JP2006063446A - 有機物蒸着装置 - Google Patents
有機物蒸着装置 Download PDFInfo
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- JP2006063446A JP2006063446A JP2005233758A JP2005233758A JP2006063446A JP 2006063446 A JP2006063446 A JP 2006063446A JP 2005233758 A JP2005233758 A JP 2005233758A JP 2005233758 A JP2005233758 A JP 2005233758A JP 2006063446 A JP2006063446 A JP 2006063446A
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- organic
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- injection nozzle
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- organic matter
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
【解決手段】 本発明の有機物蒸着装置は胴体を成し、基板を地面に対し、70゜ないし110゜の角度を維持するようにするチャンバと、前記基板上に蒸着する有機物を受け入れる少なくとも一つの有機物格納所からなる有機物格納部と、前記基板上に蒸着する有機物を噴射する有機物噴射ノズル部と、前記有機物噴射ノズル部と有機物格納部とを連結させる連結ラインと、前記有機物格納部、有機物噴射ノズル部及び連結ライン中の少なくとも前記有機物噴射ノズルを垂直方向に移動させることができる移送装置を備えてなる。
【選択図】 図1
Description
110 チャンバ
120、200、300、400、400A、400B、500 有機物蒸着源
S 基板
M マスクパターン
Claims (9)
- 胴体を成し、基板を地面に対し、70゜ないし110゜の角度を維持するようにするチャンバと、
前記基板上に蒸着する有機物を受け入れる少なくとも一つの有機物格納所からなる有機物格納部と、
前記基板上に蒸着する有機物を噴射する有機物噴射ノズル部と、
前記有機物噴射ノズル部と有機物格納部とを連結させる連結ラインと、
前記有機物格納部、有機物噴射ノズル部及び連結ラインのうち少なくとも前記有機物噴射ノズルを垂直方向に移動させることができる移送装置と、
を備えることを特徴とする有機物蒸着装置。 - 前記有機物格納部は、前記チャンバの内部または外部に位置することを特徴とする請求項1記載の有機物蒸着装置。
- 前記有機物噴射ノズル部は、隔壁を更に備えることを特徴とする請求項1記載の有機物蒸着装置。
- 前記有機物噴射ノズル部の有機物噴射方向の先端部に位置し、前記基板上に蒸着する有機物の蒸着率を測定する測定装置を更に備えることを特徴とする請求項1記載の有機物蒸着装置。
- 前記測定装置は、前記有機物噴射ノズルと一体化されて、前記有機物噴射ノズル部と共に垂直移動することを特徴とする請求項4記載の有機物蒸着装置。
- 胴体を成し、基板を地面に対し、70゜ないし110゜の角度を維持するようにするチャンバと、
前記基板上に蒸着する有機物を受け入れる少なくとも一つの有機物格納所からなる少なくとも一つの有機物格納部と、
前記基板上に蒸着する有機物を噴射する2つ以上の有機物噴射ノズル部と、
前記有機物噴射ノズル部と有機物格納部とを連結させる連結ラインと、
を備えることを特徴とする有機物蒸着装置。 - 前記有機物格納部と前記有機物噴射ノズルとは1:多数に対応することを特徴とする請求項6記載の有機物蒸着装置。
- 前記有機物格納部は、複数個であり、
前記有機物噴射ノズルは前記有機物格納部と1:1に対応することを特徴とする請求項6記載の有機物蒸着装置。 - 前記有機物噴射ノズル部の有機物噴射方向の先端部に位置し、前記基板上に蒸着する有機物の蒸着率を測定する測定装置を更に備えることを特徴とする請求項6記載の有機物蒸着装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040067260A KR20060018746A (ko) | 2004-08-25 | 2004-08-25 | 유기물 증착 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006063446A true JP2006063446A (ja) | 2006-03-09 |
Family
ID=36092910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005233758A Pending JP2006063446A (ja) | 2004-08-25 | 2005-08-11 | 有機物蒸着装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006063446A (ja) |
KR (1) | KR20060018746A (ja) |
CN (1) | CN1740378A (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007177319A (ja) * | 2005-12-28 | 2007-07-12 | Samsung Sdi Co Ltd | 蒸発源及びそれを用いた薄膜蒸着方法 |
US7964037B2 (en) | 2006-07-13 | 2011-06-21 | Canon Kabushiki Kaisha | Deposition apparatus |
JP2012214834A (ja) * | 2011-03-31 | 2012-11-08 | Hitachi High-Technologies Corp | 真空蒸着装置および有機el表示装置の製造方法 |
JP2013129866A (ja) * | 2011-12-20 | 2013-07-04 | Ulvac Japan Ltd | 薄膜製造方法、薄膜製造装置 |
JP2013171811A (ja) * | 2012-02-23 | 2013-09-02 | Hitachi High-Technologies Corp | 成膜装置 |
JP2014035864A (ja) * | 2012-08-08 | 2014-02-24 | Kaneka Corp | 成膜装置及び有機el素子の製造方法 |
CN114525474A (zh) * | 2022-03-10 | 2022-05-24 | 武汉华星光电半导体显示技术有限公司 | 蒸镀坩埚及蒸镀装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100748451B1 (ko) * | 2006-05-25 | 2007-08-10 | 에이엔 에스 주식회사 | 유기발광소자의 증착장치 |
KR100795905B1 (ko) * | 2007-02-28 | 2008-01-21 | 세메스 주식회사 | 유기 박막 증착 장치 |
KR101019947B1 (ko) * | 2010-06-10 | 2011-03-09 | 에스엔유 프리시젼 주식회사 | 유기 반도체 제조장치 |
CN102315148A (zh) * | 2010-06-30 | 2012-01-11 | 上方能源技术(杭州)有限公司 | 用于镀膜的基板传输装置和基板传输方法 |
KR101219061B1 (ko) * | 2010-11-30 | 2013-01-21 | 주식회사 케이씨텍 | 스핀노즐 유닛 사이의 간격을 줄인 가스분사 모듈 및 이를 구비하는 직립방식 증착장치 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49120847U (ja) * | 1973-02-15 | 1974-10-16 | ||
JP2001247959A (ja) * | 1999-12-27 | 2001-09-14 | Semiconductor Energy Lab Co Ltd | 成膜装置及び成膜方法 |
JP2002184571A (ja) * | 2000-12-15 | 2002-06-28 | Denso Corp | 有機el素子の製造方法 |
WO2003079420A1 (en) * | 2002-03-19 | 2003-09-25 | Innovex. Inc. | Evaporation source for deposition process and insulation fixing plate, and heating wire winding plate and method for fixing heating wire |
JP2003301255A (ja) * | 2002-02-06 | 2003-10-24 | Eiko Engineering Co Ltd | 薄膜堆積用分子線源セルと薄膜堆積方法 |
JP2003347047A (ja) * | 2002-05-28 | 2003-12-05 | Sony Corp | 有機膜形成装置 |
JP2004035964A (ja) * | 2002-07-04 | 2004-02-05 | Tokki Corp | 蒸着装置 |
JP2004204289A (ja) * | 2002-12-25 | 2004-07-22 | Sony Corp | 成膜装置とその方法および表示パネルの製造装置とその方法 |
JP2005281859A (ja) * | 2004-03-03 | 2005-10-13 | Sanyo Electric Co Ltd | 堆積厚測定方法、材料層の形成方法、堆積厚測定装置および材料層の形成装置 |
-
2004
- 2004-08-25 KR KR1020040067260A patent/KR20060018746A/ko not_active Application Discontinuation
-
2005
- 2005-08-11 JP JP2005233758A patent/JP2006063446A/ja active Pending
- 2005-08-25 CN CNA200510093332XA patent/CN1740378A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49120847U (ja) * | 1973-02-15 | 1974-10-16 | ||
JP2001247959A (ja) * | 1999-12-27 | 2001-09-14 | Semiconductor Energy Lab Co Ltd | 成膜装置及び成膜方法 |
JP2002184571A (ja) * | 2000-12-15 | 2002-06-28 | Denso Corp | 有機el素子の製造方法 |
JP2003301255A (ja) * | 2002-02-06 | 2003-10-24 | Eiko Engineering Co Ltd | 薄膜堆積用分子線源セルと薄膜堆積方法 |
WO2003079420A1 (en) * | 2002-03-19 | 2003-09-25 | Innovex. Inc. | Evaporation source for deposition process and insulation fixing plate, and heating wire winding plate and method for fixing heating wire |
JP2003347047A (ja) * | 2002-05-28 | 2003-12-05 | Sony Corp | 有機膜形成装置 |
JP2004035964A (ja) * | 2002-07-04 | 2004-02-05 | Tokki Corp | 蒸着装置 |
JP2004204289A (ja) * | 2002-12-25 | 2004-07-22 | Sony Corp | 成膜装置とその方法および表示パネルの製造装置とその方法 |
JP2005281859A (ja) * | 2004-03-03 | 2005-10-13 | Sanyo Electric Co Ltd | 堆積厚測定方法、材料層の形成方法、堆積厚測定装置および材料層の形成装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007177319A (ja) * | 2005-12-28 | 2007-07-12 | Samsung Sdi Co Ltd | 蒸発源及びそれを用いた薄膜蒸着方法 |
US7964037B2 (en) | 2006-07-13 | 2011-06-21 | Canon Kabushiki Kaisha | Deposition apparatus |
JP2012214834A (ja) * | 2011-03-31 | 2012-11-08 | Hitachi High-Technologies Corp | 真空蒸着装置および有機el表示装置の製造方法 |
JP2013129866A (ja) * | 2011-12-20 | 2013-07-04 | Ulvac Japan Ltd | 薄膜製造方法、薄膜製造装置 |
JP2013171811A (ja) * | 2012-02-23 | 2013-09-02 | Hitachi High-Technologies Corp | 成膜装置 |
JP2014035864A (ja) * | 2012-08-08 | 2014-02-24 | Kaneka Corp | 成膜装置及び有機el素子の製造方法 |
CN114525474A (zh) * | 2022-03-10 | 2022-05-24 | 武汉华星光电半导体显示技术有限公司 | 蒸镀坩埚及蒸镀装置 |
Also Published As
Publication number | Publication date |
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KR20060018746A (ko) | 2006-03-02 |
CN1740378A (zh) | 2006-03-01 |
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