CN1737188B - 用于溅镀镀膜的阳极 - Google Patents

用于溅镀镀膜的阳极 Download PDF

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Publication number
CN1737188B
CN1737188B CN200510090898.7A CN200510090898A CN1737188B CN 1737188 B CN1737188 B CN 1737188B CN 200510090898 A CN200510090898 A CN 200510090898A CN 1737188 B CN1737188 B CN 1737188B
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CN
China
Prior art keywords
anode
sputtering apparatus
cathode
endosome
conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN200510090898.7A
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English (en)
Chinese (zh)
Other versions
CN1737188A (zh
Inventor
乔治·J.·欧肯法思
马克斯·K.·太尔西
理查德·I.·塞登
罗伯特·E.·哈恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Viavi Solutions Inc
Original Assignee
Flex Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/074,249 external-priority patent/US20060049041A1/en
Application filed by Flex Products Inc filed Critical Flex Products Inc
Publication of CN1737188A publication Critical patent/CN1737188A/zh
Application granted granted Critical
Publication of CN1737188B publication Critical patent/CN1737188B/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3438—Electrodes other than cathode

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Drying Of Semiconductors (AREA)
  • Magnetic Heads (AREA)
  • Thin Magnetic Films (AREA)
CN200510090898.7A 2004-08-20 2005-08-19 用于溅镀镀膜的阳极 Expired - Lifetime CN1737188B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US60321104P 2004-08-20 2004-08-20
US60/603,211 2004-08-20
US11/074,249 US20060049041A1 (en) 2004-08-20 2005-03-07 Anode for sputter coating
US11/074,249 2005-03-07
US11/177,465 2005-07-08
US11/177,465 US7879209B2 (en) 2004-08-20 2005-07-08 Cathode for sputter coating

Publications (2)

Publication Number Publication Date
CN1737188A CN1737188A (zh) 2006-02-22
CN1737188B true CN1737188B (zh) 2011-12-14

Family

ID=35722363

Family Applications (2)

Application Number Title Priority Date Filing Date
CN200510090898.7A Expired - Lifetime CN1737188B (zh) 2004-08-20 2005-08-19 用于溅镀镀膜的阳极
CN200510092825.1A Expired - Lifetime CN1737190B (zh) 2004-08-20 2005-08-22 磁控溅镀装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN200510092825.1A Expired - Lifetime CN1737190B (zh) 2004-08-20 2005-08-22 磁控溅镀装置

Country Status (7)

Country Link
US (2) US7879209B2 (enExample)
EP (2) EP1628323B1 (enExample)
JP (2) JP4907124B2 (enExample)
CN (2) CN1737188B (enExample)
AT (1) ATE492025T1 (enExample)
DE (1) DE602005025293D1 (enExample)
ES (1) ES2626641T3 (enExample)

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US20090294017A1 (en) * 2008-05-30 2009-12-03 Precision Photonics Corporation Optical contacting enabled by thin film dielectric interface
US20100272964A1 (en) * 2008-05-30 2010-10-28 Precision Photonics Corporation - Photonics Optical Contacting Enabled by Thin Film Dielectric Interface
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US9502222B2 (en) * 2010-04-16 2016-11-22 Viavi Solutions Inc. Integrated anode and activated reactive gas source for use in magnetron sputtering device
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US8647437B2 (en) * 2010-05-31 2014-02-11 Ci Systems (Israel) Ltd. Apparatus, tool and methods for depositing annular or circular wedge coatings
RU2450086C2 (ru) * 2010-06-08 2012-05-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Национальный исследовательский институт "МЭИ" (ФГБОУ ВПО "НИУ МЭИ") Способ нанесения нанокомпозитного покрытия на плоские поверхности детали и устройство для его реализации (варианты)
DE102010038603B4 (de) * 2010-07-29 2016-06-02 Trumpf Huettinger Sp. Z O. O. DC-Plasmaanordnung
EP2509100B1 (en) * 2011-04-06 2019-08-14 Viavi Solutions Inc. Integrated anode and activated reactive gas source for use in a magnetron sputtering device
KR20140104045A (ko) * 2011-12-22 2014-08-27 캐논 아네르바 가부시키가이샤 SrRuO3 막 증착 방법
JP6244103B2 (ja) * 2012-05-04 2017-12-06 ヴァイアヴィ・ソリューションズ・インコーポレイテッドＶｉａｖｉ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． 反応性スパッタ堆積のための方法および反応性スパッタ堆積システム
TWI648561B (zh) 2012-07-16 2019-01-21 美商唯亞威方案公司 光學濾波器及感測器系統
CN103602954B (zh) * 2013-11-06 2016-02-24 深圳市华星光电技术有限公司 用于磁控溅射阳极棒的支撑件及包括其的磁控溅射装置
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CN104988465B (zh) * 2015-06-29 2017-10-13 信利（惠州）智能显示有限公司 磁控溅射装置阳极部件
US9923007B2 (en) 2015-12-29 2018-03-20 Viavi Solutions Inc. Metal mirror based multispectral filter array
US9960199B2 (en) 2015-12-29 2018-05-01 Viavi Solutions Inc. Dielectric mirror based multispectral filter array
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US10168459B2 (en) * 2016-11-30 2019-01-01 Viavi Solutions Inc. Silicon-germanium based optical filter
US12442067B2 (en) * 2017-02-24 2025-10-14 Valeo North America Ceramic metallic coatings
CN106950933B (zh) * 2017-05-02 2019-04-23 中江联合(北京)科技有限公司 质量一致性控制方法及装置、计算机存储介质
US10712475B2 (en) 2017-08-16 2020-07-14 Lumentum Operations Llc Multi-layer thin film stack for diffractive optical elements
US10802185B2 (en) 2017-08-16 2020-10-13 Lumentum Operations Llc Multi-level diffractive optical element thin film coating
CN107365968B (zh) * 2017-08-24 2019-09-17 武汉华星光电半导体显示技术有限公司 一种溅镀装置及溅镀系统
CN111286712B (zh) * 2018-12-10 2022-05-17 苏州能讯高能半导体有限公司 一种靶材溅镀设备以及靶材溅镀系统
DE102019119664A1 (de) * 2019-07-19 2021-01-21 Infineon Technologies Ag Abtasten eines Drehwinkels
CN111041434B (zh) * 2020-03-17 2020-06-19 上海陛通半导体能源科技股份有限公司 用于沉积绝缘膜的物理气相沉积设备
DE102023002926A1 (de) * 2023-07-17 2025-01-23 Oerlikon Surface Solutions Ag, Pfäffikon Methode und Vorrichtung zur Synthese von hochisolierenden Schichten

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Also Published As

Publication number Publication date
DE602005025293D1 (de) 2011-01-27
ATE492025T1 (de) 2011-01-15
ES2626641T3 (es) 2017-07-25
US20060070877A1 (en) 2006-04-06
JP2006057181A (ja) 2006-03-02
EP1628324A3 (en) 2007-07-04
JP5048229B2 (ja) 2012-10-17
EP1628323B1 (en) 2017-03-29
JP4907124B2 (ja) 2012-03-28
JP2006057184A (ja) 2006-03-02
EP1628324B8 (en) 2011-01-26
EP1628323A2 (en) 2006-02-22
EP1628324B1 (en) 2010-12-15
EP1628324A2 (en) 2006-02-22
CN1737190A (zh) 2006-02-22
EP1628323A3 (en) 2009-04-22
US20060049042A1 (en) 2006-03-09
CN1737190B (zh) 2012-05-23
US7879209B2 (en) 2011-02-01
CN1737188A (zh) 2006-02-22
US8163144B2 (en) 2012-04-24

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