TW200604226A - Radiation-sensitive composition, multilayer body and method for producing same, and electronic component - Google Patents

Radiation-sensitive composition, multilayer body and method for producing same, and electronic component

Info

Publication number
TW200604226A
TW200604226A TW094106968A TW94106968A TW200604226A TW 200604226 A TW200604226 A TW 200604226A TW 094106968 A TW094106968 A TW 094106968A TW 94106968 A TW94106968 A TW 94106968A TW 200604226 A TW200604226 A TW 200604226A
Authority
TW
Taiwan
Prior art keywords
radiation
sensitive composition
multilayer body
substrate
electronic component
Prior art date
Application number
TW094106968A
Other languages
English (en)
Chinese (zh)
Other versions
TWI377215B (enExample
Inventor
Hirokazu Higashi
Kazuyo Terada
Takashi Kiuchi
Original Assignee
Zeon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corp filed Critical Zeon Corp
Publication of TW200604226A publication Critical patent/TW200604226A/zh
Application granted granted Critical
Publication of TWI377215B publication Critical patent/TWI377215B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW094106968A 2004-03-31 2005-03-08 Radiation-sensitive composition, multilayer body and method for producing same, and electronic component TW200604226A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004104226 2004-03-31

Publications (2)

Publication Number Publication Date
TW200604226A true TW200604226A (en) 2006-02-01
TWI377215B TWI377215B (enExample) 2012-11-21

Family

ID=35125234

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106968A TW200604226A (en) 2004-03-31 2005-03-08 Radiation-sensitive composition, multilayer body and method for producing same, and electronic component

Country Status (5)

Country Link
JP (1) JP4380703B2 (enExample)
KR (1) KR101173708B1 (enExample)
CN (1) CN1957299B (enExample)
TW (1) TW200604226A (enExample)
WO (1) WO2005098539A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408496B (zh) * 2006-03-01 2013-09-11 Zeon Corp A radiation linear resin composition, a laminate, and a method for producing the same
TWI770011B (zh) * 2016-03-23 2022-07-11 日商日本瑞翁股份有限公司 樹脂組合物、樹脂膜以及電子元件

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4771086B2 (ja) * 2006-03-01 2011-09-14 日本ゼオン株式会社 感放射線性樹脂組成物、積層体及びその製造方法
JP5040432B2 (ja) * 2007-05-15 2012-10-03 住友ベークライト株式会社 感光性樹脂組成物
JP2009244801A (ja) * 2008-03-31 2009-10-22 Fujifilm Corp 感光性樹脂組成物、高分子化合物、パターンの製造法および電子デバイス
TWI559079B (zh) * 2008-11-18 2016-11-21 Sumitomo Chemical Co Photosensitive resin composition and display device
CN102024562B (zh) * 2009-09-17 2016-03-09 大赛璐化学工业株式会社 用于制造叠层陶瓷部件的溶剂或溶剂组合物
JP2012107206A (ja) * 2010-10-26 2012-06-07 Daicel Corp 印刷用溶剤又は溶剤組成物
JP5886591B2 (ja) * 2011-08-09 2016-03-16 株式会社ダイセル 印刷用溶剤及びペースト組成物
JP6524996B2 (ja) * 2014-03-20 2019-06-05 日本ゼオン株式会社 感放射線樹脂組成物及び電子部品
CN106104380B (zh) * 2014-03-20 2020-03-06 日本瑞翁株式会社 放射线敏感性树脂组合物及电子部件
EP3345971A4 (en) * 2015-08-31 2019-04-17 Zeon Corporation RESIN COMPOSITION
US20180307141A1 (en) * 2015-11-06 2018-10-25 Rohm And Haas Electronic Materials Korea Ltd. Photosensitive resin composition and cured film prepared therefrom
CN107703685B (zh) * 2016-08-08 2022-03-18 东京应化工业株式会社 层叠体和层叠体的制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065116A (ja) * 1996-08-13 1998-03-06 Fujitsu Ltd 半導体装置及びその製造方法
US6190833B1 (en) * 1997-03-30 2001-02-20 Jsr Corporation Radiation-sensitive resin composition
JPH1165116A (ja) * 1997-06-09 1999-03-05 Jsr Corp 感放射線性樹脂組成物
JPH10307388A (ja) * 1997-05-06 1998-11-17 Jsr Corp 感放射線性樹脂組成物
JP3965976B2 (ja) * 2001-11-20 2007-08-29 日本ゼオン株式会社 感放射線性樹脂組成物、樹脂パターン形成方法、樹脂パターン及びその利用
US6984476B2 (en) * 2002-04-15 2006-01-10 Sharp Kabushiki Kaisha Radiation-sensitive resin composition, forming process for forming patterned insulation film, active matrix board and flat-panel display device equipped with the same, and process for producing flat-panel display device
JP2003307847A (ja) * 2002-04-16 2003-10-31 Jsr Corp インクジェット方式により層間絶縁膜を形成するための組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408496B (zh) * 2006-03-01 2013-09-11 Zeon Corp A radiation linear resin composition, a laminate, and a method for producing the same
TWI770011B (zh) * 2016-03-23 2022-07-11 日商日本瑞翁股份有限公司 樹脂組合物、樹脂膜以及電子元件

Also Published As

Publication number Publication date
CN1957299A (zh) 2007-05-02
KR20060130691A (ko) 2006-12-19
WO2005098539A1 (ja) 2005-10-20
JP4380703B2 (ja) 2009-12-09
TWI377215B (enExample) 2012-11-21
CN1957299B (zh) 2010-04-21
KR101173708B1 (ko) 2012-08-13
JPWO2005098539A1 (ja) 2008-02-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees