CN114807918A - 金属置换处理液、铝或铝合金的表面处理方法 - Google Patents
金属置换处理液、铝或铝合金的表面处理方法 Download PDFInfo
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- CN114807918A CN114807918A CN202210500745.9A CN202210500745A CN114807918A CN 114807918 A CN114807918 A CN 114807918A CN 202210500745 A CN202210500745 A CN 202210500745A CN 114807918 A CN114807918 A CN 114807918A
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- aluminum
- metal
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- film
- treatment
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- 239000002184 metal Substances 0.000 title claims abstract description 138
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
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Abstract
本发明的目的在于提供一种可赋予与镀敷膜(金属膜)的良好附着性的金属置换处理液、使用该金属置换处理液的铝或铝合金的表面处理方法。一种含有锌化合物、镍化合物、锗化合物、氟化合物的金属置换处理液。
Description
技术领域
本发明涉及金属置换处理液、铝或铝合金的表面处理方法。
背景技术
铝在大气中、水中容易形成氧化膜。已知由于该氧化膜，在铝或铝合金上实施镀敷处理时，镀敷膜的附着性低。因此，镀敷处理之前，为了去除铝或铝合金表面的氧化覆膜，确保与铝上形成的镀敷膜的附着性的目的，进行锌置换处理(锌酸盐处理)工序(例如专利文献1～3、非专利文献1～3)。
【现有技术文献】
【专利文献】
【专利文献1】日本专利特开2000-256864号公报
【专利文献2】日本专利特开2020-196914号公报
【专利文献3】日本专利特开2009-127101号公报
【非专利文献】
【非专利文献1】表面技术Vol.64(2013)，No.12，p.645-649
【非专利文献2】表面技术Vol.66(2015)，No.12，p.658-665
【非专利文献3】表面技术Vol.47(1996)，No.9，p.802-807
发明内容
【发明所要解决的课题】
本发明人专心研究的结果，已弄清楚：现有的技术中，关于与镀敷膜的附着性，还有改善余地。
本发明的目的在于，解决本发明人新发现的所述课题，提供能够赋予与镀敷膜(金属膜)的良好附着性的金属置换处理液、使用该金属置换处理液的铝或铝合金的表面处理方法。
【用以解决课题的手段】
本发明人专心研究的结果，发现通过使用特定组成的金属置换处理液，能够赋予与镀敷膜(金属膜)的良好附着性，完成了本发明。即，本发明涉及含有锌化合物、镍化合物、锗化合物、氟化合物的金属置换处理液。
所述金属置换处理液优选含有以锌浓度计为0.2～5.0g/L的锌化合物。
所述金属置换处理液优选含有以镍浓度计为0.2～10g/L的镍化合物。
所述金属置换处理液优选含有以锗浓度计为0.2～5.0g/L的锗化合物。
所述金属置换处理液优选含有以氟浓度计为5.0～50g/L的氟化合物。
所述金属置换处理液优选锌浓度、锗浓度的比率为1∶5～5∶1。
所述金属置换处理液优选pH为4.0～6.5。
所述金属置换处理液优选用于铝或铝合金。
此外，本发明涉及铝或铝合金的表面处理方法，该方法中，进行以下的金属置换处理，在被处理物的表面上形成含有金属的置换金属膜。所述金属置换处理为，使表面上具有铝或铝合金的被处理物与所述金属置换处理液接触，去除所述铝或铝合金上的氧化膜，使所述铝被所述金属置换处理液所含的金属置换。
形成所述置换金属膜后，优选在该置换金属膜表面形成镀敷膜。
【发明的效果】
根据本发明，由于是含有锌化合物、镍化合物、锗化合物、氟化合物的金属置换处理液，因此能够赋予与镀敷膜(金属膜)的良好附着性。
附图说明
【图1】是显示弯折切割试验的概要的模式图。
【图2】(a)是表示未见A1尖刺的情况的一例的照片。(b)是表示可见A1尖刺的情况的一例的照片。
具体实施方式
本发明的金属置换处理液含有锌化合物、镍化合物、锗化合物、氟化合物。由此，可赋予与镀敷膜(金属膜)的良好附着性。
通过所述金属置换处理液得到前述效果的理由推测为如下。
使表面具有铝或铝合金的被处理物与所述金属置换处理液接触，去除所述铝或铝合金上的氧化膜，使所述铝被所述金属置换处理液所含的金属置换，通过进行该金属置换处理，镍(Ni)、锗(Ge)与锌(Zn)一同共析，可在铝或铝合金表面形成含有Zn、Ni、Ge的置换金属膜。
在表面具有这样的有Zn、Ni、Ge的置换金属膜的铝或铝合金上进行镀敷处理，形成镀敷膜(金属膜，例如镍膜)时，在铝或铝合金与镀敷膜(金属膜，例如镍膜)之间，置换金属膜中存在的Zn、Ni、Ge协同地发挥作用，可对铝或铝合金赋予与镀敷膜(金属膜)的良好附着性。
Zn、Ni、Ge协同地发挥作用从以下情况很清楚：在Zn、Ni、Ge单独的情况时，Zn、Ni组合(无Ge)的情况时，Zn、Ge组合(无Ni)的情况时，Ni、Ge组合(无Zn)的情况时，不能赋予与镀敷膜(金属膜)的良好附着性。
<金属置换处理液>
本发明的金属置换处理液含有锌化合物、镍化合物、锗化合物、氟化合物。
《锌化合物》
锌化合物若是水溶性的锌化合物，则没有特别限定。作为其具体例子，例如可例示硫酸锌、硝酸锌、氯化锌、醋酸锌、氧化锌、葡萄糖酸锌等。这些可以单独使用，也可以将2种以上并用。其中，优选硫酸锌。
金属置换处理液优选含有以锌(金属锌(Zn))浓度计为0.1～7.0g/L的锌化合物，更优选含有0.2～5.0g/L，进一步优选含有0.2～4.0g/L。小于0.1g/L时，有Zn析出量少、不能确保充分的附着性的倾向。超过7.0g/L时，有Zn析出量过剩、不能确保充分的附着性的倾向。
《镍化合物》
镍化合物若是水溶性的镍化合物，则没有特别限定。作为其具体例子，例如可例示硫酸镍、硝酸镍、氯化镍、醋酸镍、葡萄糖酸镍等。这些可以单独使用，也可以将2种以上并用。其中优选硫酸镍。
金属置换处理液优选含有以镍(金属镍(Ni))浓度计为0.1～12g/L的镍化合物，更优选含有0.2～10g/L。小于0.1g/L时，有与Zn的共析量降低、不能确保充分的附着性的倾向。超过12g/L时，有与Zn的共析量过剩、不能确保充分的附着性的倾向。
《锗化合物》
锗化合物若是水溶性的锗化合物，则没有特别限定。作为其具体例子，例如可例示二氧化锗、硫酸锗、硫化锗、氟化锗、氯化锗、碘化锗等。这些可以单独使用，也可以将2种以上并用。其中优选二氧化锗。
此外，本说明书中，当氟化锗等既能当锗化合物也能当氟化合物时，视为锗化合物。关于锌化合物、镍化合物也是同样的情况，同样视为锌化合物、镍化合物。
金属置换处理液优选含有以锗(金属锗(Ge))浓度计为0.1～7.0g/L的锗化合物，更优选含有0.2～5.0g/L。若小于0.1g/L时，有与Zn的共析量降低、不能确保充分的附着性的倾向。超过7.0g/L时，有与Zn的共析量过剩、不能确保充分的附着性的倾向。
锌浓度、锗浓度的比率(锌浓度：锗浓度)优选为1∶5～5∶1。
《氟化合物》
氟化合物溶解铝或铝合金表面的氧化覆膜中的铝，使锌等金属的置换顺利地进行。
作为氟化合物的具体例子，例如可例示氟硼酸、氟化钠、氟化钾、氟化氢铵、氟化铵、氟化氢、氟化锂等。这些可以单独使用，也可以将2种以上并用。其中，优选氟硼酸、氟化钠、氟化钾、氟化氢铵、氟化铵、氟化氢，更优选氟硼酸、氟化钠、氟化钾、氟化氢铵、氟化铵。
金属置换处理液优选含有以氟(F)浓度为1.0～100g/L的氟化合物，更优选含有5.0～50g/L。小于1.0g/L时，有使铝溶解的作用变弱、不能确保充分附着性的倾向。超过100g/L时，有铝过多溶解、不能确保充分附着性的倾向。
此外，本说明书中，金属置换处理液中的锌(金属锌(Zn))浓度、镍(金属镍(Ni))浓度、锗(金属锗(Ge))浓度通过ICP(株式会社堀场制作所制)测定。
此外，本说明书中，金属置换处理液中的氟(F)浓度使用氟离子电极测定。
《pH》
金属置换处理液的pH优选为1.0～12.0，更优选为2.0～10.0。即，本发明的金属置换处理液可使用碱性、酸性中的任意种。这里，在通常的锌酸盐处理中，碱性情况时有铝过多溶出(例如非专利文献3的图9)的情况，有产生铝尖刺的倾向，酸性情况时，铝不会过多溶出，但有不能确保充分的附着性的倾向。
另一方面，本发明的金属置换处理液，在酸性情况时也能确保充分的附着性，因而通过采用酸性，得到更显著的附着性改善效果。进一步地，酸性情况时，铝不会过多溶出，也可减少铝尖刺。不过，pH小于3.5时，有铝过多溶出的担忧。
因此，金属置换处理液的pH更优选为3.5～6.5，特别优选为4.0～6.5，最优选为4.5～6.5。由此，在如上所述地得到更显著的附着性改善效果的同时，铝不会过多溶出，也可减少铝尖刺。这里，铝被过多溶出，产生铝尖刺时，铝表面上会产生大量的楔状凹陷，在之后的镀敷膜形成工序中，例如镀镍进入其凹陷，形成缺乏平滑性的镀敷膜，给导通性也带来影响，对外观也大有损伤。因此，通过铝尖刺的减少，可形成平滑性高、镀敷外观优异的镀敷膜。
此外，本说明书中，金属置换处理液的pH是在25℃下测定的值。
金属置换处理液的pH调整可通过锌化合物、镍化合物、锗化合物、氟化合物的种类的选择而进行。另外，根据需要，也可添加碱成分、酸成分。
碱成分没有特别限定，例如可举出氢氧化钠，铵等。酸成分没有特别限定，例如可举出硫酸、磷酸等。这些碱成分、酸成分可单独使用，也可以将2种以上并用。
为了提高pH缓冲性，金属置换处理液也可含有缓冲剂。
作为缓冲剂，若有缓冲性，则没有特别限定，例如，作为在pH4.0～6.5附近具有缓冲性的化合物，例如可举出醋酸、苹果酸、琥珀酸、柠檬酸、丙二酸、乳酸、草酸、戊二酸、己二酸、甲酸等。这些可以单独使用，也可以将2种以上并用。
金属置换处理液中的缓冲剂浓度优选为1.0～50g/L，更优选为5.0～30g/L。
《其他》
金属置换处理液可以在含有所述成分的同时含有金属置换处理液中通用的成分，例如表面活性剂、光泽剂等。此外，还可含有上述以外的金属，例如铁、铜、银、钯、铅、铋、铊等金属的水溶性盐类。这些可以单独使用，也可以将2种以上并用。
金属置换处理液可通过用溶剂(优选水)将各成分适当混合来制造。基于操作安全性的观点，金属置换处理液优选作为水溶液配制，但也可使用其他溶剂，例如甲醇、乙醇、乙二醇、二乙二醇、三乙二醇、甘油、IPA等，或也可作为与水的混合溶剂。此外，这些溶剂可单独使用，也可以将2种以上并用。
金属置换处理液可作为铝或铝合金用的金属置换处理液适当使用。
<铝或铝合金的表面处理方法>
接下来，关于使用本发明的金属置换处理液的、本发明的铝或铝合金的表面处理方法进行说明。
本发明的铝或铝合金的表面处理方法中，进行金属置换处理(使表面具有铝或铝合金的被处理物与本发明的金属置换处理液接触，去除所述铝或铝合金上的氧化膜，使所述铝被所述金属置换处理液所含的金属置换)，在所述被处理物的表面形成含有所述金属的置换金属膜。
该表面处理方法是用于对被处理物实施镀敷膜、例如镍镀敷膜或钯镀敷膜的前处理方法，使至少在表面具有铝或铝合金的被处理物与本发明的金属置换处理液接触，去除表面附着的氧化膜，形成置换金属膜，由此提高之后处理的镍镀敷膜等的附着性。
本发明的铝或铝合金的表面处理方法中，通过本发明的金属置换处理液，至少在表面具有铝或铝合金的被处理物(以下也记作铝基板)上附着的氧化膜被去除，通过锌等金属与铝的电极电位差引起的置换反应，锌粒子、镍粒子、锗粒子在被处理物的表面析出。
一般，使用锌酸盐处理液的、对铝基板进行的镀前处理中，进行实施2次锌置换处理的二次锌酸盐处理工艺。即，是(1)对铝基板实施第1锌置换处理，(2)酸洗后，(3)接下来实施第2锌置换处理这样的工艺，在该二次锌酸盐处理后，(4)进行无电解镀镍等镀敷处理。
另一方面，使用本发明的金属置换处理液的、本发明的铝或铝合金的表面处理方法中，由于能得到非常良好的附着性，因此无需进行二次锌酸盐处理，能通过锌酸盐处理而赋予良好的附着性。因此，本发明的铝或铝合金的表面处理方法中，优选(1)对铝基板实施金属置换处理，在该单次锌酸盐处理后，(4)进行无电解镀镍等镀敷处理。即，优选在金属置换处理和镀敷处理之间不进行(2)酸洗处理、(3)酸洗处理后的第2金属置换处理。
《(1)金属置换处理》
镀敷被处理物即铝基板，只要至少在其表面具有铝或铝合金即可。铝基板例如除了以铝或铝合金为材质的各种物品之外，可使用在非铝材(例如陶瓷、晶圆等各种基材)上形成铝或铝合金膜而成的物品，实施了熔融铝镀敷处理的物品、铸件、压铸物等。铝基板的形状也没有特别限定，可以是成形为通常的板状物(包括膜、片等薄膜状物)、各种形状的成型品中的任意种。此外，上述板状物不限于单独铝或铝合金的板状物，也包括例如在陶瓷、晶圆等基板上通过溅射法、真空蒸镀法、离子镀法等通常方法成形的铝膜(与基板一体化的膜)。
作为铝合金没有特别限定，例如可使用以铝为主要金属成分的各种合金。例如，可将A1000系的准铝、A2000系的含有铜和锰的铝合金、A3000系的铝-锰合金、A4000系的铝-硅合金、A5000系的铝-镁合金、A6000系的铝-镁-硅合金、A7000系的铝-锌-镁合金、A8000系的铝-锂系合金等作为适用对象。
基于镀敷平滑性的观点，铝或铝合金的铝纯度优选为98％以上，更优选为98.5％以上，进一步优选为99％以上。
镀敷被处理物即铝基板可通过公知的方法例如溅射法等在非铝材、例如硅板上包覆铝层而制作。铝层的包覆可以是对非铝材全部的包覆，也可以是仅对其一部分的包覆，通常包覆具有0.5μm以上、优选1μm以上的厚度的铝层。此外，该铝基板的形成方法也不限于溅射法，可使用真空蒸镀法、离子镀法等制作。
首先，将该铝基板用公知方法实施脱脂处理等清洁处理，适当水洗后，通过碱或酸，实施公知的蚀刻处理。具体地，脱脂处理是通过在铝用脱脂液中浸渍，或进行电解脱脂来进行的。此外，蚀刻处理是通过用例如约1～10％碱溶液，或者约1～20％的酸性溶液，在约25～75℃的液温下，在溶液中浸渍约1～15分钟来进行的。
接下来，以去除碱或酸带来的蚀刻残渣(污物)为目的，在酸性溶液中浸渍规定时间。具体地，例如，在具有约10～800ml/L、优选约100～600ml/L的浓度范围，液温为约15～35℃的硝酸水溶液中，将实施了蚀刻的铝基板浸渍约30秒～2分钟，去除污物。
然后，将如此实施污物处理等的铝基板在水洗后，在本发明的金属置换处理液(锌酸盐处理液)中浸渍，实施金属置换处理。具体地，例如，在具有上述组成的、液温为10～50℃、优选15～30℃的锌酸盐处理液中浸渍铝基板。锌酸盐处理液的温度若为10℃以上，则置换反应不会太慢，不会产生斑，能够形成金属膜，另外，若为50℃以下，则置换反应不会过于增大，也可防止置换金属膜表面变粗，因而优选上述温度。
与浸渍时间有关的条件也没有特别限定，可根据需要去除的铝氧化膜的厚度等而适当设定，例如，通常为约5秒以上，优选10秒以上，作为上限为5分钟以下。浸渍时间若过短，则置换不进行，氧化膜的去除变得不充分，另一方面，浸渍时间若过长，则处理液从置换金属层的小孔进入，有铝或铝合金溶出的担忧，因而需要考虑这几点而设定条件。
通过如此地在锌酸盐处理液中让铝基板浸渍，由此可去除其基板表面附着的氧化膜，同时进一步包覆含有Zn、Ni、Ge的置换金属膜，使铝表面活性化，由此，对于被处理物，可形成具有良好附着性的镀敷膜。
金属置换处理中，只要是本发明的金属置换处理液可接触铝基板表面的方式，就没有特别限制。作为该接触方法，除了浸渍外，例如可采用涂布、喷涂等方法。
《(4)镀敷处理》
该镀敷处理是对实施了锌酸盐处理的铝基板，通过无电解镀敷或者电解镀敷进行的。例如，用无电解镍、无电解钯或铜镀浴那样的适合的金属镀敷液镀敷为期望的最终膜厚。
具体地，作为一例，关于无电解镀镍进行说明。无电解镍镀敷液是：例如通过使用硫酸镍、氯化镍、醋酸镍等水溶性镍盐来提供镍离子，作为该镍离子的浓度，例如约为1～10g/L。此外，无电解镍镀敷液中，例如含有具有约20～80g/L的浓度范围的醋酸盐、琥珀酸盐、柠檬酸盐等有机酸盐、铵盐、胺盐等镍的络合剂，还作为还原剂含有具有约10～40g/L的浓度范围的次亚磷酸或次亚磷酸钠等次亚磷酸盐。通过作为还原剂含有次亚磷酸盐等，镀敷液的稳定性得以提高，可形成成本廉价的镍-磷的合金膜。而且，由这些化合物构成的镀敷液被配制成pH为约4～7而使用，还将该镀敷液配制为60～95℃的液温，作为镀敷处理液中铝基板的浸渍时间，浸渍约15秒～120分钟，由此进行镀敷处理。此外，通过适当地改变该镀敷处理时间，可改变镀敷膜的厚度。
此外，如上所述，作为镀敷处理，不限于无电解镀敷处理限，也可通过电解镀敷进行。此外，镀敷金属的种类在以上示例之外，可使用Cu、Au等镀敷金属进行，还可通过置换镀敷法等，以形成2层以上的层的方式进行镀敷处理。
显然，关于以上说明的锌酸盐处理及镀敷处理中的处理条件，各种浓度设定，不限于以上那样的条件，可根据形成的膜厚度等适当变更。
本发明的铝或铝合金的表面处理方法中，通过进行金属置换处理(使表面具有铝或铝合金的被处理物与本发明的金属置换处理液接触，去除所述铝或铝合金上的氧化膜，使所述铝被所述金属置换处理液所含的金属置换)，Ni、Ge与Zn一同共析，可在铝或铝合金表面形成含有Zn、Ni、Ge的置换金属膜。
对表面具有含有这样的Zn、Ni、Ge的置换金属膜的铝或铝合金进行镀敷处理，在形成镀敷膜(金属膜，例如镍膜)时，在铝或铝合金和镀敷膜(金属膜，例如镍膜)间，置换金属膜中存在的Zn、Ni、Ge协同地发挥作用，可对铝或铝合金赋予与镀敷膜(金属膜)的良好附着性。
实施有通过本发明得到的镀敷膜(金属膜)的铝或铝合金，可用于各种电子部件。作为电子部件，例如可举出用于家电机器、车载机器、供电系统、输送机器、通信机器等的电子部件，具体可举出空调、电梯、电动汽车、混合动力汽车、电车、发电装置用的电源控制单元等电源模块、一般家电、个人电脑等。
本发明中，通过使金属置换处理液的pH为4.0～6.5，可实施用于形成铝尖刺也减少、平滑性高、镀敷外观优异的镀敷膜的镀敷前表面处理，因此，可适合用于半导体用途，优选适合用于晶圆用途，特别地，适合作为对于在晶圆上形成凸点下金属或凸点时的前处理有效的铝或铝合金上的金属置换处理液，及使用该金属置换处理液的铝或铝合金的表面处理方法。
【实施例】
基于实施例，具体说明本发明，但本发明不仅限于这些。
按照表1～3所示的条件，对铝基板实施各处理，形成镀敷膜。这里，作为铝基板，使用了1cm×2cm的Al-Cu TEG晶圆。关于得到的镀敷膜，设有镀敷膜的基板，用下述方法评价。评价结果如表2、3所示。
此外，表2、3中，表中的数值(浓度)是除去琥珀酸的换算为氟(F)或各金属元素的浓度(g/L)。
<附着性评价：弯折切割试验>
关于设有得到的镀敷膜的基板，进行气流干燥，在镀敷面贴透明胶带。然后，在贴胶带的晶圆中央部划上刻痕，切割为两半。从切割的中央部剥离胶带，将Al基底与Ni膜间剥离的量作为100分率求出。此外，弯折切割试验的概要如图1所示。
0％是指剥离胶带时镀敷膜完全没有剥离，100％是指剥离胶带时镀敷膜整面剥离。
<铝(Al)尖刺评价>
对于得到的镀敷膜，用日立高新技术公司制的XVision 210DB，进行FIB(集束离子束)截面观察。图2(a)显示未见Al尖刺时的一例，图2(b)显示可见Al尖刺时的一例。如图2(a)，未见Al尖刺时，判断为良好。
【表1】
脱脂/蚀刻：EPiTaS MCE-31(上村工业株式会社制)
无电解Ni：EPiTaS NPR-18(上村工业株式会社制)
从表2、3可知，含有锌化合物、镍化合物、锗化合物、氟化合物的实施例的金属置换处理液可赋予与镀敷膜(金属膜)的良好附着性。此外可知，通过使金属置换处理液的pH为3.5～6.5，铝尖刺也可减少。此外，表2、3虽然是作为铝基板使用A1-Cu TEG晶圆时的结果，但作为铝基板使用·Al-Si TEG晶圆时也是同样的结果。
Claims (10)
1.一种金属置换处理液，含有锌化合物、镍化合物、锗化合物、氟化合物。
2.根据权利要求1所述的金属置换处理液，含有以锌浓度计为0.2～5.0g/L的锌化合物。
3.根据权利要求1或者2所述的金属置换处理液，含有以镍浓度计为0.2～10g/L的镍化合物。
4.根据权利要求1～3中任一项所述的金属置换处理液，含有以锗浓度计为0.2～5.0g/L的锗化合物。
5.根据权利要求1～4中任一项所述的金属置换处理液，含有以氟浓度计为5.0～50g/L的氟化合物。
6.根据权利要求1～5中任一项所述的金属置换处理液，锌浓度、锗浓度的比率为1∶5～5∶1。
7.根据权利要求1～6中任一项所述的金属置换处理液，pH为4.0～6.5。
8.根据权利要求1～7中任一项所述的金属置换处理液，是铝或铝合金用的。
9.一种铝或铝合金的表面处理方法，进行金属置换处理，在被处理物的表面形成含有金属的置换金属膜；所述金属置换处理为使表面具有铝或铝合金的被处理物与权利要求1～8中任一项所述的金属置换处理液接触，去除所述铝或铝合金上的氧化膜，使所述铝被所述金属置换处理液所含的金属置换。
10.根据权利要求9所述的铝或铝合金的表面处理方法，在形成所述置换金属膜后，在该置换金属膜表面形成镀敷膜。
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| JP4538490B2 (ja) | 2007-11-26 | 2010-09-08 | 上村工業株式会社 | アルミニウム又はアルミニウム合金上の金属置換処理液及びこれを用いた表面処理方法 |
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| US3930081A (en) * | 1972-11-06 | 1975-12-30 | Oxy Metal Industries Corp | Composition and process for displacement plating of zinc surfaces |
| JPH07188971A (ja) * | 1993-12-28 | 1995-07-25 | Nkk Corp | アルミニウムおよびアルミニウム合金板の亜鉛系めっき 方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20230151493A1 (en) | 2023-05-18 |
| JP2023069841A (ja) | 2023-05-18 |
| TW202336272A (zh) | 2023-09-16 |
| KR20230067550A (ko) | 2023-05-16 |
| EP4177376A1 (en) | 2023-05-10 |
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