CN1812071B - 基板处理装置 - Google Patents
基板处理装置 Download PDFInfo
- Publication number
- CN1812071B CN1812071B CN2006100513629A CN200610051362A CN1812071B CN 1812071 B CN1812071 B CN 1812071B CN 2006100513629 A CN2006100513629 A CN 2006100513629A CN 200610051362 A CN200610051362 A CN 200610051362A CN 1812071 B CN1812071 B CN 1812071B
- Authority
- CN
- China
- Prior art keywords
- substrate
- handling part
- mentioned
- conveyance
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 521
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 239000012530 fluid Substances 0.000 claims description 17
- 238000003860 storage Methods 0.000 claims description 12
- 238000012546 transfer Methods 0.000 claims description 11
- 238000012545 processing Methods 0.000 abstract description 20
- 239000007788 liquid Substances 0.000 abstract description 7
- 238000009434 installation Methods 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 14
- 238000011144 upstream manufacturing Methods 0.000 description 14
- 238000001035 drying Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 206010034719 Personality change Diseases 0.000 description 7
- 238000005406 washing Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
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- 239000007921 spray Substances 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3064—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005009175A JP4563191B2 (ja) | 2005-01-17 | 2005-01-17 | 基板処理装置 |
JP2005-009175 | 2005-01-17 | ||
JP2005009175 | 2005-01-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1812071A CN1812071A (zh) | 2006-08-02 |
CN1812071B true CN1812071B (zh) | 2011-08-03 |
Family
ID=36802642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100513629A Expired - Fee Related CN1812071B (zh) | 2005-01-17 | 2006-01-05 | 基板处理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4563191B2 (ja) |
KR (1) | KR100671251B1 (ja) |
CN (1) | CN1812071B (ja) |
TW (1) | TWI271373B (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4523498B2 (ja) * | 2005-06-27 | 2010-08-11 | 東京エレクトロン株式会社 | 現像処理装置及び現像処理方法 |
JP2008098227A (ja) * | 2006-10-06 | 2008-04-24 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
KR100964127B1 (ko) * | 2008-08-11 | 2010-06-16 | (주)에스티아이 | 슬라이딩 틸팅부를 구비한 평판 디스플레이의 습윤 공정 처리 장치 |
KR100982744B1 (ko) | 2008-12-30 | 2010-09-16 | 주식회사 케이씨텍 | 기판 세정장치 |
JP4696165B2 (ja) * | 2009-02-03 | 2011-06-08 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
JP5446403B2 (ja) * | 2009-04-07 | 2014-03-19 | 株式会社Ihi | 搬送方向転換装置及び浮上搬送システム |
JP5471604B2 (ja) * | 2010-03-03 | 2014-04-16 | 株式会社Ihi | 浮上搬送装置 |
JP5471645B2 (ja) * | 2010-03-15 | 2014-04-16 | 株式会社Ihi | 浮上搬送装置 |
TWI462215B (zh) * | 2010-03-29 | 2014-11-21 | Dainippon Screen Mfg | 基板處理裝置、轉換方法、及轉移方法 |
TW201206803A (en) * | 2010-04-14 | 2012-02-16 | Tae Sung Eng Co Ltd | Multi-gate conveyor |
JP5445863B2 (ja) * | 2010-08-04 | 2014-03-19 | 株式会社ダイフク | 板状体搬送装置 |
CN102815488B (zh) * | 2011-06-07 | 2014-12-10 | 深圳中集天达空港设备有限公司 | 出入库装置及具有该装置的仓库 |
JP2013043106A (ja) * | 2011-08-23 | 2013-03-04 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
KR101234593B1 (ko) * | 2011-11-15 | 2013-02-19 | 김영환 | 와이어 연결형 롤러를 이용한 고성능 세척 유도 이송유닛 |
CN106103317B (zh) * | 2014-03-13 | 2017-12-12 | 株式会社村田制作所 | 姿势变换装置、排列装置及姿势变换方法、排列方法 |
CN104816947B (zh) * | 2015-04-27 | 2017-03-01 | 深圳市华星光电技术有限公司 | 液晶面板传送装置 |
WO2018035235A1 (en) | 2016-08-16 | 2018-02-22 | Donaldson Company, Inc. | Hydrocarbon fluid-water separation |
CN112154020B (zh) | 2018-02-15 | 2022-07-15 | 唐纳森公司 | 过滤器介质构造 |
AU2019222771B2 (en) * | 2018-02-15 | 2024-06-13 | Donaldson Company, Inc. | Substrate treatments |
CN112239068A (zh) * | 2019-07-19 | 2021-01-19 | 亚智科技股份有限公司 | 条棒式基板运输装置及其方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283185A (ja) * | 1994-04-08 | 1995-10-27 | Casio Comput Co Ltd | 基板洗浄装置 |
JP2001230299A (ja) * | 2000-02-18 | 2001-08-24 | Sumitomo Precision Prod Co Ltd | 基板処理設備 |
-
2005
- 2005-01-17 JP JP2005009175A patent/JP4563191B2/ja not_active Expired - Fee Related
- 2005-12-08 TW TW094143339A patent/TWI271373B/zh not_active IP Right Cessation
-
2006
- 2006-01-05 CN CN2006100513629A patent/CN1812071B/zh not_active Expired - Fee Related
- 2006-01-10 KR KR1020060002889A patent/KR100671251B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20060083866A (ko) | 2006-07-21 |
JP2006196834A (ja) | 2006-07-27 |
TW200626453A (en) | 2006-08-01 |
TWI271373B (en) | 2007-01-21 |
KR100671251B1 (ko) | 2007-01-19 |
CN1812071A (zh) | 2006-08-02 |
JP4563191B2 (ja) | 2010-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110803 Termination date: 20140105 |