由馬達26及滾珠螺桿（未圖示）和 旋轉軸承27來進行旋轉驅動所構成之β基體載置台28的 上面。β基體載置台28與下箱室Τ1的結合，使其夾隔箱 型構件而能確保一定的空間。此空間是爲了將U V照射機 構40或基板把持爪升降機構4 1、基板升降機機構42安 裝到下箱室Τ1的下側而設置。㊀基體載置台28介由旋轉 軸承27安裝在Υ載置台32上。另外，γ載置台32設置 成用馬達29能在設於X載置台3 3的線性軌道上移動。進 而X載置台33設置成經驅動馬達30就能在設於架台1側 之線性軌道上移動。 另外，上箱室Τ 2接觸到下箱室τ 2而構成減壓室時， 爲了使密封環2 5的下壓量一定，而在㊀基體載置台2 8的 外周部上設置複數個上箱室用的滾珠軸承3 4爲附設調節 機構的支座3 5。利用此滾珠軸承3 4及支座3 5來調整上 -10- (6) (6)200401927 箱室部T 2的下降位置。 進而爲了使β基體載置台28不變形又爲了支承0基 台28的外周部，而在固定於裝置基台（架台）1上的構件 設置複數個0基體板28用的滾珠軸承37爲附設調整機構 的支座3 8。以此方式來承受從0基體板28上的載重。此 - 樣，由於構成爲以箱室用的軸承34及Θ基體載置台用的 ， 滾珠軸承3 7的2段式來承受上下箱室周圍的載重，因而 能以最小限度抑制箱室的變形。 β 下箱室Τ1中設置用來進行標記辨識的複數個透過照 明9，在與下側載置台24所對應的位置貫穿有孔。進而 _ 在下箱室Τ1內，爲了 UV粘接劑擴散硬化使經貼合的基 板不致於偏離，而設有複數個加壓/UV照射機構40。進而 ，分別設有當進行基板的搬入/搬出之際用來防止基板往 寬度方向的撓曲之把持爪升降機構41或用來防止自動機 器手的撓曲以及往前後方向的基板撓曲之旋轉升降頂銷或 用來升降已貼合的基板之基板升降機機構43。 ® 在下側載置台24設有孔，該孔爲使加壓/UV照射機 構在下側載置台24內能往上下移動。然而，加壓/UV照 射機構40能兼用旋轉升降頂銷。另外在基板支承側分別 、 設有溝（凹缺部）使基板升降機機構43能往上下移動。 當基板搬入/搬出之際，使此基板升降機機構43作動而使 自動機器手能插入到基板下面側。上述的孔及溝，爲了將 下側載置台24固定於下箱室τ 1，而只設有最小的寬限量 亦可。 -11 - (7) (7)200401927 進而，加壓/U V照射機構40及把持爪升降機構4 1及 基板升降機機構4 2分別持有貫穿下箱室T 1之上下移動機 構，不過在下箱室T1與上述上下移動機構部之間設有〇 封圏，因而成爲保持氣密的構造。 減壓狀態下用上側載置台2把持上側基板的把持機構 即便是以靜電式夾頭把持之機構或以粘合材的物理性把持 之機構皆可。以靜電式夾頭把持時，經由切斷施加電壓經 一定的除電時間後將上側載置台2上升，因而能中斷上側 載置台2所形成的把持。另外，以粘合材把持時，經由設 置將上側基板以機械式壓接到下側的複數個頂銷，在頂銷 壓接到下側的狀態下只上升上側載置台2，因而能中斷上 側基板的把持。 其他減壓狀態下用下側載置台24把持下側基板的把 持機構也是同樣地’以備有用靜電式夾頭把持之靜電式吸 持機構的方式、或以備有用粘合材把持之粘合把持機構的 方法皆可。上側載置台2與下側載置台24之吸引方法的 組合有上側載置台或下側載置台24都用靜電式夾頭的方 式或是上側載置台2、下側載置台24其中一者用靜電式 夾頭而另外一者用粘合材的方式，只要容易持有成爲基準 的平坦部又容易成平行組裝載置台間，所以能均等貼合上 下的基板皆爲理想組合。然而，本實施形態則是構成爲兼 用以負壓吸引之吸引機構或以靜電力吸持的兩者。 減壓箱室內的減壓是透過設在上下其中一個的箱室之 排氣口 （未圖示）而連接到真空幫浦、及乾式幫浦或渦輪 -12- (8) (8)200401927 分子氣幫浦而進行減壓。另外，箱室內的大氣通氣口也是 透過設在上下其中一個箱室的閥門而導入氮氣等不活性的 氣體或大氣。大氣通氣口若是爲了減少水分附著在箱室且 縮短將箱室內減壓的時間，則導入水分子含量較少之氮氣 等的不活性氣體較爲理想。 以上爲使用本發明之基板組裝裝置的一例，已以能2 分割的構成說明了減壓箱室，不過並不侷限於此例的構成 ’即使是減壓箱室爲成一體化的構成之裝置，若爲經由將 一者的基板把持在上側載置台而在該狀態下將上側載置台 移動到把持他者基板的下側載置台側（縮小基板間隔）將 基板彼此間貼合之裝置都能適用。 第2圖中表示用來送入到基板組裝裝置內之自動機器 手的手臂部之構造。第3圖中表示加壓板的吸盤部吸引基 板的模式圖。 第2圖中，自動機器手的手臂部從腕部52起設有用 來支承複數片基板60之爪部5 1，在此爪部5 1設有複數個 吸盤53。此吸盤53在前端部設有吸引孔而成爲能以負壓 吸引基板60。此爪部51的吸盤53能上下移動，形成爲依 所把持基板60的倒角數，將接觸到液晶顯示部的面之部 位的吸盤5 3，預先退避到不與基板面接觸的位置之構成 。因此如第2 (b)所示當爲1倒角的基板60時，設在中 央部的爪之吸盤53當中，中央部的吸盤53b退避使其不 致接觸到基板面，只有周邊的吸盤53b支承基板60。 因此，如第2 (b)圖所示，基板成爲中央部呈凹狀支 200401927 Ο) 承。以此狀態用設在加壓板（上載置台）2之吸引孔施予 負壓吸引時，基板60的中央部未作用負壓而會發生基板 60無法把持在上載置台2的情況。另外即使能把持仍不 能均等吸持基板，基板作用局部性較大的伸張力，而成爲 導致貼合精度降低的原因。因此，本實施形態則是如第3 (a)圖所示，在加壓板2的中央部附近設置複數個能上下 移動的吸盤，使其能將基板中央部確實吸引到上載置台（ 加壓板）2。 吸盤由用使其上下移動之氣筒55、及用氣筒55進行 伸縮之連桿部5 7以及前端的吸盤部5 6所形成。另外，連 桿部5 7爲中空而形成爲負壓的空氣供應到該中空處之構 成（未圖示）。然而也在前端的吸盤部5 6設有連通到連 桿部5 7的中空部之孔。 第3 (a)圖中未圖示，不過在加壓板2的基板吸引面 設有以複數次負壓吸引的吸引孔。用前述構成進行從自動 機器手50轉交基板60的作業時，如第3 (b)圖所示使利 用加壓板2的負壓吸引之吸持機構作動，並且將能上下移 動的吸盤之連桿部57必要量伸出到基板側，以吸盤部56 把持基板60後，直到上載置台2的基板把持面爲止使連 桿部57後退，而確實吸引在中央部附近的吸引孔。然而 使加壓力作用到基板60而進行貼合時，吸盤部5 6也作爲 吸引吸孔供應負壓。然而，吸盤56爲橡膠等的彈性體所 構成使其在接觸到基板60時不致於傷及基板60。 本實施形態，連桿部57是用氣筒來進行上下移動。 -14- (10) (10)200401927 此驅動部在於本實施形態則是安裝在減壓箱室T2的外側 ，不過若設成安裝在與加壓板的加壓面成相反側面之構成 亦可。另外，吸盤之連桿部57的伸出量是經預先測定基 板的撓曲量5依測定量抑制伸出量之制動器的位置爲可變 ；因而能伸出量設成一定量。另外用馬達等作爲驅動裝置 之構成亦可，也能設置對所送入的基板測量撓曲量之感測 器，依該測量結果抑制連桿部57的伸出量。 以上，已說明過基板60的中央部發生撓曲時使其作 動之機構，不過用自動機器手50的複數根爪部5 1搬入基 板60時，爲了增大爪部51的剛性，而加大爪部51造成 妨礙自動機器手50的動作。因此無法增大爪部5 1的剛性 。然而，當搬入大型基板時如同第4圖爪部5 1的前端部 撓曲，加壓板2會發生施加負壓仍無法吸引基板60的情 形。因此設置在上基板60吸持到箱室內之前持起基板60 的前端部之具有校正爪之基板前端校正機構70。此基板 前端校正機構7 0備有把持基板的端部之基板端把持部7 1 、及用來升起自動機器手的爪部之爪部把持部72。基板 端把持部7 1設在自動機器手所相鄰的爪部間，如同第4 U)圖校正基板之爪間的撓曲而使其易於吸持到加壓板2 。然而不單是在爪部的前端側設置基板端把持部7 1，也 在腕部側設置基板端把持部7 1。 本圖則是在下側箱室T 1設置利用氣筒能上下移動之 基板前端校正機構70。因此，自動機器手50的爪部5 1撓 曲時，經由使基板先端校正機構7 0作動而校正基板的撓 - 15- (11) (11)200401927 曲，就能確實將基板60吸引在加壓板2。 然而’取代設置基板前端校正機構70，改而與先前的 實施例相同，在相當於自動機器手50之爪部5 1前端側的 基板把持部位置（與箱室的基板送入口側成相反側，即是 最深入側的位置）之位置上的加壓板2，設置備有上下的 驅動機構之吸盤的構成亦可。 第5圖中表示本發明的其他實施形態。本實施形態則 是將設在加壓板2的吸引孔分割成複數個組群（R 1，R2， R3) ’分別設置負壓源使供應給各組群的負壓力爲可變， 或使1個負壓源分支，在配管中途設置調壓閥就能調整負 壓。 第5圖中，吸引孔分成3個組群Rl，R2，R3，用各 別的負壓源施加A1及A2的2種負壓力。由於在基板60 的中央部形成有液晶面板的配向膜等，因而用自動機器手 兩側的吸盤5 3來支承而搬運到組裝裝置內。然而如同第5 (a)圖基板中央部撓曲而成爲距離比加壓板2小的狀態。 因而先對中央的吸引孔R2作用較大的負壓A1，吸引基板 中央部（第5 (b)圖）。接著對兩側的吸引孔Rl，R3施 加比施加給中央部的負壓A 1更小的負壓A 2，就能在基板 60沒有畸變的狀態下吸引基板（第5 (C)圖）。本實施 形態則是以吸引孔分割成3個組群的狀態爲例加以說明過 ，不過設成更細分割的組群，從基板中央部朝向基板端部 漸漸吸引而能有更高精度的吸引。另外，本動作經由將第 3圖所說明過可上下移動的複數個吸盤5 6配置在加壓板2 -16- (12) (12)200401927 ，從中央部朝向周圍依序進行吸引升起，用與此對應的加 壓板2所備有的複數個吸引孔逐漸吸引也能實認。然而， 爲了防止基板組裝裝置的箱室內減壓時基板掉落，在加壓 板設有前述的吸持機構，其他也一倂設有粘合把持機構或 靜電吸持機構。 其次，說明利用本發明的基板組裝裝置貼合液晶面板 的動作。 首先，將粘接劑塗在呈框狀包圍液晶面板的黑底或此 近邊之上側基板，以塗有粘接劑之面經反轉成爲下側的狀 態配置且載置到位於自動機器手的下側之一者爪部上。另 外，以配置表面預先塗有液晶之下側基板使液晶的滴下面 成爲上側的狀態，搭載到位於上側之自動機器手的他者爪 部上。此樣以2片基板搭載在上下的爪部上的狀態，自動 機器手移動到貼合裝置的前面。基板組裝裝置1開啓上箱 室T2部的門閥1 6，自動機器手將下側的爪部上已經反轉 的上側基板插入到裝置內。 基板組裝裝置1降下上側載置台，利用負壓所形成的 吸引，將已反轉的上側基板吸引把持在上側載置台2之下 ，基板若有撓曲時則使基板前端校正機構70或吸盤一起 作動而保持平坦。即是基板撓曲時，吸盤從載置台面突出 到可以吸引基板的位置爲止，吸盤吸引基板則後退到吸盤 面來到上載置台的位置爲止，而能將基板平坦地把持在載 置面。 然而上側載置台的吸引孔分成複數個組群時，從中央 -17- (13) (13)200401927 部的吸引孔依序朝向端部側的吸引孔作用負壓，就能去除 畸變而平坦地把持基板。 其次，下側自動機器手一度從基板組裝裝置1內後退 ，等待此後退而基板組裝裝置1將下側載置台24上的已 經完成貼合的液晶面板用基板升降機機構43及把持爪升 降機構41升起到上方。以該狀態將下側自動機器手再度 插入到基板組裝裝置1內的液晶面板下側，自動機器手升 起到上方後，使此自動機器手後退，從基板組裝裝置1中 將液晶面板取出到外部。基板組裝裝置1使基板升降機機 構43及把持爪升降機構4 1下降。 其次，將上側的自動機器手上之預先塗有液晶的下側 基板插入到基板組裝裝置1內。基板組裝裝置1將把持爪 升降機構41上升，升起下側基板且等待自動機器手的後 退而將下側基板設置在下側載置台24上，吸引下側基板200401927 〇) Description of the invention [Technical field to which the invention belongs] The present invention relates to a device for bonding substrates such as liquid crystals, and more particularly to a device suitable for holding the bonded substrates facing each other in a decompression chamber and reducing the size thereof. A substrate assembly device for assembling spaced-apart liquid crystal display panels and the like. [Prior art] In the manufacture of liquid crystal display panels, a transparent electrode or a thin-film transistor array will be provided with an adhesive (hereinafter referred to as an adhesive) provided on the peripheral edge of the substrate with a distance of approximately # m. The process of laminating a glass substrate (hereinafter, the laminated substrate is referred to as a cell), and encapsulating the liquid crystal into a space formed by the above process. This liquid crystal packaging method is proposed in Japanese Patent Laid-Open No. 2000-284295. The liquid crystal is dropped onto a substrate of one of the sealants in a closed pattern without an injection port. The other substrate is in a vacuum chamber. A method of disposing on one substrate and bringing the upper and lower substrates close to each other. In the above-mentioned Japanese Patent Laid-Open No. 2000-2U29 No. 5, the substrate is held in a vacuum, the lower substrate is placed on a flat base, and the upper substrate is attracted by negative pressure in the atmospheric state to reach a certain level. In the vacuum state, the substrate is held by an electrostatic holding clip formed by an electrostatic force. However, recently, the size of the substrate has become larger than 1 nm x 1 m, and the thickness of the substrate has also changed from 3 mm to 2 mm and 1 mm. Therefore, when the substrate is held by a pressure plate (mounting table), the center of the substrate is deflected, and the distance between the substrate and the pressure plate in the center of the substrate becomes larger. When the substrate (2) (2) 200401927 is transferred from the substrate, When transferring to a pressurized plate, it may happen that the substrate cannot be held. Especially when holding a large-screen substrate, an alignment film or TFT is formed in the center of the substrate, so it can only support the peripheral portion of the substrate, which makes it difficult to prevent the substrate from flexing. In addition, even if the substrate can be held, residual stress may occur in the substrate, or the substrate may be held in a state where the position of the substrate alignment mark is deviated. In addition, the gripper portion of the robot that grips and transports the substrate also grows. When gripping the substrate, the tip side flexes, and the gap between the substrate on the tip side of the gripper of the robot and the pressure plate is still too large to absorb the substrate. Therefore, if the above problems cannot be solved for large substrates, the bonding cannot be performed correctly. SUMMARY OF THE INVENTION An object of the present invention is to provide a high-productivity substrate assembly apparatus capable of holding a substrate with good accuracy even if the substrate is large-sized, and capable of attaching with high accuracy and high speed. In order to achieve the above object, the present invention is directed to a pressure plate (an upper mounting table) having a vacuum chamber provided for forming a decompression gas phase, and a substrate held in the vacuum chamber and configured to move up and down, And a substrate holding mounting table (lower mounting table) for holding the substrates held at intervals with the substrate held on the pressure plate, and driving the substrate holding mounting table to perform the one of the substrate and the other The characteristics of the substrate assembly device are: a substrate assembly device that aligns the positions of the substrates, drives the pressure plate up and down to reduce the space between the substrates, and uses an adhesive provided on any of the substrates to attach the substrates in a reduced pressure gas phase. For: in order to hold the substrate on the pressure plate, a plurality of suction holes with a negative pressure and a plurality of electrostatic holding mechanisms are added, the pressure plate is provided with -7- (3) (3) 200401927 which can be moved up and down A plurality of movable suction cups. [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In FIG. 1, the board | substrate assembly apparatus is comprised by the lower case T1 part and the upper case T2 part. An upper mounting table 2 (hereinafter, also referred to as a pressure plate) is provided in the T2 section of the box room, and the mounting table 2 can be moved up and down by a support section 3 and a plurality of adjusting feet 4 penetrating the upper box room T2. . The support leg 3 uses 0 sealing ring 5 and the adjustment leg 4 uses welded corrugated tube 6 to block the inside of the upper chamber T2 from being communicated with the atmosphere. The support leg 3 and the adjustment leg 4 of the upper mounting table 2 are fixed to the pressurized base plate 7. Furthermore, the center portion of this pressurized base plate 7 is fixed to the intermediate base plate 8. The intermediate base plate 8 is configured to be operated via a drive mechanism composed of a drive motor 10, a reducer 11 and a ball screw 12 mounted on the top frame 9 with a ball rack guide 13 as a guide. Moving up and down. In addition, the top frame 9 is supported on the stand 1 by a supportive arrangement different from the ball rack guide. One end is fixed to the other adjustment side 4 of each of the adjustment legs 4 of the pressure base plate 7 and is connected to a ball screw 15 driven by a drive motor 14 mounted on the intermediate base plate 8. Driving the up-and-down adjustment mechanism formed by the drive motor 14 and the ball screw 15 to apply force to the pressurized base plate 7 causes the upper stage 2 to move up and down while maintaining flatness. However, the 'upper chamber T2 is provided with a coupling mechanism for combining the pressurized base plates 7. When the upper and lower chambers T2 and T2 are separated, the coupling mechanism is operated to integrate the pressurized base plate and the upper chamber T2. Then, move the drive motor to -8- (4) (4) 200401927 and raise it upward. In addition, a gate valve 16 for carrying in and out of the substrate into the box chamber is provided on the outer wall side of the side of the upper box chamber T2. Furthermore, an ionizer 17 is provided at a position above the side wall of the chamber opposite to the gate valve 16 so that the substrate can be destaticized by blowing ionized ultrasonic air onto the surface of the substrate. Furthermore, an ionizer 17a is provided near the door valve 16 on the outside of the box. Therefore, the ionization air can be sprayed while the door is open to improve the static elimination effect of the substrate. In addition, a plurality of auxiliary guides 18 with a bushing structure are provided on the upper outer wall of the upper box chamber T2, and the auxiliary guides 18 project the central shaft 19 into the box chamber. This central axis 19 is aligned with a hole provided on a protruding portion on the outer periphery of the upper stage 2 so that the upper stage 2 can be adjusted in the horizontal direction. That is, the auxiliary guide 18 and the central axis 19 are acted as the level adjustment mechanism of the upper and lower mounting table 2. A plurality of observation windows for observing a substrate mark are provided in the upper chamber T2. "The εε of Luo machine is inserted into this measuring window with 21, and the mark on the substrate is confirmed with the camera. The lens barrel 21 of the camera is provided with a horizontal axis (X, Y direction) and a vertical axis (Z direction). ) On the moving base of the moving member, the moving base is fixed to the upper case T2. Furthermore, a hole for identifying the substrate mark is provided on the upper stage 2 at a position corresponding to the observation window. The camera is arranged outside the cabinet, but if it is configured to mount the camera directly on the upper mounting table 2, the camera can be arranged closer to the substrate and the accuracy of the camera's identification of the mark can be improved. In order to measure the pressing force on the substrate, a load cell 22 is provided between the support leg 3 (5) (5) 200401927 between the base plate 8 and the ball screw. In addition, adjust the In the case of flatness, in order to monitor the motors driving the adjustment feet 4 so as not to overload, each of the adjustment feet on the pressurized base plate 7 is provided with a load cell 23. In the lower chamber T 1 A lower mounting table 24 is fixed inside. This lower mounting table 24 is fully bonded and fixed to the lower box chamber τ1. When the lower box chamber τ1 is deformed during decompression, the flatness will be affected by the deformation. Possibility. Therefore, only the peripheral part is fixed so as not to be affected by the deformation of the lower chamber T1. In addition, a sealing ring 25, which will be described later, is arranged on the entire periphery of the lower chamber T1, contacts the upper chamber T2 ', and closes the door valve 16 The state is hermetically closed to form a decompression chamber. The lower chamber T1 is provided on an upper surface of the β-substrate mounting table 28 constituted by a motor 26, a ball screw (not shown), and a rotary bearing 27 for rotational driving. The combination of 28 and the lower box chamber T1 enables it to secure a certain space by sandwiching box-shaped members. This space is for mounting the UV irradiation mechanism 40 or the substrate holding claw lifting mechanism 4 1 and the substrate elevator mechanism 42 to the lower box chamber. The T1 is provided on the lower side. The ㊀ base mounting table 28 is mounted on the Υmounting table 32 via a rotary bearing 27. The γ mounting table 32 is provided so that it can move on a linear orbit provided on the X mounting table 3 3 by a motor 29. The X mounting table 33 is set to The drive motor 30 can move on a linear track provided on the side of the stand 1. In addition, when the upper chamber T 2 contacts the lower chamber τ 2 to constitute a decompression chamber, in order to make the depression amount of the seal ring 25 constant, A plurality of ball bearings 3 4 for the upper chamber are provided on the outer peripheral portion of the base base mounting table 2 8 as a support 3 5 with an adjustment mechanism. The ball bearing 3 4 and the support 3 5 are used to adjust the upper -10. -(6) (6) 200401927 Lowering position of the chamber section T 2. Further, in order to prevent the β base mounting table 28 from deforming and to support the outer peripheral portion of the 0 base table 28, it is fixed to the device base (stand) 1 The component is provided with a plurality of ball bearings 37 for the base plate 28 as a support 38 with an adjustment mechanism. In this way, the load from the base plate 28 is withstood. In this way, since the bearing 34 for the box chamber and the Θ base mounting table are used, the ball bearing 37 is a two-stage type to withstand the load around the upper and lower box chambers, so that the deformation of the box chamber can be minimized. In the lower case chamber T1, a plurality of transillumination lights 9 for identifying a mark are provided, and a hole is penetrated at a position corresponding to the lower mounting table 24. Furthermore, in the lower chamber T1, a plurality of pressurization / UV irradiation mechanisms 40 are provided in order to prevent the bonded substrates from shifting due to the UV adhesive diffusion hardening. Further, a gripping claw lifting mechanism 41 for preventing the substrate from being deflected in the width direction when the substrate is being carried in / out is provided, or a robot is prevented from being deflected and the substrate is deflected and rotated in the front-rear direction. The lift pin or a substrate lifter mechanism 43 for lifting and lowering the bonded substrate. ® A hole is provided in the lower mounting table 24. This hole allows the pressurization / UV irradiation mechanism to move up and down in the lower mounting table 24. However, the pressurization / UV irradiation mechanism 40 can also use a rotary lifting jack. In addition, grooves (notches) are provided on the substrate supporting side so that the substrate lifter mechanism 43 can move up and down. When the substrate is carried in / out, the substrate lifter mechanism 43 is operated so that the robot hand can be inserted into the lower surface side of the substrate. The above-mentioned holes and grooves may be provided with only a minimum width in order to fix the lower-side mounting table 24 to the lower box chamber τ 1. -11-(7) (7) 200401927 Further, the pressurization / UV irradiation mechanism 40, the gripper claw lifting mechanism 41, and the substrate lifter mechanism 4 2 respectively hold the upper and lower moving mechanisms penetrating the lower box chamber T1, but in the lower box chamber There is a zero seal between T1 and the above-mentioned up-and-down moving mechanism part, and it is a structure which maintains airtightness. The holding mechanism for holding the upper substrate by the upper mounting table 2 in a depressurized state may be a mechanism holding an electrostatic chuck or a mechanism holding a physical material of an adhesive material. When holding by the electrostatic chuck, the upper stage 2 can be raised by cutting off the applied voltage for a certain period of time for removing electricity, so that the grip formed by the upper stage 2 can be interrupted. In addition, when holding with an adhesive material, a plurality of ejector pins are mechanically crimped to the lower substrate through the setting, and only the upper mounting table 2 is raised when the ejector pins are crimped to the lower side, so the upper side can be interrupted. Holding of the substrate. In other depressurized states, the holding mechanism for holding the lower substrate with the lower mounting table 24 is the same as the method of preparing an electrostatic holding mechanism with an electrostatic chuck or using an adhesive for holding. Any method of holding the mechanism is acceptable. The combination of the suction method of the upper mounting table 2 and the lower mounting table 24 is that either the upper mounting table or the lower mounting table 24 uses an electrostatic chuck, or one of the upper mounting table 2 and the lower mounting table 24 uses static electricity. As the other method uses an adhesive material, as long as it is easy to hold the flat part that serves as a reference and it is easy to load the table in parallel groups, it is an ideal combination that can evenly bond the upper and lower substrates. However, this embodiment is configured as a suction mechanism that serves as a negative pressure suction, or a suction mechanism that holds both. The decompression in the decompression chamber is connected to the vacuum pump and the dry pump or turbine through the exhaust port (not shown) provided in one of the upper and lower chambers. -12- (8) (8) 200401927 Molecule The air is pumped to reduce the pressure. In addition, the air vent in the chamber is also used to introduce an inert gas such as nitrogen or the atmosphere through a valve provided in one of the upper and lower chambers. If the atmospheric vent is to reduce the adhesion of moisture to the chamber and shorten the time for decompressing the chamber, it is desirable to introduce inert gas such as nitrogen with a small water molecule content. The above is an example of the substrate assembly apparatus using the present invention. The decompression box chamber has been described with a two-division structure, but it is not limited to the structure of this example. 'Even the decompression box chamber is an integrated device. Any device can be used for attaching the substrates to each other by holding one substrate on the upper mounting table and moving the upper mounting table to the lower mounting table side (reducing the substrate interval) holding the other substrate in this state. Be applicable. Fig. 2 shows the structure of an arm portion of an automatic robot hand for feeding into a substrate assembly apparatus. Fig. 3 is a schematic view showing that the suction plate portion of the pressure plate sucks the substrate. In FIG. 2, the arm portion of the robot is provided with a claw portion 51 for supporting a plurality of substrates 60 from the wrist portion 52, and a plurality of suction cups 53 are provided at the claw portion 51. This suction cup 53 is provided with a suction hole in the front end portion, so that the substrate 60 can be suctioned by a negative pressure. The suction pad 53 of the claw portion 51 can be moved up and down, and is formed in a structure that the suction pad 5 3 of the portion that touches the surface of the liquid crystal display portion is retracted to a position that does not contact the substrate surface in advance according to the number of chamfers of the substrate 60 held. . Therefore, as shown in FIG. 2 (b), when the substrate 60 is chamfered, it is provided in the claws 53 of the claws in the center portion, and the suction cups 53b in the center portion are retracted so that they do not touch the substrate surface. Substrate 60. Therefore, as shown in Fig. 2 (b), the substrate is a recessed support at the center portion (200401927 Ο). When negative pressure suction is applied through the suction hole provided in the pressure plate (mounting table) 2 in this state, a negative pressure is not applied to the central portion of the substrate 60 and the substrate 60 cannot be held on the mounting table 2. In addition, even if the substrate can be gripped, the substrate cannot be evenly held, and the substrate has a large local tensile force, which causes a reduction in bonding accuracy. Therefore, in this embodiment, as shown in FIG. 3 (a), a plurality of up and down suction cups are provided near the central portion of the pressure plate 2, so that the central portion of the substrate can be reliably attracted to the mounting table (pressurization). Board) 2. The suction cup is formed by a gas cylinder 55 for moving it up and down, a link part 57 for expanding and contracting with the gas cylinder 55, and a suction cup part 56 at the front end. In addition, the link portion 57 is hollow, and a structure (not shown) in which air having a negative pressure is supplied to the hollow is provided. However, a hole is connected to the hollow portion of the link portion 57 at the suction cup portion 56 at the front end. Although not shown in Fig. 3 (a), the suction surface of the substrate of the pressure plate 2 is provided with suction holes that are suctioned by a plurality of negative pressures. When the substrate 60 is transferred from the robot 50 with the aforementioned configuration, as shown in FIG. 3 (b), the holding mechanism that is sucked by the negative pressure of the pressure plate 2 is operated, and the suction cup capable of moving up and down is connected. The lever portion 57 is extended to the substrate side by a necessary amount, and after holding the substrate 60 with the chuck portion 56, the link portion 57 is retracted until the substrate holding surface of the mounting table 2, and the suction hole near the center portion is surely sucked. However, when a pressing force is applied to the substrate 60 for bonding, the chuck portion 56 also supplies a negative pressure as a suction suction hole. However, the suction cup 56 is made of an elastic body such as rubber, so that the substrate 60 will not be damaged when it comes in contact with the substrate 60. In this embodiment, the link portion 57 is vertically moved by a gas cylinder. -14- (10) (10) 200401927 This drive unit is mounted on the outside of the decompression tank T2 in this embodiment, but it can also be configured to be mounted on the side opposite to the pressure surface of the pressure plate. . In addition, the amount of protrusion of the link portion 57 of the sucker is determined by measuring the deflection amount 5 of the substrate in advance. The position of the brake that suppresses the protrusion is variable according to the measurement amount; It is also possible to use a motor or the like as a driving device. A sensor that measures the amount of deflection of the substrate to be fed in can also be provided, and the amount of extension of the link portion 57 can be suppressed based on the measurement result. The mechanism for operating the central portion of the substrate 60 when it is deflected has been described above. However, when the plurality of claw portions 51 of the robot 50 are carried into the substrate 60, the rigidity of the claw portion 51 is increased to increase the rigidity. The claw portion 51 causes the movement of the robot 50 to be hindered. Therefore, the rigidity of the claw portion 51 cannot be increased. However, when a large substrate is carried in, the front end portion of the claw portion 51 in Fig. 4 is flexed, and the pressure plate 2 may not be able to attract the substrate 60 by applying a negative pressure. Therefore, a substrate front-end correction mechanism 70 having a correction claw is provided on the front end portion of the substrate 60 that is held before the upper substrate 60 is sucked into the chamber. This substrate front-end correction mechanism 70 is provided with a substrate end holding portion 7 1 that holds an end portion of the substrate, and a claw portion holding portion 72 for raising a claw portion of the robot. The substrate end holding portion 71 is provided between the claw portions adjacent to the robot, and as shown in FIG. 4 U), the deflection between the claws of the substrate is corrected so that it can be easily held on the pressure plate 2. However, not only the substrate end holding portion 71 is provided on the front end side of the claw portion, but also the substrate end holding portion 71 is provided on the arm side. In this figure, a substrate front-end correction mechanism 70 that can be moved up and down by a gas cylinder is provided in the lower tank T1. Therefore, when the claw portion 51 of the robot 50 is deflected, the substrate deflection mechanism 70 is actuated to correct the deflection of the substrate-15- (11) (11) 200401927 curvature, and the substrate 60 can be surely attracted to Canada.压板 2。 Pressure plate 2. However, instead of providing the substrate front-end correction mechanism 70, it is the same as the previous embodiment, and is located at the position of the substrate holding portion corresponding to the claw portion 51 of the robot 50 (the opposite side from the substrate feed-in side of the box chamber). That is, the pressure plate 2 at the position of the deepest side) may be configured with a suction cup provided with a vertical driving mechanism. Fig. 5 shows another embodiment of the present invention. In this embodiment, the suction holes provided in the pressure plate 2 are divided into a plurality of groups (R 1, R2, R3). 'Negative pressure sources are provided to make the negative pressure supplied to each group variable, or One negative pressure source branch, and a negative pressure can be adjusted by setting a pressure regulating valve in the middle of the piping. In Fig. 5, the suction holes are divided into three groups R1, R2, and R3, and two types of negative pressures of A1 and A2 are applied by respective negative pressure sources. Since an alignment film or the like of the liquid crystal panel is formed in the center of the substrate 60, it is supported by the suction cups 53 on both sides of the robot and carried into the assembly device. However, as shown in FIG. 5 (a), the center portion of the substrate is deflected and the distance is smaller than that of the pressure plate 2. Therefore, a large negative pressure A1 is applied to the central suction hole R2 first, and the central portion of the substrate is suctioned (Fig. 5 (b)). Then, a negative pressure A 2 smaller than the negative pressure A 1 applied to the central portion is applied to the suction holes R1 and R3 on both sides, and the substrate 60 can be attracted without distortion of the substrate 60 (Fig. 5 (C)). In this embodiment, the state in which the suction hole is divided into three groups has been described as an example, but it is set to a more finely divided group, which gradually attracts from the center of the substrate toward the end of the substrate, and can attract with higher precision. . In addition, in this operation, a plurality of suction cups 5 6 that can be moved up and down as described in FIG. 3 are arranged on the pressure plate 2 -16- (12) (12) 200401927 and are sequentially sucked and raised from the center to the surroundings. It can also be confirmed that the suction holes are gradually attracted by the plurality of suction holes provided in the corresponding pressure plate 2. However, in order to prevent the substrate from falling when the chamber of the substrate assembling device is decompressed, the above-mentioned holding mechanism is provided on the pressure plate, and others are also provided with an adhesive holding mechanism or an electrostatic holding mechanism. Next, an operation of bonding a liquid crystal panel by the substrate assembly apparatus of the present invention will be described. First, the adhesive is applied to a black substrate or a near-upper side substrate that surrounds the liquid crystal panel in a frame shape. The adhesive-coated surface is reversed to the lower side and placed on the robot. One of the lower side is on the claw. In addition, the lower surface substrate of the liquid crystal is coated in advance on the arrangement surface so that the lower surface of the liquid crystal becomes the upper side, and it is mounted on the other claw portion of the upper robot. In this state, the two robots are mounted on the upper and lower claws, and the robot moves to the front of the bonding apparatus. The substrate assembly apparatus 1 opens the gate valve 16 of the upper chamber T2, and the robot hand inserts the upper substrate which has been inverted on the lower claw portion into the apparatus. The substrate assembly apparatus 1 lowers the upper mounting table, and uses the suction formed by the negative pressure to suck and hold the reversed upper substrate below the upper mounting table 2. If the substrate is flexed, the substrate front end correction mechanism 70 or the suction cup together Act and keep flat. That is, when the substrate is flexed, the chuck protrudes from the mounting table surface to a position where the substrate can be attracted, and the chuck sucks the substrate back until the chuck surface reaches the position of the mounting table, so that the substrate can be held flat on the mounting surface. However, when the suction holes on the upper stage are divided into a plurality of groups, negative pressure is applied from the suction holes in the center -17- (13) (13) 200401927 in sequence toward the suction holes on the end side, and distortion can be removed and flat. Hold the substrate. Next, the lower robot hand once retreated from the substrate assembly apparatus 1 and waited for this retreat, and the substrate assembly apparatus 1 lifted the substrate lifter mechanism 43 for the liquid crystal panel and the holding claw lifter mechanism 41 on the lower mounting table 24. Rise up. In this state, the lower robot hand is inserted into the lower side of the liquid crystal panel in the substrate assembly device 1 again. After the robot robot is raised upward, the robot hand is retracted, and the liquid crystal panel is removed from the substrate assembly device 1 to external. The substrate assembling device 1 lowers the substrate elevator mechanism 43 and the holding claw elevating mechanism 41. Next, the lower substrate coated with the liquid crystal in advance on the upper robot hand is inserted into the substrate assembly apparatus 1. The substrate assembly apparatus 1 raises the holding claw lifting mechanism 41 to raise the lower substrate and waits for the robot to retreat, and sets the lower substrate on the lower mounting table 24 to attract the lower substrate.
G 其次，利用攝影機的鏡筒2 1下降垂直方向的移動軸 測定上側基板的基板標記位置，用水平方向移動軸移動到 上側基板的標記中心位置與攝影機鏡筒2 1的中心成一致 的位置。接著下降上側載置台2，利用攝影機的鏡筒21 測定上側基板與下側基板之標記位置偏離。然後用升降機 (未圖示）升起滾珠軸承34，透過附有調整機構的支座35 上升上箱室部T2，使密封環25與上箱室部T2些微接觸 或是不接觸（使上箱室的載重不會作用到密封環），驅動 馬達26、馬達29、馬達30。因而下側載置台24與下箱室 -18- (14) (14)200401927 T1 一起往X Υ θ方向水平移動，進行下基板與上基板之 定位標記的大致定位。大致定位完成後，下降滾珠軸承 3 4。其次，上下載置台用靜電式夾頭吸持基板時，對靜電 夾頭施加電壓，進行基板的吸引。在此狀態下，關閉門閥 1 6且用真空幫浦將減壓箱室內減壓排氣。減壓排氣中上 升上側載置台2使上下基板間的氣體容易排出。 減壓箱室內成爲一定的減壓狀態後，再度下降上側載 置台2，測定上下基板間的位置偏離，驅動馬達26，馬達 2 9，馬達3 0使下箱室Τ1部往X Υ 0方向水平移動，進行 下基板與上基板之定位標記的微定位。微定位完成後，--面測定動力傳感器22之値，一面更加下降上側載置台2， 進行基板的加壓/貼合。加壓力達到壓擴散著劑的一定之 値後，完成加壓，用加壓/UV照射機構40，一面將預先塗 在基板暫固定位置之暫固定用的U V粘接劑加壓，一面照 射UV光，進行暫固促使基板的位置不致偏離。 暫固定完成後，上升加壓/UV照射機構40。上側載置 台利用靜電式夾頭在真空中的吸持時，切斷電壓，經除電 時間待機後’上升上側載置台。上側載置台2利用粘合時 ，用複數個頂銷將上側基板以機械式推壓到下側的基板， 在頂銷推壓到下側的狀態下只上升上側載置台，而中斷把 持上側的基板。 之後，透過設在減壓箱室之閥將氮氣等的不活性氣體 或大氣導入到減壓箱室內在大氣中開放。接著開放門閥 1 6，進行基板的送入及送出。關於基板組裝裝置1的真空 -19- (15) 200401927 箱室內，進行淸潔等的維護時，使安裝在上箱室部 結合機構動作，加壓基板板7與上箱室T2部成一 用驅動馬達10而與上側載置台2 一起往z軸方向 因而能在開放箱室的狀態下維護上下載置台。如前 實施形態解決了當大型基板把持在上側載置台之際 基板送入時所發生的基板撓曲，而無法確實將基板 上側載置台之問題，且能達到提高基板貼合的精度 如以上所說明過，依據本發明的基板貼合裝置 板送入到裝置內時，特別是當大型的上基板把持在 置台之際，由於能消除基板發生撓曲的影響可以確 板把持在一定的位置，因而能提高位置對準的精度 也能縮短位置對準所要的時間。 【圖式之簡單說明】 桌1圖爲表不本發明一實施形態之基板組裝置 之圖。 第2圖（a) (b)爲表示用於基板搬運之自動 的槪要之圖。 第3圖（a) (b)爲說明設在加壓板之吸盤的槪 及基板撓曲時的把持方式之圖。 第4圖（a) (b)爲說明校正自動機器手的爪部 造成的基板撓曲的機構之說明圖。 第5圖（a) (b)爲本發明用來把持撓曲基板之 成的圖面。 T2之 體化， 升起。 述，本 ，由於 把持在 〇 ，當基 上側載 實將基 ，並且 的構成 機器手 略構成 撓曲所 其他構 -20- (16) (16)200401927 元件對照表 T 1 :下箱室 T 2 :上箱室 1：架台 2 :上側載置台 3:支承腳 4:調整腳 5:〇封圈 6:熔接皺褶管 7:加壓基體板 8:中間基體板 9:頂部框架 10:驅動馬達 11:減速機 1 2 :滾珠螺桿 13:滾珠齒條導引 1 4 :驅動馬達 1 5 :滾珠螺桿 16:門閥 17:電離器 1 8 :副導引 1 9 :中心軸 21:鏡筒 -21 - (17) (17)200401927 22，23:測力傳感器 24:下側載置台 25:密封環 26:馬達 27:旋轉軸承 28: β基體載置台 30:馬達 34，37:滾珠軸承 3 8:支座 40: UV照射機構 4 1:基板把持爪升降機構 42、43:基板升降機機構 50:自動機器手 51:爪指 5 3 :吸盤 5 5 : 氣筒 57:連桿 60:基板 70:基板前端校正機構 71:基板端把持部 72:爪部把持部 - 22-G Next, use the vertical movement axis of the lens barrel 21 of the camera to measure the substrate mark position of the upper substrate, and use the horizontal movement axis to move the mark center position of the upper substrate to the position where the center of the camera lens barrel 21 coincides. Next, the upper stage 2 is lowered, and the deviation of the mark position between the upper substrate and the lower substrate is measured using the lens barrel 21 of the camera. Then lift the ball bearing 34 with an elevator (not shown), and raise the upper case chamber portion T2 through the support 35 with the adjustment mechanism, so that the seal ring 25 slightly contacts or does not touch the upper case chamber portion T2 (make the upper case The load of the chamber does not act on the seal ring), and the motor 26, the motor 29, and the motor 30 are driven. Therefore, the lower mounting table 24 and the lower chamber -18- (14) (14) 200401927 T1 are horizontally moved in the X Υ θ direction to perform approximate positioning of the positioning marks of the lower substrate and the upper substrate. After positioning is completed, lower the ball bearing 3 4. Next, when the substrate is held by the electrostatic chuck for loading and unloading, a voltage is applied to the electrostatic chuck to suck the substrate. In this state, the door valve 16 is closed and the decompression chamber is decompressed and exhausted with a vacuum pump. During the decompression exhaust, the upper stage 2 is lifted so that the gas between the upper and lower substrates can be easily exhausted. After the decompression chamber has reached a certain decompression state, the upper stage 2 is lowered again, and the position deviation between the upper and lower substrates is measured. The motor 26, the motor 29, and the motor 30 drive the T1 of the lower chamber horizontally in the direction of X Υ 0. Move to perform micro-positioning of the positioning marks of the lower substrate and the upper substrate. After the micro-positioning is completed, the upper side of the upper stage 2 is further lowered while the power sensor 22 is measured, and the substrate is pressed and bonded. After the pressure has reached a certain level of the pressure diffusion agent, the pressure is completed. The pressure / UV irradiation mechanism 40 is used to press the UV adhesive for temporary fixing previously applied to the temporary fixing position of the substrate while irradiating UV. Light and temporary fixation prevent the position of the substrate from deviating. After the temporary fixing is completed, the pressure / UV irradiation mechanism 40 is raised. When the upper stage is held in a vacuum by an electrostatic chuck, the voltage is cut off and the standby stage is raised after the static elimination time has elapsed. When the upper stage 2 is bonded, the upper substrate is mechanically pushed to the lower substrate by a plurality of ejector pins. Only the upper stage is raised while the ejector pin is pushed to the lower side, and the upper one is interrupted. Substrate. After that, an inert gas such as nitrogen or the atmosphere is introduced into the decompression chamber through a valve provided in the decompression chamber and opened to the atmosphere. Next, the gate valve 16 is opened to carry in and out the substrate. Regarding the vacuum of the substrate assembly device 1-19 (15) 200401927 When performing maintenance such as cleaning in the box chamber, the coupling mechanism installed in the upper box chamber portion is operated, and the pressurized substrate plate 7 and the upper box chamber T2 are driven in one unit The motor 10 moves in the z-axis direction together with the upper mounting table 2, so that the upper loading table can be maintained while the box chamber is opened. The previous embodiment solves the problem of substrate deflection that occurs when the substrate is fed when the large substrate is held on the upper stage, and the upper stage of the substrate cannot be surely fixed, and the accuracy of substrate bonding can be improved as described above. It has been explained that when the substrate bonding device board according to the present invention is fed into the device, especially when a large upper substrate is held on the table, the board can be surely held at a certain position because the influence of substrate deflection can be eliminated. Therefore, the accuracy of the alignment can be improved and the time required for the alignment can be shortened. [Brief description of the drawings] The table 1 is a diagram showing a substrate assembly device according to an embodiment of the present invention. Figures 2 (a) and (b) are schematic diagrams showing the outline of automatic board transfer. Figures 3 (a) and (b) are diagrams illustrating the gripping method of the suction cup provided on the pressure plate and the substrate when the substrate is flexed. Fig. 4 (a) and (b) are explanatory diagrams for explaining a mechanism for correcting a substrate deflection caused by a claw portion of an automatic robot hand. Figs. 5 (a) and 5 (b) are diagrams showing a configuration for holding a flexible substrate according to the present invention. The integration of T2, rises. As described above, since it is held at 0, when the base is loaded on the base, and the structure of the robot is slightly different from the other structures of the deflection institute-20- (16) (16) 200401927 Component comparison table T 1: Lower box room T 2 : Upper box room 1: Shelf table 2: Upper mounting table 3: Support foot 4: Adjusting foot 5: Sealing ring 6: Welded corrugated tube 7: Pressurized base plate 8: Intermediate base plate 9: Top frame 10: Drive motor 11: Reducer 1 2: Ball screw 13: Ball rack guide 1 4: Drive motor 1 5: Ball screw 16: Gate valve 17: Ionizer 1 8: Secondary guide 1 9: Central shaft 21: Mirror tube-21 -(17) (17) 200401927 22, 23: load cell 24: lower mounting table 25: seal ring 26: motor 27: rotary bearing 28: β base mounting table 30: motor 34, 37: ball bearing 3 8: Stand 40: UV irradiation mechanism 4 1: Substrate holding claw lifting mechanism 42, 43: Substrate elevator mechanism 50: Automatic robot 51: Claw finger 5 3: Suction cup 5 5: Air cylinder 57: Connecting rod 60: Substrate 70: Front end of substrate Calibration mechanism 71: substrate-side holding portion 72: claw portion holding portion-22-