TWI318231B - Ink jet printing process and solder mask ink composition - Google Patents

Ink jet printing process and solder mask ink composition

Info

Publication number
TWI318231B
TWI318231B TW092125062A TW92125062A TWI318231B TW I318231 B TWI318231 B TW I318231B TW 092125062 A TW092125062 A TW 092125062A TW 92125062 A TW92125062 A TW 92125062A TW I318231 B TWI318231 B TW I318231B
Authority
TW
Taiwan
Prior art keywords
parts
solder mask
mask ink
ink
jet printing
Prior art date
Application number
TW092125062A
Other languages
English (en)
Chinese (zh)
Other versions
TW200420682A (en
Inventor
Alan John Hopper
Mark Robert James
Original Assignee
Fujifilm Imaging Colorants Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Imaging Colorants Ltd filed Critical Fujifilm Imaging Colorants Ltd
Publication of TW200420682A publication Critical patent/TW200420682A/zh
Application granted granted Critical
Publication of TWI318231B publication Critical patent/TWI318231B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Glass Compositions (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW092125062A 2002-09-20 2003-09-10 Ink jet printing process and solder mask ink composition TWI318231B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0221893.1A GB0221893D0 (en) 2002-09-20 2002-09-20 Process

Publications (2)

Publication Number Publication Date
TW200420682A TW200420682A (en) 2004-10-16
TWI318231B true TWI318231B (en) 2009-12-11

Family

ID=9944479

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092125062A TWI318231B (en) 2002-09-20 2003-09-10 Ink jet printing process and solder mask ink composition

Country Status (11)

Country Link
US (1) US20060047014A1 (cg-RX-API-DMAC7.html)
EP (1) EP1543704B1 (cg-RX-API-DMAC7.html)
JP (1) JP2005539390A (cg-RX-API-DMAC7.html)
KR (1) KR20050057461A (cg-RX-API-DMAC7.html)
CN (1) CN1695407A (cg-RX-API-DMAC7.html)
AT (1) ATE326828T1 (cg-RX-API-DMAC7.html)
AU (1) AU2003260739A1 (cg-RX-API-DMAC7.html)
DE (1) DE60305333T2 (cg-RX-API-DMAC7.html)
GB (1) GB0221893D0 (cg-RX-API-DMAC7.html)
TW (1) TWI318231B (cg-RX-API-DMAC7.html)
WO (1) WO2004028225A1 (cg-RX-API-DMAC7.html)

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Also Published As

Publication number Publication date
WO2004028225A1 (en) 2004-04-01
AU2003260739A1 (en) 2004-04-08
GB0221893D0 (en) 2002-10-30
EP1543704B1 (en) 2006-05-17
JP2005539390A (ja) 2005-12-22
EP1543704A1 (en) 2005-06-22
KR20050057461A (ko) 2005-06-16
DE60305333T2 (de) 2007-03-29
US20060047014A1 (en) 2006-03-02
DE60305333D1 (de) 2006-06-22
CN1695407A (zh) 2005-11-09
ATE326828T1 (de) 2006-06-15
TW200420682A (en) 2004-10-16

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