JP2006196834A - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP2006196834A JP2006196834A JP2005009175A JP2005009175A JP2006196834A JP 2006196834 A JP2006196834 A JP 2006196834A JP 2005009175 A JP2005009175 A JP 2005009175A JP 2005009175 A JP2005009175 A JP 2005009175A JP 2006196834 A JP2006196834 A JP 2006196834A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3064—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
【解決手段】 第1処理部20で処理が施された後の基板を、搬送方向転換部40が搬送方向を転換し、その傾斜搬送部49によって、第1搬送路41の勾配で傾斜姿勢とされた状態を略維持したまま第2搬送路43まで搬送する。この傾斜搬送部49によって搬送される基板Bの主面に対しては液供給部が処理液を供給する。第2搬送路43及び第2処理部30では、傾斜搬送部49によって傾斜姿勢が保たれている基板を、そのままの姿勢で第1処理部20とは逆方向に搬送させて処理する。
【選択図】 図5
Description
前記第1処理部と略平行に配置され、前記予め定められた方向とは逆方向に基板を搬送させつつ当該基板を処理する第2処理部と、
前記第1処理部の基板搬送終了端と前記第2処理部の基板搬送開始端との間で基板を搬送しながら、前記第1処理部による基板搬送方向を前記第2処理部による基板搬送方向に転換する搬送方向転換部とを備えた基板処理装置において、
前記搬送方向転換部は、前記第1処理部の基板搬送終了端から基板を受け取り、基板搬送方向に向けて勾配を有する第1搬送路と、
前記第1搬送路が有する前記勾配によって傾斜された基板の姿勢を略維持した状態で基板を搬送する傾斜搬送部と、
前記傾斜搬送部によって搬送される基板の主面に処理液を供給する液供給手段と
を備えるものである。
前記傾斜搬送部は、前記搬送方向転換装置から受け取った基板を、前記第1処理部による基板搬送方向と同一方向であって、かつ、当該傾斜搬送部による基板搬送方向に直交する方向に傾斜させて搬送するものである。
12 基板搬送ローラ
20 第1処理部
21 基板立替装置
29 基板搬送路
30 第2処理部
39 基板搬送路
40 搬送方向転換部
41 第1搬送路
42 液供給部
43 第2搬送路
49 傾斜搬送部
60 基板昇降装置
61 ローラ支持枠体
62 方向転換ローラ
63 支持軸
80 基板昇降装置
81 ローラ支持枠体
82 方向転換ローラ
121 分割搬送ローラ
211 基板載置部
212 シリンダ
B 基板
C 基板収納カセット
R ロボット部
Claims (5)
- 予め定められた方向に基板を搬送させつつ当該基板を処理する第1処理部と、
前記第1処理部と略平行に配置され、前記予め定められた方向とは逆方向に基板を搬送させつつ当該基板を処理する第2処理部と、
前記第1処理部の基板搬送終了端と前記第2処理部の基板搬送開始端との間で基板を搬送しながら、前記第1処理部による基板搬送方向を前記第2処理部による基板搬送方向に転換する搬送方向転換部とを備えた基板処理装置において、
前記搬送方向転換部は、前記第1処理部の基板搬送終了端から基板を受け取り、基板搬送方向に向けて勾配を有する第1搬送路と、
前記第1搬送路が有する前記勾配によって傾斜された基板の姿勢を略維持した状態で基板を搬送する傾斜搬送部と、
前記傾斜搬送部によって搬送される基板の主面に処理液を供給する液供給手段と
を備える基板処理装置。 - 前記傾斜搬送部から搬送されてくる基板を、その傾斜姿勢を略維持しつつ、前記第2処理部の基板搬送開始端に向けて搬送し、基板搬送方向に対して前記第1搬送路の前記勾配とは反対方向に傾斜した勾配を有する第2搬送路を備えた請求項1に記載の基板処理装置。
- 前記第1搬送路には、当該第1搬送路の勾配によって付与される基板傾斜姿勢を維持したまま、前記第1処理部による基板搬送方向に直交する方向に基板搬送方向を転換する搬送方向転換装置が設けられ、
前記傾斜搬送部は、前記搬送方向転換装置から受け取った基板を、前記第1処理部による基板搬送方向と同一方向であって、かつ、当該傾斜搬送部による基板搬送方向に直交する方向に傾斜させて搬送する請求項2に記載の基板処理装置。 - 前記第2搬送路には、前記傾斜搬送部によって搬送される基板の傾斜姿勢を維持したまま、前記第2処理部による基板搬送方向に基板搬送方向を転換する搬送方向転換装置がさらに設けられている請求項3に記載の基板処理装置。
- 前記第1処理部又は第2処理部には、前記第1搬送路又は第2搬送路の勾配と同一の勾配が形成され、基板収納カセットから基板を出し入れする基板搬送ロボットとの間で基板を受け渡し、前記第1処理部又は第2処理部に基板を載置する基板受け渡し機構が設けられている請求項1乃至請求項4のいずれかに記載の基板処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005009175A JP4563191B2 (ja) | 2005-01-17 | 2005-01-17 | 基板処理装置 |
TW094143339A TWI271373B (en) | 2005-01-17 | 2005-12-08 | Substrate processing apparatus |
CN2006100513629A CN1812071B (zh) | 2005-01-17 | 2006-01-05 | 基板处理装置 |
KR1020060002889A KR100671251B1 (ko) | 2005-01-17 | 2006-01-10 | 기판 처리 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005009175A JP4563191B2 (ja) | 2005-01-17 | 2005-01-17 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006196834A true JP2006196834A (ja) | 2006-07-27 |
JP4563191B2 JP4563191B2 (ja) | 2010-10-13 |
Family
ID=36802642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005009175A Expired - Fee Related JP4563191B2 (ja) | 2005-01-17 | 2005-01-17 | 基板処理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4563191B2 (ja) |
KR (1) | KR100671251B1 (ja) |
CN (1) | CN1812071B (ja) |
TW (1) | TWI271373B (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007005695A (ja) * | 2005-06-27 | 2007-01-11 | Tokyo Electron Ltd | 基板処理装置 |
JP2008098227A (ja) * | 2006-10-06 | 2008-04-24 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2010182755A (ja) * | 2009-02-03 | 2010-08-19 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
KR100982744B1 (ko) | 2008-12-30 | 2010-09-16 | 주식회사 케이씨텍 | 기판 세정장치 |
JP2011178543A (ja) * | 2010-03-03 | 2011-09-15 | Ihi Corp | 浮上搬送装置 |
JP2011190037A (ja) * | 2010-03-15 | 2011-09-29 | Ihi Corp | 浮上搬送装置 |
JP2012035940A (ja) * | 2010-08-04 | 2012-02-23 | Daifuku Co Ltd | 板状体搬送装置 |
JP2013043106A (ja) * | 2011-08-23 | 2013-03-04 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
CN103100533A (zh) * | 2011-11-15 | 2013-05-15 | 金荣焕 | 使用导线连结型轧辊之高性能清洗感应移送单元 |
TWI403449B (zh) * | 2009-04-07 | 2013-08-01 | Ihi Corp | Transport direction conversion device and floating handling system |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100964127B1 (ko) * | 2008-08-11 | 2010-06-16 | (주)에스티아이 | 슬라이딩 틸팅부를 구비한 평판 디스플레이의 습윤 공정 처리 장치 |
TWI462215B (zh) * | 2010-03-29 | 2014-11-21 | Dainippon Screen Mfg | 基板處理裝置、轉換方法、及轉移方法 |
TW201206803A (en) * | 2010-04-14 | 2012-02-16 | Tae Sung Eng Co Ltd | Multi-gate conveyor |
CN102815488B (zh) * | 2011-06-07 | 2014-12-10 | 深圳中集天达空港设备有限公司 | 出入库装置及具有该装置的仓库 |
KR101784245B1 (ko) * | 2014-03-13 | 2017-10-11 | 가부시키가이샤 무라타 세이사쿠쇼 | 자세 변환 장치, 정렬 장치, 자세 변환 방법, 및 정렬 방법 |
CN104816947B (zh) * | 2015-04-27 | 2017-03-01 | 深圳市华星光电技术有限公司 | 液晶面板传送装置 |
US10315140B2 (en) | 2016-08-16 | 2019-06-11 | Donaldson Company, Inc. | Hydrocarbon fluid-water separation |
MX2020008526A (es) | 2018-02-15 | 2020-09-18 | Donaldson Co Inc | Configuraciones de medios de filtro. |
AU2019222771B2 (en) * | 2018-02-15 | 2024-06-13 | Donaldson Company, Inc. | Substrate treatments |
CN112239068A (zh) * | 2019-07-19 | 2021-01-19 | 亚智科技股份有限公司 | 条棒式基板运输装置及其方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283185A (ja) * | 1994-04-08 | 1995-10-27 | Casio Comput Co Ltd | 基板洗浄装置 |
JP2001230299A (ja) * | 2000-02-18 | 2001-08-24 | Sumitomo Precision Prod Co Ltd | 基板処理設備 |
-
2005
- 2005-01-17 JP JP2005009175A patent/JP4563191B2/ja not_active Expired - Fee Related
- 2005-12-08 TW TW094143339A patent/TWI271373B/zh not_active IP Right Cessation
-
2006
- 2006-01-05 CN CN2006100513629A patent/CN1812071B/zh not_active Expired - Fee Related
- 2006-01-10 KR KR1020060002889A patent/KR100671251B1/ko not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283185A (ja) * | 1994-04-08 | 1995-10-27 | Casio Comput Co Ltd | 基板洗浄装置 |
JP2001230299A (ja) * | 2000-02-18 | 2001-08-24 | Sumitomo Precision Prod Co Ltd | 基板処理設備 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4523498B2 (ja) * | 2005-06-27 | 2010-08-11 | 東京エレクトロン株式会社 | 現像処理装置及び現像処理方法 |
JP2007005695A (ja) * | 2005-06-27 | 2007-01-11 | Tokyo Electron Ltd | 基板処理装置 |
JP2008098227A (ja) * | 2006-10-06 | 2008-04-24 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
KR100982744B1 (ko) | 2008-12-30 | 2010-09-16 | 주식회사 케이씨텍 | 기판 세정장치 |
JP2010182755A (ja) * | 2009-02-03 | 2010-08-19 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP4696165B2 (ja) * | 2009-02-03 | 2011-06-08 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
KR101555717B1 (ko) * | 2009-02-03 | 2015-09-25 | 도쿄엘렉트론가부시키가이샤 | 기판처리장치 및 기판처리방법 |
TWI403449B (zh) * | 2009-04-07 | 2013-08-01 | Ihi Corp | Transport direction conversion device and floating handling system |
JP2011178543A (ja) * | 2010-03-03 | 2011-09-15 | Ihi Corp | 浮上搬送装置 |
JP2011190037A (ja) * | 2010-03-15 | 2011-09-29 | Ihi Corp | 浮上搬送装置 |
JP2012035940A (ja) * | 2010-08-04 | 2012-02-23 | Daifuku Co Ltd | 板状体搬送装置 |
JP2013043106A (ja) * | 2011-08-23 | 2013-03-04 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
CN103100533A (zh) * | 2011-11-15 | 2013-05-15 | 金荣焕 | 使用导线连结型轧辊之高性能清洗感应移送单元 |
Also Published As
Publication number | Publication date |
---|---|
TW200626453A (en) | 2006-08-01 |
TWI271373B (en) | 2007-01-21 |
KR100671251B1 (ko) | 2007-01-19 |
CN1812071B (zh) | 2011-08-03 |
KR20060083866A (ko) | 2006-07-21 |
JP4563191B2 (ja) | 2010-10-13 |
CN1812071A (zh) | 2006-08-02 |
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