CN1839220A - 用于在铝和铝合金上镀覆的含水酸性浸镀溶液和方法 - Google Patents
用于在铝和铝合金上镀覆的含水酸性浸镀溶液和方法 Download PDFInfo
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- CN1839220A CN1839220A CNA2004800242433A CN200480024243A CN1839220A CN 1839220 A CN1839220 A CN 1839220A CN A2004800242433 A CNA2004800242433 A CN A2004800242433A CN 200480024243 A CN200480024243 A CN 200480024243A CN 1839220 A CN1839220 A CN 1839220A
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- Prior art keywords
- immersion plating
- plating solutions
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- solution
- matrix
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- 238000007654 immersion Methods 0.000 title claims abstract description 104
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 69
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- 230000002378 acidificating effect Effects 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 39
- 229910000838 Al alloy Inorganic materials 0.000 title abstract description 25
- -1 cobalt iron ions Chemical class 0.000 claims abstract description 40
- 239000003112 inhibitor Substances 0.000 claims abstract description 36
- 229910001297 Zn alloy Inorganic materials 0.000 claims abstract description 30
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 229910001453 nickel ion Inorganic materials 0.000 claims abstract description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 16
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 49
- 239000011159 matrix material Substances 0.000 claims description 38
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
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- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims description 14
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- 238000004140 cleaning Methods 0.000 claims description 12
- 125000003118 aryl group Chemical group 0.000 claims description 11
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- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 7
- 229910052728 basic metal Inorganic materials 0.000 claims description 7
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- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 claims description 6
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- GNVMUORYQLCPJZ-UHFFFAOYSA-M Thiocarbamate Chemical class NC([S-])=O GNVMUORYQLCPJZ-UHFFFAOYSA-M 0.000 claims description 4
- 229910052783 alkali metal Inorganic materials 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- OGYGFUAIIOPWQD-UHFFFAOYSA-N 1,3-thiazolidine Chemical compound C1CSCN1 OGYGFUAIIOPWQD-UHFFFAOYSA-N 0.000 claims description 3
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 claims description 3
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 claims description 3
- CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical compound C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 claims description 3
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 claims description 3
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 claims description 3
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- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical class CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 3
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- 150000003233 pyrroles Chemical class 0.000 claims description 3
- 238000007670 refining Methods 0.000 claims description 3
- CBDKQYKMCICBOF-UHFFFAOYSA-N thiazoline Chemical compound C1CN=CS1 CBDKQYKMCICBOF-UHFFFAOYSA-N 0.000 claims description 3
- 150000003852 triazoles Chemical class 0.000 claims description 3
- GBNDTYKAOXLLID-UHFFFAOYSA-N zirconium(4+) ion Chemical compound [Zr+4] GBNDTYKAOXLLID-UHFFFAOYSA-N 0.000 claims description 3
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims description 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical class [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 229940095064 tartrate Drugs 0.000 claims description 2
- 125000003831 tetrazolyl group Chemical group 0.000 claims description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 2
- JLVVSXFLKOJNIY-UHFFFAOYSA-N Magnesium ion Chemical compound [Mg+2] JLVVSXFLKOJNIY-UHFFFAOYSA-N 0.000 claims 2
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- RGHNJXZEOKUKBD-SQOUGZDYSA-M D-gluconate Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O RGHNJXZEOKUKBD-SQOUGZDYSA-M 0.000 claims 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims 1
- 239000003599 detergent Substances 0.000 claims 1
- 229960001731 gluceptate Drugs 0.000 claims 1
- KWMLJOLKUYYJFJ-VFUOTHLCSA-N glucoheptonic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)[C@@H](O)C(O)=O KWMLJOLKUYYJFJ-VFUOTHLCSA-N 0.000 claims 1
- 229940050410 gluconate Drugs 0.000 claims 1
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical compound [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 claims 1
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- 125000004434 sulfur atom Chemical group 0.000 abstract 2
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- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 25
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- 125000004432 carbon atom Chemical group C* 0.000 description 9
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- HELHAJAZNSDZJO-OLXYHTOASA-L sodium L-tartrate Chemical compound [Na+].[Na+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O HELHAJAZNSDZJO-OLXYHTOASA-L 0.000 description 2
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- FCPHVJQWZFNNKD-UHFFFAOYSA-N 3-amino-1,1-dimethylthiourea Chemical compound CN(C)C(=S)NN FCPHVJQWZFNNKD-UHFFFAOYSA-N 0.000 description 1
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- YPXQSGWOGQPLQO-UHFFFAOYSA-N 5-nitro-1,3-dihydrobenzimidazole-2-thione Chemical compound [O-][N+](=O)C1=CC=C2N=C(S)NC2=C1 YPXQSGWOGQPLQO-UHFFFAOYSA-N 0.000 description 1
- UGZAJZLUKVKCBM-UHFFFAOYSA-N 6-sulfanylhexan-1-ol Chemical compound OCCCCCCS UGZAJZLUKVKCBM-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical group CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- GXKADOUVSQXMJG-UHFFFAOYSA-N C(C)N(CC)OS(=O)(=O)S(=O)(=O)O Chemical compound C(C)N(CC)OS(=O)(=O)S(=O)(=O)O GXKADOUVSQXMJG-UHFFFAOYSA-N 0.000 description 1
- GEQHHDIQXAJDRD-UHFFFAOYSA-N CN(C(S)=S)C.CN(C)OS(=O)(=O)S(=O)(=O)O Chemical compound CN(C(S)=S)C.CN(C)OS(=O)(=O)S(=O)(=O)O GEQHHDIQXAJDRD-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- YPZMPEPLWKRVLD-PJEQPVAWSA-N D-Glycero-D-gulo-Heptose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)[C@@H](O)C=O YPZMPEPLWKRVLD-PJEQPVAWSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- LXXNWCFBZHKFPT-UHFFFAOYSA-N Ethyl 2-mercaptopropionate Chemical compound CCOC(=O)C(C)S LXXNWCFBZHKFPT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- JVTAAEKCZFNVCJ-UHFFFAOYSA-M Lactate Chemical compound CC(O)C([O-])=O JVTAAEKCZFNVCJ-UHFFFAOYSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- HLCFGWHYROZGBI-JJKGCWMISA-M Potassium gluconate Chemical compound [K+].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O HLCFGWHYROZGBI-JJKGCWMISA-M 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- LVJOFJVCBFMGPW-UHFFFAOYSA-N SC1=C(C(=O)O)C=C(C=C1C(=O)O)C Chemical compound SC1=C(C(=O)O)C=C(C=C1C(=O)O)C LVJOFJVCBFMGPW-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 229910000635 Spelter Inorganic materials 0.000 description 1
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- PMNLUUOXGOOLSP-UHFFFAOYSA-N alpha-mercaptopropionic acid Natural products CC(S)C(O)=O PMNLUUOXGOOLSP-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- GHWVXCQZPNWFRO-UHFFFAOYSA-N butane-2,3-diamine Chemical compound CC(N)C(C)N GHWVXCQZPNWFRO-UHFFFAOYSA-N 0.000 description 1
- JIRRNZWTWJGJCT-UHFFFAOYSA-N carbamothioylthiourea Chemical compound NC(=S)NC(N)=S JIRRNZWTWJGJCT-UHFFFAOYSA-N 0.000 description 1
- ZBYYWKJVSFHYJL-UHFFFAOYSA-L cobalt(2+);diacetate;tetrahydrate Chemical compound O.O.O.O.[Co+2].CC([O-])=O.CC([O-])=O ZBYYWKJVSFHYJL-UHFFFAOYSA-L 0.000 description 1
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- WIVXEZIMDUGYRW-UHFFFAOYSA-L copper(i) sulfate Chemical compound [Cu+].[Cu+].[O-]S([O-])(=O)=O WIVXEZIMDUGYRW-UHFFFAOYSA-L 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- HRKQOINLCJTGBK-UHFFFAOYSA-N dihydroxidosulfur Chemical compound OSO HRKQOINLCJTGBK-UHFFFAOYSA-N 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 235000019524 disodium tartrate Nutrition 0.000 description 1
- AUZONCFQVSMFAP-UHFFFAOYSA-N disulfiram Chemical compound CCN(CC)C(=S)SSC(=S)N(CC)CC AUZONCFQVSMFAP-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011790 ferrous sulphate Substances 0.000 description 1
- 235000003891 ferrous sulphate Nutrition 0.000 description 1
- 150000004673 fluoride salts Chemical class 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229920000831 ionic polymer Polymers 0.000 description 1
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 description 1
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 1
- 229910000360 iron(III) sulfate Inorganic materials 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- CNFDGXZLMLFIJV-UHFFFAOYSA-L manganese(II) chloride tetrahydrate Chemical compound O.O.O.O.[Cl-].[Cl-].[Mn+2] CNFDGXZLMLFIJV-UHFFFAOYSA-L 0.000 description 1
- SQQMAOCOWKFBNP-UHFFFAOYSA-L manganese(II) sulfate Chemical compound [Mn+2].[O-]S([O-])(=O)=O SQQMAOCOWKFBNP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001512 metal fluoride Inorganic materials 0.000 description 1
- VGIVLIHKENZQHQ-UHFFFAOYSA-N n,n,n',n'-tetramethylmethanediamine Chemical compound CN(C)CN(C)C VGIVLIHKENZQHQ-UHFFFAOYSA-N 0.000 description 1
- CPQCSJYYDADLCZ-UHFFFAOYSA-N n-methylhydroxylamine Chemical compound CNO CPQCSJYYDADLCZ-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N n-propyl alcohol Natural products CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000008427 organic disulfides Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004224 potassium gluconate Substances 0.000 description 1
- 235000013926 potassium gluconate Nutrition 0.000 description 1
- 229960003189 potassium gluconate Drugs 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- ZNNZYHKDIALBAK-UHFFFAOYSA-M potassium thiocyanate Chemical compound [K+].[S-]C#N ZNNZYHKDIALBAK-UHFFFAOYSA-M 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- ZNZJJSYHZBXQSM-UHFFFAOYSA-N propane-2,2-diamine Chemical class CC(C)(N)N ZNZJJSYHZBXQSM-UHFFFAOYSA-N 0.000 description 1
- WHMDPDGBKYUEMW-UHFFFAOYSA-N pyridine-2-thiol Chemical compound SC1=CC=CC=N1 WHMDPDGBKYUEMW-UHFFFAOYSA-N 0.000 description 1
- HBCQSNAFLVXVAY-UHFFFAOYSA-N pyrimidine-2-thiol Chemical compound SC1=NC=CC=N1 HBCQSNAFLVXVAY-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 229960004249 sodium acetate Drugs 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 229960002167 sodium tartrate Drugs 0.000 description 1
- 235000011004 sodium tartrates Nutrition 0.000 description 1
- VGTPCRGMBIAPIM-UHFFFAOYSA-M sodium thiocyanate Chemical compound [Na+].[S-]C#N VGTPCRGMBIAPIM-UHFFFAOYSA-M 0.000 description 1
- WWGXHTXOZKVJDN-UHFFFAOYSA-M sodium;n,n-diethylcarbamodithioate;trihydrate Chemical compound O.O.O.[Na+].CCN(CC)C([S-])=S WWGXHTXOZKVJDN-UHFFFAOYSA-M 0.000 description 1
- RJCVAPZBRKHUSV-UHFFFAOYSA-M sodium;n,n-dimethylcarbamodithioate;hydrate Chemical compound O.[Na+].CN(C)C([S-])=S RJCVAPZBRKHUSV-UHFFFAOYSA-M 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- FRGKKTITADJNOE-UHFFFAOYSA-N sulfanyloxyethane Chemical compound CCOS FRGKKTITADJNOE-UHFFFAOYSA-N 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- VLLMWSRANPNYQX-UHFFFAOYSA-N thiadiazole Chemical compound C1=CSN=N1.C1=CSN=N1 VLLMWSRANPNYQX-UHFFFAOYSA-N 0.000 description 1
- 150000003548 thiazolidines Chemical class 0.000 description 1
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 1
- 229940103494 thiosalicylic acid Drugs 0.000 description 1
- ZEMGGZBWXRYJHK-UHFFFAOYSA-N thiouracil Chemical compound O=C1C=CNC(=S)N1 ZEMGGZBWXRYJHK-UHFFFAOYSA-N 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- DUNKXUFBGCUVQW-UHFFFAOYSA-J zirconium tetrachloride Chemical compound Cl[Zr](Cl)(Cl)Cl DUNKXUFBGCUVQW-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
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Abstract
本发明提供了一种非氰化物含水酸性浸镀溶液,该溶液的pH为从大约3.5至大约6.5,且该溶液包括锌离子、镍离子和/或钴离子,以及氟离子。在一个实施方案中,本发明的浸镀溶液还含有至少一种含一个或多个氮原子、一个或多个硫原子,或氮和硫原子两者的抑制剂。本发明还涉及用于在铝和铝合金基质上沉积锌合金保护涂层的方法,该方法包括将该铝或铝合金基质沉浸在本发明非氰化物酸性浸镀溶液中。可选地,该锌合金涂覆的铝或铝合金基质通过采用一种无电镀或电解的金属镀液镀覆。
Description
技术领域
本发明涉及含水酸性浸镀溶液以及将锌合金保护涂层(protectivecoating)沉积在铝或铝合金基质上的方法。本发明还涉及镀有金属的铝或铝合金基质。
背景技术
金属表面精整/电镀工业中增长最快的全球市场之一是对铝及其合金的加工和电镀。铝以其独特的物理和机械特性,使得它在诸如汽车、电子、电信和航空电子工业,以及大量的装饰应用工业中尤其引人注目。铝的最令人喜爱的性质包括其低的整体密度(2.7g/cc)、通过合金和热处理达到的高的机械强度,以及其相对较高的耐腐蚀性。铝的另外的性质包括:高的热和电传导率、其磁中性、高残余价值,以及其两性化学特性。许多应用的铝制品由各种包括:硅、镁、铜等的合金元素的铝合金制成。这些合金混合物为了达到提高诸如高强度或展延性的特性而产生。
为进行成功的电解的和无电镀的沉积,铝和其合金的电镀需要特定的表面准备。用于达到成功的电沉积的最普通的方法是在电镀恰好开始前给基质涂覆一种浸锌涂层(immersion zinc coating)(更为熟知地称为锌酸盐)。该工序长期以来被认为是最经济和最实用的铝预处理方法。预处理涂覆的锌酸盐层的主要好处在于其设备和化学的相对低成本、加工的更宽阔的操作窗口,以及易于涂覆一种受控的沉积物。
锌酸盐溶液中其它金属的存在会影响锌沉积的速率和功效。小量的合金成分(即,Fe、Ni、Cu)不但能提高锌酸盐沉积的粘附力,还能增加锌酸盐在各种铝合金中的可用性。例如,加入Fe离子能提高含镁合金的粘附力。锌酸盐中镍的存在会提高直接镀在锌酸盐上的镍的粘附力,且在锌酸盐和随后的铜镀中加入铜也能发现类似的作用。然而,通常锌酸盐的合金炼制显示出能提供更薄更致密的沉积,该沉积能有效地转化成更好的下游无电镀/电解镀层的粘附力。另一方面,随着合金锌酸盐中的金属离子的添加,其成分变得越来越复杂。这使得配位剂的选择对锌酸盐的总体性能变得更加复杂和关键。锌-铁-镍组合物比锌-铁组合物对配位剂的选择和组合物中金属离子的比例更加敏感。当在合金锌酸盐中加入铜离子时,这变得尤其关键。由于铜在电势序中处于贵金属的位置,它在浸锌酸盐沉积中的沉积速率比锌酸盐中的其它元素高得多。因此,控制铜的沉积速率就变得比较重要。通过为铜离子选择合适的配位剂和与其它金属离子的适当比例,控制铜的沉积速率是有可能的。能提供合金锌酸盐的良好稳定性和性能的铜离子的强配位剂很少,氰化物似乎是最好的选择。氰化物是含铜的锌酸盐组合物的配位剂的选择,且多年来,它对于该应用已经成为工业标准。使用氰化物的一个消极面是其剧毒特性,因而,和其它金属表面精整产品一样,寻找合金锌酸盐中的氰化物替代品已经成为多年来感兴趣的课题。
近年来,一些非氰化物合金锌酸盐组合物已经被开发出来,但是为了将该多离子体系维持在一种稳定形式中,这些组合物还是含有诸如EDTA、NTA、亚乙基二酰胺等的硬配位剂(hard complexing agents),这使得废锌酸盐溶液的废物处理以及其洗涤更加困难。锌酸盐处理也通常在多次处理模式下表现更好。在随后的镀覆步骤前,在锌酸盐中单次浸渍的铝的预处理产生的结果不如在锌酸盐中二次或三次浸渍工序的结果好。该多次锌酸盐工序需要更多的工艺步骤和时间,也意味着工序更加复杂、产能更低且更不经济。因此,正如其它金属表面精整产品一样,寻找用于在铝上面镀覆的常规碱性氰化物或非氰化物成合金锌酸盐已经成为近年来感兴趣的课题。
发明内容
本发明提供了一种非氰化物含水酸性浸镀溶液,该溶液包括锌离子、镍离子和/或钴离子、氟离子,和任选地,至少一种含有一个或多个氮原子、硫原子,或氮和硫原子两者的抑制剂。本发明还涉及在铝和铝基合金上沉积锌合金保护涂层的方法,该方法包括将铝或铝基合金沉浸在本发明的酸性浸镀溶液中,以沉积锌合金保护涂层,任选地,随后用无电镀或电解金属电镀液镀覆锌合金涂层的铝或铝合金基质。
具体实施方式
在一个实施方案中,本发明涉及不含氰根离子的含水酸性浸镀溶液,尤其是涉及可用于在铝或各种铝基合金基质上沉积锌合金保护涂层的非氰化物含水酸性浸镀溶液。因而,在一个实施方案中,本发明的非氰化物含水酸性浸镀溶液的pH从大约3.5至大约6.5且包含锌离子、镍离子和/或钴离子,以及氟离子,条件是该溶液不含氰根离子。在另一个实施方案中,本发明的含水酸性浸镀溶液可含有诸如铜离子、铁离子、锰离子,以及锆离子的其它金属离子,和/或一种或多种金属配位剂。在另一个实施方案中,该溶液还含有包含一个或多个氮原子、硫原子,或氮和硫原子两者的至少一种抑制剂。
本发明的含水酸性浸镀溶液可由在水中溶解所需金属的水溶性盐而制备。该浸镀溶液中的锌离子源的实例包括氟化锌、硝酸锌、氯化锌、硫酸锌、醋酸锌等。
镍离子可以通过溶解诸如醋酸镍、硝酸镍、硫酸镍等的镍盐而引入该酸性浸镀溶液中。钴离子可以作为醋酸钴、硝酸钴、硫酸钴等而引入。可用于引入的任选的铁离子的铁盐包括:氯化亚铁、氯化铁、硫酸亚铁、硫酸铁、硝酸亚铁、硝酸铁等。铜离子可通过在水中溶解诸如氯化亚铜、硝酸亚铜、硝酸铜、氯化铜、硫酸亚铜、硫酸铜等的盐而引入。其它金属离子可通过溶解诸如氯化锰(II)、硫酸锰(II)、氯化锆、氯化镁、硫酸镁等的盐而引入。
在一个实施方案中,该浸镀溶液含有镍离子,但不合钴离子。在另一个实施方案中,该浸镀溶液含有镍离子和钴离子。在还有一个实施方案中,该浸镀溶液含有钴,但不含镍离子。出于经济考虑,该溶液含有镍离子或含少量钴的镍混合物。在一个实施方案中,镍离子或钴离子的浓度,或钴离子和镍离子的混合物的浓度大于锌离子的浓度。
本发明的浸镀溶液还含有氟离子。只要和氟离子一起引入的离子对溶液的性能无害,氟离子源可以是任何可溶性氟化合物。既可使用金属氟化物也可使用铵氟化物。通常的氟原料包括氢氟酸、诸如氟化钠、氟化铵等的碱金属或铵氟化物,以及诸如氟化氢钠、氟化氢铵等的碱金属或铵氟化氢化物(alkali metal or ammonium hydrogen fluorides)。由于只要可能都希望是高度水溶性,所以优选诸如氟化氢钠或氟化氢铵的高溶解性的氟化物。
本发明的含水酸性浸镀溶液的pH在大约3.5至大约6.5的范围内。在另一个实施方案中,该溶液的pH可在大约4.0至大约6.0的范围内,在还有一个实施方案中,该溶液的pH在大约4.5至大约5.5的范围内。
在一个实施方案中,本发明的含水酸性浸镀溶液包括:
从大约1至大约150g/l的锌离子,
从大约5至大约250g/l的镍离子和/或钴离子,
以及
从大约0.005至大约0.05g/l的氟离子。
在另一个实施方案中,本发明的含水酸性浸镀溶液可包括:
从大约10至大约30g/l的锌离子,
从大约20至大约50g/l的镍离子和/或钴离子,
以及
从大约0.5至大约10g/l的氟离子。
在一个实施方案中,锌离子的浓度小于镍离子和/或钴离子的浓度。
本发明的含水酸性浸镀溶液也可包括含有一个或多个氮原子、一个或多个硫原子,或氮和硫原子两者的至少一种抑制剂。在一个实施方案中,该氮原子不以脂族胺或羟胺存在。在另一个实施方案中,本发明的浸镀溶液还含有一种或多种金属配位剂。对各种铝和铝合金,该溶液提供了改善的配位系统的稳定性和可接受的性能。由于本发明的浸镀溶液不含氰根离子,因而该溶液还提供了用于预处理各种诸如铝和铝基合金的金属基质的环境友好的应用的额外优点。在另一个实施方案中,本发明的含水酸性浸镀溶液不含诸如EDTA、NTA、亚乙基二酰胺等的硬配位剂。
在本发明的浸镀溶液中可使用的抑制剂可选自含氮和/或硫原子的各种成分。因而,在一个实施方案中,该抑制剂可以选自以下式为特征的一种或多种化合物:
R2N-C(S)Y I
其中每一个R独立地是氢或烷基、烯基或芳基基团,Y是XR1、NR2或N(H)NR2,其中X是O或S,而R1是氢或碱金属。该化合物的实例包括硫脲类(thioureas)、硫代氨基甲酸盐或酯类(thiocarbamates),以及氨基硫脲类(thiosemicarbazides)。
本发明可利用的硫脲化合物的特点可在于下式:
[R2N]2CS (II)
其中每一个R独立地是氢或烷基、环烷基、烯基或芳基基团。该烷基、环烷基、烯基或芳基基团可含有达十个或更多个碳原子以及诸如羟基、氨基和/或卤素基团的取代基。该烷基或烯基基团可以是直链或支链。本发明使用的硫脲类包括或者硫脲,或者其各种已知的衍生物、同系物或类似物。该硫脲类的实例包括:硫脲、1,3-二甲基-2-硫脲、1,3-二丁基-2-硫脲、1,3-二癸基-2-硫脲、1,3-二乙基-2-硫脲、1,1-二乙基-2-硫脲、1,3-二庚基-2-硫脲、1,1-二苯基-2-硫脲、1-乙基-1-(1-萘基)-2-硫脲、1-乙基-1-苯基-2-硫脲、1-乙基-3-苯基-2-硫脲、1-苯基-2-硫脲、1,3-二苯基-2-硫脲、1,1,3,3-四甲基-2-硫脲、1-烯丙基-2-硫脲、3-烯丙基-1,1-二乙基-2-硫脲以及1-甲基-3-羟乙基-2-硫脲、2,4-二硫代缩二脲(2,4-dithiobiuret)、2,4,6-三硫代缩二脲(trithiobiuret)、异硫脲的烷氧基醚等。
在本发明的酸性浸镀溶液中可用作抑制剂的硫代氨基甲酸盐或酯类包括由下式表示的硫代氨基甲酸盐或酯类:
R2NC(S)-XR1 III
其中每一个R独立地是氢,或烷基、烯基或芳基基团,X是O或S,而R1是氢或碱金属。该烷基和烯基基团可含有大约1至大约5个碳原子。在另一个实施方案中,该烷基基团可各含1或2个碳原子。在还有一个实施方案中,两个R基团都是含1或2个碳原子的烷基基团。该硫代氨基甲酸盐或酯类的实例包括:二甲基氨基二硫代羧酸(dimethyldithiocarbamic acid)、二乙基氨基二硫代羧酸、水合二甲基二硫代氨基甲酸钠(sodium dimethyldithiocarbamate hydrate)、三水合二乙基二硫代氨基甲酸钠(sodium diethyldithiocarbamate trihydrate)等。
在本发明的酸性浸镀溶液中可用作抑制剂的氨基硫脲类包括由下式表示的氨基硫脲类:
R2N-C(S)-N(H)NR2 IV
其中每一个R独立地是氢或烷基、烯基或芳基基团。在一个实施方案中,R基团是含1至5个碳原子的烷基基团,在另一个实施方案中,烷基基团可各含1或2个碳原子。该氨基硫脲类的实例包括4,4-二甲基-3-氨基硫脲和4,4-二乙基-3-氨基硫脲。
本发明的含水酸性浸镀溶液还可包括作为抑制剂的一种或多种诸如下式表示的含氮二硫化物:
[R2NCS2]2 V
其中每一个R独立地是氢或烷基、烯基或芳基基团。该烷基基团可含1至大约5个碳原子。在一个实施方案中,该烷基基团可各含一或两个碳原子。在另一个实施方案中,两个R基团都是含一或两个碳原子的烷基基团。该有机二硫化物的实例包括:双(二甲基硫代氨基甲酰基)二硫化物(bis(dimethylthiocarbamyl)disulfide)(福美双(thiram))、双(二乙基硫代氨基甲酰基)二硫化物等。
可用于本发明的抑制剂也可是取代或非取代的含氮杂环化合物。取代基的实例包括烷基、芳基、硝基、巯基等。该含氮杂环化合物可含一个或多个氮原子,该含氮杂环化合物的实例包括吡咯、咪唑、苯并咪唑、吡唑、吡啶、联吡啶、哌嗪、吡嗪、哌啶、三唑、苯并三唑、四唑、嘧啶等。该含氮杂环化合物还可含有诸如氧或硫的其它原子。含氮和氧的杂环化合物的一个实例为吗啉,含氮和硫的含氮杂环化合物的实例包括噻唑、噻唑啉和四氢噻唑(thiazolidines)。
在一个实施方案中,该抑制剂包括被一个巯基取代的一种或多种上述含氮杂环化合物。可用作本发明的浸镀溶液的抑制剂的巯基取代的含氮杂环化合物的具体实例包括:2-巯基-1-甲基咪唑;2-巯基苯并咪唑;2-巯基咪唑;2-巯基-5-甲基苯并咪唑;2-巯基吡啶;4-巯基吡啶;2-巯基嘧啶(2-硫脲嘧啶);2-巯基-5-甲基-1,4-噻二唑(thiadiazole);3-巯基-4-甲基-4H-1,2,4-三唑;2-巯基噻唑啉,2-巯基苯并噻唑,4-羟基-2-巯基嘧啶;2-巯基苯并唑;5-巯基-1-甲基四唑;以及2-巯基-5-硝基苯并咪唑。
可用作本发明的浸镀溶液中的抑制剂还可包括诸如硫氰酸钠和硫氰酸钾的碱金属硫氰酸盐。作为本发明的浸镀溶液中的抑制剂还可包括硫醇(thio alcohol)和硫代酸(thio acid)。这些抑制剂的实例包括:3-巯基乙醇;6-巯基-1-己醇;3-巯基-1,2-丙二醇;1-巯基-2-丙醇;3-巯基-1-丙醇;巯基乙酸;4-巯基苯甲酸;2-巯基丙酸;以及3-巯基丙酸。
在一个实施方案中,本发明的浸镀溶液可含有上述抑制剂的一种或多种。在另一个实施方案中,该浸镀溶液含有上述抑制剂的两种或更多种。当抑制剂被包含在浸镀溶液中时,抑制剂的量可从大约0.0005至大约5g/l或更多之间变化,在另一实施方案中,其量可从大约0.005至大约0.05g/l之间变化。
本发明的浸镀溶液还可含有一种或多种金属配位剂。该配位剂可用于稳定镀液中的金属离子。本发明镀液中包括的配位剂的量可在大约5至大约250克每升或更多的范围内。在一个实施方案中,配位剂的浓度为大约20至大约100g/l。可用的配位剂可选自大量不同的物质,包括那些含有诸如乙酸根、柠檬酸根、乙醇酸根、乳酸根、马来酸根、焦磷酸根、酒石酸根、葡萄糖酸根、葡庚糖酸根等阴离子的物质。两种或更多种配位剂的混合物可用于本发明的浸镀溶液。该配位剂的具体实例包括:酒石酸钠、醋酸钠、酒石酸二钠、葡萄糖酸钠、葡萄糖酸钾、酒石酸氢钾、酒石酸钾钠(罗氏盐)等。
在一些实施方案中,本发明的浸镀溶液中可包括的金属配位剂可包括脂族胺、脂族羟胺或其混合物。在另一实施方案中,该配位剂包括上述的一种或多种脂族胺和/或脂族羟胺以及一种或多种其它配位剂的混合物。本发明的浸镀溶液中包含的胺的量可在大约1至大约50g/l的范围内。可用的胺的实例包括:乙二胺、二氨基丙烷、二氨基丁烷、N,N,N,N-四甲基二氨基甲烷、二亚乙基三胺、3,3-氨基二丙胺(3,3-aminobispropylamine)、三亚乙基四胺、单乙醇胺、二乙醇胺、三乙醇胺、N-甲基羟胺、3-氨基正丙醇、N-甲基乙醇胺等。在另一个实施方案中,本发明的浸镀溶液不含脂族胺和脂族羟胺。
本发明的含水酸性浸镀溶液可通过在水中溶解上述各种成分制备。该成分可以以任何顺序与水混合。镀液中可包含诸如乙酸、乳酸等的有机酸以调节溶液的pH。
下述实施例举例说明了本发明的含水酸性浸镀溶液。除非在随后的实施例或书面说明书和/或权利要求中的其它地方另外指出,所有的份和百分数都以重量计,温度为摄氏温度而压力为或接近大气压。
表I
实施例A-H
溶液实例* | A | B | C | D | E | F | G | H |
二水醋酸锌 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
四水醋酸镍 | 30 | 70 | 70 | 70 | 70 | 70 | 70 | 70 |
四水醋酸钴 | - | - | - | - | - | - | - | |
氟化氢铵 | 1 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
2-巯基苯并噻唑 | 0.01 | - | - | |||||
2,2′-联吡啶 | 0.01 | - | - | |||||
1,3-二乙基-2-硫脲 | 0.01 | - | ||||||
2-苯并咪唑 | 0.01 | |||||||
2-巯基-1-甲基咪唑 | 0.01 | |||||||
1,10-邻二氮杂菲 | 0.01 | |||||||
pH | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 |
*所有份的单位是g/l,余量为水
表II
实施例I-M
溶液实例* | I | J | K | L | M |
二水醋酸锌 | 38 | 38 | 45 | 40 | 35 |
四水醋酸镍 | 75 | 75 | 100 | 75 | - |
四水醋酸钴 | 75 | ||||
氟化氢铵 | 4 | 4 | 5 | 4 | 3 |
2-巯基苯并噻唑 | 0.005 | 0.005 | 0.005 | 0.005 | |
2,2′-联吡啶 | |||||
1,3-二乙基-2-硫脲 | 0.005 | 0.005 | |||
2-苯并咪唑 | |||||
2-巯基-1-甲基咪唑 | 0.005 | 0.005 | |||
1,10-邻二氮杂菲 | |||||
pH | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 |
*所有份的单位是g/l,余量为水
上文描述的本发明的非氰化物酸性浸镀溶液可用于沉积作为铝和各种铝合金的预处理的锌合金保护涂层。在一个实施方案中,当镀液含有上述的一种或多种抑制剂时,可获得更好的结果。上述抑制剂以及抑制剂和配位剂的组合物在浸镀溶液中的使用被认为是,至少部分是,本发明的浸镀溶液性能改善的原因。抑制剂影响锌合金沉积速率,并在铝和铝合金上提供了一层既薄又均匀的涂层。此处描述的浸镀溶液可获得重量为大约2-6mg/ft2的合金保护涂层。
除了铝之外,本发明的浸镀溶液可用于在包括浇铸和锻造合金两者的各种铝合金上沉积锌保护涂层。浇铸合金的例子包括356、380和383合金。锻造合金的例子包括1100、2024、3003、3105、5052、5056、6061、6063,以及7075型铝合金。
在一个实施方案中,利用本发明的酸性浸镀溶液的锌合金保护涂层的沉积包括用无电镀或电解金属镀液的可选地金属镀覆铝或铝合金基质的预处理步骤。应该理解,在每一工艺步骤后,通常采用水洗步骤。
可选的预处理工序的第一步是用例如,适当的碱性、酸性或溶剂的非浸蚀清洁剂清洗铝表面上的任何油脂、污垢或油。适当的清洁剂包括非硅酸盐弱碱性清洁剂和硅酸盐弱碱性清洁剂,两者都在温度大约为49℃至66℃的范围内,使用大约1至大约5分钟。清洗后,通常用水漂洗铝。
然后用常规的酸性或碱性蚀刻剂对清洗的铝基质进行蚀刻。通常使用酸性蚀刻剂。在一个实施方案中,该蚀刻溶液可含有50%的硝酸。在下文的实施例中采用的工序中,用于去除铝表面的过量氧化物的蚀刻溶液为来自美国阿托科技(Atotech USA)的Alklean AC-2(5%体积),且该蚀刻溶液包括磷酸/硫酸/氟化物。铝或铝合金与Alklean AC-2在大约20-25℃下接触大约一至两分钟。然后用水漂洗蚀刻样品。
然后蚀刻的铝表面被剥黑膜(desmut)。剥黑膜是一道从铝表面去除过量的尘垢的工序。剥黑膜可以用硝酸溶液(例如50%体积的溶液)或硝酸和硫酸的混合物进行。在一个实施方案中,用于铝合金的一种典型剥黑膜溶液可含有25%重量的硫酸、50%重量的硝酸和25%重量的氟化铵。剥黑膜也可用含有含氟化氢铵的酸性、氟化物盐产品的硝酸和硫酸的混合物完成。在随后的实施例中,蚀刻铝合金的剥黑膜是通过使用美国阿托科技的DeSmutter NF(100g/l)在温度为大约20-25℃下进行大约一分钟并用水漂洗进行,DeSmutter NF含有酸性盐和基于过(二)硫酸盐的氧化剂的混合物。
通过将蚀刻和剥黑膜的铝基质在本发明的非氰化物酸性浸镀溶液中沉浸诸如大约100至大约150秒的一小段时间以完全覆盖铝基质,而在该铝基质上涂覆一层锌合金保护涂层。浸镀溶液的温度通常维持在大约20℃至25℃之间。过量的浸镀溶液通常通过在去离子水中漂洗而从铝基质表面去除。在下述的实施例中,铝在20℃-25℃下在所述的浸镀溶液中沉浸大约120-150秒。
上述酸性浸镀溶液处理以后,该锌合金涂覆的铝基质可以采用本领域熟知的无电镀或电解镀覆方法用任何适用的金属镀覆。适用的金属包括镍、铜、青铜、黄铜、银、金,以及铂。在一个实施方案中,在无电镀镍中或通过诸如氨基磺酸镍(sulfamate nickel)打底(strike)或焦磷酸铜打底溶液的电解电镀方法,镀覆该锌合金涂覆的铝基质。
下述的实施例1-14说明了在金属镀覆前依据本发明在各种铝合金上锌合金保护涂层的沉积。镀覆试验使用了1英寸×4英寸,厚0.09-0.25英寸的铝合金试验金属片。在本发明的非氰化物酸性浸镀溶液中沉浸之前,所有的试验金属片都用如上所述的方法清洗、蚀刻和剥黑膜。在粘附力试验之前,被镀覆的金属层厚达大约1mil(千分之一英寸)或稍微更厚。在实施例1-13中,在大约95℃下,利用Nichem-2500(美国阿托科技)无电镀镍浴90分钟在锌合金涂覆的样品上镀镍。在实施例14中,通过在大约25ASF电流密度下在焦磷酸铜电镀溶液中45分钟在锌合金涂覆的样品上电解镀覆。实施例15的锌合金涂覆的样品在氨基磺酸镍电解打底镀浴(strike bath)中镀覆,随后进行光泽酸性铜(bright acidcopper)、光泽镍和装饰性铬电镀步骤。然后实施例1-15的金属镀覆样品用水漂洗、干燥,并测试镍或其它铝基质上的镀覆金属的粘附力。镀覆金属的粘附力由一种或多种下述试验确定。一个粘附力试验涉及用90°弯曲(bend)。在该试验中,在90°弯曲该镀覆样品后,检验弯曲区域的内部和外部表面从基础铝基质上的镀覆金属的剥离(lift-off)。镀覆金属的粘附力的评定为:好(Good)(0%的剥离),中(Fair)(在弯曲区域的任一侧小于10%的剥离)和差(Poor)(大于20%的剥离)。对于铸造合金,为检验镀覆金属的粘附力,使用了“回动锯(Reverse Saw)”“研磨(Grinding)”以及“划痕/划交叉影线(Scribe/Cross-Hatch)”法,并用上述标准评定粘附力。一些镀覆样品还用如下方法进行测试:在150℃烘烤两小时,在冷水(20℃)中骤冷,然后用“无气泡(blisters)/及格”以及“有气泡/不及格”的标准分析镀覆表面的气泡。
实施例1-10
将实施例A-K和M的浸镀溶液用于在锻造铝合金2024和6061上沉积锌合金涂层。然后该锌合金涂覆的铝合金在大约95℃下,在Nichem-2500(美国阿托科技)无电镀镍浴中处理90分钟镀覆。该镀覆的样品用水漂洗,干燥,并用上述的90°弯曲试验测试粘附力。其结果总结在下述的表III中。
表III
90°弯曲粘附力测试结果
实施例 | 浸镀溶液实例 | 2024合金 | 6061合金 |
123456789101112 | ABCDEFGHIJKM | 好/中好好好好好好好好好好好 | 中中好中好好好中中好好好 |
实施例13
包括铸造合金356和380,以及包括1100、2024、3003、5052、6061和7075的浇铸合金的铝合金用实施例L的浸镀溶液涂覆锌合金,随后采用无电解镍镀。镍镀部分在90°弯曲测试和研磨及冷水骤冷法中测试粘附力。所有的样品都被评为好。
实施例14
铝合金2024和6061通过上述步骤用实施例L的浸镀溶液涂覆。然后该锌合金涂覆的样品通过在约25ASF电流密度下在焦磷酸铜浴中处理45分钟进行电解电镀。对镀铜样品测试镀覆的铜到铝合金上的粘附力,在90°弯曲测试中没有观察到粘附力不及格的样品。
实施例15
除了锌合金涂覆部分在氨基磺酸镍电解打底镀浴中镀覆,随后进行光泽酸性铜、光泽镍和装饰性铬电镀步骤外,重复实施例14的步骤。用上述的90°弯曲测试以及烘烤测试试验这些电镀样品的粘附力。没有在任何镀覆样品上观察到粘附力不及格或气泡。
实施例16
除了用实施例M的浸镀溶液沉积锌合金涂层外,重复实施例15的步骤。没有在任何镀覆样品中观察到粘附力不及格或气泡。
尽管本发明通过涉及不同的实施方案得到了解释,但是应该理解,本领域技术人员在阅读本说明书后,其另外的变型是显而易见的。因此,应该理解,在此公开的本发明意在涵盖落在所附权利要求中的此类变型。
Claims (49)
1.一种含水酸性浸镀溶液,该溶液的pH为大约3.5至大约6.5,该溶液包括锌离子、镍离子和/或钴离子,以及氟离子,条件是所述溶液不含氰根离子。
2.如权利要求1所述的浸镀溶液,该溶液还含有含一个或多个氮原子、一个或多个硫原子,或氮和硫原子两者的至少一种抑制剂。
3.如权利要求1所述的浸镀溶液,该溶液还含有一种或多种金属配位剂。
4.如权利要求1所述的浸镀溶液,该溶液还含有选自铜离子、铁离子、锰离子、镁离子和锆离子的一种或多种其它金属离子。
5.如权利要求2所述的浸镀溶液,其特征在于,该抑制剂选自含氮二硫化物;碱金属硫氰酸盐;硫代氨基甲酸盐或酯类;含氮杂环化合物;巯基取代的含氮杂环化合物、硫代酸、硫醇、以下式为特征的化合物:
R2N-C(S)Y I
其中每一个R独立地是氢或烷基、烯基、或芳基基团,而Y是XR1、NR2或N(H)NR2;其中X是O或S,而R1是氢或碱金属;及其混合物。
6.如权利要求2所述的浸镀溶液,其特征在于,该抑制剂是一种由下式表示的硫脲化合物:
[R2N]2CS II
其中每一个R独立地是氢或烷基、烯基或芳基基团。
7.如权利要求2所述的浸镀溶液,其特征在于,该抑制剂为至少一种含氮杂环化合物或巯基取代的含氮杂环化合物,或其混合物。
8.如权利要求7所述的浸镀溶液,其特征在于,该杂环化合物选自吡咯、咪唑、苯并咪唑、吡唑、三唑、吡啶、哌嗪、吡嗪、哌啶、嘧啶、噻唑、噻唑啉、四氢噻唑、若丹明以及吗啉。
9.如权利要求2所述的浸镀溶液,其特征在于,该抑制剂是一种巯基取代的含氮杂环化合物。
10.如权利要求1所述的浸镀溶液,含有:
从大约1至大约150g/l的锌离子,以及
从大约5至大约250g/l的镍离子和/或钴离子。
11.如权利要求10所述的浸镀溶液,其特征在于,该溶液还含有大约0.0005至大约5g/l的含有一个或多个氮原子、一个或多个硫原子,或氮和硫原子两者的一种抑制剂。
12.如权利要求1所述的浸镀溶液,该溶液不含脂族胺和脂族羟胺。
13.一种含水酸性浸镀溶液,该溶液的pH为大约3.5至大约6.5,该溶液包括:
从大约1至大约150g/l的锌离子,
从大约5至大约250g/l的镍离子和/或钴离子,以及
从大约0.005至大约100g/l的氟离子,
条件是该溶液不含氰根离子。
14.如权利要求13所述的浸镀溶液,该溶液还含有:
从大约0.005至大约100g/l的含有一个或多个氮原子、一个或多个硫原子,或氮和硫原子两者的一种抑制剂。
15.如权利要求13所述的浸镀溶液,该溶液还含有至少一种金属配位剂。
16.如权利要求15所述的浸镀溶液,其特征在于,该金属配位剂选自:乙酸盐、柠檬酸盐、乙醇酸盐、乳酸盐、马来酸盐、焦磷酸盐、酒石酸盐、葡萄糖酸盐,或葡庚糖酸盐,及其混合物。
17.如权利要求14所述的浸镀溶液,其特征在于,该抑制剂选自含氮二硫化物、碱金属硫氰酸盐、碱金属硫代氨基甲酸盐或酯类、含氮杂环化合物、巯基取代的含氮杂环化合物、硫代酸、硫醇、以下式为特征的化合物:
R2N-C(S)Y I
其中每一个R独立地是氢或烷基、烯基或芳基基团,而Y是XR1、NR2或N(H)NR2,其中X是O或S而R1是氢或碱金属,及其混合物。
18.如权利要求14所述的浸镀溶液,其特征在于,该抑制剂是一种由下式表示的硫脲化合物:
[R2N]2CS II
其中每一个R独立地是氢或烷基、烯基或芳基基团。
19.如权利要求14所述的浸镀溶液,其特征在于,该抑制剂为至少一种含氮杂环化合物或巯基取代的含氮杂环化合物,或其混合物。
20.如权利要求19所述的浸镀溶液,其特征在于,该杂环化合物选自吡咯、咪唑、吡唑、三唑、四唑、噻唑、噻唑啉、四氢噻唑、吡啶、哌嗪、吡嗪、哌啶、嘧啶以及吗啉。
21.如权利要求14所述的浸镀溶液,其特征在于,该抑制剂是一种巯基取代的含氮杂环化合物。
22.如权利要求13所述的浸镀溶液,该溶液的pH为大约4至大约6。
23.如权利要求13所述的浸镀溶液,该溶液还含有选自铜离子、铁离子、锰离子、镁离子和锆离子的一种或多种金属离子。
24.如权利要求13所述的浸镀溶液,该溶液不含脂族胺和脂族羟胺。
25.一种非氰化物的含水酸性浸镀溶液,该溶液的pH为大约4至大约6,且该溶液包括:
从大约10至大约30g/l的锌离子,
从大约20至大约50g/l的镍离子和/或钴离子,
从大约0.5至大约10g/l的氟离子,以及
从大约0.005至大约0.05g/l的含有一个或多个氮原子、一个或多个硫原子,或氮和硫原子两者的一种抑制剂。
26.如权利要求25所述的浸镀溶液,该溶液还含有:
从大约1至大约250g/l的至少一种金属配位剂。
27.如权利要求25所述的浸镀溶液,其特征在于,该抑制剂是一种巯基取代的含氮杂环化合物。
28.一种在铝或铝基合金基质上沉积锌合金保护涂层的方法,包括:
(A)将铝或铝基合金基质在如权利要求1所述的含水酸性浸镀溶液中沉浸一段足以沉积所需涂层的时间,以及
(B)从浸镀溶液中移去该涂覆的基质。
29.如权利要求28所述的方法,其特征在于,在沉浸到该浸镀溶液中之前,该铝或铝基合金的表面被清洗、蚀刻和剥黑膜。
30.如权利要求29所述的方法,其特征在于,该清洗用一种碱性、酸性或溶剂的清洁剂进行,且该蚀刻用一种碱性或酸性蚀刻溶液进行。
31.如权利要求29所述的方法,其特征在于,在每一次清洗、蚀刻、剥黑膜,以及浸镀步骤之后,用水漂洗该铝或铝基合金。
32.一种在铝或铝基合金基质上沉积锌合金保护涂层的方法,包括:
(A)将该基质在如权利要求13所述的含水酸性浸镀溶液中沉浸一段足以沉积所需涂层的时间,以及
(B)从浸镀溶液中移去该涂覆的基质。
33.如权利要求32所述的方法,其特征在于,在沉浸到该浸镀溶液中之前,该基质的表面被清洗、蚀刻和剥黑膜。
34.如权利要求33所述的方法,其特征在于,该清洗用一种碱性、酸性或溶剂的清洁剂进行,且该蚀刻用一种碱性或酸性蚀刻溶液进行。
35.如权利要求34所述的方法,其特征在于,在每一次清洗、蚀刻、剥黑膜,以及浸镀步骤之后,用水漂洗该基质。
36.一种在铝或铝基合金基质上沉积锌合金保护涂层的方法,包括:
(A)将该基质在如权利要求25所述的含水酸性浸镀溶液中沉浸一段足以沉积所需涂层的时间,以及
(B)从浸镀溶液中移去该涂覆的基质。
37.如权利要求36所述的方法,其特征在于,在沉浸到该浸镀溶液中之前,该基质的表面被清洗、蚀刻和剥黑膜。
38.如权利要求37所述的方法,其特征在于,该清洗用一种碱性、酸性或溶剂的清洁剂进行,且该蚀刻用一种碱性或酸性蚀刻溶液进行。
39.如权利要求37所述的方法,其特征在于,在每一次清洗、蚀刻、剥黑膜,以及浸镀步骤之后,用水漂洗该基质。
40.一种在铝或铝基合金基质上沉积金属涂层的方法,包括:
(A)通过将该基质沉浸在如权利要求1所述的含水酸性浸镀溶液中的方法,在基质上涂覆沉浸锌合金保护涂层,以及
(B)用无电镀或电解金属镀液镀覆该锌合金涂覆的基质。
41.如权利要求40所述的方法,其特征在于,在沉浸到该浸镀溶液中之前,该基质的表面被清洗、酸性蚀刻和剥黑膜。
42.如权利要求41所述的方法,其特征在于,该清洗用一种碱性、酸性或溶剂的清洁剂进行,且该蚀刻用一种碱性或酸性蚀刻溶液进行。
43.一种在铝或铝基合金基质上沉积金属涂层的方法,包括:
(A)通过将该基质沉浸在如权利要求13所述的含水酸性浸镀溶液中的方法,在基质上涂覆沉浸锌合金保护涂层,以及
(B)用无电镀或电解金属镀液镀覆该锌合金涂覆的基质。
44.如权利要求43所述的方法,其特征在于,在沉浸到该浸镀溶液中之前,该基质的表面进行碱性、酸性或溶剂清洗、酸性蚀刻和剥黑膜。
45.如权利要求44所述的方法,其特征在于,该清洗用一种碱性清洁剂进行,且该蚀刻用一种碱性或酸性蚀刻溶液进行。
46.一种依据权利要求40所述的方法获得的金属涂覆的铝或铝基合金。
47.一种依据权利要求43所述的方法获得的金属涂覆的铝或铝基合金。
48.一种依据权利要求44所述的方法获得的金属涂覆的铝或铝基合金。
49.一种依据权利要求45所述的方法获得的金属涂覆的铝或铝基合金。
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US10/606,460 | 2003-06-26 | ||
US10/606,460 US7407689B2 (en) | 2003-06-26 | 2003-06-26 | Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys |
PCT/US2004/011417 WO2005010233A2 (en) | 2003-06-26 | 2004-04-14 | Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys |
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CN1839220A true CN1839220A (zh) | 2006-09-27 |
CN1839220B CN1839220B (zh) | 2012-12-05 |
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US (1) | US7407689B2 (zh) |
EP (1) | EP1649083B1 (zh) |
JP (1) | JP4714684B2 (zh) |
KR (1) | KR101078136B1 (zh) |
CN (1) | CN1839220B (zh) |
BR (1) | BRPI0411937A (zh) |
CA (1) | CA2530286A1 (zh) |
TW (1) | TWI306908B (zh) |
WO (1) | WO2005010233A2 (zh) |
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- 2004-04-14 JP JP2006517087A patent/JP4714684B2/ja not_active Expired - Fee Related
- 2004-04-14 WO PCT/US2004/011417 patent/WO2005010233A2/en active Application Filing
- 2004-04-14 EP EP04801791.7A patent/EP1649083B1/en not_active Expired - Lifetime
- 2004-04-14 CA CA002530286A patent/CA2530286A1/en not_active Abandoned
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CN102650059A (zh) * | 2009-06-26 | 2012-08-29 | 中国石油化工股份有限公司 | 一种丁基橡胶氯甲烷甘醇脱水再生系统的复合缓蚀剂 |
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CN102650058B (zh) * | 2009-06-26 | 2015-04-15 | 中国石油化工股份有限公司 | 一种丁基橡胶氯甲烷甘醇脱水再生系统的复合缓蚀剂 |
CN102650057B (zh) * | 2009-06-26 | 2015-04-15 | 中国石油化工股份有限公司 | 一种丁基橡胶氯甲烷甘醇脱水再生系统的复合缓蚀剂 |
CN102888138A (zh) * | 2012-09-21 | 2013-01-23 | 史昊东 | 汽车零件表面低温防腐保护剂 |
CN110129779A (zh) * | 2019-06-12 | 2019-08-16 | 合肥工业大学 | 一种铝合金表面化学浸镀铁的方法 |
CN114807918A (zh) * | 2021-11-08 | 2022-07-29 | 上村工业株式会社 | 金属置换处理液、铝或铝合金的表面处理方法 |
Also Published As
Publication number | Publication date |
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WO2005010233A3 (en) | 2005-02-24 |
CN1839220B (zh) | 2012-12-05 |
WO2005010233A2 (en) | 2005-02-03 |
EP1649083A2 (en) | 2006-04-26 |
KR101078136B1 (ko) | 2011-10-28 |
TW200500502A (en) | 2005-01-01 |
BRPI0411937A (pt) | 2006-08-15 |
JP2007521390A (ja) | 2007-08-02 |
US7407689B2 (en) | 2008-08-05 |
JP4714684B2 (ja) | 2011-06-29 |
CA2530286A1 (en) | 2005-02-03 |
TWI306908B (en) | 2009-03-01 |
KR20060031644A (ko) | 2006-04-12 |
EP1649083B1 (en) | 2013-10-23 |
US20050008788A1 (en) | 2005-01-13 |
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