CN100405185C - Base plate assembly apparatus - Google Patents
Base plate assembly apparatus Download PDFInfo
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- CN100405185C CN100405185C CNB031386539A CN03138653A CN100405185C CN 100405185 C CN100405185 C CN 100405185C CN B031386539 A CNB031386539 A CN B031386539A CN 03138653 A CN03138653 A CN 03138653A CN 100405185 C CN100405185 C CN 100405185C
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- substrate
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- increased pressure
- pressure board
- upper substrate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Abstract
A suction pad which is vertically expandable and contractible is disposed near the central part of the pressing plate 2 (upper table), the suction pad is expanded in accordance with the amount of deflection of the conveyed upper substrate, a negative pressure is supplied to a suction hole disposed on the pressing plate, at the same time, the negative pressure is supplied to the suction pad, too, the substrate is sucked, thereafter, the suction pad is contracted in such a manner that the top end of the suction pad is located on the suction surface of the pressing plate and, thereby, the substrate is firmly retained by the pressing plate.
Description
Technical field
The present invention relates to the device of the substrate of a kind of liquid crystal of fitting etc., the substrate of applying is relatively kept, make stenosis at interval narrow and be applicable to the substrate assembling device of assembling of the LCD panel etc. of applying.
Background technology
In the manufacturing of LCD panel, there is a procedure to be, 2 glass substrates that are provided with transparency electrode and thin film transistor (TFT) display kept the very approaching interval about number μ m and fit (later on the substrate after fitting being called element) with the bonding agent (being hereinafter referred to as sealant) on the circumference that is arranged on substrate, sealing liquid crystal in the space that forms thus.
In the seal process of this liquid crystal, the method that proposes in the TOHKEMY 2000-284295 communique is, the liquid crystal that drips on the substrate that inlet ground is coated with sealant in the figure that is drawn as sealing is not set, in vacuum chamber, another piece substrate is configured on this substrate, make upper and lower base plate near and fit.
In original technology of above-mentioned TOHKEMY 2000-284295 communique, the maintenance of the substrate in the vacuum is made, the downside substrate-placing on smooth objective table, and the upside substrate is adsorbed by vacuum suction under atmospheric condition, when becoming the specified vacuum state, use the Electrostatic Absorption that produces by electrostatic force to keep substrate.; recently; have and be of a size of the above large substrate of 1m * 1m; substrate thickness also has the tendency that changes to the slimming of 2mm, 1mm from 3mm simultaneously, for this reason, and when remaining on substrate absorption on the increased pressure board (upper plate); substrate is in the central portion deflection; it is big that the substrate of substrate center portion and the interval of increased pressure board become, and when the substrate input mechanism carried out the transition on the increased pressure board, existence can not keep the situation of substrate to take place substrate.When keeping the substrate of big picture, owing to form oriented film and TFT etc. at the central portion of substrate, can only use the periphery support of substrate especially, the deflection that prevents substrate is difficult.In addition,, on substrate, also can produce residual stress, under the state of the favorably situated mark position skew of substrate, keep even can keep.In addition, elongated and when keeping substrate, because top one side deflection, the substrate of same mechanical arm tip side and the interval of increased pressure board become big, can not adsorb substrate when the finger of the mechanical arm that keeps conveying substrate.For this reason, for large substrate,, just can not carry out correct applying if do not address the above problem.
Summary of the invention
Therefore, the objective of the invention is to, still can precision keep substrate well even provide a kind of substrate to maximize, simultaneously can high precision and the high substrate assembling device of throughput rate of fitting at a high speed.
In order to achieve the above object, in substrate assembling device of the present invention, have: be used to make reduced pressure atmosphere the chamber, upper substrate is remained on the above-mentioned indoor and increased pressure board that can move up and down, relative and vacate the substrate holding plate that keeps infrabasal plate at interval with upper substrate on remaining on above-mentioned increased pressure board; The position that drives the aforesaid substrate holding plate and carry out above-mentioned upper substrate and infrabasal plate meets, driving above-mentioned increased pressure board up and down makes the interval stenosis between the substrate narrow, fit in reduced pressure atmosphere by the bonding agent that is arranged on any one of aforesaid substrate, it is characterized in that, on above-mentioned increased pressure board, have a plurality of adsorption holes of the negative pressure that is used to keep upper substrate, near the adsorption hole the increased pressure board central portion in above-mentioned a plurality of adsorption hole is separately positioned on a plurality of adsorbent pad that have reciprocating mechanism, above-mentioned adsorbent pad is descended, after keeping substrate, make its substrate that retreats into above-mentioned increased pressure board keep face, keep upper substrate by the negative pressure of supplying with by above-mentioned a plurality of adsorption holes and adsorbent pad.
The present invention also provides a kind of substrate assembling device, have: the chamber that is used to make reduced pressure atmosphere, upper substrate is remained on the above-mentioned indoor and increased pressure board that can move up and down, relative and vacate the substrate holding plate that keeps at interval infrabasal plate with the upper substrate on remaining on above-mentioned increased pressure board, the position that drives the aforesaid substrate holding plate and carry out above-mentioned upper substrate and infrabasal plate meets, driving above-mentioned increased pressure board up and down makes the interval stenosis between the upper and lower base plate narrow, fit in reduced pressure atmosphere by the bonding agent that is arranged on any one of above-mentioned upper and lower base plate, it is characterized in that, on above-mentioned increased pressure board, be provided for supplying with a plurality of adsorption holes of negative pressure, deflection according to the finger tip side that upper substrate is transported to the mechanical arm on the above-mentioned increased pressure board, at the indoor upper substrate top correction mechanism of shifting increased pressure board one side on being provided for above-mentioned upper substrate onto, on by the top ends of upper substrate top correction mechanism, shift onto under the state of increased pressure board one side upper substrate, adsorption hole to above-mentioned increased pressure board is supplied with negative pressure, attracts absorption to remain on the increased pressure board upper substrate.
The present invention also provides a kind of substrate assembling device, have: the chamber that is used to make reduced pressure atmosphere, upper substrate is remained on the above-mentioned indoor and increased pressure board that can move up and down, relative and vacate the substrate holding plate that keeps at interval infrabasal plate with the upper substrate on remaining on above-mentioned increased pressure board, the position that drives above-mentioned infrabasal plate holding plate and carry out above-mentioned upper substrate and infrabasal plate meets, driving above-mentioned increased pressure board up and down makes the interval stenosis between the substrate narrow, fit in reduced pressure atmosphere by the bonding agent that is arranged on any one of above-mentioned upper and lower base plate, it is characterized in that, on above-mentioned increased pressure board, be provided for supplying with negative pressure, attract absorption to keep a plurality of adsorption holes of upper substrate, above-mentioned a plurality of adsorption holes be divided into more than 3 group, make the formation that has negative pressure source or pressure regulator valve, make each group can change absorption affinity.
The present invention also provides a kind of substrate assembly method, the empty standard width of a room in an old-style house is every also relative make 2 substrates in vacuum chamber about, by attracting absorption to remain on the upper and lower plates respectively, carrying out the position meets, interval by making two substrates is narrow, carry out the applying of two substrates by the bonding agent that is arranged on any one substrate, it is characterized in that, when remaining on upper substrate on the upper plate, the upper substrate that is transfused to that is etat lacunaire with respect to the upper plate central portion, supply with negative pressure to the adsorption hole of periphery successively by adsorption hole, thereby pick up upper substrate, attract absorption to keep to periphery to it successively from the upper substrate central portion from above-mentioned upper plate central portion.
Description of drawings
Fig. 1 is the figure of formation of the substrate assembling device of expression one embodiment of the present of invention.
Fig. 2 is the figure that is illustrated in the summary of the mechanical arm that uses in the substrate input.
Fig. 3 is that the summary of the adsorbent pad that is provided with on increased pressure board of explanation constitutes and the figure of the maintenance method during substrate generation deflection.
Fig. 4 is the key diagram by the mechanism of the deflection correction substrate deflection of the finger of mechanical arm.
Fig. 5 is the figure that is used to keep another formation of deflection substrate of the present invention.
Embodiment
One embodiment of the present of invention are described below with reference to the accompanying drawings.
In Fig. 1, the substrate assembling device is made of following chamber T1 portion and last chamber T2 portion.In the T2 portion of last chamber, have the epipleural 2 (also being called increased pressure board later on sometimes) that support foot 3 by connecting chamber T2 and a plurality of adjustment pin 4 can move up at upper and lower.Support foot 3 is adjusted pin 4 and is isolated, T2 inside, chamber is not communicated with atmosphere by welding bellows 6 by O type circle 5.The support foot 3 of epipleural 2 and adjustment pin 4 are fixed on the pressurization substrate 7.
Have, the central portion of this increased pressure board 7 is fixed on the Intermediate substrate 8 again.Intermediate substrate 8 is made into by start by the driving mechanism that the CD-ROM drive motor 10, speed reduction unit 11 and the ball-screw 12 that are installed on the upper frame 9 constitute, and as guiding mechanism, can move up and down ball spline axis rail 13.In addition, except that the ball spline axis rail, support upper frame 9 by the support column that is arranged on the stand 1.Another ball-screw 15 distolateral and that driven by the CD-ROM drive motor 14 that is installed on the Intermediate substrate 8 of respectively adjusting pin 4 that one end is fixed on the pressurization substrate 7 links.Act on the pressurization substrate 7 by driving the adjusting mechanism up and down that constitutes by this CD-ROM drive motor 14 and ball-screw 15 and exerting all one's strength, can when epipleural 2 maintenances are smooth, move up and down.
Have, last chamber T2 has and the connect mechanism that pressurizes and combine between the substrate 7 again, when chamber T2 separates with following chamber T1 on making, makes this connect mechanism action and pressurization substrate and last chamber T2 are become one, and CD-ROM drive motor 10 actions are risen upward.
In addition, be used for being arranged on side outer wall one side of chamber T2 the indoor family of power and influence 16 who carries out the input and output of substrate.Again the family of power and influence 16 relatively on the position of chamber sidewall, electro-dissociator 17 is set, by blow the ionization ultrasonic gas to substrate surface, can carry out removing of substrate.Have again, near the family of power and influence 16 of outside, electro-dissociator 17a is set also, thus, opening under the state of valve by blowing the electric effect of removing that ionized gas can improve substrate.
The secondary guide rail 18 of a plurality of sleeve structures is set to indoor protrusion central shaft 19 ground on the outer wall on last chamber T2.Hole on the protuberance of this central shaft 19 and the periphery that is arranged on epipleural 2 cooperates, and can carry out the adjustment of the horizontal direction of epipleural 2, that is, move as the secondary guide rail 18 and the central shaft 19 of the horizontal adjusting mechanism of epipleural 2.
The observation window of a plurality of base plate mark observation usefulness is set on last chamber T2.In this observation window, insert the lens barrel 21 of camera, discern the mark that is arranged on the substrate by camera.The lens barrel 21 of camera is arranged on the moving stage that has horizontal direction (X, Y direction) shifting axle and vertical direction (Z direction) shifting axle, and this moving stage is fixed on the T2 of chamber.Have again, the identification base plate mark is set on the position corresponding with above-mentioned observation window of epipleural 2 uses the hole.
In the present embodiment, outdoor, if this camera is directly installed on the epipleural 2, can improve the accuracy of identification of camera to mark to camera arrangement camera near the configuration of substrate ground, the position that can improve substrate meets precision.
Have again, in order to measure plus-pressure, between the Intermediate substrate 8 of support foot 3 and ball-screw, force cell 22 is set substrate.In addition, adjust on pin in pressurization each on the substrate 7 force cell 23 is set respectively, be used for monitoring, make motor 14 that driving respectively adjusts pin 4 overload not when adjusting the flatness of epipleural.
At following chamber T1 internal fixation lower side panel 24.This lower side panel 24, if it is fixing that full surface engages with following chamber T1, under the situation of the chamber T1 distortion at present of reducing pressure, be subjected to the influence of its distortion, the danger of flatness skew is arranged, for this reason, only fixing periphery makes it not to be subjected to the influence of chamber T1 down, in addition, configuration O-ring seal 25 described later contacts with last chamber T2 on the full week of following chamber T1, and constitutes the decompression chamber of inner sealing under the family of power and influence's 16 closing state.
Following chamber T1 is arranged on the θ substrate 28 that constitutes drivingly by motor 26, not shown ball-screw and by swing bearing 27 revolutions.In order to link θ substrate 28 and following chamber T1,, can guarantee the space of stipulating by box component.This space is used at the downside of following chamber T1 UV irradiation means 40 being installed, substrate keeps pawl elevating mechanism 41 and substrate elevating mechanism 42.θ substrate 28 is installed on the Y plate 32 through swing bearing 27.In addition, Y plate 32 is configured to and can be moved on the line slideway that is arranged on the X plate 33 by motor 29.Have, X plate 33 is configured to and can moves on the linear guides that is arranged at stand 1 one sides by CD-ROM drive motor 30 again.
In addition, when chamber T2 being contacted with following chamber T1 and constitutes the decompression chamber, for the compression surplus that makes O-ring seal 25 is certain, be provided with on the peripheral part of θ substrate 28 a plurality of on the ball bearing used of chamber 34 and band adjusting mechanism bear seat 35.With these ball bearing 34 and a down position that bears the last chamber T2 of seat 35 adjustment.
Have, what the ball bearing 37 of a plurality of θ substrate 28 usefulness and band adjusting mechanism were set on the member that is fixed on the device pedestal (stand) 1 bears seat 38 again, makes it to support the peripheral part of θ substrate 28, makes θ substrate 28 indeformable.Bear the loading of θ substrate 28 with them.Like this and since ball bearing 37 two parts that ball bearing of being used by the chamber 34 and θ substrate are used bear chamber up and down around loading, can reduce the distortion of chamber.
A plurality of transmission illuminations 39 that are used for mark identification are being set, perforate on the correspondence position of lower side panel 24 in the T1 of chamber down.Have again, in the T1 of chamber a plurality of pressurization UV irradiation means 40 are being set down, be used for compression and UV curing bonding agent, make the substrate of applying not produce skew.Have again, be provided with respectively when carrying out the input and output of substrate, be used to prevent that substrate is at the rotary and lifting pin of the deflection of the substrate of the maintenance pawl elevating mechanism 41 of Width deflection, the deflection that prevents mechanical arm and fore-and-aft direction be used for the substrate elevating mechanism 43 of the substrate that lifting fits.
On lower side panel 24, the hole is set, pressurization UV irradiation means 40 can be moved up and down in lower side panel 24.Have, pressurization UV irradiation means is made into can doublely do the rotary and lifting pin again.In addition, groove (notch) is set respectively, substrate elevating mechanism 43 can be moved up and down in the substrate supporting side.Make when substrate input and output, can make these substrate elevating mechanism 43 actions and can below substrate, side insert mechanical arm.For lower side panel 24 is fixed on down in the T1 of chamber, these holes or groove can only be provided with minimum margin.
Have, pressurization UV irradiation means 40, maintenance elevating mechanism 41 and substrate elevating mechanism 42 have the perforation reciprocating mechanism of chamber T1 down respectively, but are being provided with O type circle between chamber T1 and these reciprocating mechanism portions down, thus, make the structure that keeps airtight again.
The maintaining body of the upside substrate that is formed by the epipleural 2 of decompression state can be any of the electric maintaining body that formed by electrostatic chuck or the physics maintaining body that formed by adhesives.When carrying out electric maintenance by electrostatic chuck, by cutting off additional power source, rising epipleural 2 after certain electricity time of removing can interrupt the maintenance that is produced by epipleural 2.In addition, when keeping, the upside substrate is mechanically pressed a plurality of pins on the substrate that is attached to downside,, can interrupt the maintenance of the substrate of upside pin being pressed the epipleural 2 that only rises under the state that is attached to downside by being provided with by adhesives.
On the other hand, by the downside substrate holding mechanism that the lower side panel 24 of decompression state forms, can be too have by electrostatic chuck carry out electric maintenance Electrostatic Absorption mechanism method or have method any that carries out the bonding maintaining body that physics keeps by adhesives.The assembling of the adsorption method of epipleural 2 and lower side panel 24, preferably epipleural 2 and lower side panel 24 are all made electrostatic chuck, perhaps one of them of epipleural 2 or lower side panel 24 made electrostatic chuck and another is made adhesives, like this, between plate, just assemble and become easily with the par that becomes benchmark, therefore, the upper and lower base plate of can fitting equably.Have again, in the present embodiment, attraction adsorbing mechanism that also can dual-purpose adsorbs by negative pressure and the Electrostatic Absorption mechanism that carries out Electrostatic Absorption by static.
Decompression in the decompression chamber is undertaken by being arranged on the vacuum pump that any one indoor not shown exhausr port up and down is connected to vacuum valve and dry pump or turbomolecular pump.In addition, indoor inflation is to be arranged on up and down by not shown that any one indoor valve imports inert gas such as nitrogen or atmosphere carries out.In order to reduce the time of adhering to and shorten indoor decompression of indoor moisture, the gas that charges into is inert gas such as poor nitrogen of hydrone preferably.
As an example that uses above substrate assembling device of the present invention, with can the structure that the decompression chamber is divided into two parts being illustrated, but be not limited to the formation of this example, also can be the device that the decompression chamber is made of one.If, also can use the present invention by a substrate being remained on epipleural and under this state, epipleural being moved to the device that lower side panel one side (dwindling substrate at interval) that keeps another substrate is fitted substrate mutually.
Fig. 2 is the figure of structure of the hand of the expression mechanical arm that is used for the input substrate assembling device, and Fig. 3 represents the mode chart of the substrate absorption in the adsorbent pad portion of increased pressure board.
In Fig. 2, the hand of mechanical arm begins to be provided with the finger 51 of a plurality of supporting substrates 60 from arm 52, and a plurality of adsorbent pad 53 are set on this finger 51.This adsorbent pad 53 is provided with adsorption hole in top ends, can adsorb substrate 60 by negative pressure.The adsorbent pad 53 of this finger 51 can move up and down, according to the chamfering number of the substrate 60 that keeps, make the adsorbent pad 53 of the part that contacts with the surface of liquid crystal display part keep out of the way in advance not with the real estate position contacting on.For this reason, shown in Fig. 2 (b), under the situation of the substrate 60 of a chamfering, among the adsorbent pad 53 that is arranged on the finger of central portion, the adsorbent pad 53b of central portion keep out of the way not with the real estate position contacting on, with the adsorbent pad 53a supporting substrates 60 of periphery.
For this reason, shown in Fig. 2 (b), it is recessed that substrate is supported to central portion.When using the attraction hole that is arranged on the increased pressure board (upper plate) 2 to be attracted to adsorb by negative pressure under this state, negative pressure does not act on the central portion of substrate 60, and the situation that has substrate 60 can not remain on the upper plate 2 takes place.In addition, promptly enable to keep, it is inhomogeneous that the absorption of substrate also becomes, and local big attraction force acts also becomes and causes the reason that precision reduces when fitting on substrate.Therefore, in the present embodiment, shown in Fig. 3 (a), a plurality of adsorbent pad that can move up and down are set near the central portion of increased pressure board 2, substrate center portion can be adsorbed on the upper plate (increased pressure board) 2 reliably.
Adsorbent pad is made of the bar portion 57 that makes its gas that moves up and down 55, stretched by gas 55 and the cushion part 56 on top.In addition, though bar portion 57 is not shown, but hollow is supplied with the air of negative pressure therefrom.The hole that is communicated with the hollow bulb of bar portion 57 is set on the cushion part 56 on top.
At Fig. 3 (a) though in not shown, the attraction adsorption hole of a plurality of negative pressure is set on the substrate adsorption plane of increased pressure board 2.With above-mentioned formation when mechanical arm 50 carries out the excessive operation of substrate 60, shown in Fig. 3 (b), negative pressure by increased pressure board 2 makes the action of attraction adsorbing mechanism, essential amount is stretched out to substrate one side by 57 in the bar portion of the adsorbent pad that can move up and down simultaneously, after keeping substrate 60 with cushion part 56, retreat into by barre portion 57 on the substrate maintenance face of upper plate 2, make it to be adsorbed on reliably near the attraction adsorption hole of central portion.Have, when plus-pressure being acted on the substrate 60 and fitting, cushion part 56 is as attracting adsorption hole to supply with negative pressure again.Have, elastic bodys such as cushion part 56 usefulness rubber constitute again, so as when to contact with substrate 60 wounded substrate 60 not.
In the present embodiment, moving up and down by cylinder of bar portion 57 undertaken, and this drive division is installed in the outside of decompression chamber T2 in the present embodiment, but also can be installed in and the adding on the opposite side of pressure surface of increased pressure board.In addition, the overhang of the bar portion 57 of adsorbent pad can be by measuring the deflection of substrate in advance, and change suppresses the position of the stop of elongation according to measured quantity, and making overhang is ormal weight.As drive unit, also can use motor etc., the sensor of metering deflection also can be set on the substrate of every input, come the overhang of control lever portion 57 according to its metering result.
More than, the actuation mechanism when the central portion generation deflection of substrate 60 has been described, but with many fingers 51 input substrates 60 of mechanical arm 50 time, if increase the rigidity of finger 51, finger 51 becomes big, can hinder the action of mechanical arm 50.For this reason, can not strengthen the rigidity of finger 51.For this reason, when the input large substrate, as shown in Figure 4, and the top ends deflection of finger 51, increased pressure board 2 can take place can not be by the situation of negative-pressure adsorption substrate 60.For this reason, at the indoor substrate top correction mechanism 70 of revising pawl that has that is arranged on the top ends that is used to promote substrate 60 before attracting absorption upper substrate 60.This substrate top correction mechanism 70 provides edge of substrate maintaining part 71 that keeps the substrate end and the finger maintaining part 72 that is used for the finger 51 of elevating gear hand.Edge of substrate maintaining part 71 is arranged between the adjacent finger of mechanical arm, shown in Fig. 4 (a), revises the deflection between the finger of substrate easily and is adsorbed on easily on the increased pressure board 2.For this reason, not only the tip side of finger also is provided with edge of substrate maintaining part 71 in the arm side.
In this figure, in following side room T1, be provided with and carry out substrate top correction mechanism 70 up and down by cylinder.Thereby, when 51 deflections of the finger of mechanical arm 50, make correction mechanism 70 actions in substrate top revise the deflection of substrate, can be adsorbed on substrate 60 on the increased pressure board 2 reliably.
Have again, replace being provided with substrate top correction mechanism 70, also can be identical with embodiment formerly, on the increased pressure board 2 of the position (opposition side of the substrate input oral-lateral of chamber, promptly the most inboard position) of the substrate maintaining part of finger 51 tip side that are equivalent to mechanical arm 50, be provided with and have the adsorbent pad of driving mechanism up and down.
Fig. 5 represents an alternative embodiment of the invention.The attraction adsorption hole that is set in the present embodiment on the increased pressure board 2 is divided into a plurality of groups (R1, R2, R3), negative pressure source is set respectively, the negative pressure of supplying with every group can be changed, perhaps with a negative pressure source branch, on the pipe arrangement halfway pressure regulator valve is set, can adjusts pressure.
In Fig. 5,, add A1 and two kinds of negative pressure of A2 respectively with negative pressure source attracting adsorption hole to be divided into 3 group R1, R2, R3.Owing on the central portion of substrate 60, formed the directed mould of liquid crystal board etc., substrate is supported to transport in the assembling device by the adsorbent pad 53 of mechanical arm both sides.For this reason, shown in Fig. 5 (a), become the deflection of substrate center portion and the state of distance is arranged with increased pressure board 2.For this reason, the big negative pressure A1 of effect and adsorb substrate center portion (Fig. 5 (b)) on the attraction adsorption hole R2 of central authorities at first.Secondly, by being added on attraction adsorption hole R1, the R3 of both sides, can under the not crooked state of substrate 60, be adsorbed on (Fig. 5 (c)) on the increased pressure board 2 to substrate 60 than the little negative pressure A2 of negative pressure A1 that is added on the central portion.In the present embodiment, the state that adsorption hole is divided into 3 groups is illustrated as an example, but by being divided into thinner group and adsorbing lentamente to the substrate end from substrate center portion, can adsorb more accurately.In addition, this action is that a plurality of adsorbent pad that can move up and down 56 with Fig. 3 explanation are configured on the increased pressure board 2, from central authorities towards periphery order attract absorption to carry out drawing, corresponding, this action also can be adsorbed by a plurality of attraction adsorption holes that had by increased pressure board 2 and realized.Have, though not shown, on increased pressure board, substrate falls when preventing the indoor decompression of substrate assembling device again, except above-mentioned attraction adsorbing mechanism and, also be provided with bonding maintaining body and Electrostatic Absorption mechanism together.
Below, the action by 1 pair of applying liquid crystal board of substrate assembling device of the present invention describes.
At first, surrounding the periphery of liquid crystal board with bonding agent frame shape ground and apply into the black matrix shape or, the face that has been coated with bonding agent is become under the state of downside overturning, be positioned on the finger of the downside that is positioned at mechanical arm near the upside substrate of black matrix shape.In addition,, become at the face of dripping that is configured to liquid crystal under the state of upside, carry on another finger of the mechanical arm that is positioned at upside the downside substrate that has applied liquid crystal in advance from the teeth outwards.Like this, two substrates are being carried under the state on the finger up and down, mechanical arm moves in front of the laminating apparatus.Substrate assembling device 1 is opened the family of power and influence 16 of chamber T2 portion, and mechanical arm inserts the upside substrate of the upset on the finger that is in downside in the device.
Substrate assembling device 1 decline epipleural 2, by by vacuum suction absorption the absorption of the upside substrate of upset remain on epipleural 2 below.At this moment, when on substrate, deflection being arranged, substrate top correction mechanism 70 and adsorbent pad are moved together, keep smooth.That is, when on substrate, deflection being arranged,, when adsorbent pad absorption substrate, make the adsorbent pad surface retreat into the position of upper face, can flatly remain on substrate on the plate face by adsorbent pad slave plate face is protruded on the position that can adsorb substrate.
Have, when the adsorption hole of epipleural is divided into a plurality of group times, from the adsorption hole order of the central portion adsorption hole effect negative pressure to end side, can flatly be held in substrate can be not crooked again.
Next, in a single day the downside mechanical arm retreats in substrate assembling device 1, waits for this substrate assembling device that retreats 1 usefulness substrate elevating mechanism 43 and keeps pawl elevating mechanism 41 to promote upward being in the liquid crystal board that is over of having fitted on the lower side panel 24.Under this state, the downside mechanical arm is inserted liquid crystal board downside in the substrate assembling device 1 once more, lift upward after the mechanical arm, by retreating mechanical arm liquid crystal board is fetched into the outside in substrate assembling device 1.Substrate assembling device 1 makes substrate elevating mechanism 43 and keeps pawl elevating mechanism 41 to descend.
Next, the downside substrate that has applied liquid crystal in advance on the mechanical arm that is in upside is inserted in the substrate assembling device 1, substrate assembling device 1 rises and keeps pawl elevating mechanism 41, the downside substrate is risen, after retreating on mechanical arm, the downside substrate is arranged on the lower side panel 24, attracts absorption downside substrate.
Next, the shifting axle of the lens barrel 21 of decline vertical direction camera is measured the base plate mark position of upside substrate, moves to the horizontal direction shifting axle on the center consistent location of lens barrel 21 of the mark center position of upside substrate and camera.Then, decline epipleural 2 is measured the deviation of the mark position of upside substrates and downside substrate by the lens barrel 21 of camera.By with not shown elevating mechanism rising ball bearing 34, thereby the seat 35 that bears by the band adjusting mechanism rises upper chamber part T2, O-ring seal 25 is contacted a little with upper chamber part T2, perhaps do not contact (loading of chamber is not acted on the O-ring seal 25), CD-ROM drive motor 26, motor 29, motor 30 drive lower chamber part T1.Thus, lower side panel 24 moves horizontally to XY θ direction with following chamber T1, carries out the coarse positioning of the collimating marks of infrabasal plate and upper substrate.After coarse positioning finishes, decline ball bearing 34.Next, when upper and lower plates adsorbs substrate with electrostatic chuck, voltage is added to the absorption of carrying out substrate on the electrostatic chuck.Under this state, close the family of power and influence 16, in the decompression chamber, carry out decompression exhaust with vacuum pump.In the decompression exhaust process, rising epipleural 2 is so that easily discharge gas between the upper and lower base plate.
After the decompression state that becomes regulation in the decompression chamber, epipleural 2 once more descends, measure the position deviation between the upper and lower base plate, drive down chamber T1 by CD-ROM drive motor 26, motor 29, motor 30, move horizontally to XY θ direction, carry out the microposition of the collimating marks of infrabasal plate and upper substrate.After microposition finished, the value limit decline epipleural 2 of force cell 22 was measured on the limit, carried out the pressurizing attaching of substrate.Plus-pressure reaches after the setting of compression bonding agent, stop pressurization, at temporary fixed top, the position pressurization of the substrate UV bonding agent limit irradiation UV light of the temporary fixed usefulness of coating in advance, carry out temporary fixedly by pressurization UV irradiation means 40, the position of substrate is not offset.
After the temporary fixed end, pressurization UV irradiation means 40 rises.When epipleural 2 utilizes electrostatic chuck to carry out absorption in the vacuum, cut off voltage, epipleural 2 rose after power failure standby a few minutes.When epipleural 2 utilizes adhesion, mechanically upside substrate pressure is attached on the substrate of downside by a plurality of pins, in that the pin pressure is attached under the state of downside, interrupt the maintenance of the substrate of upside by the epipleural that only rises.
Then, by being arranged on that valve on the decompression chamber imports inert gases such as nitrogen or air in the decompression chamber and to atmosphere opening.Next, the open family of power and influence 16 carries out the input and output of substrate.When in the vacuum chamber of substrate assembling device 1, cleaning etc. when safeguarding, make the connect mechanism action that is installed on the upper chamber part T2, pressurization substrate 7 and upper chamber part T2 are joined together, usefulness CD-ROM drive motor 10 rises to Z-direction with epipleural 2.Thus, under the chamber opened state, can carry out the maintenance of upper and lower plates.As mentioned above, solved in the present embodiment when remaining on large substrate on the epipleural, because the substrate deflection that produces of substrate when input, can not be reliably substrate have been remained on problem on the epipleural, can improve the precision of baseplate-laminating.
As described above, according to Base Plate Lamination Device of the present invention, when being input to substrate in the device, particularly when large-scale upper substrate is remained on epipleural, owing to can not be subjected to reliably substrate to be remained on the position of regulation on the influence ground of the deflection that produces on the substrate, so can improve the precision that the position meets, also can shorten the position simultaneously and meet the needed time.
Claims (7)
1. substrate assembling device has: be used to make reduced pressure atmosphere the chamber, upper substrate is remained on the above-mentioned indoor and increased pressure board that can move up and down, relative and vacate the substrate holding plate that keeps infrabasal plate at interval with upper substrate on remaining on above-mentioned increased pressure board; The position that drives the aforesaid substrate holding plate and carry out above-mentioned upper substrate and infrabasal plate meets, driving above-mentioned increased pressure board up and down makes the interval stenosis between the substrate narrow, fit in reduced pressure atmosphere by the bonding agent that is arranged on any one of aforesaid substrate, it is characterized in that
On above-mentioned increased pressure board, have a plurality of adsorption holes of the negative pressure that is used to keep upper substrate, near the adsorption hole the increased pressure board central portion in above-mentioned a plurality of adsorption hole is separately positioned on a plurality of adsorbent pad that have reciprocating mechanism, after above-mentioned adsorbent pad descended, keeping substrate, make its substrate that retreats into above-mentioned increased pressure board keep face, keep upper substrate by the negative pressure of supplying with by above-mentioned a plurality of adsorption holes and adsorbent pad.
2. substrate assembling device as claimed in claim 1 is characterized in that, above-mentioned a plurality of adsorbent pad only are arranged near the increased pressure board central portion.
3. substrate assembling device as claimed in claim 1 is characterized in that, with end one side of the opposite side in substrate input port of above-mentioned increased pressure board a plurality of adsorbent pad with reciprocating mechanism is being set also.
4. substrate assembling device, have: the chamber that is used to make reduced pressure atmosphere, upper substrate is remained on the above-mentioned indoor and increased pressure board that can move up and down, relative and vacate the substrate holding plate that keeps at interval infrabasal plate with the upper substrate on remaining on above-mentioned increased pressure board, the position that drives the aforesaid substrate holding plate and carry out above-mentioned upper substrate and infrabasal plate meets, driving above-mentioned increased pressure board up and down makes the interval stenosis between the upper and lower base plate narrow, fit in reduced pressure atmosphere by the bonding agent that is arranged on any one of above-mentioned upper and lower base plate, it is characterized in that
On above-mentioned increased pressure board, be provided for supplying with a plurality of adsorption holes of negative pressure,
Deflection according to the finger tip side that upper substrate is transported to the mechanical arm on the above-mentioned increased pressure board, at the indoor upper substrate top correction mechanism of shifting increased pressure board one side on being provided for above-mentioned upper substrate onto, on by the top ends of upper substrate top correction mechanism, shift onto under the state of increased pressure board one side upper substrate, adsorption hole to above-mentioned increased pressure board is supplied with negative pressure, attracts absorption to remain on the increased pressure board upper substrate.
5. substrate assembling device, have: the chamber that is used to make reduced pressure atmosphere, upper substrate is remained on the above-mentioned indoor and increased pressure board that can move up and down, relative and vacate the substrate holding plate that keeps at interval infrabasal plate with the upper substrate on remaining on above-mentioned increased pressure board, the position that drives the aforesaid substrate holding plate and carry out above-mentioned upper substrate and infrabasal plate meets, driving above-mentioned increased pressure board up and down makes the interval stenosis between the substrate narrow, fit in reduced pressure atmosphere by the bonding agent that is arranged on any one of above-mentioned upper and lower base plate, it is characterized in that
On above-mentioned increased pressure board, be provided for supplying with negative pressure, attract absorption to keep a plurality of adsorption holes of upper substrate, above-mentioned a plurality of adsorption holes are divided into group more than 3, make the formation that has negative pressure source or pressure regulator valve, make each group can change absorption affinity.
6. the described substrate assembling device of each of claim 1 to 5, it is characterized in that, the adsorption hole on being arranged at above-mentioned increased pressure board, when above-mentioned indoor decompression, be used to keep the absorption affinity also effect that diminishes that attracts of aforesaid substrate to keep the Electrostatic Absorption mechanism or the bonding maintaining body of the confining force of substrate even also have.
7. substrate assembly method, the empty standard width of a room in an old-style house is every also relative make 2 substrates in vacuum chamber about, by attracting absorption to remain on the upper and lower plates respectively, carrying out the position meets, interval by making two substrates is narrow, carry out the applying of two substrates by the bonding agent that is arranged on any one substrate, it is characterized in that
When remaining on upper substrate on the upper plate, the upper substrate that is transfused to that is etat lacunaire with respect to the upper plate central portion, supply with negative pressure to the adsorption hole of periphery successively by adsorption hole from above-mentioned upper plate central portion, thereby pick up upper substrate, attract absorption to keep to periphery to it successively from the upper substrate central portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002210443 | 2002-07-19 | ||
| JP210443/2002 | 2002-07-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1469171A CN1469171A (en) | 2004-01-21 |
| CN100405185C true CN100405185C (en) | 2008-07-23 |
Family
ID=29997189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031386539A Expired - Fee Related CN100405185C (en) | 2002-07-19 | 2003-05-29 | Base plate assembly apparatus |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR100550648B1 (en) |
| CN (1) | CN100405185C (en) |
| SG (1) | SG107148A1 (en) |
| TW (1) | TW594297B (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3693972B2 (en) | 2002-03-19 | 2005-09-14 | 富士通株式会社 | Bonded substrate manufacturing apparatus and substrate bonding method |
| US7349060B2 (en) | 2003-12-02 | 2008-03-25 | Lg.Philips Lcd Co., Ltd. | Loader and bonding apparatus for fabricating liquid crystal display device and loading method thereof |
| JP4213610B2 (en) | 2004-03-15 | 2009-01-21 | 富士通株式会社 | Bonded board manufacturing equipment |
| TWI285758B (en) * | 2004-10-08 | 2007-08-21 | Au Optronics Corp | A method for combining set of substrates and apparatus of the same |
| KR100969754B1 (en) | 2005-01-13 | 2010-07-13 | 삼성전자주식회사 | Method for transmitting broadcast channel in cellular wireless communication system |
| CN100458513C (en) * | 2006-05-22 | 2009-02-04 | 旭东机械(昆山)有限公司 | Glass substrate fetching device |
| JP5190433B2 (en) * | 2009-10-27 | 2013-04-24 | 日東電工株式会社 | Wiring circuit board inspection method, wiring circuit board manufacturing method, and wiring circuit board inspection apparatus |
| JP5554617B2 (en) * | 2010-04-12 | 2014-07-23 | 株式会社ディスコ | Holding table |
| KR101383282B1 (en) * | 2011-12-28 | 2014-04-08 | 엘아이지에이디피 주식회사 | Substrate bonding apparatus |
| JP5810207B1 (en) * | 2014-11-14 | 2015-11-11 | 株式会社日立製作所 | Board assembly apparatus and board assembly method using the same |
| CN104570419B (en) * | 2014-12-26 | 2018-01-30 | 深圳市华星光电技术有限公司 | Absorption type microscope carrier and its adsorption method |
| CN105113318A (en) * | 2015-08-28 | 2015-12-02 | 重庆三好纸业有限公司 | Chinese art paper drying device |
| TWI587968B (en) | 2015-10-08 | 2017-06-21 | 財團法人工業技術研究院 | Support device, support unit system and support unit control system |
| CN105676492B (en) * | 2016-04-06 | 2019-02-01 | 深圳市华星光电技术有限公司 | Vacuum adsorption platform and glass substrate transport method |
| KR102330225B1 (en) * | 2016-10-17 | 2021-11-22 | 신에츠 엔지니어링 가부시키가이샤 | Vacuum bonding apparatus of bonding device |
| CN110730611B (en) * | 2019-09-30 | 2020-12-08 | 云谷（固安）科技有限公司 | Curved surface display screen binding device and curved surface display screen binding method |
| KR20210134097A (en) | 2020-04-29 | 2021-11-09 | 삼성디스플레이 주식회사 | Apparatus for manufacturing display device and method for manufacturing display device |
| KR102606055B1 (en) * | 2023-04-25 | 2023-11-24 | 주식회사 에이치비테크놀러지 | Glass Substrate Installation Apparatus for Seating the Warped Glass Substrate Completely |
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| JPH0980404A (en) * | 1995-09-11 | 1997-03-28 | Hitachi Ltd | Substrate suction device |
| JPH1159894A (en) * | 1997-08-07 | 1999-03-02 | Hitachi Electron Eng Co Ltd | Handling device for large-sized glass board |
| JP2000284295A (en) * | 1999-03-30 | 2000-10-13 | Hitachi Techno Eng Co Ltd | Method and apparatus for assembling substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3742000B2 (en) * | 2000-11-30 | 2006-02-01 | 富士通株式会社 | Press machine |
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2003
- 2003-02-07 TW TW092102581A patent/TW594297B/en not_active IP Right Cessation
- 2003-05-29 CN CNB031386539A patent/CN100405185C/en not_active Expired - Fee Related
- 2003-07-17 SG SG200303898A patent/SG107148A1/en unknown
- 2003-07-18 KR KR1020030049096A patent/KR100550648B1/en not_active IP Right Cessation
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0980404A (en) * | 1995-09-11 | 1997-03-28 | Hitachi Ltd | Substrate suction device |
| JPH1159894A (en) * | 1997-08-07 | 1999-03-02 | Hitachi Electron Eng Co Ltd | Handling device for large-sized glass board |
| JP2000284295A (en) * | 1999-03-30 | 2000-10-13 | Hitachi Techno Eng Co Ltd | Method and apparatus for assembling substrate |
| CN1445585A (en) * | 2002-03-19 | 2003-10-01 | 富士通株式会社 | Device and method for manufacturing joint substrate |
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| 特开2000-284295A 2000.10.13 |
| 特开平11-59894A 1999.03.02 |
| 特开平9-80404A 1997.03.28 |
Also Published As
| Publication number | Publication date |
|---|---|
| SG107148A1 (en) | 2004-11-29 |
| TW594297B (en) | 2004-06-21 |
| CN1469171A (en) | 2004-01-21 |
| KR20040010244A (en) | 2004-01-31 |
| KR100550648B1 (en) | 2006-02-08 |
| TW200401927A (en) | 2004-02-01 |
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