CN1695407A - 印刷方法和阻焊油墨组合物 - Google Patents

印刷方法和阻焊油墨组合物 Download PDF

Info

Publication number
CN1695407A
CN1695407A CNA038252082A CN03825208A CN1695407A CN 1695407 A CN1695407 A CN 1695407A CN A038252082 A CNA038252082 A CN A038252082A CN 03825208 A CN03825208 A CN 03825208A CN 1695407 A CN1695407 A CN 1695407A
Authority
CN
China
Prior art keywords
parts
ink
solder resist
weight
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA038252082A
Other languages
English (en)
Chinese (zh)
Inventor
A·J·霍珀
M·R·詹姆斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avecia Ltd
Original Assignee
Avecia Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avecia Ltd filed Critical Avecia Ltd
Publication of CN1695407A publication Critical patent/CN1695407A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Glass Compositions (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CNA038252082A 2002-09-20 2003-08-22 印刷方法和阻焊油墨组合物 Pending CN1695407A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0221893.1A GB0221893D0 (en) 2002-09-20 2002-09-20 Process
GB0221893.1 2002-09-20

Publications (1)

Publication Number Publication Date
CN1695407A true CN1695407A (zh) 2005-11-09

Family

ID=9944479

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA038252082A Pending CN1695407A (zh) 2002-09-20 2003-08-22 印刷方法和阻焊油墨组合物

Country Status (11)

Country Link
US (1) US20060047014A1 (cg-RX-API-DMAC7.html)
EP (1) EP1543704B1 (cg-RX-API-DMAC7.html)
JP (1) JP2005539390A (cg-RX-API-DMAC7.html)
KR (1) KR20050057461A (cg-RX-API-DMAC7.html)
CN (1) CN1695407A (cg-RX-API-DMAC7.html)
AT (1) ATE326828T1 (cg-RX-API-DMAC7.html)
AU (1) AU2003260739A1 (cg-RX-API-DMAC7.html)
DE (1) DE60305333T2 (cg-RX-API-DMAC7.html)
GB (1) GB0221893D0 (cg-RX-API-DMAC7.html)
TW (1) TWI318231B (cg-RX-API-DMAC7.html)
WO (1) WO2004028225A1 (cg-RX-API-DMAC7.html)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103192602A (zh) * 2012-01-06 2013-07-10 住友重机械工业株式会社 薄膜形成装置及薄膜形成方法
CN109906253A (zh) * 2016-11-10 2019-06-18 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
CN109923181A (zh) * 2016-11-10 2019-06-21 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
CN110023421A (zh) * 2016-11-10 2019-07-16 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
CN110072950A (zh) * 2016-11-10 2019-07-30 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
CN110831345A (zh) * 2019-11-22 2020-02-21 东莞市鸿运电子有限公司 一种厚铜板的印刷方法
CN111512452A (zh) * 2017-10-17 2020-08-07 科迪华公司 用于显示装置的具有高量子点浓度的油墨组合物
CN111902493A (zh) * 2018-03-23 2020-11-06 科迪华公司 用于形成有机薄膜的组合物和技术
CN114395287A (zh) * 2021-12-30 2022-04-26 广州斯达利电子原料有限公司 阻焊油墨、阻焊层、Mini-LED印刷线路板
CN118206895A (zh) * 2022-12-16 2024-06-18 庆鼎精密电子(淮安)有限公司 感光防焊油墨及电路板的制造方法

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1007308B1 (en) * 1997-02-24 2003-11-12 Superior Micropowders LLC Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US20050039634A1 (en) * 2003-07-11 2005-02-24 Hermansky Clarence Gaetano Non-aqueous ink jet inks with improved decap
JP4290510B2 (ja) * 2003-08-22 2009-07-08 太陽インキ製造株式会社 インクジェット用光硬化性・熱硬化性組成物とそれを用いたプリント配線板
US7485242B2 (en) * 2004-01-23 2009-02-03 Printar Ltd Reactive fine particles
US7439285B2 (en) * 2004-01-23 2008-10-21 Printar Ltd. Liquid thermosetting ink
GB0414847D0 (en) * 2004-07-02 2004-08-04 Avecia Ltd Process
JP4852953B2 (ja) * 2004-09-30 2012-01-11 セイコーエプソン株式会社 インク組成物およびそれを用いた画像形成方法
WO2006076612A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation A process for manufacturing application specific printable circuits (aspc’s) and other custom electronic devices
WO2006076607A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of passive electricalcomponents
WO2006076615A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of compositionally no-uniform features
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
WO2006076606A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
US20060158478A1 (en) * 2005-01-14 2006-07-20 Howarth James J Circuit modeling and selective deposition
US20060190917A1 (en) * 2005-01-14 2006-08-24 Cabot Corporation System and process for manufacturing application specific printable circuits (ASPC'S) and other custom electronic devices
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US20060163744A1 (en) * 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
WO2006076604A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
US7533361B2 (en) * 2005-01-14 2009-05-12 Cabot Corporation System and process for manufacturing custom electronics by combining traditional electronics with printable electronics
WO2007026366A1 (en) 2005-08-31 2007-03-08 Printar Ltd. Uv curable hybridcuring ink jet ink composition and solder mask using the same
WO2007055332A1 (ja) * 2005-11-11 2007-05-18 Toyo Ink Mfg. Co., Ltd. 活性エネルギー線硬化型インクジェットインキ
ES2322276T3 (es) * 2005-11-28 2009-06-18 Agfa Graphics N.V. Dispersiones de quinacridona no acuosas para utilizacion en sinergicos de dispersion.
EP1803784B3 (en) 2005-12-28 2018-02-14 Fujifilm Corporation Inkjet recording composition, inkjet recording method, method for producing planographic printing plate, and planographic printing plate
JP4979232B2 (ja) * 2005-12-28 2012-07-18 富士フイルム株式会社 インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
US20070281099A1 (en) * 2006-05-31 2007-12-06 Cabot Corporation Solderable pads utilizing nickel and silver nanoparticle ink jet inks
US20080291169A1 (en) * 2007-05-21 2008-11-27 Brenner David S Multimodal Adaptive User Interface for a Portable Electronic Device
US7883092B2 (en) 2007-12-31 2011-02-08 Scientific Games International, Inc. Energy cured coating
KR101401488B1 (ko) * 2008-01-10 2014-06-03 동우 화인켐 주식회사 착색 감광성 수지 조성물 및 이를 이용하여 제조된컬러필터와 액정표시장치
US8399175B2 (en) * 2008-04-07 2013-03-19 Addison Clear Wave, Llc Photopolymer resins for photo replication of information layers
US8778074B2 (en) 2009-07-20 2014-07-15 Markem-Imaje Corporation Solvent-based inkjet ink formulations
JP2011178832A (ja) * 2010-02-26 2011-09-15 Dic Corp 紫外線硬化型インクジェット記録用インク、それから得られた絶縁膜、電子素子及び電子素子の製造方法
ES2550469T3 (es) * 2010-12-20 2015-11-10 Agfa Graphics N.V. Método para fabricar una matriz de impresión flexográfica
EP2656145B1 (en) 2010-12-20 2019-03-20 Agfa Nv A curable jettable fluid for making a flexographic printing master
TW201233403A (en) * 2011-02-11 2012-08-16 Univ Nat Taiwan Dental composite material and applications thereof
CN102858091B (zh) * 2011-06-28 2015-08-19 北大方正集团有限公司 一种清除混压成型pcb板树脂流胶的方法
CA2863624A1 (en) * 2012-01-19 2013-07-25 Isola Usa Corp. Synthesized resins and varnishes, prepregs and laminates made therefrom
TW201442130A (zh) * 2013-04-29 2014-11-01 Zen Voce Corp 可增進積體電路基板植球良率之方法
CN103568612B (zh) * 2013-11-06 2015-06-17 复旦大学 一种基于压电式家用喷墨打印技术制备印制电子阻焊材料的方法
US20150197062A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR Method, device, and system of three-dimensional printing
TW201600349A (zh) * 2014-03-26 2016-01-01 肯提克有限公司 多色列印技術
US9902006B2 (en) 2014-07-25 2018-02-27 Raytheon Company Apparatus for cleaning an electronic circuit board
US9606430B2 (en) * 2014-08-28 2017-03-28 Xerox Corporation Method of aerosol printing a solder mask ink composition
US11149155B2 (en) 2015-05-01 2021-10-19 Sun Chemical Corporation Electrically-insulating energy-curable inkjet fluids
EP3119170B1 (en) 2015-07-14 2018-12-26 Agfa-Gevaert Manufacturing printed circuit boards using uv free radical curable inkjet inks
EP3491080B1 (en) * 2016-07-27 2026-04-29 Sun Chemical Corporation Water-based electrically-insulating energy-curable fluids
EP3296368B1 (en) * 2016-09-14 2020-11-11 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing printed circuit boards
JP7140686B2 (ja) * 2017-09-11 2022-09-21 フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド 誘電フィルム形成用組成物
EP3728490B1 (en) 2017-12-18 2022-02-09 Agfa-Gevaert Nv Solder mask inkjet inks for manufacturing printed circuit boards
EP3498788B1 (en) 2017-12-18 2023-05-03 Agfa-Gevaert Nv Solder mask inkjet inks for manufacturing printed circuit boards
KR20200116151A (ko) 2018-03-02 2020-10-08 아그파-게바에르트 엔.브이. 인쇄 회로 기판을 제조하기 위한 잉크젯 잉크
EP3656824A1 (en) 2018-11-26 2020-05-27 Agfa-Gevaert Nv Radiation curable inkjet for manufacturing printed circuit boards
US20210403738A1 (en) 2018-11-26 2021-12-30 Agfa-Gevaert Nv Novel photoinitiators
EP3686252A1 (en) 2019-01-24 2020-07-29 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
US11596070B2 (en) * 2019-02-14 2023-02-28 Orbotech Ltd. Apparatus for use in preparing a printed circuit board and photosensitive ink for in an ink jet printer
EP3981846B1 (en) * 2020-10-09 2026-06-17 Agfa Nv Free radical curable inkjet inks and inkjet printing methods

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1179398A (en) * 1967-06-26 1970-01-28 Ford Motor Co Improvements in or relating to Printed Circuit Boards
JPS61278577A (ja) * 1985-06-05 1986-12-09 Mitsubishi Rayon Co Ltd 紫外線硬化型インキ組成物
US4789620A (en) * 1986-03-03 1988-12-06 Mitsubishi Rayon Co. Ltd. Liquid photosensitive resin composition containing carboxylated epoxy acrylates or methacrylates
JPH0686505B2 (ja) * 1986-03-10 1994-11-02 キヤノン株式会社 活性エネルギ−線硬化型樹脂組成物
US5089376A (en) * 1986-12-08 1992-02-18 Armstrong World Industries, Inc. Photoimagable solder mask coating
GB9123070D0 (en) * 1991-10-30 1991-12-18 Domino Printing Sciences Plc Ink
GB9014299D0 (en) * 1990-06-27 1990-08-15 Domino Printing Sciences Plc Ink composition
US5248752A (en) * 1991-11-12 1993-09-28 Union Carbide Chemicals & Plastics Technology Corporation Polyurethane (meth)acrylates and processes for preparing same
US5270368A (en) * 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
US5288589A (en) * 1992-12-03 1994-02-22 Mckeever Mark R Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
US5910854A (en) * 1993-02-26 1999-06-08 Donnelly Corporation Electrochromic polymeric solid films, manufacturing electrochromic devices using such solid films, and processes for making such solid films and devices
EP0737701B1 (en) * 1995-04-13 2002-03-06 Mitsui Chemicals, Inc. Epoxy acrylate resins and their uses
US5643657A (en) * 1995-04-28 1997-07-01 E. I. Du Pont De Nemours And Company Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits
GB9603667D0 (en) * 1996-02-21 1996-04-17 Coates Brothers Plc Ink composition
JPH10158582A (ja) * 1996-05-01 1998-06-16 Minnesota Mining & Mfg Co <3M> 保護用コーティングおよびインクカートリッジのためのその液体の適用
FR2772522B1 (fr) * 1997-12-17 2000-02-25 Framatome Connectors Int Dispositif de connexion a emboitement perpendiculaire, connecteur etanche a double verrouillage obtenu
DE19842379A1 (de) * 1998-09-16 2000-05-11 Tron Elektronik Gmbh F Verfahren zum zweidimensional-gerasterten Herstellen von Schichtstrukturen auf Schaltungsplatinen
US6310115B1 (en) * 1998-10-29 2001-10-30 Agfa-Gevaert Ink compositions for ink jet printing
JP2001288387A (ja) * 2000-04-05 2001-10-16 Sony Chem Corp 電離放射線硬化型インクジェット用インク及びその印画物
JP4611554B2 (ja) * 2000-12-01 2011-01-12 昭和電工株式会社 感光性組成物およびその硬化物ならびにそれを用いたプリント配線基板
MXPA03003997A (es) * 2000-11-09 2004-02-12 3M Innovative Properties Co Composiciones fluidas de tinta, eyectables, curables por radiacion, resistentes a la intemperie, particularmente adecuadas para aplicaciones exteriores.
US20030203994A1 (en) * 2002-04-26 2003-10-30 Michael Chen Solventless photo-sensitive thermosetting-type ink

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103192602A (zh) * 2012-01-06 2013-07-10 住友重机械工业株式会社 薄膜形成装置及薄膜形成方法
CN103192602B (zh) * 2012-01-06 2016-05-04 住友重机械工业株式会社 薄膜形成装置及薄膜形成方法
CN110023421B (zh) * 2016-11-10 2022-03-01 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
CN109906253A (zh) * 2016-11-10 2019-06-18 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
CN110023421A (zh) * 2016-11-10 2019-07-16 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
CN110072950A (zh) * 2016-11-10 2019-07-30 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
CN109923181A (zh) * 2016-11-10 2019-06-21 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
CN110072950B (zh) * 2016-11-10 2022-02-11 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
CN109906253B (zh) * 2016-11-10 2022-02-01 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
CN109923181B (zh) * 2016-11-10 2022-01-14 爱克发-格法特公司 用于制造印刷电路板的阻焊喷墨油墨
CN111512452A (zh) * 2017-10-17 2020-08-07 科迪华公司 用于显示装置的具有高量子点浓度的油墨组合物
CN111512452B (zh) * 2017-10-17 2023-11-21 科迪华公司 用于显示装置的具有高量子点浓度的油墨组合物
CN111902493A (zh) * 2018-03-23 2020-11-06 科迪华公司 用于形成有机薄膜的组合物和技术
CN110831345A (zh) * 2019-11-22 2020-02-21 东莞市鸿运电子有限公司 一种厚铜板的印刷方法
CN114395287A (zh) * 2021-12-30 2022-04-26 广州斯达利电子原料有限公司 阻焊油墨、阻焊层、Mini-LED印刷线路板
CN118206895A (zh) * 2022-12-16 2024-06-18 庆鼎精密电子(淮安)有限公司 感光防焊油墨及电路板的制造方法

Also Published As

Publication number Publication date
WO2004028225A1 (en) 2004-04-01
AU2003260739A1 (en) 2004-04-08
GB0221893D0 (en) 2002-10-30
EP1543704B1 (en) 2006-05-17
JP2005539390A (ja) 2005-12-22
EP1543704A1 (en) 2005-06-22
KR20050057461A (ko) 2005-06-16
DE60305333T2 (de) 2007-03-29
TWI318231B (en) 2009-12-11
US20060047014A1 (en) 2006-03-02
DE60305333D1 (de) 2006-06-22
ATE326828T1 (de) 2006-06-15
TW200420682A (en) 2004-10-16

Similar Documents

Publication Publication Date Title
EP1543704B1 (en) Printing process and solder mask ink composition
CN1694934A (zh) 制备电子装置的方法和油墨
CN101283061B (zh) 紫外线固化性混合固化喷墨油墨组合物以及使用该组合物的阻焊膜
KR101685469B1 (ko) 개선된 핫 멜트 조성물
JP6703112B2 (ja) インクジェット印刷用樹脂組成物およびそれを使用して調製されたプリント配線板
WO2009118976A1 (ja) エッチングレジスト用インクジェットインキ組成物
EP3321331B1 (en) Solder mask inkjet inks for manufacturing printed circuit boards
US20060019077A1 (en) Process
JP2012102294A (ja) 紫外線硬化型インクジェット用インク組成物
JP6663034B2 (ja) インクジェット樹脂組成物およびそれを使用するプリント配線板
CN112011223A (zh) 一种pcb板基板填充用uv固化喷印油墨及pcb板
JP5518311B2 (ja) エッチングレジスト用インクジェットインキ組成物
JP6890837B2 (ja) インクジェット樹脂組成物の調製方法
JP4392350B2 (ja) メッキ法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication