CN1822355A - 集成电路基板的粘接垫结构 - Google Patents
集成电路基板的粘接垫结构 Download PDFInfo
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- CN1822355A CN1822355A CNA2005101145206A CN200510114520A CN1822355A CN 1822355 A CN1822355 A CN 1822355A CN A2005101145206 A CNA2005101145206 A CN A2005101145206A CN 200510114520 A CN200510114520 A CN 200510114520A CN 1822355 A CN1822355 A CN 1822355A
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- metallic plate
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Abstract
本发明是有关于一种集成电路基板的粘接垫结构,本发明提供了一种提供一集成电路芯片,其中此芯片包括一粘接垫结构。此粘接垫结构包括一粘接垫、一第一金属板和一第二金属板。此第一金属板位于粘接垫下方。此第一金属板具有一第一外观面积。第二金属板位于第一金属板下方。因此,第一金属板和第二金属板聚积而成的顶视外型区域大于第一金属板的第一外观面积。此第二金属板亦具有一第二外观面积,其面积实质上大于或等于此第一外观面积。一第一垂直轴是从第一金属板的质量中心延展而出,且第二金属板的质量中心侧偏于第一垂直轴。
Description
技术领域
本发明涉及一种集成电路芯片的粘接垫结构。特别是涉及一种可防止内连接剥离且可增进粘接能力的集成电路基板的粘接垫结构。
背景技术
集成电路芯片常需通过线路(例如:金或铝线)电性连接至一封装基板或支架来与外部信号进行交换。这种连线一般是使用热压缩或超音波震动的方法被连接至一集成电路芯片的粘接垫上。这种连线制程常会施加热和机械应力至粘接垫和位于粘接垫下方的层及结构上。因此,粘接垫结构需能承受这些应力,如此才能确保粘接垫不受损坏,以免危害到集成电路芯片本身。
一种可替代的粘接垫结构是从底部向顶层进行制造,此种结构不允许金属线路或半导体元件穿越粘接垫或位于粘接垫下方。为了能较有效率的使用芯片或降低芯片的尺寸,金属线路或半导体元件需位于粘接垫下方。这种结构被称为粘接垫位于主动线路上(bond over active circuits,BOAC)或线路位于粘接垫下(circuits under pad,CUP)。现今,许多制程是使用低介电常数或超低介电常数材料来形成内金属介电层(intermetaldielectric,IMD),藉以降低电阻电容延迟时间和寄生电容。这种趋势造成IMD在设计上会让介电常数值由顶层朝向基板逐层降低。然而,当介电常数值降低时,依一般原理,会造成介电材料强度下降。因此,许多低介电常数材料常会造成破裂,或缺乏能抵挡某些机械制程(例如粘线制程或机械研磨制程)所需的强度。低介电常数材料除了强度不佳外,其粘和强度亦不佳。
在一传统的粘线制程中,粘接垫结构需能于进行粘结对锡球进行压合时,抵挡住压合和侧面的剪应力。这些应力会造成低介电常数层的破裂。除此之外,当连线被一粘接机具拉扯时藉以进行与粘接垫的连线时,此时粘接垫结构亦必须能抵挡这种连线时的拉力和扭力。这些力量常会造成粘接垫结构的剥离或错位。因此,亟需一种于进行粘线时,可承受且可分散粘线所产生应力的粘接垫结构,且此粘接垫结构亦是由低介电常数材料来形成内金属介电层。且此结构亦允许电路和半导体元件位于粘接垫下方。
由此可见,上述现有的集成电路基板的粘接垫结构在结构与使用上,显然仍存在有不便与缺陷,而亟待加以进一步改进。为了解决集成电路基板的粘接垫结构存在的问题,相关厂商莫不费尽心思来谋求解决之道,但长久以来一直未见适用的设计被发展完成,而一般产品又没有适切的结构能够解决上述问题,此显然是相关业者急欲解决的问题。因此如何能创设一种新型结构的集成电路基板的粘接垫结构,便成了当前业界极需改进的目标。
有鉴于上述现有的集成电路基板的粘接垫结构存在的缺陷,本发明人基于从事此类产品设计制造多年丰富的实务经验及专业知识,并配合学理的运用,积极加以研究创新,以期创设一种新型结构的集成电路基板的粘接垫结构,能够改进一般现有的集成电路基板的粘接垫结构,使其更具有实用性。经过不断的研究、设计,并经反复试作样品及改进后,终于创设出确具实用价值的本发明。
发明内容
本发明的目的在于,克服现有的集成电路基板的粘接垫结构存在的缺陷,而提供一种新型的集成电路基板的粘接垫结构,所要解决的的目的在于提供一种于进行粘线时,可承受且可分散粘线所产生应力的粘接垫结构。
本发明的目的及解决其技术问题是采用以下技术方案来实现的。依据本发明提出的一至少包括一粘接垫结构的集成电路芯片,其中该粘接垫结构至少包括:一粘接垫;一第一金属板位于该粘接垫下方,其中该第一金属板具有一第一外观面积;以及一第二金属板位于该第一金属板下方,其中该第一金属板和该第二金属板聚积而成的顶视外观面积大于该第一金属板的该第一外观面积。
本发明的目的及解决其技术问题还采用以下技术措施来进一步实现。
前述的集成电路基板的粘接垫结构,其中所述的第二金属板具有一第二外观面积,该第二外观面积实质上大于或等于该第一外观面积。
前述的集成电路基板的粘接垫结构,其中一第一垂直轴从该第一金属板的质量中心延展而出,该第二金属板的质量中心是侧偏于该第一垂直轴。
前述的集成电路基板的粘接垫结构的集成电路芯片,其中所述的粘接垫结构更包括一第三金属板位于第二金属板下方,其中该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第一金属板的该第一外观面积。
前述的集成电路基板的粘接垫结构的集成电路芯片,其中所述的粘接垫结构更包括一第三金属板位于第二金属板下方,其中该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第一金属板的该第一外观面积,且该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第二金属板的该第二外观面积。
前述的集成电路基板的粘接垫结构的集成电路芯片,其中所述的粘接垫结构更包括一第三金属板位于第二金属板下方,其中该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第一金属板的该第一外观面积,且该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第二金属板的该第二外观面积,且该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第三金属板的该第三外观面积。
前述的集成电路基板的粘接垫结构的集成电路芯片,其中所述的粘接垫具有一粘接垫外观面积,且其中该第一外观面积实质上等于或大于该粘接垫外观面积。
本发明的目的及解决其技术问题还采用以下技术方案来实现。依据本发明提出的一至少包括一粘接垫结构的集成电路芯片,其中所述的粘接垫结构至少包括:一粘接垫;一第一金属板位于该粘接垫下方,其中一第一垂直轴从该第一金属板的质量中心延展而出;以及一第二金属板位于该第一金属板下方,其中该第二金属板的质量中心是侧偏于该第一垂直轴。
本发明的目的及解决其技术问题还采用以下技术措施来进一步实现。
前述的集成电路基板的粘接垫结构的集成电路芯片,其中所述的第一金属板具有一第一外观面积,该第二金属板具有一第二外观面积,该第二外观面积实质上大于或等于该第一外观面积。
前述的集成电路基板的粘接垫结构的集成电路芯片,其中一第二垂直轴从该第二金属板的质量中心延展而出,且其中该粘接垫结构更包括一第三金属板是位于第二金属板下方,该第三金属板具有一第三外观面积,该第三外观面积实质上大于或等于该第一外观面积,且该第三金属板的质量中心是侧偏于该第一垂直轴,该第三外观面积面积实质上大于或等于该第二外观面积,且该第三金属板的质量中心是侧偏于该第二垂直轴,且其中该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第三外观面积。
本发明与现有技术相比具有明显的优点和有益效果。由以上技术方案可知,本发明的主要技术内容如下:
为了达到上述目的本发明提供了一种集成电路芯片,其中此芯片包括一粘接垫结构。此粘接垫结构包括一粘接垫、一第一金属板和一第二金属板。此第一金属板位于粘接垫下方。此第一金属板具有一第一外观面积。第二金属板位于第一金属板下方。因此,第一金属板和第二金属板聚积而成的顶视外型区域大于第一金属板的第一外观面积。此第二金属板亦具有一第二外观面积,其面积实质上大于或等于此第一外观面积。一第一垂直轴是从第一金属板的质量中心延展而出,且第二金属板的质量中心是侧偏于第一垂直轴。且,一第二垂直轴是从第二金属板的质量中心延展而出。一第三金属板(亦属于粘接垫结构)位于第二金属板下方。此第三金属板具有一第三外观面积,其面积实质上大于或等于此第一外观面积,且第三金属板的质量中心是侧偏于第一垂直轴。第三外观面积实质上大于或等于此第二外观面积,且第三金属板的质量中心是侧偏于第二垂直轴。第一、第二和第三金属板聚积而成的顶视外型区域大于第三外观面积。此粘接垫结构更包括一位于第二金属板下方的第三金属板,藉以使得第一、第二和第三金属板聚积而成的顶视外型区域大于第一金属板的第一外观面积。例如,此第一金属板可具有一空的中间部分、形成于其中的狭缝或是为一固体实板结构。此粘接垫结构更可包括复数个介层连接洞位于第一金属板和第二金属板间。此粘接垫具有一粘接垫外型区,且第一外观面积实质上大于或等于此接垫外型区。此第二金属板具有一第二外观面积,且第二外观面积面积大于第一外观面积。此粘接垫结构更包括一位于第二金属板下方的第三金属板,此第三金属板具有一第三外观面积,且第三外观面积面积大于第二外观面积。此芯片至少一部份位于粘接垫结构的下方。
又,为了达到上述目的,本发明还提供了一种集成电路芯片,其中此芯片包括一粘接垫结构。此粘接垫结构包括一粘接垫、一第一金属板和一第二金属板。此第一金属板位于粘接垫下方。一第一垂直轴是从第一金属板的质量中心延展而出。第二金属板位于第一金属板下方,且第二金属板的质量中心是侧偏于第一垂直轴。
再者,为了达到上述目的,本发明还提供了一种集成电路芯片,其中此芯片包括一粘接垫结构。此粘接垫结构包括一粘接垫、一第一、一第二和一第三金属板。此第一金属板位于粘接垫下方。此第一金属板具有一第一外观面积。一第一垂直轴是从第一金属板的质量中心延展而出。第二金属板位于第一金属板下方。此第二金属板具有一第二外观面积。此第二外观面积实质上大于或等于此第一外观面积,且第二金属板的质量中心是侧偏于第一垂直轴。一第二垂直轴是从第二金属板的质量中心延展而出。第三金属板位于第二金属板下方。此第三金属板具有一第三外观面积。此第三外观面积实质上大于或等于此第一外观面积,且第三金属板的质量中心是侧偏于第一垂直轴。此第三外观面积实质上大于或等于此第二外观面积,且第三金属板的质量中心是侧偏于第二垂直轴。因此,第一、第二和第三金属板聚积而成的顶视外型区域大于第三外观面积。
此外,为了达到上述目的,本发明还提供了一种集成电路芯片,其中此芯片包括一粘接垫结构。此粘接垫结构包括一粘接垫、一第一、一第二和一第三金属板。此第一金属板位于粘接垫下方。此第一金属板具有一第一外观面积。第二金属板是位于第一金属板下方。此第二金属板具有一第二外观面积。此第二外观面积大于此第一外观面积。第三金属板位于第二金属板下方。此第三金属板具有一第三外观面积。此第三外观面积是大于此第二外观面积。
此外,为了达到上述目的,本发明还提供了一种集成电路芯片,其中此芯片包括一第一粘接垫结构和一第二粘接垫结构。此第一粘接垫结构包括一第一粘接垫、一第一M1金属板和一第一M2金属板。此第一M1金属板位于M1金属层。一第一垂直轴是从第一M1金属板的质量中心延展而出。此第一M2金属板位于M2金属层。此M2金属层位于M1金属层下方。此第一M2金属板位于第一M1金属板下方。第一M2金属板的质量中心是侧偏于第一垂直轴。此第二粘接垫结构包括一第二粘接垫、一第二M1金属板和一第二M2金属板。此第二M1金属板位于M1金属层。一第二垂直轴是从第二M1金属板的质量中心延展而出。此第二M2金属板位于M2金属层。此第二M2金属板位于第二M1金属板下方。第二M2金属板的质量中心是侧偏于第二垂直轴。此第一M1金属板邻接于沿着第一侧偏轴的第二M1金属板形成,而此第一侧偏轴是遵循M1布局图案间距来沿着M1金属层进行延展。此第一M2金属板邻接于沿着第二侧偏轴的第二M2金属板形成,而此第二侧偏轴遵循M2布局图案间距来沿着M2金属层进行延展。此M1布局图案间距实质上相同于M2布局图案间距。
根据本发明的再一实施方式,提供一种制造包括一粘接垫结构的集成电路芯片方法。此方法包括描述于下列段落中的步骤。这些步骤的顺序可加以改变。此粘接垫结构包括一粘接垫、一第一金属板和一第二金属板。形成此粘接垫结构的第二金属板。形成此粘接垫结构的第一金属板。此第一金属板是位于第二金属板的上方。此第一金属板具有一第一外观面积。第一金属板和第二金属板聚积而成的顶视外观面积大于第一金属板的第一外观面积。形成此粘接垫结构的粘接垫。此粘接垫位于第一金属板上方。
根据本发明的再一实施方式,提供一种制造包括一粘接垫结构的集成电路芯片方法。此方法包括描述于下列段落中的步骤。这些步骤的顺序可加以改变。此粘接垫结构包括一粘接垫、一第一金属板和一第二金属板。形成此粘接垫结构的第二金属板。形成此粘接垫结构的第一金属板。此第一金属板是位于第二金属板的上方。一第一垂直轴是从第一金属板的质量中心延展而出。第二金属板的质量中心是侧偏于第一垂直轴。形成此粘接垫结构的粘接垫。此粘接垫位于第一金属板上方。
借由上述技术方案,本发明集成电路基板的粘接垫结构至少具有下列优点:
利用本发明的结构进行粘线时,其可承受且可分散粘线所产生应力的粘接垫结构,且此粘接垫结构亦是由低介电常数材料来形成内金属介电层。此外,此结构亦允许电路和半导体元件位于粘接垫下方。
综上所述,本发明集成电路基板的粘接垫结构,其具有上述诸多的优点及实用价值,并在同类产品中未见有类似的结构设计公开发表或使用而确属创新,其不论在产品结构或功能上皆有较大的改进,在技术上有较大的进步,并产生了好用及实用的效果,且较现有的集成电路基板的粘接垫结构具有增进的多项功效,从而更加适于实用,而具有产业广泛利用价值,诚为一新颖、进步、实用的新设计。
上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手段,而可依照说明书的内容予以实施,并且为了让本发明的上述和其他目的、特征和优点能够更明显易懂,以下特举较佳实施例,并配合附图,详细说明如下。
附图说明
图1是一具有可替换粘接垫结构的部分集成电路芯片的剖视图,于粘接垫下方设计有一电路结构;
图2是图1的粘接垫结构中,不同层中的金属板结构俯视图;
图3是根据本发明第一实施例的一具有粘接垫结构的部分集成电路芯片的剖视图;
图4是图3的粘接垫结构中,位于不同层中的金属板结构俯视图;
图5是根据本发明第二实施例的一具有粘接垫结构的部分集成电路芯片的剖视图;
图6是图5的粘接垫结构中,位于不同层中的金属板结构俯视图;
图7A至图7G是可用于本发明任一实施例的粘接垫结构中的一些金属板形状和其设计的俯视图;
图8是根据本发明的实施例,藉由增加效率面积使得粘接电结构强度增进的百分率图。
20:集成电路芯片 22、61、62:粘接垫结构
24:部分集成电路 26:绝缘区域
28:闸极电极 30:接触点
32:内连线 38:粘接垫
41:第一金属板 42:第二金属板
43:第三金属板 51:第一组连接洞
52:第二组连接洞 54:中心部分
71:第一外观面积 72:第二外观面积
73:第三外观面积 76:俯视图
80:俯视外观面积 81:第一垂直轴
82:第二垂直轴 93:质量中心
98:金属板 99:外观面积
100:缝隙 P1、P2、P 3:尺寸
具体实施方式
为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功效,以下结合附图及较佳实施例,对依据本发明提出的集成电路基板的粘接垫结构其具体实施方式、结构、特征及其功效,详细说明如后。
请参阅图式,根据各种不同实施例所展现的各图式中,其相似的符号是代表相同或相似元件。其中图式并未依循固定的尺寸比率绘示,且于某些特定情况或特定目的下,图式中的某些部分会被简化,一熟习该项技艺者,将可利用本发明作为基础,来发展出其他可能的应用。
一般而言,本发明的所提供的实施例是用以增进集成电路芯片上粘接垫结构强度,特别是对于那些于粘接垫下方形成有电路,以及使用低介电常数材质来形成内介电层的粘接垫结构。首先,请参阅图1以及图2,为了比较目的,一可替代的粘接垫结构被展示于图式中且描述于其下。接着,详述本发明两个具增进结构强度的粘接垫结构实施例。其中图3以及图4是有关于本发明的第一实施例。请参阅图5以及图6例是有关于本发明的第二实施例。请参阅图7A至图7G是有关于可用于本发明任一实施例粘接垫结构中的一些金属板形状和其设计。最后于图8中图示粘接电结构强度增进的百分率图。本发明这些实施例中可得出的优点亦将于其下的段落中加以描述。
请参阅图1和图2所示,一具有可替换粘接垫结构22设计的部分集成电路芯片20的剖视图。此粘接垫结构22形成于至少部分的集成电路24之上。于集成电路24上的某些部分(例如,绝缘区域26、闸极电极28、接触点30以及内连线32)亦显示于其中。图1中的每一个连接垫结构22包括一粘接垫38、一第一金属板41、一第一组连接洞51、一第二金属板42、一第二组连接洞52以及一第三金属板43。如图2所示,这些金属板41、42和43的一简化的俯视图。第一金属板41位于粘接垫38的下方。第二金属板42位于第一金属板41的下方。第一组连接洞51位于第二金属板42和第一金属板41间,用以提供第二金属板42和第一金属板41的机械性连接。第三金属板43位于第二金属板42的下方。第二组连接洞52位于第二金属板42和第三金属板43间,用以提供第二金属板42和第三金属板43的机械性连接。
请参阅图2所示,第一金属板41具有一空的中心部分54。第二金属板42和第三金属板43每一个均具有实心的平板结构。图2的其余部分将于其下讨论。
请参阅图3和图4所示,根据本发明第一实施例所形成的粘接垫结构61。例如,为了增进本发明的目的,第一实施例的粘接垫结构61可以替代如图1所示的可替换式粘接垫结构22。第一实施例的粘接垫结构61形成于至少部分的集成电路24之上。集成电路24上具有与图1示相同的某些部分,此部分亦显示于图3中。而于其他的实施例中,于粘接垫61的下方,亦可形成其他部分和其他形式的集成电路。
请参阅图3所示,其中的每一个连接垫结构61包括一粘接垫38、一第一金属板41、一第一组连接洞51、一第二金属板42、一第二组连接洞52以及一第三金属板43。请参阅图4所示,第一实施例中这些金属板41、42和43的一简化俯视图。第一金属板41位于粘接垫38的下方。第一金属板41具有一第一外观面积71。此第一外观面积71于图4中是以虚线表示。一板的“外观面积”为一金属板俯视图的外型所圈出的面积。因此,于后述所讨论者,不论一金属板中是否存有缝隙或孔洞均不会影响外观面积。
请参阅图4所示,第一实施例的第一金属板41具有一空的中心部分54,其类似于图2粘接垫结构22的设计。此中空的中心部分54将由围绕于IMD层周围的介电材料来加以填充。
请参阅图3所示,第二金属板42位于第一金属板41的下方。如图4的俯视图所示,第二金属板42具有一第二外观面积72。此第二外观面积72于图4中是以虚线表示。在第一实施例中,第二金属板42的第二外观面积72大于第一金属板41的第一外观面积71。然而,在其他的实施例中,第二金属板42的第二外观面积72可实质大于或等于第一金属板41的第一外观面积71。第一组连接洞51位于第二金属板42和第一金属板41间,用以提供第二金属板42和第一金属板41的机械性连接。虽然,较佳地于本发明的一实施例中可选择性使用第一组连接洞51。此外,在其他的实施例中,关于第一组连接洞51的置放位置、形状、大小、填充材料和其数目均可加以变动。
请参阅图3所示,第三金属板43位于第二金属板42的下方。如图4的俯视图所示,第三金属板43具有一第三外观面积73。此第三外观面积73于图4中是以虚线表示。在第一实施例中,第三金属板43的第三外观面积73大于第二金属板42的第二外观面积72。然而,在其他的实施例中,三金属板43的第三外观面积73可实质大于或等于第二金属板42的第二外观面积72。此外,在第一实施例中,第三金属板43的第三外观面积73大于第一金属板41的第一外观面积71。然而,在其他的实施例中,第三金属板43的第三外观面积73可实质大于或等于第一金属板41的第一外观面积71。第二组连接洞52位于第二金属板42和第三金属板43间,用以提供第二金属板42和第三金属板43的机械性连接。虽然,较佳地于本发明的一实施例中可选择性使用第二组连接洞52。此外,在其他的实施例中,关于第二组连接洞52的置放位置、形状、大小、填充材料和其数目均可加以变动。
接着,请参阅比较图2与图4所示,将呈现出为何第一具体实施例中的粘接垫结构61具有比图2所示粘接垫结构增进的效能。如图2所示,图中显示出一由一第一金属板41、第二金属板42和第三金属板43所堆积而成的俯视图76。相似于图1,于图2中,第二金属板42和第三金属板43位于第一金属板41的下方。其后将以一简化的方程式来进一步解说此部分。值得注意的是,第二金属板42的第二外观面积72和第三金属板43的第三外观面积73,在图1和图2的基板22上,实质上分别等于第一金属板41的第一外观面积71。在图2中,由第一金属板41、第二金属板42和第三金属板43所堆积而成的俯视外观面积80,实质上等于第一金属板41的第一外观面积71,而于图4中,第一金属板41、第二金属板42和第三金属板43堆积成俯视图76。在图2与图4中,俯视外观面积80是由一粗实线来加以表示。于第一实施例中,请参阅图4所示,由第一金属板41、第二金属板42和第三金属板43所堆积而成的俯视外观面积80,实质上大于第一金属板41的第一外观面积71。
此外,第一实施例中,请参阅图4所示,由第一金属板41、第二金属板42和第三金属板43所堆积而成的俯视外观面积80,是大于图2中粘接垫结构22的俯视外观面积80。因此,为了讨论和比较的目的,假设所有的因素,如粘接垫和第一金属板的材料、大小和形状是相同,则第一实施例的粘接垫结构61,因为比图1和图2所示的粘接垫结构22具有较大的俯视外观面积80,因此可提供一较强的结构,藉以抵档,例如于进行粘结时,施加于其上的施加力。其后将以一简化的方程式来进一步解说此部分。亦值得注意的是,如图4中所示的第一实施例,尺寸W1是大于图2中所示的尺寸W0。虽然,图4中第一实施例所示的俯视外观面积80仅在一方向上,即W1和W0,大于图2中粘接垫结构22的俯视外观面积80,但是于其他的实施例中,于其他的方向上,俯视外观面积80亦可能是较大的。
由于晶圆上粘接垫结构61的密度关系,在邻接的粘接垫结构61间,请参阅图3所示的尺寸P3需加以考虑,因为其会影响邻接粘接垫结构61的放大第三金属板43间的空间S1,如图3所示,对于邻接放大第三金属板43间的空间S1大小会造成限制的原因有,例如,粘接垫结构61的放大第三金属板43。当尺寸P 3因晶圆的设计而缩小时,第三金属板43可被放大的尺寸将会被限制。在另一实施例中(未图式),第二金属板42和第三金属板43可有一比第一金属板41还大的外观面积72和73,当第二金属板42和第三金属板43有一实质上相同的外观面积72和73。
为了讨论本发明的目的,一假设的第一垂直轴81是从第一金属板41的质量中心延展而出,请参阅图3和图4所示。于第一实施例中,此第一垂直轴81亦从第二金属板42延展而出,且穿过第三金属板43的质量中心。然而,在另一实施例中,此第二金属板42和/或第三金属板43的质量中心是侧偏于第一垂直轴81。
根据本发明的其他实施例,粘接垫61的俯视外观面积80可以其他的方式来加大。例如,请参阅图5和图6所示,的本发明第二实施例,其展示以另一种方法来增加粘接垫62的俯视外观面积80。在此第二实施例中,第二金属板42和第三金属板43具有一跟第一金属板41实质上相等的外观面积72和73。一第一垂直轴81是从第一金属板41的质量中心延展而出。一第二垂直轴82是从第二金属板42的质量中心延展而出。于此实施例中,第二金属板42的质量中心是侧偏于第一垂直轴81。而且,第二实施例中的第三金属板43的质量中心93是侧偏于第一垂直轴81和第二垂直轴82。因此,藉由如图6中所示的侧偏,粘接垫62的俯视外观面积80可加大。请参阅在图6中绘示一俯视图,其中第二金属板42和第三金属板43位于第一金属板41的下方。其中,如图6中所示,俯视外观面积80是由一粗实线来加以表示。
请参阅比较图2和图6所示,如图6所示的第二实施例,其俯视外观面积80,实质上大于图2所示的俯视外观面积80。因此,若假设所有的因素,如粘接垫和第一金属板的材料、大小和形状相同,则第二实施例的粘接垫结构62,因为比图1和图2所示的粘接垫结构22具有较大的俯视外观面积80,因此可提供一较强的结构,藉以抵档,例如于进行粘结时,施加于其上的施加力。其后将以一简化的方程式来进一步解说此部分。亦值得注意的是,如图6中所示的第二实施例,尺寸W2是大于图2中所示的尺寸W0。虽然,如图6中第二实施例所示的俯视外观面积80仅在一方向上,即W2和W0,大于图2中粘接垫结构22的俯视外观面积80,但是于其他的实施例中,于其他的方向上,俯视外观面积80亦可能是较大的。
第二实施例的优点为,请参阅图6中所示,粘接垫结构62其俯视外观面积80可在每一金属层尺寸均相同的情况下加以增加。易言之,第二实施例的优点为,在不增加邻接的粘接垫结构62的尺寸情形下,以及在不减少位于相同金属层的邻接第三金属板间的空间情形下,俯视外观面积80可加以增加。请参阅在图5显示于邻接的粘接垫结构62间的第一金属板布局时的尺寸P1,同时亦显示粘接垫结构62间的第二和第三金属板42和43布局时的尺寸P2和P3。如第二实施例所示,于不同金属层间的尺寸P1、P2和P 3可彼此相等,但于其他实施例中可彼此不相同。在其他实施例中,任合金属层间或复合金属层间的尺寸可彼此相同亦可彼此不同。在许多的情形下,在每一金属层的尺寸上具相同的大小是较佳地。
然而,于其他的实施例中(未图式),第一垂直轴81和/或第二垂直轴82可穿越第三金属板43的质量中心。此外,于另外的实施例中(未图式),第一垂直轴81穿越第二金属板42的质量中心,亦即第一垂直轴81和第二垂直轴82在同一直线上,此时,第三金属板43的质量中心93是侧偏于第一以及第二垂直轴81和82。而于另一实施例中(未图式),第一垂直轴81穿越第三金属板43的质量中心93,此时,第二金属板42的质量中心是侧偏于第一垂直轴81。
虽然,第一以及第二实施例中,所展示的金属板41、42和43具有长方形的外观面积,但这些仅为一例示。在本发明的其他实施例中,金属板41、42和43中的任一金属板可具有合适形状的外观面积。此外,第一以及第二实施例所示的第一金属板41具有一中空的部分54,然而,在本发明的其他实施例中,第一金属板41可具有任何宽度的合适外型或结构。同样的,虽然第一和第二实施例中,所展示的第二金属板42和第三金属板43均具有实心的平板结构,但第二金属板42和第三金属板43可具有任何宽度的合适外型或结构。在一较佳实施例中,请参阅图1至图6所示,第二金属板42和第三金属板43均具有实心的平板结构。请参阅图7A至图7G所示,展示一些可应用于本发明实施例的金属板98的形状和结构。
请参阅图7A至图7G所示,其外观面积99是以虚线表示。如图7A所示,金属板98具有一八角型的外观面积形状,且为实心结构。如图7B所示,金属板98具有一八角型的外观面积形状,且具有一空的中间部分54。如图7C所示,金属板98具有一八角型的外观面积形状,且具有一缝隙100形成于其中。如图7D所示,金属板98具有一八角型的外观面积形状,具有一空的中间部分54和一缝隙100形成于其中。亦需注意的是,如图7D所示,一连接部102从金属板98延展而出,此部分可用以做为金属板98与集成电路进行连接时的电性连接点。如此的连接部102可为任何形状,且可从本实施例的任一金属板98的任何合适部分或边缘延展而出。如图7A中,金属板98具有一拥有圆形边角的长方型外观面积形状,且为实心结构。在图7F中,金属板98具有一拥有圆形边角的长方型外观面积形状,且具有一空的中间部分54。以及,在图7G中,金属板98具有一拥有圆形边角的长方型外观面积形状,且具有一缝隙100形成于其中。值得注意的是,显示于图7A至图7G中仅是部分的实施例,其并未展示出所有可能的形状。
将本发明比第一金属板41的第一外观面积71还大的俯视外观面积80,和图1和图2所示的粘接电结构22进行比较后,本发明可提供一较强的结构,藉以抵挡较大外力。下述的式子可帮助解释此特点。对图1和图2所示的粘接垫结构22而言,于粘合制程时,进行连线拖拉的步骤时,其可抵挡的最大的张力(F1)为:
F1=σ1A1
其中σ1为第三金属板43和下层介电层间的最大粘合力。A1为图2粘接垫结构22的俯视外观面积80。
相同的式子亦可用于本发明的第一和第二实施例中,藉以估计粘接垫结构61或62其可抵挡的最大的张力(F2)为:
F2=σ2A2
其中σ2为第三金属板43和第二金属板42间,或第三金属板43和其下层介电层间的最大粘合力。A2为图4和图6粘接垫结构的俯视外观面积80。假若所有的因素,如粘接垫和第一金属板的材料、大小和形状相同,则σ2=σ1,因此:
F2=σ1A2
因此,当等效面积(A2)增加时,亦即,俯视外观面积增加,粘接垫结构可抵挡的最大的张力(F2)亦随的增加。抵挡力增加的百分率可由面积增加的大小(ΔA)来加以表示,其中A2=A1+ΔA:
抵挡力增加的百分率(%reinforcement)
=(F2-F1)/F1
=(σ1A2-σ1A1)/σ1A1=(A2-A1)/A1
=(ΔA+A1-A1)/A1=ΔA/A1
面积的增加亦可以下式表示:
ΔA=xA2
其中X为一实施例的俯视外观面积比例,在如此的情况中,抵挡力增加的百分率可由下式表示:
抵挡力增加的百分率%reinforcement
=ΔA/A1=xA2/A1
请参阅图8所示,显示三条曲线分别代表三种实施例下所形成的粘接垫结构,藉由增加额外面积ΔA或比率x,其可增加的抵挡力百分率。如图8中的第一条曲线111代表一实施例中其第一、第二和第三金属板41、42和43为实心结构。图8中的第二条曲线112代表一实施例中,其第一、第二和第三金属板41、42和43为实心结构。在图8中的第二条曲线112代表一实施例中,其第一金属板41具有一缝隙,而第二和第三金属板42和43为实心结构。以及,在图8中的第三条曲线113代表一实施例中,其第一金属板41具有空的中间部分54,而第二和第三金属板42和43为实心结构。图8所示以及上述的式子所述,当等效可拉面积增加时,亦即粘接垫结构的俯视外观面积80增加,其抵挡力的百分率亦可增加。
有关于本发明实施例所使用的材料,金属板41、42、43和98可由相同或不同的材料来加以形成,亦即第一斤属板和第二金属板可由不同的材料形成。一金属板可由任何合适的结构性材料来加以形成,例如包括但不限定为铜、铝、钛、钨、或其合金、或其复合物、或其组合物。相似的,于一实施例中粘接垫结构的粘接垫部分38亦可由任何合适的结构性材料来加以形成,例如包括但不限定为铜、铝、钛、钨、或其合金、或其复合物、或其组合物。此外,连接洞51和52亦可由任何合适的结构性材料来加以形成,例如包括但不限定为铜、铝、钛、钨、或其合金、或其复合物、或其组合物。围绕于粘接垫结构或为于其下方的介电层材料,可为任何合适的介电材料结,例如包括但不限定为低介电常数述的介电材料、超低介电常数述的介电材料、氧化物、氮化物、氮氧化物和其组合物。
虽然,图式或说明书中所描述者为位于三层中的三金属板,但粘接垫结构亦可例如仅具有位于两层中的两金属板。此外,于其他的实施例中,粘接垫结构亦可具有位于不同层中的四、五或六金属板。
以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的结构及技术内容作出些许的更动或修饰为等同变化的等效实施例,但是凡是未脱离本发明技术方案的内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。
Claims (10)
1、一种至少包括一粘接垫结构的集成电路芯片,其特征在于其中该粘接垫结构至少包括:
一粘接垫;
一第一金属板位于该粘接垫下方,其中该第一金属板具有一第一外观面积;以及
一第二金属板位于该第一金属板下方,其中该第一金属板和该第二金属板聚积而成的顶视外观面积大于该第一金属板的该第一外观面积。
2、根据权利要求1所述的接垫结构的集成电路芯片,其特征在于其中所述的第二金属板具有一第二外观面积,该第二外观面积实质上大于或等于该第一外观面积。
3、根据权利要求2所述的接垫结构的集成电路芯片,其特征在于其中一第一垂直轴从该第一金属板的质量中心延展而出,该第二金属板的质量中心是侧偏于该第一垂直轴。
4、根据权利要求1所述的接垫结构的集成电路芯片,其特征在于其中所述的粘接垫结构更包括一第三金属板位于第二金属板下方,其中该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第一金属板的该第一外观面积。
5、根据权利要求1所述的接垫结构的集成电路芯片,其特征在于其中所述的粘接垫结构更包括一第三金属板位于第二金属板下方,其中该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第一金属板的该第一外观面积,且该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第二金属板的该第二外观面积。
6、根据权利要求1所述的接垫结构的集成电路芯片,其特征在于其中所述的粘接垫结构更包括一第三金属板位于第二金属板下方,其中该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第一金属板的该第一外观面积,且该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第二金属板的该第二外观面积,且该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第三金属板的该第三外观面积。
7、根据权利要求1所述的接垫结构的集成电路芯片,其特征在于其中所述的粘接垫具有一粘接垫外观面积,且其中该第一外观面积实质上等于或大于该粘接垫外观面积。
8、一种至少包括一粘接垫结构的集成电路芯片,其特征在于粘接垫结构至少包括:
一粘接垫;
一第一金属板位于该粘接垫下方,其中一第一垂直轴从该第一金属板的质量中心延展而出;以及
一第二金属板位于该第一金属板下方,其中该第二金属板的质量中心是侧偏于该第一垂直轴。
9、根据权利要求8所述的接垫结构的集成电路芯片,其特征在于其中所述的第一金属板具有一第一外观面积,该第二金属板具有一第二外观面积,该第二外观面积实质上大于或等于该第一外观面积。
10、根据权利要求9所述的接垫结构的集成电路芯片,其特征在于其中一第二垂直轴从该第二金属板的质量中心延展而出,且其中该粘接垫结构更包括一第三金属板是位于第二金属板下方,该第三金属板具有一第三外观面积,该第三外观面积实质上大于或等于该第一外观面积,且该第三金属板的质量中心是侧偏于该第一垂直轴,该第三外观面积面积实质上大于或等于该第二外观面积,且该第三金属板的质量中心是侧偏于该第二垂直轴,且其中该第一、该第二和该第三金属板聚积而成的顶视外观面积大于该第三外观面积。
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