SG107148A1 - Substrates assembly apparatus - Google Patents
Substrates assembly apparatusInfo
- Publication number
- SG107148A1 SG107148A1 SG200303898A SG200303898A SG107148A1 SG 107148 A1 SG107148 A1 SG 107148A1 SG 200303898 A SG200303898 A SG 200303898A SG 200303898 A SG200303898 A SG 200303898A SG 107148 A1 SG107148 A1 SG 107148A1
- Authority
- SG
- Singapore
- Prior art keywords
- assembly apparatus
- substrates assembly
- substrates
- assembly
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Liquid Crystal (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manufacturing Optical Record Carriers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002210443 | 2002-07-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG107148A1 true SG107148A1 (en) | 2004-11-29 |
Family
ID=29997189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200303898A SG107148A1 (en) | 2002-07-19 | 2003-07-17 | Substrates assembly apparatus |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR100550648B1 (en) |
CN (1) | CN100405185C (en) |
SG (1) | SG107148A1 (en) |
TW (1) | TW594297B (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3693972B2 (en) | 2002-03-19 | 2005-09-14 | 富士通株式会社 | Bonded substrate manufacturing apparatus and substrate bonding method |
US7349060B2 (en) * | 2003-12-02 | 2008-03-25 | Lg.Philips Lcd Co., Ltd. | Loader and bonding apparatus for fabricating liquid crystal display device and loading method thereof |
JP4213610B2 (en) * | 2004-03-15 | 2009-01-21 | 富士通株式会社 | Bonded board manufacturing equipment |
TWI285758B (en) * | 2004-10-08 | 2007-08-21 | Au Optronics Corp | A method for combining set of substrates and apparatus of the same |
KR100969754B1 (en) | 2005-01-13 | 2010-07-13 | 삼성전자주식회사 | Method for transmitting broadcast channel in cellular wireless communication system |
CN100458513C (en) * | 2006-05-22 | 2009-02-04 | 旭东机械(昆山)有限公司 | Glass substrate fetching device |
JP5190433B2 (en) | 2009-10-27 | 2013-04-24 | 日東電工株式会社 | Wiring circuit board inspection method, wiring circuit board manufacturing method, and wiring circuit board inspection apparatus |
JP5554617B2 (en) * | 2010-04-12 | 2014-07-23 | 株式会社ディスコ | Holding table |
KR101383282B1 (en) * | 2011-12-28 | 2014-04-08 | 엘아이지에이디피 주식회사 | Substrate bonding apparatus |
JP5810207B1 (en) * | 2014-11-14 | 2015-11-11 | 株式会社日立製作所 | Board assembly apparatus and board assembly method using the same |
CN104570419B (en) * | 2014-12-26 | 2018-01-30 | 深圳市华星光电技术有限公司 | Absorption type microscope carrier and its adsorption method |
CN105113318A (en) * | 2015-08-28 | 2015-12-02 | 重庆三好纸业有限公司 | Chinese art paper drying device |
TWI587968B (en) | 2015-10-08 | 2017-06-21 | 財團法人工業技術研究院 | Support device, support unit system and support unit control system |
CN105676492B (en) * | 2016-04-06 | 2019-02-01 | 深圳市华星光电技术有限公司 | Vacuum adsorption platform and glass substrate transport method |
WO2018074013A1 (en) * | 2016-10-17 | 2018-04-26 | 信越エンジニアリング株式会社 | Apparatus for vacuum bonding of bonded device |
JP7111816B2 (en) * | 2018-07-30 | 2022-08-02 | アルバックテクノ株式会社 | SUBSTRATE LIFT DEVICE AND SUBSTRATE TRANSFER METHOD |
CN110730611B (en) * | 2019-09-30 | 2020-12-08 | 云谷(固安)科技有限公司 | Curved surface display screen binding device and curved surface display screen binding method |
KR20210134097A (en) | 2020-04-29 | 2021-11-09 | 삼성디스플레이 주식회사 | Apparatus for manufacturing display device and method for manufacturing display device |
KR102606055B1 (en) * | 2023-04-25 | 2023-11-24 | 주식회사 에이치비테크놀러지 | Glass Substrate Installation Apparatus for Seating the Warped Glass Substrate Completely |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020062787A1 (en) * | 2000-11-30 | 2002-05-30 | Fujitsu Limited | Apparatus for manufacturing bonded substrate |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0980404A (en) * | 1995-09-11 | 1997-03-28 | Hitachi Ltd | Substrate suction device |
JPH1159894A (en) * | 1997-08-07 | 1999-03-02 | Hitachi Electron Eng Co Ltd | Handling device for large-sized glass board |
JP3410983B2 (en) * | 1999-03-30 | 2003-05-26 | 株式会社 日立インダストリイズ | Substrate assembly method and apparatus |
JP3693972B2 (en) * | 2002-03-19 | 2005-09-14 | 富士通株式会社 | Bonded substrate manufacturing apparatus and substrate bonding method |
-
2003
- 2003-02-07 TW TW092102581A patent/TW594297B/en not_active IP Right Cessation
- 2003-05-29 CN CNB031386539A patent/CN100405185C/en not_active Expired - Fee Related
- 2003-07-17 SG SG200303898A patent/SG107148A1/en unknown
- 2003-07-18 KR KR1020030049096A patent/KR100550648B1/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020062787A1 (en) * | 2000-11-30 | 2002-05-30 | Fujitsu Limited | Apparatus for manufacturing bonded substrate |
Also Published As
Publication number | Publication date |
---|---|
KR20040010244A (en) | 2004-01-31 |
TW200401927A (en) | 2004-02-01 |
CN1469171A (en) | 2004-01-21 |
CN100405185C (en) | 2008-07-23 |
TW594297B (en) | 2004-06-21 |
KR100550648B1 (en) | 2006-02-08 |
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