CN1812071B - 基板处理装置 - Google Patents

基板处理装置 Download PDF

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Publication number
CN1812071B
CN1812071B CN2006100513629A CN200610051362A CN1812071B CN 1812071 B CN1812071 B CN 1812071B CN 2006100513629 A CN2006100513629 A CN 2006100513629A CN 200610051362 A CN200610051362 A CN 200610051362A CN 1812071 B CN1812071 B CN 1812071B
Authority
CN
China
Prior art keywords
substrate
handling part
mentioned
conveyance
carrying channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006100513629A
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English (en)
Chinese (zh)
Other versions
CN1812071A (zh
Inventor
小田裕史
川根旬平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Publication of CN1812071A publication Critical patent/CN1812071A/zh
Application granted granted Critical
Publication of CN1812071B publication Critical patent/CN1812071B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3064—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN2006100513629A 2005-01-17 2006-01-05 基板处理装置 Expired - Fee Related CN1812071B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005009175A JP4563191B2 (ja) 2005-01-17 2005-01-17 基板処理装置
JP2005-009175 2005-01-17
JP2005009175 2005-01-17

Publications (2)

Publication Number Publication Date
CN1812071A CN1812071A (zh) 2006-08-02
CN1812071B true CN1812071B (zh) 2011-08-03

Family

ID=36802642

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006100513629A Expired - Fee Related CN1812071B (zh) 2005-01-17 2006-01-05 基板处理装置

Country Status (4)

Country Link
JP (1) JP4563191B2 (ja)
KR (1) KR100671251B1 (ja)
CN (1) CN1812071B (ja)
TW (1) TWI271373B (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4523498B2 (ja) * 2005-06-27 2010-08-11 東京エレクトロン株式会社 現像処理装置及び現像処理方法
JP2008098227A (ja) * 2006-10-06 2008-04-24 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100964127B1 (ko) * 2008-08-11 2010-06-16 (주)에스티아이 슬라이딩 틸팅부를 구비한 평판 디스플레이의 습윤 공정 처리 장치
KR100982744B1 (ko) 2008-12-30 2010-09-16 주식회사 케이씨텍 기판 세정장치
JP4696165B2 (ja) * 2009-02-03 2011-06-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5446403B2 (ja) * 2009-04-07 2014-03-19 株式会社Ｉｈｉ 搬送方向転換装置及び浮上搬送システム
JP5471604B2 (ja) * 2010-03-03 2014-04-16 株式会社Ｉｈｉ 浮上搬送装置
JP5471645B2 (ja) * 2010-03-15 2014-04-16 株式会社Ｉｈｉ 浮上搬送装置
TWI462215B (zh) * 2010-03-29 2014-11-21 Dainippon Screen Mfg 基板處理裝置、轉換方法、及轉移方法
TW201206803A (en) * 2010-04-14 2012-02-16 Tae Sung Eng Co Ltd Multi-gate conveyor
JP5445863B2 (ja) * 2010-08-04 2014-03-19 株式会社ダイフク 板状体搬送装置
CN102815488B (zh) * 2011-06-07 2014-12-10 深圳中集天达空港设备有限公司 出入库装置及具有该装置的仓库
JP2013043106A (ja) * 2011-08-23 2013-03-04 Dainippon Screen Mfg Co Ltd 基板処理装置
KR101234593B1 (ko) * 2011-11-15 2013-02-19 김영환 와이어 연결형 롤러를 이용한 고성능 세척 유도 이송유닛
CN106103317B (zh) * 2014-03-13 2017-12-12 株式会社村田制作所 姿势变换装置、排列装置及姿势变换方法、排列方法
CN104816947B (zh) * 2015-04-27 2017-03-01 深圳市华星光电技术有限公司 液晶面板传送装置
WO2018035235A1 (en) 2016-08-16 2018-02-22 Donaldson Company, Inc. Hydrocarbon fluid-water separation
CN112154020B (zh) 2018-02-15 2022-07-15 唐纳森公司 过滤器介质构造
AU2019222771B2 (en) * 2018-02-15 2024-06-13 Donaldson Company, Inc. Substrate treatments
CN112239068A (zh) * 2019-07-19 2021-01-19 亚智科技股份有限公司 条棒式基板运输装置及其方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07283185A (ja) * 1994-04-08 1995-10-27 Casio Comput Co Ltd 基板洗浄装置
JP2001230299A (ja) * 2000-02-18 2001-08-24 Sumitomo Precision Prod Co Ltd 基板処理設備

Also Published As

Publication number Publication date
KR20060083866A (ko) 2006-07-21
JP2006196834A (ja) 2006-07-27
TW200626453A (en) 2006-08-01
TWI271373B (en) 2007-01-21
KR100671251B1 (ko) 2007-01-19
CN1812071A (zh) 2006-08-02
JP4563191B2 (ja) 2010-10-13

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110803

Termination date: 20140105