CN1742233A - 能正性成像的厚膜组合物 - Google Patents
能正性成像的厚膜组合物 Download PDFInfo
- Publication number
- CN1742233A CN1742233A CNA2003801092354A CN200380109235A CN1742233A CN 1742233 A CN1742233 A CN 1742233A CN A2003801092354 A CNA2003801092354 A CN A2003801092354A CN 200380109235 A CN200380109235 A CN 200380109235A CN 1742233 A CN1742233 A CN 1742233A
- Authority
- CN
- China
- Prior art keywords
- composition
- film
- acrylate
- patterned structure
- methacrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Electrodes For Cathode-Ray Tubes (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Discharge Lamps And Accessories Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43139202P | 2002-12-06 | 2002-12-06 | |
| US60/431,392 | 2002-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1742233A true CN1742233A (zh) | 2006-03-01 |
Family
ID=32507722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2003801092354A Pending CN1742233A (zh) | 2002-12-06 | 2003-12-05 | 能正性成像的厚膜组合物 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20040170925A1 (OSRAM) |
| EP (1) | EP1567917A2 (OSRAM) |
| JP (1) | JP2006510046A (OSRAM) |
| KR (1) | KR20050084150A (OSRAM) |
| CN (1) | CN1742233A (OSRAM) |
| AU (1) | AU2003293441A1 (OSRAM) |
| WO (1) | WO2004053593A2 (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101125944B (zh) * | 2006-04-26 | 2011-05-18 | 三星Sdi株式会社 | 组合物及由其形成的电子发射源和电子发射装置 |
| CN101086617B (zh) * | 2006-06-09 | 2012-07-04 | 太阳控股株式会社 | 光固化性组合物以及使用其得到的烧成物图案 |
| CN104541202A (zh) * | 2012-08-31 | 2015-04-22 | 富士胶片株式会社 | 感光性树脂组合物、硬化物及其制造方法、树脂图案的制造方法、硬化膜、液晶显示装置、有机el显示装置、以及触摸屏显示装置 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101038621B1 (ko) * | 2002-11-15 | 2011-06-03 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 전자 소자 제조에 보호층을 사용하는 방법 |
| GB0227902D0 (en) * | 2002-11-29 | 2003-01-08 | Ingenia Holdings Ltd | Template |
| WO2005052691A1 (ja) * | 2003-11-25 | 2005-06-09 | Murata Manufacturing Co., Ltd. | 厚膜パターンの形成方法、電子部品の製造方法、およびフォトリソグラフィー用感光性ペースト |
| US7402373B2 (en) * | 2004-02-05 | 2008-07-22 | E.I. Du Pont De Nemours And Company | UV radiation blocking protective layers compatible with thick film pastes |
| KR101042667B1 (ko) * | 2004-07-05 | 2011-06-20 | 주식회사 동진쎄미켐 | 포토레지스트 조성물 |
| KR20060090520A (ko) * | 2005-02-07 | 2006-08-11 | 삼성전자주식회사 | 감광성 수지 및 상기 감광성 수지로 이루어진 패턴을포함하는 박막 표시판 및 그 제조 방법 |
| US7247419B2 (en) | 2005-04-11 | 2007-07-24 | Az Electronic Materials Usa Corp. | Nanocomposite photosensitive composition and use thereof |
| US7524606B2 (en) | 2005-04-11 | 2009-04-28 | Az Electronic Materials Usa Corp. | Nanocomposite photoresist composition for imaging thick films |
| JP4861767B2 (ja) | 2005-07-26 | 2012-01-25 | 富士フイルム株式会社 | ポジ型レジスト組成物およびそれを用いたパターン形成方法 |
| WO2008065827A1 (fr) * | 2006-11-28 | 2008-06-05 | Tokyo Ohka Kogyo Co., Ltd. | Composition de résine photosensible de type positif chimiquement amplifié pour film épais, film sec chimiquement amplifié pour film épais, et procédé de fabrication d'un motif de résine photosensible sur film épais |
| KR101034346B1 (ko) * | 2006-12-22 | 2011-05-16 | 주식회사 엘지화학 | 탄소 나노 튜브를 통한 내열성 개선의 감광성 수지 조성물 |
| US8310069B2 (en) * | 2007-10-05 | 2012-11-13 | Texas Instruements Incorporated | Semiconductor package having marking layer |
| CN101861282A (zh) * | 2007-11-15 | 2010-10-13 | 纳幕尔杜邦公司 | 碳纳米管的保护 |
| US20110012035A1 (en) * | 2009-07-15 | 2011-01-20 | Texas Instruments Incorporated | Method for Precision Symbolization Using Digital Micromirror Device Technology |
| US20140267107A1 (en) | 2013-03-15 | 2014-09-18 | Sinovia Technologies | Photoactive Transparent Conductive Films |
| US20130189524A1 (en) * | 2012-01-19 | 2013-07-25 | Brewer Science Inc. | Viscous fugitive polymer-based carbon nanotube coatings |
| TW201421154A (zh) * | 2012-10-26 | 2014-06-01 | Fujifilm Corp | 感光性樹脂組成物、硬化物及其製造方法、樹脂圖案製造方法、硬化膜、有機el顯示裝置、液晶顯示裝置以及觸控面板顯示裝置 |
| JP6564196B2 (ja) * | 2014-03-20 | 2019-08-21 | 東京応化工業株式会社 | 厚膜用化学増幅型ポジ型感光性樹脂組成物 |
| US11097449B2 (en) | 2017-05-17 | 2021-08-24 | Formlabs, Inc. | Techniques for casting from additively fabricated molds and related systems and methods |
Family Cites Families (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5915394B2 (ja) * | 1978-08-31 | 1984-04-09 | 富士通株式会社 | 厚膜微細パタ−ン生成方法 |
| DD234196A3 (de) * | 1983-02-09 | 1986-03-26 | Ptnjj Npo Elektronpribor | Fotoempfindliche dielektrische mischung |
| JPS6232453A (ja) * | 1985-08-06 | 1987-02-12 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジスト用現像液 |
| US4939070A (en) * | 1986-07-28 | 1990-07-03 | Brunsvold William R | Thermally stable photoresists with high sensitivity |
| US5256836A (en) * | 1989-06-09 | 1993-10-26 | Toshiba Lighting & Technology Corporation | Thick film hybrid circuit board device and method of manufacturing the same |
| US4985332A (en) * | 1990-04-10 | 1991-01-15 | E. I. Du Pont De Nemours And Company | Resist material with carbazole diazonium salt acid generator and process for use |
| JP2670711B2 (ja) * | 1990-05-29 | 1997-10-29 | 富士写真フイルム株式会社 | ネガ型感光性樹脂組成物用現像液 |
| EP0483693B1 (en) * | 1990-10-29 | 1998-12-30 | Toyo Gosei Kogyo Co., Ltd. | Photosensitive colored resin composition, colored image formation method of color filter, and formation method of black matrix |
| US5164286A (en) * | 1991-02-01 | 1992-11-17 | Ocg Microelectronic Materials, Inc. | Photoresist developer containing fluorinated amphoteric surfactant |
| US6074893A (en) * | 1993-09-27 | 2000-06-13 | Sumitomo Metal Industries, Ltd. | Process for forming fine thick-film conductor patterns |
| NL9301908A (nl) * | 1993-11-04 | 1995-06-01 | Spiro Research Bv | Werkwijze en inrichting voor het ontluchten van een vloeistof in een in hoofdzaak gesloten vloeistofcirculatiesysteem. |
| KR100195595B1 (ko) * | 1994-07-11 | 1999-06-15 | 니시무로 타이죠 | 감광성 재료 |
| US5506090A (en) * | 1994-09-23 | 1996-04-09 | Minnesota Mining And Manufacturing Company | Process for making shoot and run printing plates |
| JPH08148787A (ja) * | 1994-11-21 | 1996-06-07 | Sumitomo Kinzoku Ceramics:Kk | 厚膜ペースト |
| WO1997011975A1 (en) * | 1995-09-29 | 1997-04-03 | Nippon Kayaku Kabushiki Kaisha | Actinic radiation-curable and heat ray-shielding resin composition and film coated with the same |
| US5879856A (en) * | 1995-12-05 | 1999-03-09 | Shipley Company, L.L.C. | Chemically amplified positive photoresists |
| US5942367A (en) * | 1996-04-24 | 1999-08-24 | Shin-Etsu Chemical Co., Ltd. | Chemically amplified positive resist composition, pattern forming method, and method for preparing polymer having a crosslinking group |
| JP3297324B2 (ja) * | 1996-10-30 | 2002-07-02 | 富士通株式会社 | レジスト組成物、レジストパターンの形成方法及び半導体装置の製造方法 |
| US6323361B1 (en) * | 1997-04-17 | 2001-11-27 | Corning Inc. | Photocurable halofluorinated acrylates |
| JPH10340666A (ja) * | 1997-06-09 | 1998-12-22 | Futaba Corp | 電界電子放出素子 |
| US6291129B1 (en) * | 1997-08-29 | 2001-09-18 | Kabushiki Kaisha Toshiba | Monomer, high molecular compound and photosensitive composition |
| US6399279B1 (en) * | 1998-01-16 | 2002-06-04 | Mitsubishi Chemical Corporation | Method for forming a positive image |
| KR100594768B1 (ko) * | 1998-03-12 | 2006-07-03 | 후지 샤신 필름 가부시기가이샤 | 포지티브 감광성 조성물 |
| KR100571313B1 (ko) * | 1998-03-17 | 2006-04-17 | 후지 샤신 필름 가부시기가이샤 | 포지티브 감광성 조성물 |
| WO1999048945A1 (en) * | 1998-03-20 | 1999-09-30 | Nippon Soda Co., Ltd. | Photocurable composition containing iodonium salt compound |
| US6294270B1 (en) * | 1998-12-23 | 2001-09-25 | 3M Innovative Properties Company | Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| US6455234B1 (en) * | 1999-05-04 | 2002-09-24 | Air Products And Chemicals, Inc. | Acetylenic diol ethylene oxide/propylene oxide adducts and their use in photoresist developers |
| KR20010051350A (ko) * | 1999-11-01 | 2001-06-25 | 이시마루 기미오, 다께우찌 마사아끼 | 활성 입자, 감광성 수지 조성물 및 패턴 형성 방법 |
| US7449081B2 (en) * | 2000-06-21 | 2008-11-11 | E. I. Du Pont De Nemours And Company | Process for improving the emission of electron field emitters |
| US6534235B1 (en) * | 2000-10-31 | 2003-03-18 | Kansai Research Institute, Inc. | Photosensitive resin composition and process for forming pattern |
| TW583503B (en) * | 2000-12-01 | 2004-04-11 | Kansai Paint Co Ltd | Method of forming conductive pattern |
| JP3914386B2 (ja) * | 2000-12-28 | 2007-05-16 | 株式会社ルネサステクノロジ | フォトマスク、その製造方法、パターン形成方法および半導体装置の製造方法 |
| JP4317330B2 (ja) * | 2001-02-07 | 2009-08-19 | 富士フイルム株式会社 | 感光性平版印刷版の製版方法 |
| US6656667B2 (en) * | 2001-03-14 | 2003-12-02 | United Microelectronics Corp. | Multiple resist layer photolithographic process |
| US20020187438A1 (en) * | 2001-06-12 | 2002-12-12 | Ching-Yu Chang | Development method for manufacturing semiconductors |
| WO2003026368A1 (en) * | 2001-09-11 | 2003-03-27 | Daiken Chemical Co., Ltd. | Method for forming image on object surface including circuit substrate |
| US20030070559A1 (en) * | 2001-10-15 | 2003-04-17 | Victor Robert J. | Vegetable and related food products steamer cooker |
| US20030073042A1 (en) * | 2001-10-17 | 2003-04-17 | Cernigliaro George J. | Process and materials for formation of patterned films of functional materials |
| KR100646793B1 (ko) * | 2001-11-13 | 2006-11-17 | 삼성전자주식회사 | 씬너 조성물 |
| JP2003195517A (ja) * | 2001-12-14 | 2003-07-09 | Shipley Co Llc | フォトレジスト用現像液 |
| JP2003195518A (ja) * | 2001-12-14 | 2003-07-09 | Shipley Co Llc | フォトレジスト用現像液 |
| US6900003B2 (en) * | 2002-04-12 | 2005-05-31 | Shipley Company, L.L.C. | Photoresist processing aid and method |
| US6769945B2 (en) * | 2002-08-24 | 2004-08-03 | Industrial Technology Research Institute | Method of growing isomeric carbon emitters onto triode structure of field emission display |
| US6798127B2 (en) * | 2002-10-09 | 2004-09-28 | Nano-Proprietary, Inc. | Enhanced field emission from carbon nanotubes mixed with particles |
| US20040140861A1 (en) * | 2002-11-15 | 2004-07-22 | Alvarez Robby L. | High temperature superconducting mini-filter resonator configuration with low sensitivity to variations in substrate thickness and resonator patterning |
| KR101038621B1 (ko) * | 2002-11-15 | 2011-06-03 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 전자 소자 제조에 보호층을 사용하는 방법 |
| EP1586112B1 (en) * | 2003-01-22 | 2006-12-27 | E.I. du Pont de Nemours and Company | Binder diffusion patterning of a thick film paste layer |
| JP4040544B2 (ja) * | 2003-06-27 | 2008-01-30 | 東京応化工業株式会社 | レジスト用現像液組成物およびレジストパターンの形成方法 |
| US7186498B2 (en) * | 2003-10-02 | 2007-03-06 | Willi-Kurt Gries | Alkaline developer for radiation sensitive compositions |
| US7125648B2 (en) * | 2003-12-19 | 2006-10-24 | Fuji Photo Film Co., Ltd. | Method for forming images |
| US7402373B2 (en) * | 2004-02-05 | 2008-07-22 | E.I. Du Pont De Nemours And Company | UV radiation blocking protective layers compatible with thick film pastes |
| CN1973247A (zh) * | 2004-05-27 | 2007-05-30 | 纳幕尔杜邦公司 | 光聚合物保护层的显影剂 |
-
2003
- 2003-12-04 US US10/728,210 patent/US20040170925A1/en not_active Abandoned
- 2003-12-05 CN CNA2003801092354A patent/CN1742233A/zh active Pending
- 2003-12-05 KR KR1020057010117A patent/KR20050084150A/ko not_active Ceased
- 2003-12-05 WO PCT/US2003/038810 patent/WO2004053593A2/en not_active Ceased
- 2003-12-05 JP JP2004559365A patent/JP2006510046A/ja active Pending
- 2003-12-05 AU AU2003293441A patent/AU2003293441A1/en not_active Abandoned
- 2003-12-05 EP EP03790390A patent/EP1567917A2/en not_active Withdrawn
-
2008
- 2008-03-05 US US12/042,772 patent/US20080166666A1/en not_active Abandoned
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101125944B (zh) * | 2006-04-26 | 2011-05-18 | 三星Sdi株式会社 | 组合物及由其形成的电子发射源和电子发射装置 |
| CN101086617B (zh) * | 2006-06-09 | 2012-07-04 | 太阳控股株式会社 | 光固化性组合物以及使用其得到的烧成物图案 |
| CN104541202A (zh) * | 2012-08-31 | 2015-04-22 | 富士胶片株式会社 | 感光性树脂组合物、硬化物及其制造方法、树脂图案的制造方法、硬化膜、液晶显示装置、有机el显示装置、以及触摸屏显示装置 |
| CN104541202B (zh) * | 2012-08-31 | 2019-03-01 | 富士胶片株式会社 | 树脂组合物、硬化膜、物及其与图案的制法、及显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20040170925A1 (en) | 2004-09-02 |
| WO2004053593A2 (en) | 2004-06-24 |
| WO2004053593A3 (en) | 2004-10-28 |
| EP1567917A2 (en) | 2005-08-31 |
| KR20050084150A (ko) | 2005-08-26 |
| AU2003293441A8 (en) | 2004-06-30 |
| JP2006510046A (ja) | 2006-03-23 |
| US20080166666A1 (en) | 2008-07-10 |
| AU2003293441A1 (en) | 2004-06-30 |
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| C06 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |