CN1782133A - 六氟化硫远程清洁等离子源 - Google Patents

六氟化硫远程清洁等离子源 Download PDF

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Publication number
CN1782133A
CN1782133A CNA2005101141116A CN200510114111A CN1782133A CN 1782133 A CN1782133 A CN 1782133A CN A2005101141116 A CNA2005101141116 A CN A2005101141116A CN 200510114111 A CN200510114111 A CN 200510114111A CN 1782133 A CN1782133 A CN 1782133A
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CN
China
Prior art keywords
gas mixture
sulfur hexafluoride
chamber
gas
remote plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005101141116A
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English (en)
Chinese (zh)
Inventor
崔寿永
王群华
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN1782133A publication Critical patent/CN1782133A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CNA2005101141116A 2004-11-04 2005-10-19 六氟化硫远程清洁等离子源 Pending CN1782133A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62562204P 2004-11-04 2004-11-04
US60/625,622 2004-11-04
US11/088,327 2005-03-22

Publications (1)

Publication Number Publication Date
CN1782133A true CN1782133A (zh) 2006-06-07

Family

ID=36772727

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005101141116A Pending CN1782133A (zh) 2004-11-04 2005-10-19 六氟化硫远程清洁等离子源

Country Status (5)

Country Link
US (1) US20060090773A1 (enExample)
JP (1) JP2006148095A (enExample)
KR (1) KR100855597B1 (enExample)
CN (1) CN1782133A (enExample)
TW (1) TWI270138B (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102077338A (zh) * 2008-06-24 2011-05-25 应用材料股份有限公司 用于低温pecvd应用的基座加热器
CN102639748A (zh) * 2009-12-01 2012-08-15 中央硝子株式会社 清洁气体
CN102844854A (zh) * 2009-12-18 2012-12-26 应用材料公司 宽范围晶圆温度控制的多功能加热器/冷却器基座
CN102094186B (zh) * 2009-12-15 2013-03-13 财团法人工业技术研究院 气体供应设备
CN110571121A (zh) * 2019-09-17 2019-12-13 江苏鲁汶仪器有限公司 采用远程等离子体源自清洗离子束刻蚀装置及清洗方法
CN118403855A (zh) * 2024-04-23 2024-07-30 大连皓宇电子科技有限公司 利用等离子体技术对工艺腔体末端管路及阀门进行清洁的方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100163179A1 (en) * 2005-12-22 2010-07-01 Shigeki Tozawa Substrate Processing Apparatus
US20090056743A1 (en) * 2007-08-31 2009-03-05 Soo Young Choi Method of cleaning plasma enhanced chemical vapor deposition chamber
KR100906377B1 (ko) * 2007-09-04 2009-07-07 성균관대학교산학협력단 기판의 고속 박층화장치 및 방법
US7699935B2 (en) 2008-06-19 2010-04-20 Applied Materials, Inc. Method and system for supplying a cleaning gas into a process chamber
US8911559B2 (en) * 2008-09-22 2014-12-16 Taiwan Semiconductor Manufacturing Company, Ltd. Method to pre-heat and stabilize etching chamber condition and improve mean time between cleaning
JP2012506620A (ja) * 2008-10-21 2012-03-15 アプライド マテリアルズ インコーポレイテッド チャンバをクリーニングするプラズマ発生源とプロセス
WO2012112187A1 (en) * 2011-02-15 2012-08-23 Applied Materials, Inc. Method and apparatus for multizone plasma generation
JP5830275B2 (ja) * 2011-06-15 2015-12-09 東京エレクトロン株式会社 プラズマエッチング方法
JP6306030B2 (ja) 2012-10-18 2018-04-04 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ シャドーフレームサポート
WO2015134156A1 (en) 2014-03-06 2015-09-11 Applied Materials, Inc. Plasma foreline thermal reactor system
GB201609119D0 (en) 2016-05-24 2016-07-06 Spts Technologies Ltd A method of cleaning a plasma processing module
WO2018026509A1 (en) * 2016-08-05 2018-02-08 Applied Materials, Inc. Aluminum fluoride mitigation by plasma treatment
US10161034B2 (en) * 2017-04-21 2018-12-25 Lam Research Corporation Rapid chamber clean using concurrent in-situ and remote plasma sources
WO2019027738A1 (en) * 2017-08-04 2019-02-07 Micromaterials Llc ENHANCED METAL CONTACT LANDING STRUCTURE
KR102088596B1 (ko) * 2018-07-09 2020-06-01 램 리써치 코포레이션 Rf 플라즈마 생성기 및 리모트 플라즈마 생성기에 공급하는 rf 신호 소스
CN115714151B (zh) * 2022-10-11 2025-12-09 福建兆元光电有限公司 一种半导体沉积腔残留物的清洁方法
JP7641017B2 (ja) * 2022-10-19 2025-03-06 株式会社オプトラン 成膜装置及びそのクリーニング方法

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5870570A (ja) * 1981-09-28 1983-04-27 Fujitsu Ltd 半導体装置の製造方法
US5620525A (en) * 1990-07-16 1997-04-15 Novellus Systems, Inc. Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate
GB9207424D0 (en) * 1992-04-04 1992-05-20 British Nuclear Fuels Plc A process and an electrolytic cell for the production of fluorine
US5373523A (en) * 1992-10-15 1994-12-13 Kabushiki Kaisha Komatsu Seisakusho Excimer laser apparatus
US5350236A (en) * 1993-03-08 1994-09-27 Micron Semiconductor, Inc. Method for repeatable temperature measurement using surface reflectivity
JPH0786242A (ja) * 1993-09-10 1995-03-31 Fujitsu Ltd 半導体装置の製造方法
US5492597A (en) * 1994-05-13 1996-02-20 Micron Semiconductor, Inc. Method of etching WSix films
EP0697467A1 (en) * 1994-07-21 1996-02-21 Applied Materials, Inc. Method and apparatus for cleaning a deposition chamber
US5597495A (en) * 1994-11-07 1997-01-28 Keil; Mark Method and apparatus for etching surfaces with atomic fluorine
US5770263A (en) * 1995-11-08 1998-06-23 Micron Technology, Inc. Method for in situ removal of particulate residues resulting from hydrofluoric acid cleaning treatments
US5788778A (en) * 1996-09-16 1998-08-04 Applied Komatsu Technology, Inc. Deposition chamber cleaning technique using a high power remote excitation source
US5824375A (en) * 1996-10-24 1998-10-20 Applied Materials, Inc. Decontamination of a plasma reactor using a plasma after a chamber clean
KR100399291B1 (ko) * 1997-01-27 2004-01-24 가부시키가이샤 아드반스트 디스프레이 반도체 박막트랜지스터, 그 제조방법, 반도체 박막트랜지스터어레이 기판 및 해당 반도체 박막트랜지스터어레이 기판을 사용한 액정표시장치
US5824607A (en) * 1997-02-06 1998-10-20 Applied Materials, Inc. Plasma confinement for an inductively coupled plasma reactor
EP1008167A4 (en) * 1997-03-14 2006-08-23 Univ George Washington DEVICE FOR THE CONTINUOUS CONTROL OF THE ISOTOPIC RATIO AFTER FLUORINE CHEMICAL REACTIONS
US6286451B1 (en) * 1997-05-29 2001-09-11 Applied Materials, Inc. Dome: shape and temperature controlled surfaces
US6079426A (en) * 1997-07-02 2000-06-27 Applied Materials, Inc. Method and apparatus for determining the endpoint in a plasma cleaning process
US8075789B1 (en) * 1997-07-11 2011-12-13 Applied Materials, Inc. Remote plasma cleaning source having reduced reactivity with a substrate processing chamber
US6274058B1 (en) * 1997-07-11 2001-08-14 Applied Materials, Inc. Remote plasma cleaning method for processing chambers
US6534007B1 (en) * 1997-08-01 2003-03-18 Applied Komatsu Technology, Inc. Method and apparatus for detecting the endpoint of a chamber cleaning
US6261524B1 (en) * 1999-01-12 2001-07-17 Advanced Technology Materials, Inc. Advanced apparatus for abatement of gaseous pollutants
US5935874A (en) * 1998-03-31 1999-08-10 Lam Research Corporation Techniques for forming trenches in a silicon layer of a substrate in a high density plasma processing system
US6182603B1 (en) * 1998-07-13 2001-02-06 Applied Komatsu Technology, Inc. Surface-treated shower head for use in a substrate processing chamber
US6207583B1 (en) * 1998-09-04 2001-03-27 Alliedsignal Inc. Photoresist ashing process for organic and inorganic polymer dielectric materials
US6312616B1 (en) * 1998-12-03 2001-11-06 Applied Materials, Inc. Plasma etching of polysilicon using fluorinated gas mixtures
US6374831B1 (en) * 1999-02-04 2002-04-23 Applied Materials, Inc. Accelerated plasma clean
US6416589B1 (en) * 1999-02-18 2002-07-09 General Electric Company Carbon-enhanced fluoride ion cleaning
US20020033183A1 (en) * 1999-05-29 2002-03-21 Sheng Sun Method and apparatus for enhanced chamber cleaning
US6239006B1 (en) * 1999-07-09 2001-05-29 Advanced Micro Devices, Inc. Native oxide removal with fluorinated chemistry before cobalt silicide formation
US6431182B1 (en) * 1999-10-27 2002-08-13 Advanced Micro Devices, Inc. Plasma treatment for polymer removal after via etch
US6350697B1 (en) * 1999-12-22 2002-02-26 Lam Research Corporation Method of cleaning and conditioning plasma reaction chamber
KR100767762B1 (ko) * 2000-01-18 2007-10-17 에이에스엠 저펜 가부시기가이샤 자가 세정을 위한 원격 플라즈마 소스를 구비한 cvd 반도체 공정장치
US6772827B2 (en) * 2000-01-20 2004-08-10 Applied Materials, Inc. Suspended gas distribution manifold for plasma chamber
US6477980B1 (en) * 2000-01-20 2002-11-12 Applied Materials, Inc. Flexibly suspended gas distribution manifold for plasma chamber
US6432255B1 (en) * 2000-01-31 2002-08-13 Applied Materials, Inc. Method and apparatus for enhancing chamber cleaning
US6673323B1 (en) * 2000-03-24 2004-01-06 Applied Materials, Inc. Treatment of hazardous gases in effluent
US6500356B2 (en) * 2000-03-27 2002-12-31 Applied Materials, Inc. Selectively etching silicon using fluorine without plasma
US20030010354A1 (en) * 2000-03-27 2003-01-16 Applied Materials, Inc. Fluorine process for cleaning semiconductor process chamber
US6857387B1 (en) * 2000-05-03 2005-02-22 Applied Materials, Inc. Multiple frequency plasma chamber with grounding capacitor at cathode
JP2002057106A (ja) * 2000-08-08 2002-02-22 Tokyo Electron Ltd 処理装置のクリーニング方法及び処理装置
US6843258B2 (en) * 2000-12-19 2005-01-18 Applied Materials, Inc. On-site cleaning gas generation for process chamber cleaning
US6534423B1 (en) * 2000-12-27 2003-03-18 Novellus Systems, Inc. Use of inductively-coupled plasma in plasma-enhanced chemical vapor deposition reactor to improve film-to-wall adhesion following in-situ plasma clean
JP3925088B2 (ja) * 2001-01-16 2007-06-06 株式会社日立製作所 ドライ洗浄方法
US6544838B2 (en) * 2001-03-13 2003-04-08 Infineon Technologies Ag Method of deep trench formation with improved profile control and surface area
WO2002090615A1 (en) * 2001-05-04 2002-11-14 Lam Research Corporation Duo-step plasma cleaning of chamber residues
US6868856B2 (en) * 2001-07-13 2005-03-22 Applied Materials, Inc. Enhanced remote plasma cleaning
US6686594B2 (en) * 2001-10-29 2004-02-03 Air Products And Chemicals, Inc. On-line UV-Visible light halogen gas analyzer for semiconductor processing effluent monitoring
US6872323B1 (en) * 2001-11-01 2005-03-29 Novellus Systems, Inc. In situ plasma process to remove fluorine residues from the interior surfaces of a CVD reactor
US6828241B2 (en) * 2002-01-07 2004-12-07 Applied Materials, Inc. Efficient cleaning by secondary in-situ activation of etch precursor from remote plasma source
US7008484B2 (en) * 2002-05-06 2006-03-07 Applied Materials Inc. Method and apparatus for deposition of low dielectric constant materials
US7270713B2 (en) * 2003-01-07 2007-09-18 Applied Materials, Inc. Tunable gas distribution plate assembly
US6942753B2 (en) * 2003-04-16 2005-09-13 Applied Materials, Inc. Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition
US7572337B2 (en) * 2004-05-26 2009-08-11 Applied Materials, Inc. Blocker plate bypass to distribute gases in a chemical vapor deposition system
US20060017043A1 (en) * 2004-07-23 2006-01-26 Dingjun Wu Method for enhancing fluorine utilization

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102077338A (zh) * 2008-06-24 2011-05-25 应用材料股份有限公司 用于低温pecvd应用的基座加热器
CN102639748A (zh) * 2009-12-01 2012-08-15 中央硝子株式会社 清洁气体
CN102094186B (zh) * 2009-12-15 2013-03-13 财团法人工业技术研究院 气体供应设备
CN102844854A (zh) * 2009-12-18 2012-12-26 应用材料公司 宽范围晶圆温度控制的多功能加热器/冷却器基座
CN102844854B (zh) * 2009-12-18 2016-04-27 应用材料公司 宽范围晶圆温度控制的多功能加热器/冷却器基座
CN110571121A (zh) * 2019-09-17 2019-12-13 江苏鲁汶仪器有限公司 采用远程等离子体源自清洗离子束刻蚀装置及清洗方法
CN118403855A (zh) * 2024-04-23 2024-07-30 大连皓宇电子科技有限公司 利用等离子体技术对工艺腔体末端管路及阀门进行清洁的方法

Also Published As

Publication number Publication date
KR20060092979A (ko) 2006-08-23
TW200620458A (en) 2006-06-16
TWI270138B (en) 2007-01-01
KR100855597B1 (ko) 2008-09-03
JP2006148095A (ja) 2006-06-08
US20060090773A1 (en) 2006-05-04

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