CN1782120B - 蒸发源和具备蒸发源的蒸镀装置 - Google Patents
蒸发源和具备蒸发源的蒸镀装置 Download PDFInfo
- Publication number
- CN1782120B CN1782120B CN2005101269355A CN200510126935A CN1782120B CN 1782120 B CN1782120 B CN 1782120B CN 2005101269355 A CN2005101269355 A CN 2005101269355A CN 200510126935 A CN200510126935 A CN 200510126935A CN 1782120 B CN1782120 B CN 1782120B
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- 238000001704 evaporation Methods 0.000 title claims abstract description 368
- 230000008020 evaporation Effects 0.000 title claims abstract description 367
- 238000007747 plating Methods 0.000 title abstract description 13
- 238000003860 storage Methods 0.000 claims abstract description 135
- 238000010438 heat treatment Methods 0.000 claims abstract description 120
- 239000000463 material Substances 0.000 claims abstract description 91
- 230000008093 supporting effect Effects 0.000 claims description 141
- 239000007921 spray Substances 0.000 claims description 131
- 239000000758 substrate Substances 0.000 claims description 56
- 238000000576 coating method Methods 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 26
- 239000004020 conductor Substances 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 238000012546 transfer Methods 0.000 claims description 7
- 229910001026 inconel Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- 229910000753 refractory alloy Inorganic materials 0.000 claims description 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 4
- 230000008016 vaporization Effects 0.000 abstract description 14
- 239000000126 substance Substances 0.000 abstract description 10
- 238000005507 spraying Methods 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 21
- 239000002245 particle Substances 0.000 description 19
- 230000000694 effects Effects 0.000 description 13
- 238000009834 vaporization Methods 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 11
- 229910002804 graphite Inorganic materials 0.000 description 11
- 239000010439 graphite Substances 0.000 description 11
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- 239000005416 organic matter Substances 0.000 description 10
- 239000012528 membrane Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 6
- 239000003870 refractory metal Substances 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 229910052735 hafnium Inorganic materials 0.000 description 3
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- 239000010955 niobium Substances 0.000 description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 3
- 229910052702 rhenium Inorganic materials 0.000 description 3
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229910052720 vanadium Inorganic materials 0.000 description 3
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 208000033999 Device damage Diseases 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (31)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR98270/04 | 2004-11-26 | ||
KR1020040098270A KR100685431B1 (ko) | 2004-11-26 | 2004-11-26 | 유기물 증착원 |
KR1020050013298A KR100796589B1 (ko) | 2005-02-17 | 2005-02-17 | 증발원 및 그를 포함하는 증착장치 |
KR13298/05 | 2005-02-17 | ||
KR14713/05 | 2005-02-22 | ||
KR1020050014713A KR100712117B1 (ko) | 2005-02-22 | 2005-02-22 | 증발원 및 그를 포함하는 증착장치 |
KR1020050018833A KR100623729B1 (ko) | 2005-03-07 | 2005-03-07 | 증발원과 이를 구비한 증발원 어셈블리 |
KR18833/05 | 2005-03-07 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101852802A Division CN101445909B (zh) | 2004-11-26 | 2005-11-28 | 蒸发源和具备蒸发源的蒸镀装置 |
CN200810185279XA Division CN101445908B (zh) | 2004-11-26 | 2005-11-28 | 蒸发源和具备蒸发源的蒸镀装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1782120A CN1782120A (zh) | 2006-06-07 |
CN1782120B true CN1782120B (zh) | 2011-09-28 |
Family
ID=36772719
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810185279XA Active CN101445908B (zh) | 2004-11-26 | 2005-11-28 | 蒸发源和具备蒸发源的蒸镀装置 |
CN2008101852802A Active CN101445909B (zh) | 2004-11-26 | 2005-11-28 | 蒸发源和具备蒸发源的蒸镀装置 |
CN2005101269355A Active CN1782120B (zh) | 2004-11-26 | 2005-11-28 | 蒸发源和具备蒸发源的蒸镀装置 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810185279XA Active CN101445908B (zh) | 2004-11-26 | 2005-11-28 | 蒸发源和具备蒸发源的蒸镀装置 |
CN2008101852802A Active CN101445909B (zh) | 2004-11-26 | 2005-11-28 | 蒸发源和具备蒸发源的蒸镀装置 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100685431B1 (zh) |
CN (3) | CN101445908B (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100928136B1 (ko) * | 2007-11-09 | 2009-11-25 | 삼성모바일디스플레이주식회사 | 유기물 선형 증착 장치 |
US20100206234A1 (en) * | 2009-02-17 | 2010-08-19 | Michael Long | Simplified powder feeding and vaporization apparatus |
JP5492120B2 (ja) * | 2011-03-08 | 2014-05-14 | 株式会社日立ハイテクノロジーズ | 蒸発源および蒸着装置 |
KR101879805B1 (ko) * | 2012-01-20 | 2018-08-17 | 삼성디스플레이 주식회사 | 박막 증착 장치 및 방법 |
JP2014072005A (ja) * | 2012-09-28 | 2014-04-21 | Hitachi High-Technologies Corp | 蒸発源、真空蒸着装置及び有機el表示装置製造方法 |
KR102124588B1 (ko) | 2012-10-22 | 2020-06-22 | 삼성디스플레이 주식회사 | 선형 증착원 및 이를 포함하는 진공 증착 장치 |
CN104294219A (zh) * | 2014-08-14 | 2015-01-21 | 京东方科技集团股份有限公司 | 蒸镀线源 |
CN104241551B (zh) | 2014-08-22 | 2017-02-15 | 京东方科技集团股份有限公司 | 一种有机电致发光显示面板、其制作方法及显示装置 |
KR102386658B1 (ko) * | 2015-08-03 | 2022-04-14 | 삼성디스플레이 주식회사 | 증착원 |
KR20170104710A (ko) * | 2016-03-07 | 2017-09-18 | 삼성디스플레이 주식회사 | 성막 장치 및 표시 장치의 제조 방법 |
JP6765237B2 (ja) * | 2016-07-05 | 2020-10-07 | キヤノントッキ株式会社 | 蒸着装置及び蒸発源 |
CN106191787B (zh) * | 2016-09-20 | 2019-04-05 | 深圳市力沣实业有限公司 | 一种多真空室的电阻式蒸发镀膜机及其操作方法 |
CN113227442B (zh) * | 2019-09-09 | 2023-07-18 | 株式会社爱发科 | 蒸镀源以及真空处理装置 |
CN110499492A (zh) * | 2019-09-19 | 2019-11-26 | 京东方科技集团股份有限公司 | 一种蒸镀装置及其蒸镀方法 |
CN112877651A (zh) * | 2021-01-08 | 2021-06-01 | 京东方科技集团股份有限公司 | 蒸镀装置 |
KR20230012415A (ko) * | 2021-07-15 | 2023-01-26 | 캐논 톡키 가부시키가이샤 | 성막 장치, 성막 방법 및 증발원 유닛 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1495284A (zh) * | 2002-09-03 | 2004-05-12 | 三星日本电气移动显示株式会社 | 有机薄膜形成设备用加热坩埚 |
KR20040043361A (ko) * | 2002-11-18 | 2004-05-24 | 주식회사 야스 | 증착 공정용 원추형 노즐 증발원 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4281029B2 (ja) * | 1998-07-13 | 2009-06-17 | キヤノンアネルバ株式会社 | 蒸発源 |
US20040040504A1 (en) * | 2002-08-01 | 2004-03-04 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing apparatus |
KR100889760B1 (ko) * | 2002-09-03 | 2009-03-20 | 삼성모바일디스플레이주식회사 | 유기박막 형성장치의 가열용기 |
KR20020092296A (ko) * | 2002-11-07 | 2002-12-11 | 정세영 | 유기물 증착 장치 |
JP2004353083A (ja) * | 2003-05-08 | 2004-12-16 | Sanyo Electric Co Ltd | 蒸発装置 |
-
2004
- 2004-11-26 KR KR1020040098270A patent/KR100685431B1/ko active IP Right Grant
-
2005
- 2005-11-28 CN CN200810185279XA patent/CN101445908B/zh active Active
- 2005-11-28 CN CN2008101852802A patent/CN101445909B/zh active Active
- 2005-11-28 CN CN2005101269355A patent/CN1782120B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1495284A (zh) * | 2002-09-03 | 2004-05-12 | 三星日本电气移动显示株式会社 | 有机薄膜形成设备用加热坩埚 |
KR20040043361A (ko) * | 2002-11-18 | 2004-05-24 | 주식회사 야스 | 증착 공정용 원추형 노즐 증발원 |
Also Published As
Publication number | Publication date |
---|---|
CN101445908B (zh) | 2011-06-22 |
CN101445908A (zh) | 2009-06-03 |
CN101445909A (zh) | 2009-06-03 |
KR20060059097A (ko) | 2006-06-01 |
KR100685431B1 (ko) | 2007-02-22 |
CN101445909B (zh) | 2011-06-22 |
CN1782120A (zh) | 2006-06-07 |
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