CN1793195A - 有机蒙脱土改性环氧树脂 - Google Patents
有机蒙脱土改性环氧树脂 Download PDFInfo
- Publication number
- CN1793195A CN1793195A CN 200510022412 CN200510022412A CN1793195A CN 1793195 A CN1793195 A CN 1793195A CN 200510022412 CN200510022412 CN 200510022412 CN 200510022412 A CN200510022412 A CN 200510022412A CN 1793195 A CN1793195 A CN 1793195A
- Authority
- CN
- China
- Prior art keywords
- organo montmorillonite
- epoxy
- imvite modified
- resins
- epoxyresin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 31
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 31
- 230000008961 swelling Effects 0.000 claims abstract description 19
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 58
- -1 organo montmorillonite Chemical compound 0.000 claims description 57
- 239000004593 Epoxy Substances 0.000 claims description 41
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 238000002156 mixing Methods 0.000 claims description 17
- 238000003756 stirring Methods 0.000 claims description 17
- 238000002360 preparation method Methods 0.000 claims description 16
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 12
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 10
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 10
- 239000003960 organic solvent Substances 0.000 claims description 8
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid group Chemical group C(C=1C(C(=O)O)=CC=CC1)(=O)O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 8
- 238000010792 warming Methods 0.000 claims description 7
- ZCPCLAPUXMZUCD-UHFFFAOYSA-M dihexadecyl(dimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCC ZCPCLAPUXMZUCD-UHFFFAOYSA-M 0.000 claims description 4
- REZZEXDLIUJMMS-UHFFFAOYSA-M dimethyldioctadecylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC REZZEXDLIUJMMS-UHFFFAOYSA-M 0.000 claims description 4
- 239000004664 distearyldimethylammonium chloride (DHTDMAC) Substances 0.000 claims description 4
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000005342 ion exchange Methods 0.000 claims description 3
- GZTMDLIDGQGZFL-UHFFFAOYSA-M [Cl-].[NH4+].C(C1=CC=CC=C1)C(C1=CC=CC=C1)[N+](C)(C)CCCCCCCCCCCCCCCC.[Cl-] Chemical compound [Cl-].[NH4+].C(C1=CC=CC=C1)C(C1=CC=CC=C1)[N+](C)(C)CCCCCCCCCCCCCCCC.[Cl-] GZTMDLIDGQGZFL-UHFFFAOYSA-M 0.000 claims description 2
- 238000000227 grinding Methods 0.000 claims description 2
- 230000008595 infiltration Effects 0.000 claims description 2
- 238000001764 infiltration Methods 0.000 claims description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 abstract description 2
- 239000004927 clay Substances 0.000 abstract 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- 239000004568 cement Substances 0.000 abstract 1
- 238000005325 percolation Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000002114 nanocomposite Substances 0.000 description 7
- 239000002086 nanomaterial Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 241000446313 Lamella Species 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- 238000010008 shearing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000009830 intercalation Methods 0.000 description 3
- 230000002687 intercalation Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910017059 organic montmorillonite Inorganic materials 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012496 blank sample Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000005543 nano-size silicon particle Substances 0.000 description 1
- 239000011858 nanopowder Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000004760 silicates Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
编号 | 有机蒙脱土加入量(重量比) | 拉伸强度(Mpa) | 剪切强度(Mpa) |
0 | 空白样 | 19.6 | 6.6 |
1 | 1% | 11.0 | 11.3 |
2 | 3% | 24.0 | 9.4 |
3 | 5% | 28.7 | 16.1 |
4 | 7% | 30.7 | 15.5 |
5 | 9% | 27.1 | 15.1 |
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100224126A CN100334124C (zh) | 2005-12-27 | 2005-12-27 | 有机蒙脱土改性环氧树脂 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100224126A CN100334124C (zh) | 2005-12-27 | 2005-12-27 | 有机蒙脱土改性环氧树脂 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1793195A true CN1793195A (zh) | 2006-06-28 |
CN100334124C CN100334124C (zh) | 2007-08-29 |
Family
ID=36804853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100224126A Expired - Fee Related CN100334124C (zh) | 2005-12-27 | 2005-12-27 | 有机蒙脱土改性环氧树脂 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100334124C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105623197A (zh) * | 2016-04-08 | 2016-06-01 | 章俊 | 一种环氧树脂纳米塑料及其制备方法 |
CN107507692A (zh) * | 2017-10-10 | 2017-12-22 | 徐州赛欧电子科技有限公司 | 一种防锈散热的架立式变压器 |
CN109161076A (zh) * | 2018-07-26 | 2019-01-08 | 徐州辛辛那提新型材料有限公司 | 一种高抗冲击性防腐轻质pe实壁管的制备工艺 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5853886A (en) * | 1996-06-17 | 1998-12-29 | Claytec, Inc. | Hybrid nanocomposites comprising layered inorganic material and methods of preparation |
CN1250064A (zh) * | 1998-10-06 | 2000-04-12 | 中国科学院化学研究所 | 一种环氧树脂/蒙脱土插层复合材料的制备方法 |
CN1250790A (zh) * | 1998-10-13 | 2000-04-19 | 中国科学院化学研究所 | 一种抗流淌环氧树脂/蒙脱土复合物及其制备方法 |
JP2000202937A (ja) * | 1999-01-14 | 2000-07-25 | Toppan Printing Co Ltd | 蒸着フィルム積層包装材料 |
CN1288206C (zh) * | 2001-12-26 | 2006-12-06 | 河北工业大学 | 一种环氧树脂/蒙脱土纳米复合材料及其制备方法 |
-
2005
- 2005-12-27 CN CNB2005100224126A patent/CN100334124C/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105623197A (zh) * | 2016-04-08 | 2016-06-01 | 章俊 | 一种环氧树脂纳米塑料及其制备方法 |
CN107507692A (zh) * | 2017-10-10 | 2017-12-22 | 徐州赛欧电子科技有限公司 | 一种防锈散热的架立式变压器 |
CN109161076A (zh) * | 2018-07-26 | 2019-01-08 | 徐州辛辛那提新型材料有限公司 | 一种高抗冲击性防腐轻质pe实壁管的制备工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN100334124C (zh) | 2007-08-29 |
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Owner name: CHENGDU ZHENGGUANG INVESTMENT GROUP CO., LTD. Free format text: FORMER OWNER: CHENGDU ZHENGGUANG NANO TECHNOLOGY CO., LTD. Effective date: 20100413 |
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