CN1658744B - 液冷系统和电子装置 - Google Patents

液冷系统和电子装置 Download PDF

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Publication number
CN1658744B
CN1658744B CN2004101048381A CN200410104838A CN1658744B CN 1658744 B CN1658744 B CN 1658744B CN 2004101048381 A CN2004101048381 A CN 2004101048381A CN 200410104838 A CN200410104838 A CN 200410104838A CN 1658744 B CN1658744 B CN 1658744B
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China
Prior art keywords
mentioned
radiator
heat
stream
thin plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2004101048381A
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English (en)
Chinese (zh)
Other versions
CN1658744A (zh
Inventor
南谷林太郎
大桥繁男
长绳尚
松下伸二
及川洋典
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Maxell Ltd
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Hitachi Ltd
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Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN1658744A publication Critical patent/CN1658744A/zh
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Publication of CN1658744B publication Critical patent/CN1658744B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN2004101048381A 2004-02-16 2004-12-29 液冷系统和电子装置 Expired - Fee Related CN1658744B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004038180A JP4234621B2 (ja) 2004-02-16 2004-02-16 液冷システムおよび電子装置
JP038180/2004 2004-02-16

Publications (2)

Publication Number Publication Date
CN1658744A CN1658744A (zh) 2005-08-24
CN1658744B true CN1658744B (zh) 2010-07-21

Family

ID=34697952

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2004101048381A Expired - Fee Related CN1658744B (zh) 2004-02-16 2004-12-29 液冷系统和电子装置

Country Status (7)

Country Link
US (1) US7624789B2 (enExample)
EP (1) EP1564626B1 (enExample)
JP (1) JP4234621B2 (enExample)
KR (1) KR100618482B1 (enExample)
CN (1) CN1658744B (enExample)
DE (1) DE602004030756D1 (enExample)
TW (1) TWI272892B (enExample)

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US7086452B1 (en) * 2000-06-30 2006-08-08 Intel Corporation Method and an apparatus for cooling a computer
TWI417604B (zh) 2005-12-28 2013-12-01 半導體能源研究所股份有限公司 顯示裝置
JP2008027374A (ja) 2006-07-25 2008-02-07 Fujitsu Ltd 液冷ユニット用受熱器および液冷ユニット並びに電子機器
JP5283836B2 (ja) * 2006-07-25 2013-09-04 富士通株式会社 液冷ユニット用受熱器および液冷ユニット並びに電子機器
US7978474B2 (en) * 2007-05-22 2011-07-12 Apple Inc. Liquid-cooled portable computer
TWI422313B (zh) * 2007-12-04 2014-01-01 Asia Vital Components Co Ltd Radiative fin manufacturing method
JP5065202B2 (ja) * 2008-08-28 2012-10-31 トヨタ自動車株式会社 半導体装置
JP5161757B2 (ja) * 2008-12-26 2013-03-13 パナソニック株式会社 画像表示装置
CN102819303A (zh) * 2011-06-09 2012-12-12 鸿富锦精密工业（深圳）有限公司 计算机机箱
CN103179837A (zh) * 2011-12-20 2013-06-26 研能科技股份有限公司 应用于可携式电子装置的冷却系统
US20130255281A1 (en) * 2012-03-29 2013-10-03 General Electric Company System and method for cooling electrical components
US9472487B2 (en) * 2012-04-02 2016-10-18 Raytheon Company Flexible electronic package integrated heat exchanger with cold plate and risers
US9801310B2 (en) 2013-04-03 2017-10-24 International Business Machines Corporation Server cooling system without the use of vapor compression refrigeration
US9970687B2 (en) * 2013-06-26 2018-05-15 Tai-Her Yang Heat-dissipating structure having embedded support tube to form internally recycling heat transfer fluid and application apparatus
WO2015199726A1 (en) * 2014-06-27 2015-12-30 Hewlett-Packard Development Company, L. P. Heat distribution of computing devices
US10355356B2 (en) 2014-07-14 2019-07-16 Palo Alto Research Center Incorporated Metamaterial-based phase shifting element and phased array
CN204084274U (zh) * 2014-07-30 2015-01-07 深圳Tcl新技术有限公司 散热器、背光模组及显示模组
US10060686B2 (en) * 2015-06-15 2018-08-28 Palo Alto Research Center Incorporated Passive radiative dry cooling module/system using metamaterials
CN107175813A (zh) * 2017-06-30 2017-09-19 北京金达雷科技有限公司 冷却基板、冷却组件、显示组件、树脂池组件、3d打印机
CN109426049B (zh) * 2017-08-21 2021-03-05 深圳光峰科技股份有限公司 液冷循环散热装置、液冷循环散热系统及光学投影系统
DE102018129983A1 (de) 2018-11-27 2020-05-28 Bayerische Motoren Werke Aktiengesellschaft Stator mit einem Kühlmantel, elektrische Maschine sowie Kraftfahrzeug
EP3842726A1 (en) * 2019-12-25 2021-06-30 Showa Denko Packaging Co., Ltd. Heat exchanger and inner fin thereof
CN112762732A (zh) * 2020-12-28 2021-05-07 深圳市宝晟互联信息技术有限公司 散热装置
CN116888424A (zh) * 2021-02-26 2023-10-13 京瓷株式会社 热器件
CN116997134A (zh) * 2022-04-26 2023-11-03 华为技术有限公司 一种柔性液冷散热单元

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5535818A (en) * 1992-10-12 1996-07-16 Fujitsu Limited Cooling system for electronic device
CN1193762A (zh) * 1996-12-31 1998-09-23 康帕克电脑公司 计算机特殊器件的液体冷却装置
CN2496065Y (zh) * 2001-08-17 2002-06-19 创微国际开发股份有限公司 微环路热管

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US3327776A (en) * 1965-10-24 1967-06-27 Trane Co Heat exchanger
US4155402A (en) * 1977-01-03 1979-05-22 Sperry Rand Corporation Compliant mat cooling
US5132873A (en) * 1988-09-30 1992-07-21 Microelectronics And Computer Technology Corporation Diaphragm sealing apparatus
US5245693A (en) * 1991-03-15 1993-09-14 In-Touch Products Co. Parenteral fluid warmer apparatus and disposable cassette utilizing thin, flexible heat-exchange membrane
US5381510A (en) * 1991-03-15 1995-01-10 In-Touch Products Co. In-line fluid heating apparatus with gradation of heat energy from inlet to outlet
US5205348A (en) * 1991-05-31 1993-04-27 Minnesota Mining And Manufacturing Company Semi-rigid heat transfer devices
US5485671A (en) 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
US5731954A (en) * 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
KR20000011358A (ko) * 1998-07-01 2000-02-25 안자이 이치로 전자기기용방열장치
JP4055323B2 (ja) 1999-12-13 2008-03-05 松下電器産業株式会社 放熱体およびこれを用いた冷却装置およびこの冷却装置を備えた電子機器
US6808015B2 (en) * 2000-03-24 2004-10-26 Denso Corporation Boiling cooler for cooling heating element by heat transfer with boiling
JP2002098454A (ja) * 2000-07-21 2002-04-05 Mitsubishi Materials Corp 液冷ヒートシンク及びその製造方法
US6367543B1 (en) * 2000-12-11 2002-04-09 Thermal Corp. Liquid-cooled heat sink with thermal jacket
US6587336B2 (en) 2001-06-27 2003-07-01 International Business Machines Corporation Cooling system for portable electronic and computer devices
JP3636118B2 (ja) 2001-09-04 2005-04-06 株式会社日立製作所 電子装置用の水冷装置
JP3961844B2 (ja) 2002-02-08 2007-08-22 株式会社日立製作所 冷却液タンク
TWI234063B (en) 2002-05-15 2005-06-11 Matsushita Electric Industrial Co Ltd Cooling apparatus for electronic equipment
JP2004047843A (ja) 2002-07-15 2004-02-12 Hitachi Ltd 電子装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5535818A (en) * 1992-10-12 1996-07-16 Fujitsu Limited Cooling system for electronic device
CN1193762A (zh) * 1996-12-31 1998-09-23 康帕克电脑公司 计算机特殊器件的液体冷却装置
CN2496065Y (zh) * 2001-08-17 2002-06-19 创微国际开发股份有限公司 微环路热管

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
全文.

Also Published As

Publication number Publication date
JP4234621B2 (ja) 2009-03-04
EP1564626A1 (en) 2005-08-17
JP2005229036A (ja) 2005-08-25
KR100618482B1 (ko) 2006-08-31
DE602004030756D1 (de) 2011-02-10
US7624789B2 (en) 2009-12-01
US20050178533A1 (en) 2005-08-18
EP1564626B1 (en) 2010-12-29
KR20050081867A (ko) 2005-08-19
TW200529735A (en) 2005-09-01
TWI272892B (en) 2007-02-01
CN1658744A (zh) 2005-08-24

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C06 Publication
PB01 Publication
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SE01 Entry into force of request for substantive examination
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Owner name: HITACHI LTD.

Free format text: FORMER OWNER: HITACHI,LTD.

Effective date: 20130723

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Effective date of registration: 20130723

Address after: Tokyo, Japan

Patentee after: HITACHI CONSUMER ELECTRONICS Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: Hitachi, Ltd.

ASS Succession or assignment of patent right

Owner name: HITACHI MAXELL LTD.

Free format text: FORMER OWNER: HITACHI LTD.

Effective date: 20150401

TR01 Transfer of patent right

Effective date of registration: 20150401

Address after: Osaka, Japan

Patentee after: Hitachi Maxell, Ltd.

Address before: Tokyo, Japan

Patentee before: Hitachi Consumer Electronics Co.,Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20171213

Address after: Kyoto Japan

Patentee after: MAXELL, Ltd.

Address before: Osaka, Japan

Patentee before: Hitachi Maxell, Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100721

Termination date: 20211229