CN1957299B - 放射线感应组合物、叠层体及其制造方法以及电子部件 - Google Patents

放射线感应组合物、叠层体及其制造方法以及电子部件 Download PDF

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Publication number
CN1957299B
CN1957299B CN2005800166928A CN200580016692A CN1957299B CN 1957299 B CN1957299 B CN 1957299B CN 2005800166928 A CN2005800166928 A CN 2005800166928A CN 200580016692 A CN200580016692 A CN 200580016692A CN 1957299 B CN1957299 B CN 1957299B
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CN
China
Prior art keywords
radiation
substrate
resin film
sensitive composition
ether
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2005800166928A
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English (en)
Chinese (zh)
Other versions
CN1957299A (zh
Inventor
东广和
寺田和代
木内孝司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeon Corp
Original Assignee
Nippon Zeon Co Ltd
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Filing date
Publication date
Application filed by Nippon Zeon Co Ltd filed Critical Nippon Zeon Co Ltd
Publication of CN1957299A publication Critical patent/CN1957299A/zh
Application granted granted Critical
Publication of CN1957299B publication Critical patent/CN1957299B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN2005800166928A 2004-03-31 2005-03-22 放射线感应组合物、叠层体及其制造方法以及电子部件 Expired - Fee Related CN1957299B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP104226/2004 2004-03-31
JP2004104226 2004-03-31
PCT/JP2005/005094 WO2005098539A1 (ja) 2004-03-31 2005-03-22 感放射線組成物、積層体及びその製造方法並びに電子部品

Publications (2)

Publication Number Publication Date
CN1957299A CN1957299A (zh) 2007-05-02
CN1957299B true CN1957299B (zh) 2010-04-21

Family

ID=35125234

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005800166928A Expired - Fee Related CN1957299B (zh) 2004-03-31 2005-03-22 放射线感应组合物、叠层体及其制造方法以及电子部件

Country Status (5)

Country Link
JP (1) JP4380703B2 (enExample)
KR (1) KR101173708B1 (enExample)
CN (1) CN1957299B (enExample)
TW (1) TW200604226A (enExample)
WO (1) WO2005098539A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408496B (zh) * 2006-03-01 2013-09-11 Zeon Corp A radiation linear resin composition, a laminate, and a method for producing the same
JP4771086B2 (ja) * 2006-03-01 2011-09-14 日本ゼオン株式会社 感放射線性樹脂組成物、積層体及びその製造方法
JP5040432B2 (ja) * 2007-05-15 2012-10-03 住友ベークライト株式会社 感光性樹脂組成物
JP2009244801A (ja) * 2008-03-31 2009-10-22 Fujifilm Corp 感光性樹脂組成物、高分子化合物、パターンの製造法および電子デバイス
TWI559079B (zh) * 2008-11-18 2016-11-21 Sumitomo Chemical Co Photosensitive resin composition and display device
CN102024562B (zh) * 2009-09-17 2016-03-09 大赛璐化学工业株式会社 用于制造叠层陶瓷部件的溶剂或溶剂组合物
JP2012107206A (ja) * 2010-10-26 2012-06-07 Daicel Corp 印刷用溶剤又は溶剤組成物
JP5886591B2 (ja) * 2011-08-09 2016-03-16 株式会社ダイセル 印刷用溶剤及びペースト組成物
JP6524996B2 (ja) * 2014-03-20 2019-06-05 日本ゼオン株式会社 感放射線樹脂組成物及び電子部品
CN106104380B (zh) * 2014-03-20 2020-03-06 日本瑞翁株式会社 放射线敏感性树脂组合物及电子部件
EP3345971A4 (en) * 2015-08-31 2019-04-17 Zeon Corporation RESIN COMPOSITION
US20180307141A1 (en) * 2015-11-06 2018-10-25 Rohm And Haas Electronic Materials Korea Ltd. Photosensitive resin composition and cured film prepared therefrom
JP6816761B2 (ja) * 2016-03-23 2021-01-20 日本ゼオン株式会社 樹脂組成物、樹脂膜、及び電子部品
CN107703685B (zh) * 2016-08-08 2022-03-18 东京应化工业株式会社 层叠体和层叠体的制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6190833B1 (en) * 1997-03-30 2001-02-20 Jsr Corporation Radiation-sensitive resin composition
CN1479173A (zh) * 2002-04-15 2004-03-03 夏普株式会社 辐射敏感树脂组合物，形成有图案绝缘膜的形成方法，装配有该膜的有源矩阵板和平板显示设备，和生产平板显示设备的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065116A (ja) * 1996-08-13 1998-03-06 Fujitsu Ltd 半導体装置及びその製造方法
JPH1165116A (ja) * 1997-06-09 1999-03-05 Jsr Corp 感放射線性樹脂組成物
JPH10307388A (ja) * 1997-05-06 1998-11-17 Jsr Corp 感放射線性樹脂組成物
JP3965976B2 (ja) * 2001-11-20 2007-08-29 日本ゼオン株式会社 感放射線性樹脂組成物、樹脂パターン形成方法、樹脂パターン及びその利用
JP2003307847A (ja) * 2002-04-16 2003-10-31 Jsr Corp インクジェット方式により層間絶縁膜を形成するための組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6190833B1 (en) * 1997-03-30 2001-02-20 Jsr Corporation Radiation-sensitive resin composition
CN1479173A (zh) * 2002-04-15 2004-03-03 夏普株式会社 辐射敏感树脂组合物，形成有图案绝缘膜的形成方法，装配有该膜的有源矩阵板和平板显示设备，和生产平板显示设备的方法

Also Published As

Publication number Publication date
CN1957299A (zh) 2007-05-02
KR20060130691A (ko) 2006-12-19
WO2005098539A1 (ja) 2005-10-20
JP4380703B2 (ja) 2009-12-09
TWI377215B (enExample) 2012-11-21
TW200604226A (en) 2006-02-01
KR101173708B1 (ko) 2012-08-13
JPWO2005098539A1 (ja) 2008-02-28

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Granted publication date: 20100421