CN1788040A - 热塑性塑料用透明母料 - Google Patents
热塑性塑料用透明母料 Download PDFInfo
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- CN1788040A CN1788040A CNA2004800127929A CN200480012792A CN1788040A CN 1788040 A CN1788040 A CN 1788040A CN A2004800127929 A CNA2004800127929 A CN A2004800127929A CN 200480012792 A CN200480012792 A CN 200480012792A CN 1788040 A CN1788040 A CN 1788040A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
- C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/46—Block-or graft-polymers containing polysiloxane sequences containing polyether sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
Abstract
Description
实例 | 聚合物 | 多面低聚硅-氧簇 | 本发明 | |
数量(wt%) | 来自实例 | |||
2.1 | 聚对苯二甲酸丁二醇酯(VESTODUR1000) | 15 | 1.3 | × |
2.2 | 25 | 1.3 | × | |
2.3 | - | |||
2.4 | 聚酰胺12(VESTAMIDL 1700) | 18 | 1.4 | × |
2.5 | 30 | 1.4 | × | |
2.6 | - |
实例 | 聚合物 | 母料 | 多面低聚硅-氧簇在塑料中的含量(wt%) | |
来自实例 | 数量(wt%) | |||
3.1 | 聚对苯二甲酸丁二醇酯(VESTODUR1000) | 2.1 | 3.3 | 0.5 |
3.2 | 聚对苯二甲酸丁二醇酯(VESTODUR1000) | 2.2 | 4.0 | 1.0 |
3.3 | 聚对苯二甲酸丁二醇酯(VESTODUR1000) | - | - | 0 |
3.4 | 聚酰胺12(VESTAMIDL 1700) | 2.5 | 1.6 | 0.5 |
3.5 | 聚酰胺12(VESTAMIDL 1700) | 2.4 | 11.1 | 2 |
3.6 | 聚酰胺12(VESTAMIDL 1700) | - | - | 0 |
试样(实例) | 抗划伤 | 本发明 |
3.1 | 3 | X |
3.2 | 2 | X |
33 | 5 | |
3.4 | 3 | X |
3.5 | 1 | X |
3.6 | 5 |
试样(实例) | 触感 | 本发明 |
3.1 | 2 | X |
3.2 | 1 | X |
3.3 | 5 | |
3.4 | 2 | X |
3.5 | 1 | X |
3.6 | 5 |
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10321555.7 | 2003-05-14 | ||
DE10321555A DE10321555A1 (de) | 2003-05-14 | 2003-05-14 | Transparente Masterbatches für thermoplastische Kunstsoffe |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1788040A true CN1788040A (zh) | 2006-06-14 |
CN100443527C CN100443527C (zh) | 2008-12-17 |
Family
ID=33394550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800127929A Expired - Fee Related CN100443527C (zh) | 2003-05-14 | 2004-03-18 | 热塑性塑料用透明母料 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7598307B2 (zh) |
EP (1) | EP1622968A2 (zh) |
JP (1) | JP2006528720A (zh) |
KR (1) | KR20060015249A (zh) |
CN (1) | CN100443527C (zh) |
DE (1) | DE10321555A1 (zh) |
WO (1) | WO2004101653A2 (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103382301A (zh) * | 2013-07-03 | 2013-11-06 | 苏州市沃特新材料科技有限公司 | 聚苯醚合金材料及其制备方法 |
TWI615438B (zh) * | 2015-10-21 | 2018-02-21 | Shengyi Technology Co Ltd | 一種聚苯醚樹脂組合物及其在高頻電路基板中的應用 |
TWI615439B (zh) * | 2015-10-21 | 2018-02-21 | Shengyi Technology Co Ltd | 一種聚苯醚樹脂組合物及其在高頻電路基板中的應用 |
TWI644984B (zh) * | 2017-04-17 | 2018-12-21 | 廣東生益科技股份有限公司 | Thermosetting vinyl organic resin composition and its application in high frequency circuit boards |
TWI644983B (zh) * | 2017-04-17 | 2018-12-21 | 廣東生益科技股份有限公司 | Thermosetting vinyl organic enamel resin composition and application thereof in high frequency circuit board |
WO2021120091A1 (en) * | 2019-12-19 | 2021-06-24 | Evonik Operations Gmbh | Moulding composition comprising polyether block amide |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE602005026544D1 (de) * | 2004-09-11 | 2011-04-07 | Kumho Europ Technical Ct Operating In Europ On Behalf Of Kumho Tire Co Inc | Ein polyedrisches oligomeres silsesquioxanadditiv umfassende kautschukzusammensetzung |
EP1810993A3 (en) * | 2005-12-29 | 2009-04-22 | Hyosung Corporation | Method of preparation of polyethylenetherephthalate nanocomposite fiber with enhanced modulus |
TW200741751A (en) * | 2006-02-27 | 2007-11-01 | Union Carbide Chem Plastic | Polyolefin-based high dielectric strength (HDS) nanocomposites, compositions therefor, and related methods |
FR2925060B1 (fr) * | 2007-12-13 | 2012-12-21 | Essilor Int | Procede de preparation d'un materiau polymere transparent comprenant un polycarbonate thermoplastique et des nanoparticules minerales. |
EP2354201A3 (en) * | 2008-07-29 | 2012-09-26 | E. I. du Pont de Nemours and Company | Use of a surface active adhesion promoting agent |
CN101955594A (zh) * | 2009-07-17 | 2011-01-26 | 深圳富泰宏精密工业有限公司 | 壳体的制作方法及由该方法制得的壳体 |
TWI573903B (zh) * | 2009-08-20 | 2017-03-11 | 杜邦股份有限公司 | 用於製造聚(芳香酸丙二酯)/聚苯乙烯之成形物品之方法 |
KR101249798B1 (ko) * | 2010-08-18 | 2013-04-03 | 한국과학기술연구원 | 선택적으로 구조가 제어된 폴리실세스퀴옥산의 제조방법 및 이로부터 제조된 폴리실세스퀴옥산 |
US8691915B2 (en) | 2012-04-23 | 2014-04-08 | Sabic Innovative Plastics Ip B.V. | Copolymers and polymer blends having improved refractive indices |
US9312047B2 (en) | 2012-06-22 | 2016-04-12 | Honeywell International Inc. | Method and compositions for producing polymer blends |
KR101465611B1 (ko) * | 2014-06-25 | 2014-11-27 | 국방과학연구소 | 다면체 올리고머 실세스퀴옥산 및 무기 난연제로 보강된 폴리우레탄 복합재 |
CN108976650B (zh) * | 2018-06-20 | 2020-12-29 | 临海伟星新型建材有限公司 | 一种环保耐候型高透光pvc管道 |
CN110358301B (zh) * | 2019-07-25 | 2022-01-07 | 成都硅宝科技股份有限公司 | 一种持久耐刮擦有机硅母粒及其制备方法 |
CN114249906B (zh) * | 2021-11-10 | 2023-05-12 | 北京化工大学 | 一种透明聚酰亚胺薄膜及其制备方法和应用 |
Family Cites Families (16)
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DE4000695C2 (de) | 1990-01-12 | 1997-07-03 | Huels Chemische Werke Ag | Weitgehend amorphe Polyalphaolefine mit enger Molekulargewichtsverteilung, Verfahren zu deren Herstellung und Verwendung für Teppichschwerbeschichtungsmassen oder Schmelzklebstoffe |
DE4026719A1 (de) | 1990-08-24 | 1992-02-27 | Huels Chemische Werke Ag | Schmelzfluessig applizierbare schutzmassen |
US6362279B2 (en) * | 1996-09-27 | 2002-03-26 | The United States Of America As Represented By The Secretary Of The Air Force | Preceramic additives as fire retardants for plastics |
JP2000239398A (ja) * | 1999-02-19 | 2000-09-05 | Shin Etsu Chem Co Ltd | 熱可塑性有機樹脂とシリコーンパウダーからなるマスターバッチ |
EP1208105B1 (en) * | 1999-08-04 | 2006-10-04 | Hybrid Plastics | Process for the formation of polyhedral oligomeric silsesquioxanes |
DE19963125A1 (de) | 1999-12-24 | 2001-06-28 | Creavis Tech & Innovation Gmbh | Verfahren zur Herstellung von doppelbindungshaltigen Polymeren durch ringöffnende Polymerisation |
DE10060775A1 (de) | 2000-12-07 | 2002-06-13 | Creavis Tech & Innovation Gmbh | Oligomere Silasesquioxane und Verfahren zur Herstellung von oligomeren Silasesquioxanen |
DE10060776A1 (de) | 2000-12-07 | 2002-06-13 | Creavis Tech & Innovation Gmbh | Katalysatorsystem auf Basis von Silasesequioxan-Metallkomplexe aufweisenden Polymerverbindungen |
DE60118790T2 (de) * | 2000-12-19 | 2006-08-31 | Bausch & Lomb Incorporated | Polymere biomaterialien, die silsesquioxan-monomere enthalten |
DE10209521B4 (de) * | 2001-03-08 | 2004-04-08 | Asahi Kasei Kabushiki Kaisha | Harzzusammensetzung |
JP4662403B2 (ja) * | 2001-03-30 | 2011-03-30 | 旭化成ケミカルズ株式会社 | ポリアミド系樹脂組成物 |
US6569932B2 (en) * | 2001-07-06 | 2003-05-27 | Benjamin S. Hsiao | Blends of organic silicon compounds with ethylene-based polymers |
US6852794B2 (en) | 2001-09-07 | 2005-02-08 | The Goodyear Tire & Rubber Company | Rubber compound containing a polyhedral oligomeric silsesquioxanes |
DE10156619A1 (de) | 2001-11-17 | 2003-05-28 | Creavis Tech & Innovation Gmbh | Verfahren zur Herstellung funktionalisierter oligomerer Silasesquioxane sowie deren Verwendung |
WO2003042292A2 (de) * | 2001-11-17 | 2003-05-22 | Creavis Gesellschaft Für Technologie Und Innovation Mbh | Polyolefinzusammensetzungen, verfahren zu deren herstellung und verwendung dieser zusammensetzungen |
DE10331787A1 (de) | 2003-07-11 | 2005-02-17 | Degussa Ag | NCO-haltige Verbindungen mit kovalent gebundenen polyedrischen oligomeren Silizium-Sauerstoffclustereinheiten |
-
2003
- 2003-05-14 DE DE10321555A patent/DE10321555A1/de not_active Withdrawn
-
2004
- 2004-03-18 EP EP04721545A patent/EP1622968A2/en not_active Withdrawn
- 2004-03-18 JP JP2006530162A patent/JP2006528720A/ja active Pending
- 2004-03-18 CN CNB2004800127929A patent/CN100443527C/zh not_active Expired - Fee Related
- 2004-03-18 KR KR1020057021651A patent/KR20060015249A/ko not_active Application Discontinuation
- 2004-03-18 US US10/556,719 patent/US7598307B2/en not_active Expired - Fee Related
- 2004-03-18 WO PCT/EP2004/050327 patent/WO2004101653A2/en active Application Filing
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103382301A (zh) * | 2013-07-03 | 2013-11-06 | 苏州市沃特新材料科技有限公司 | 聚苯醚合金材料及其制备方法 |
CN103382301B (zh) * | 2013-07-03 | 2015-10-28 | 江苏沃特新材料科技有限公司 | 聚苯醚合金材料及其制备方法 |
TWI615438B (zh) * | 2015-10-21 | 2018-02-21 | Shengyi Technology Co Ltd | 一種聚苯醚樹脂組合物及其在高頻電路基板中的應用 |
TWI615439B (zh) * | 2015-10-21 | 2018-02-21 | Shengyi Technology Co Ltd | 一種聚苯醚樹脂組合物及其在高頻電路基板中的應用 |
US10645806B2 (en) | 2015-10-21 | 2020-05-05 | Shengyi Technology Co., Ltd. | Polyphenyl ether resin composition and use thereof in high-frequency circuit substrate |
US10745599B2 (en) | 2015-10-21 | 2020-08-18 | Shengyi Technology Co., Ltd. | Polyphenyl ether resin composition and use thereof in high-frequency circuit substrate |
TWI644984B (zh) * | 2017-04-17 | 2018-12-21 | 廣東生益科技股份有限公司 | Thermosetting vinyl organic resin composition and its application in high frequency circuit boards |
TWI644983B (zh) * | 2017-04-17 | 2018-12-21 | 廣東生益科技股份有限公司 | Thermosetting vinyl organic enamel resin composition and application thereof in high frequency circuit board |
WO2021120091A1 (en) * | 2019-12-19 | 2021-06-24 | Evonik Operations Gmbh | Moulding composition comprising polyether block amide |
Also Published As
Publication number | Publication date |
---|---|
US7598307B2 (en) | 2009-10-06 |
DE10321555A1 (de) | 2004-12-02 |
CN100443527C (zh) | 2008-12-17 |
EP1622968A2 (en) | 2006-02-08 |
JP2006528720A (ja) | 2006-12-21 |
US20070072972A1 (en) | 2007-03-29 |
KR20060015249A (ko) | 2006-02-16 |
WO2004101653A3 (en) | 2005-01-20 |
WO2004101653A2 (en) | 2004-11-25 |
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