1331270 - 九、發明說明： 【發明所屬之技術領域】 本發明，是有關膨脹罐裝置、膨脹罐裝置的製造方法及 具備膨脹罐裝置的液冷式散熱裝置，譬如個人電腦或伺服 器等之I T機器、或A V機器、或產業機械、或工作機械 等從具備發熱源所產生的熱用來散熱之裝置所使用。 本說明書及申請專利範圍中，所謂「鋁」之用語，是指 含純鋁及其他的鋁合金。又，將第5圖之上下稱作爲上下。 【先前技術】 先前技術，譬如作爲個人電腦或伺服器等從具備發熱源 所產生的熱用來散熱之方法，是使用由單面形成受熱面的 鋁製散熱基板、及在散熱基板之另一面一體所設置的散熱 片’並在散熱基板之受熱面使發熱源接觸，藉由從風扇將 風吹到散熱片’由發熱源將所產生的熱通過散熱基板及散 熱片來放出到空氣中之方法廣汎地被採用。 可是’最近，譬如在個人電腦或伺服器等，增加高速處 理所要求的用途，其中一方’亦增加音樂或動畫等多媒體 應用。因此’譬如中央演算處理裝置（以下，簡稱CPU : 中央處理器）之動作頻率亦變高，發熱量亦明顯地增加。 又’此等之機器中’安靜性亦被要求。因此，以上述之方 法不能獲得充分地散熱性能，同時亦不能滿足所要求的安 靜性。 又’譬如作爲從產業機械或工作機械等之發熱源所產生 的熱用來散熱之方法，利用冷媒系統的作用液之熱導管將 熱放出到空氣中的方法廣汎地被採用。 1331270 可是’從地球環境保護的觀點被要求不利用冷媒而朝冷 卻方式轉換。 爲了解決這樣的問題，將水作爲主體的冷卻液，譬如形 成利用使用不凍液之液冷式散熱裝置。 譬如，作爲筆記型個人電腦的液冷式散熱裝置，提出專 利申請有具備：由充滿冷卻液之水冷電子管（water jacket) 而成且固定於發熱電子零件的兩端、及兩端連接於受熱器 且使冷卻液循環之冷卻液循環管，並在受熱器內及冷卻液 循環管內封入不凍液，受熱器配置於具有鍵盤的個人電腦 本體部’冷卻液循環管延伸到開關自如地設於個人電腦本 體部的顯示裝置爲止，當顯示裝置中打開時在定位於上方 的角部’設置連通於冷卻液循環管的備用罐（參考曰本專 利特開2002-182797號公報）。該液冷式散熱裝置中，藉 由備用罐的作用’依據從發熱源所受的熱當冷卻液加熱時 來吸收熱膨脹’同時當減少冷卻液時來補充冷卻液的不足 分。 但是，爲了使液冷式散熱裝置中提高冷卻效率，有必要 將冷卻液中之空氣儘可能從循環系統加以排除。可是，上 述公報記載的液冷式散熱裝置，當關閉顯示裝置時備用罐 內之空氣混入到冷卻液循環管內，該空氣即使打開顯示裝 置亦難以回到備用罐內’所以會有降低冷卻效力的問題。 本發明之目的，是要來解決上述問題，提供一種膨脹罐 裝置、膨脹罐裝置的製造方法及液冷式散熱裝置，將冷卻 液中之空氣從循環系統加以排除，同時可用來防止循環系 統的破壞’並且可用來防止減少循環系統內之冷卻液。 1331270 三、發明內容 〔發明之揭示〕 本發明，爲了達成上述目的由以下態樣所構成。 η —種膨脹罐裝置，具備有：具有冷卻液通路的罐設置 罐底、及在罐設置罐底之上面所設置的膨脹罐，罐設置罐 底，具有通過其上面及冷卻液通路的連通孔，膨脹罐，具 有：具有膨脹突出於上方且在下方開口之膨脹突出部的罐 本體、及接合於罐本體之下端且堵塞膨脹突出部的下端開 口，同時接合於罐設置罐底之上面的底板，在與膨脹罐之 底板中之連通孔對應的部分，用來形成與罐設置罐底之連 通孔貫通的貫通孔，在底板中之貫通孔的周緣上，朝向上 方將傾斜於貫通孔之中央部側的擋板跨越全周圍所設置。 2) 上述1)所記載之膨脹罐裝置，其中罐設置罐底，是 藉由將上下2片的罐底形成用板來接合成疊層狀所形成， 並藉由使下罐底形成用板膨脹突出於下方在上下兩罐底形 成用板間來形成冷卻液通路，並在上罐底形成用板打通連 通孔。 3) 上述2)所記載之膨脹罐裝置，其中上下兩罐底形成 用板分別由金屬所構成，而上下兩罐底形成用板是被硬 焊。 4) 上述2)所記載之膨脹罐裝置，其中上下兩罐底形成 用板分別由鋁所構成，並利用設於上罐底形成用板的下面 及下罐底形成用琢的上面之中至少其中一方的焊料層使上 下兩罐底形成用板被硬焊。 5)上述4)所記載之膨脹罐裝置，其中底板由鋁所構成 1331270 並利用設於底板的下面及上罐底形成用板的上面之中至少 其中一方的焊料層使底板及上罐底形成用板被硬焊。 6) 上述1)所記載之膨脹罐裝置，其中罐本體的膨脹突 出部之頂壁爲平坦，並在頂壁中的擋板先端所包圍之開口 使面對部分突出於下方。 7) 上述1)所記載之膨脹罐裝置，其中罐本體及底板分 別由金屬所構成，而罐本體中的膨脹突出部之周圍的朝外 凸緣及底板被硬焊。 8) 上述7)所記載之膨脹罐裝置，其中罐本體及底板分 別由鋁所構成，並利用設於罐本體的下面及底板的上面之 中至少其中一方的焊料層使罐本體之朝外凸緣及底板被硬 焊。 9 ) 一種膨脹罐裝置的製造方法，是用來製造上述1)記 載之膨脹罐裝置的方法，包含：用來準備具有膨脹突出於 下方之冷卻液通路的金屬製下罐底形成用板、及具有貫通 狀之連通孔的金屬製上罐底形成用板；用來準備具有膨脹 突出於上方且在下方開口之膨脹突出部的金屬製罐本體、 及堵塞罐本體之膨脹突出部的下端開口之金屬製底板；在 底板來形成貫通孔，同時在底板中之貫通孔的周緣，朝向 上方將傾斜於貫通孔之中央部側的擋板跨越全周圍所形成； 在下罐底形成用板上，將上罐底形成用板，使連通孔面對 冷卻液通路重疊；在上罐底形成用板上，在貫通孔內含連通 孔使底板重疊，同時在底板上，將罐本體，使擋板來到上 方膨脹突出部內重疊；將上下兩罐底形成用板之間、上罐底 形成用板及底板、以及底板及罐本體同時進行硬焊。 1331270 10) 上述9)所記載之膨脹罐裝置的製造方法》是將上 下兩罐底形成用板、底板及罐本體用鋁來形成，並在上罐 底形成用板的下面及下罐底形成用板的上面之中至少其中 一方來設置焊料層，同時在罐本體的下面及底板的上面之 中至少其中一方來設置焊料層，進而在底板的下面及上罐 底形成用板的上面之中至少其中一方來設置焊料層，並利 用此等焊料層將上下兩罐底形成用板之間、上罐底形成用 板及底板、以及底板及罐本體來進行硬焊。 11) —種液冷式散熱裝置，具備有：連接於上述1)所 記載之膨脹罐裝置中的罐設置罐底之冷卻液通路的兩端開 口之冷卻液循環路、及在冷卻液循環路之途中所設置的受 熱器、及在罐設置罐底之冷卻液通路及冷卻液循環路內使 冷卻液循環的泵。 12) 上述11)所記載之液冷式散熱裝置，其中在冷卻液 循環路及冷卻液通路內所封入冷卻液的量，當膨脹罐裝置 形成垂直狀態時，用來充滿冷卻液循環路及冷卻液通路 內，同時使膨脹罐之膨脹突出部內的冷卻液之液面來定位 在比膨脹罐的底板中之擋板前端所包圍的開口更上方，而 且當膨脹罐裝置朝向上下相反時，亦用來充滿冷卻液循環 路及冷卻液通路內，同時使膨脹罐之膨脹突出部內的冷卻 液之液面來定位在比膨脹罐的底板中之擋板前端所包圍的 開口更上方之量。 13) 上述11)所記載之液冷式散熱裝置，其中受熱器， 具備有：由接合成疊層狀的2片高熱傳導性板所構成，同 時在兩高熱傳導性板間形成兩端開口之冷卻液通路的受熱 -10- 1331270 器本體、及由高熱傳導性材所構成且在受熱器本體之冷卻 液通路內所配置的傳熱構件，而受熱器本體具有在其外面 與發熱體進行熱接觸之受熱部。 上述13)所記載之液冷式散熱裝置，其中傳熱構件， 是由延伸於受熱器本體的冷卻液通路之長度方向的複數孔 狀通路形成爲並列狀之扁平管所構成。 15) 上述Μ)所記載之液冷式散熱裝置，其中2片高熱 傳導性板及扁平管分別由鋁所構成，使兩高熱傳導性板相 互被硬焊，並使扁平管來硬焊在兩高熱傳導性板上。 16) 上述15)所記載之液冷式散熱裝置，其中扁平管， 除了其兩端部之外被硬焊在兩高熱傳導性板。 17) 上述16)所記載之液冷式散熱裝置，其中兩高熱傳 導性板及扁平管分別由鋁所構成，而兩者藉由片狀焊料所 硬焊。 18) 上述16)所記載之液冷式散熱裝置，其中一方高熱 傳導性板在內面由具有焊料層的鋁硬焊片所構成，同時另 一方商熱傳導性板及扁平管分別由錦之踝材所構成，含上 述其中一方高熱傳導性板中的扁平管之兩端部分跨越扁平 管的全寬以上之長度，使膨脹突出於外方，並使扁平管的 兩端定位於上述其中一方高熱傳導性板之膨脹突出部中的 寬度方向之中間部’並使上述其中一方高熱傳導性板及扁 平管藉由鋁硬焊片的焊料層所硬焊，而上述另一方高熱傳 導性板及扁平管藉由片狀焊料所硬焊。 19) 上述16)所記載之液冷式散熱裝置，其中兩高熱傳 導性板分別在內面由具有焊料層的鋁硬焊片所構成，而扁 -11 - 1331270 平管由鋁之滾球材所構成，兩高熱傳導性板中的扁平管之 兩端部分分別跨越扁平管的全寬以上之長度使膨脹突出於 外方，並使扁平管的兩端定位於兩高熱傳導性板之膨脹突 出部中的寬度方向之中間部，並使兩高熱傳導性板及扁平 管藉由鋁硬焊片的焊料層所硬焊。 20) 上述13)所記載之液冷式散熱裝置，其中傳熱構件， 是由延伸於受熱器本體的冷卻液通路之長度方向的波頂部 及波底部、及由用來連結波頂部及波底部之連結部而成的 波紋狀散熱片所構成。 21) 上述20)所記載之液冷式散熱裝置，其中2片高熱 傳導性板及散熱片分別由鋁所構成，兩高熱傳導性板相互 被硬焊，而散熱片在波頂部及波底部被硬焊在兩高熱傳導 性板。 22) —種液冷式散熱裝置，在由接合成疊層狀之2片金 屬板而成的基板上，設置具有冷卻液通路之受熱器、上述1) 所記載的膨脹罐裝置、及用來連接受熱器之冷卻液通路及 膨脹罐裝置的冷卻液通路之冷卻液循環路，而膨脹罐裝置 之罐設置罐底是由上述2片金屬板所構成。 23 )上述22)所記載之液冷式散熱裝置，其中在2片金 屬板之中至少其中一方的金屬板，用來防止冷卻液循環路 之短接發生的短接防止用貫通孔，並形成露出於外部。 24)上述22)所記載之液冷式散熱裝置，其中受熱器， 由上述2片金屬板所構成，同時具備：在兩金屬板間使兩 端開口.的冷卻液通路所形成之受熱器本體、及由高熱傳導 性材所形成且配置在受熱器本體的冷卻液通路內之傳熱構 -12· 1331270 件，而受熱器本體具有在其外面與發熱體進行熱接觸的受 熱部。 25) 上述24)所記載之液冷式散熱裝置，其中傳熱構件， 是由延伸於受熱器本體的冷卻液通路之長度方向的複數孔 狀通路形成爲並列狀之扁平管所構成。 26) 上述25)所記載之液冷式散熱裝置，其中2片金屬 板及扁平管分別由鋁所構成，使兩金屬板相互被硬焊，並 使扁平管被硬焊在兩金屬板上。 27) 上述26)所記載之液冷式散熱裝置，其中扁平管， 除了其兩端部之外被硬焊在兩金屬板上。 28) 上述27)所記載之液冷式散熱裝置，其中兩金屬板 及扁平管分別由鋁稞材所構成，而兩者藉由片狀焊料所硬 焊。 29) 上述27)所記載之液冷式散熱裝置，其中其中一方 之金屬板在內面由具有焊料層的鋁硬焊片所構成，同時另 一方之金屬板及扁平管分別由鋁的踝材所構成，使含上述 其中一方之金屬板中的扁平管之兩端部分跨越扁平管之全 寬以上的長度使膨脹突出於外方，並使扁平管之兩端位於 上述其中一方兩金屬板的膨脹突出部中之寬度方向的中間 部’而上述其中一方之金屬板及扁平管藉由鋁硬焊片的焊 料層所硬焊，使上述另一方之金屬板及扁平管藉由片狀焊 料所硬焊。 30) 上述27)所記載之液冷式散熱裝置，其中兩金屬板 分別在內面由具有焊料層的鋁硬焊片所構成，而扁平管由 鋁之踝材所成，使含兩金屬板中的扁平管兩端部分分別跨 -13- 1331270 越扁平管之全寬以上的長度使膨脹突出於外方’並使扁平 管之兩端定位於兩金屬板的膨脹突出部中之寬度方向的中 間部，而兩金屬板及扁平管藉由鋁硬焊片之焊料層所硬 焊。 31) 上述24)所記載之液冷式散熱裝置，其中傳熱構件， 是由延伸於受熱器本體的冷卻液通路之長度方向的波頂部 及波底部，及由用來連結波頂部及波底部之連結部而成的 波紋狀散熱片所構成。 32) 上述31)所記載之液冷式散熱裝置，其中2片金屬 板及散熱片分別由鋁所構成，兩金屬板板相互被硬焊，而 散熱片在波頂部及波底部被硬焊在兩金屬板。 33) —種筆記型個人電腦，由具有鍵盤之本體部、及在 本體部設置成開關自如的顯示裝置所構成，並在本體部之 外殼內配置上述11)〜32)之中任何其中之一所記載的液 冷式散熱裝置。 連接於上述1)之膨脹罐裝置中的罐設置罐底之冷卻液 通路的兩端開口用來形成冷卻液循環路，並在冷卻液循環 路之途中設置受熱器，若在罐設置罐底之冷卻液通路及冷 卻液循環路內配置使冷卻液循環之泵，則在受熱器從發熱 源接受所產生的熱而被加熱之冷卻液，是藉由泵通過冷卻 液循環路及罐設置罐底的冷卻液通路在回到受熱器之間被 冷卻。並且’在冷卻液中含氣泡狀態的空氣，當通過罐設 置罐底之冷卻液通路時，通過罐設置罐底的連通孔及底板 之貫通孔而進入到罐本體的膨脹突出部內，並在此停留。 而且’藉由貫通孔周圍之擋板的作用，—旦進入到膨脹突 -14- 1331270 出部內的空氣難以逆流到冷卻液通路。因此，使空氣從冷 卻液循環路內之冷卻液所排出，來提高冷卻效率。又，藉 由從發熱源來接受熱使冷卻液被加熱即使作爲熱膨脹，但 因爲冷卻液流入到膨脹罐之膨脹突出部內，所以藉由內壓 上昇可防止冷卻液循環路的破壞。進而，若在膨脹罐裝置 之膨脹罐本體內流入多餘的冷卻液，則即使減少冷卻液亦 可防止冷卻效率之降低。 若依據上述2)〜4)之膨脹罐裝置，則可將上下兩罐底 形成用板以簡單地加工方法加以製作，其結果可將罐設置 罐底以較簡單地加以製造。 若依據上述5)之膨脹罐裝置，則可將膨脹罐裝置全體 以較簡單地加以製造。 若依據上述5)之膨脹罐裝置，則使進入到罐本體的膨 脹突出部內之空氣’難以朝向罐設置罐底的冷卻液通路內 逆流。 若依據上述7)及8)之膨脹罐裝置，則可將罐本體及底 板以簡單地方法加以製作，其結果可將膨脹罐以較簡單地 加以製造。 若依據上述9)及10)之膨脹罐裝置的製造方法，則可 將膨脹罐裝置全體以較簡單地加以製造。 若依據上述11)及22)之液冷式散熱裝置，則在受熱器 從發熱源接受所產生的熱而被加熱之冷卻液，是藉由泵通 過冷卻液循環路及罐設置罐底的冷卻液通路在回到受熱器 之間被冷卻。並且，在冷卻液中含氣泡狀態的空氣，當通 過罐設置罐底之冷卻液通路時，通過罐設置罐底的連通孔 -15- 1331270 及底板之貫通孔而進入到罐本體的膨脹突出部內，並在此 停留。而且，藉由貫通孔周圍之擋板的作用，一旦進入到 膨脹突出部內的空氣難以逆流到冷卻液通路。因此，使空 氣從冷卻液循環路內之冷卻液所排出，來提高冷卻效率β g，藉由從發熱源來接受熱使冷卻液被加熱即使作爲熱膨 燁，但因爲冷卻液流入到膨脹罐之膨脹突出部內，所以藉 由內壓上昇可防止冷卻液循環路的破壞。進而，若在膨脹 罐裝置之膨脹罐本體內流入多餘的冷卻液，則即使減少冷 卻液亦可防止冷卻效率之降低。 若依據上述12)之液冷式散熱裝置，則將膨脹罐裝置的 姿勢即使作爲任何姿勢，但可盡量防止膨脹罐之膨脹突出 部內的空氣逆流到冷卻液通路內。 若依據13)之液冷式散熱裝置，則在受熱部從熱接觸的 發熱體所發生的熱，從高熱傳導性板直接傳達到流動冷卻 液通路內的冷卻液，同時經過高熱傳導性板及傳熱構件傳 達到流動冷卻液通路內的冷卻液，所以從發熱體朝向冷卻 液可提高傳熱效率。 若依據14)之液冷式散熱裝置，則流入到受熱器本體之 流體通路內的冷卻液是分離於扁平管之孔狀通路而流動， 其結果對冷卻液增大傳熱面積。因此’在受熱器本體的受 熱部從熱接觸之發熱體將熱藉由對流傳熱傳達到冷卻液時 形成優越地熱傳達率。 若依據15)之液冷式散熱裝置，則扁平管硬焊在高熱傳 導性板上，所以來增大對受熱器本體之冷卻液通路的內壓 力之破壞強度。 -16- 1331270 若依據16)之液冷式散熱裝置’則當扁平管及兩高熱傳 導性板硬焊時，可防止熔融後的焊料流入到扁平管之孔狀 通路內，其結果可防止孔狀通路的堵塞。 若依據18)及19)之液冷式散熱裝置，則當扁平管及兩 高熱傳導性板硬焊時，可防止熔融後的焊料流入到扁平管 之孔狀通路內，其結果可防止孔狀通路的堵塞。 若依據20)之液冷式散熱裝置，則流入到受熱器本體的 流體液通路內之冷卻液是分離於形成在散熱片緊鄰的連結 部間之流路而流動，其結果對冷卻液增大傳熱面積，同時 使流動上述流路內的冷卻液流速變成高速。因此，在受熱 器本體的受熱部從熱接觸之發熱體將熱，藉由對流傳熱傳 達到冷卻液時形成優越地熱傳達率。 若依據21)之液冷式散熱裝置，則使散熱片的波頂部及 波底部硬焊在兩高熱傳導性板上，所以來增大對受熱器本 體之冷卻液通路的內壓力之破壞強度。 若依據23)之液冷式散熱裝置，則進行金屬板接合之後， 譬如進行氦洩漏試驗，在金屬板間，使冷卻液循環路不通 於基板的外緣部，但在冷卻液循環路使短接產生而發生接 合不良之情況下·，通過短接防止用貫通孔朝向氦外部所檢 '測’所以可知發生上述接合不良。因此，可用來防止在冷 卻液循環路由於發生短接的散熱性能之下降。未形成短接 防止用貫通孔的情況下，在金屬板間，使冷卻液循環路不 通於基板的外緣部，但在冷卻液循環路使短接產生而發生 接合不良，則即使進行氦洩漏試驗，亦不能用來檢測朝向 氦外部的洩漏。而且，發生這種接合不良，則在冷卻液循 -17- 1331270 環路發生短接，會有使冷卻液不能流動冷卻液循環路全體 而降底散熱性能之虞。又，在任何其中之一金屬板形成短 接防止用貫通孔，所以可達成基板輕量化。 若依據24)〜27)之液冷式散熱裝置，則可達成與上述 1 3 )〜1 6 )之情形的同樣效果。 若依據29)及30)之液冷式散熱裝置，則可達成與上述 18)及19)之情形的同樣效果。 若依據31)及32)之液冷式散熱裝置，則可達成與上述 20 )〜21 )之情形的同樣效果。 若依據上述33)之筆記型個人電腦，則可有效用來冷卻 CPU等的發熱電子零件。 【實施方式】 以下，將本發明之實施形態，參考圖式加以說明。尙有， 在以下之說明中，第1圖所示箭頭X方向稱爲左方，與此 相反方向稱爲右方，同樣所示箭頭Y方向稱爲前方，與此 相反方向稱爲後方。 第1圖及第2圖是顯示具備依據本發明之膨脹罐裝置的 液冷式散熱裝置之全體構成圖，而第3圖〜第7圖是顯示 其重要部分構成圖。又，第8圖及第9圖是顯示液冷式散 熱裝置的製造方法。 第1圖及第2圖中，液冷式散熱裝置（1)，是一體設有： 在上下接合成疊層狀之2片高熱傳導性板，譬如在由鋁板 (2) (3)而成左右方向並在長方形狀的基板（4)上，具 有冷卻液通路（7)之受熱器（5)、具有冷卻液通路（17) 的膨脹罐裝置（14)、及用來連接兩冷卻液通路（7) (17) -18- 1331270 之冷卻液循環路（6)，並在兩冷卻液通路（7) (17)及 冷卻液循環路（6 )內對於由不凍液而成鋁來封入非腐蝕性 的冷卻液。 上鋁板（2)在下面是由具有焊料層之鋁硬焊片所構成， 同時下鋁板（3 )是由踝材所構成，兩鋁板（2 ) ( 3 )是利 用上鋁板（2)之焊料層所硬焊。 如第3圖及第4圖詳細所示’受熱器（5)，具備有：由 上下鋁板（2 ) ( 3 )所構成’同時在兩鋁板（2 ) ( 3 )間 形成延伸於前後方向之冷卻液通路（7)的受熱器本體（8)、 及在受熱器本體（8)之冷卻液通路（7)內並列成左右方 向所配置且高熱傳導性板，譬如作爲由鋁壓出形材而成傳 熱構件的2個扁平管（9)。 在用來構成受熱器本體（8)之上鋁板（2)的上面，發 熱器（12)設有進行熱接觸之受熱部（11)。而受熱器本 體（8)的冷卻液通路（7)，是藉由使下鋁板（3)膨脹突 出於下方所形成，其前端部朝向前端慢慢地形成寬度變 窄。冷卻液通路（7 )，前端爲開口同時後端的右端部亦開 口。含用來構成受熱器本體（8)之上鋁板（2)中的扁平 管（9)之兩端部分，是跨越2個扁平管（9)之全寬合計 以上的長度並膨脹突出於外方，形成延伸於左右方向之焊 料流入防止用膨脹突出部（13)。 各扁平管（9)形成爲並列狀，且具有延伸於冷卻液通路 (7)之長度方向（前後方向）的複數孔狀通路（9a)。各 扁平管（9)之兩端是定位於膨脹突出部（13)的寬度方向 (前後方向）之中間部。接觸在兩扁平管（9)的上壁中之 -19- 1331270 上鋁板（2)下面的部分全體，分別利用上鋁板（2)下面 之焊料層來硬焊在上鋁板（2)。又，兩扁平管（9)的下 壁’分別除了其兩端部之外利用比扁平管（9 )更短的片狀 焊料來硬焊在下鋁板（3)。除了定位於扁平管（9)之全 部孔狀通路（9a)之中的兩端之外孔狀通路（9a)的高度 爲0·5〜2.0mm爲佳，同樣左右方向之寬度爲0.3〜1.5mm 爲佳。又，扁平管（9)之上下壁的壁厚爲0.2〜1.0mm爲 佳，同樣結鄰孔狀通路（9a )間之隔壁的壁厚爲 0.1〜0.5 爲佳。譬如，孔狀通路（9a)之高度爲1.1mm，同樣左右 _ 方向之寬度爲〇.55mm，扁平管（9)的上下壁之壁厚爲 0.3 mm，同樣結鄰孔狀通路（9a)間之隔壁的壁厚爲〇.2mm。 還有，作爲扁平管，取代鋁壓出形材製（80)，亦可使用 藉由在鋁製電縫管之內部來插入內散熱片用來形成複數孔 狀通路。又’將一種板，具備：藉由在單面在具有焊料層 之鋁硬焊片來施與壓延加工所形成，·且介於連結部來連結 成2個之平坦壁形成部、及與各平坦壁形成部中的連結部 由相反側之側緣以隆起狀地一體所成形的側壁形成部、及 在平坦壁形成部之寬度方向隔著預定間隔由兩平坦壁形成 鲁 部分別以隆起狀地一體所成形的複數之間隔壁形成部，連 結部中彎曲成細銷狀使側壁形成部之間相互地硬焊，並藉 由間隔壁形成部用來形成間隔壁，亦可使用所設置孔狀通 路。這種情況下，側壁形成部及間隔壁形成部，在鋁硬焊 片之焊料面側所形成。 膨脹罐裝置（14)是設於基板（4)之右端部上，在膨脹 罐裝置（14)的後方’在受熱器（5)之冷卻液通路（7) ' -20- 1331270 冷卻液循環路（6 )及膨脹罐裝置（1 4 )的冷卻液通路（1 7 ) 內設有使冷卻液循環的栗（15)。 膨脹罐裝置（14)，如第5圖詳細所示，具備：由上下 鋁板（2) (3)(上下兩罐底形成用板）所構成’同時在 兩鋁板（2)( 3)間形成延伸於前後方向之冷卻液通路（17) 的罐設置罐底（16)、及設在罐設置罐底（16)上的膨脹 罐（18 )。 罐設置罐底（16)之冷卻液通路（17)，藉由使下鋁板 (3)膨脹突出於下方所形成。在用來構成罐設置罐底（16) 的上鋁板（2)，使冷卻液通路（17)通過罐設置罐底（16) 上面來形成圓形之連通孔（19)。連通孔（19)的形狀並 不限定於圓形。 膨脹罐（18)，是由具有膨皞突出於上方且在下方開口 之膨脹突出部（22)的鋁製罐本體（21)、及封閉罐本體 (21)之下端開口且延伸於比罐本體（21)更後方的鋁製 底板（2 3 )所構成。 罐本體（21)，在下面除了將由具有焊料層之鋁硬焊片 而成圓形板的周緣部之外的部分藉由使膨脹突出於上方所 形成，膨脹突出部（22)爲圓錐台狀其周圍壁（22a)朝向 上方並傾斜於直徑方向內方。又，膨脹突出部（22)之頂 壁（22b)是平坦，在其中央部形成有下方突出部（24)。 罐本體（21)中之膨脹突出部（22)的周圍之朝外凸緣 (21a)，是下方突出部（24)定位於連通孔（19)的正上 方，利用上述焊料層並硬焊在底板（23)。罐本體（21) 並不限定由圓形板所形成，又膨脹突出部（22)亦不限定 -21 - 1331270 於圓錐台狀。 底板（23)，在下面由具有焊料層之鋁硬焊片而成在前 後方向成長方形狀，利用上述焊料層並硬焊在罐設置罐底 (16) 的上鋁板（2)上。在與底板（23)中之上鋁板（2) 的連通孔（1 9 )之對應部分，是比連通孔（1 9 )更大的圓 形貫通孔（25)，與連通孔要連通與此形成同心狀。貫通 孔（25)並不限定於圓形。在底板（23)中之貫通孔（25) 的周緣部，朝向上方並傾斜於直徑方向內方的擋板（26) 跨越全周圍以一體所形成，包圍擋板（26)之前端並形成 開口（27)。而且，使下方突出部（24)面對開口（27)。 泵（15)，從膨脹罐裝置（14)之底板（23)中的罐本 體（21)安裝在突出於後方的部分。 液冷式散熱裝置（1)之冷卻液循環路（6)，藉由使下 鋁板（3)膨脹突出於下方所形成，朝向用來構成罐設置罐 底（16)之上下鋁板（2) (3)的左方之延長部分間及朝 向用來構成受熱器本體（8)之上下鋁板（2) (3)的右方 之延長部分間所形成。冷卻液循環路（6)，是使受熱器（5) 之冷卻液通路（7)的前端開口及膨脹罐裝置（14)之冷卻 液通路（17)的前端開口連通之直線狀的第1部分（60)、 及使冷卻液通路（7 )之後端的右端部開口及冷卻液通路 (17) 之後端開口連通之蛇行狀的第2部分（61)所構成。 第2部分（61)，具有：延伸於前後方向之複數的直線狀 部分（61a)、及將結鄰直線狀部分（61a)連結成前後交 替的屈曲部分（61b)。在下鋁板（3)中之第2部分（61) 的結鄰直線狀部分（61a) (61a)間、受熱器（5)之冷卻 -22- 1331270 液通路（7)及左端的直線狀部分（61a)之間、及右端的 直線狀部分（61a)及膨脹罐裝置（14)的冷卻液通路（17) 之間’分別形成有延伸於前後方向且從冷卻液循環路（6) 來檢測洩漏的第1〜第3短接防止用貫通孔（62 ) ( 63 ) (64)。又，在下鋁板（3)中之第1部分（60)、及第2 部分的前側屈曲部分（61b)之間，形成有延伸於左右方向 且從冷卻液循環路（6)來檢測洩漏的第4短接防止用貫通 孔（6 5 )。還有，右側部中藉由屈曲部分（6 1 b )在所連結 之2個直線狀部分（6 1 a )間所形成的第1貫通孔（6 2 )、 第2貫通孔（63)及第3貫通孔（64)，是在前端中連接 在第4貫通孔（65 ) ^ 在受熱器（5)之冷卻液通路（7)、膨脹罐裝置（4)的 冷卻液通路（17)及冷卻液循環路（6)所封入的冷卻液之 量，如第6圖所示當基板（4 )成垂直狀態時，充滿冷卻液 通路（7 )( 1 7 )及冷卻液循環路（6 )內，同時使膨脹罐 (18)之膨脹突出部（22)內的冷卻液之液面位於比膨脹 罐（18)的底板（23)中之擋板（2 6)前端的開口（27) 更上方，並且如第7圖所示當基板（4)朝上下相反時，充 滿冷卻液通路（7) (17)及冷卻液循環路（6)內，同時 使膨脹罐（18)之膨脹突出部（22)內的冷卻液之液面位 於比膨脹罐（18)的底板（23)中之擋板（26)前端的開 口（27)更上方之量。 上述之液冷式散熱裝置（1)，譬如一種筆記型個人電腦 具備：具有鍵盤的個人電腦本體部、及在個人電腦本體部 設置成開關自如的顯示裝置’配置在個人電腦本體部之外 -23- 1331270 殼內’使CPU (發熱源）在液冷式散熱裝置（1)之受熱器 (5)的受熱部（11)熱接觸。當筆記型個人電腦啓動時， 藉由泵（15)使冷卻液循環受熱器（5)之冷卻液通路（7)、 膨脹罐裝置（I4)的冷卻液通路（I7)及冷媒循環路（6) 內。從C P U所產生的熱，經由上鋁板（2 )傳達到配置於 受熱器（5)之冷卻液通路（7)內的扁平管（9)之孔狀通 路（9 a )內所流動的冷卻液。而且，冷卻液，通過冷卻液 循環路（6)及膨脹罐裝置（14)之冷卻液通路（17)在返 回到受熱器（5 )的冷卻液通路（7 )之間，冷卻液具有的 熱經由上下鋁板（2 )( 3 )被散熱到外部，來冷卻冷卻液。 重複這樣的動作從CPU所產生的熱被散熱。 還有，從CPU所產生的熱量很多的情況下，從基板（4 ) 中之受熱器（5)在分離的埸所用來配置具有散熱片的散熱 器（圖示省略），比先前的情況輸出更小且藉由安靜地冷 卻扇（圖示省略）在散熱器之散熱片來吹風亦可。 冷卻液中含有氣泡狀態下之空氣，當進行通過膨脹罐裝 置（14)的冷卻液通路（17)時，通過罐設置罐底（16) 之連通孔（19)及底板（23)的貫通孔（25)並進入到罐 本體（21)之膨脹突出部（22)內，在此停留。而且，藉 由貫通孔（25)周圍的擋板（26)之作用，形成一旦進入 到膨脹突出部（22 )內的空氣難以逆流到冷卻液通路（17 )。 因此’從冷卻液循環路（6)內之冷卻液使空氣被排出，來 提高冷卻效率。又，藉由從CPU所受的熱使冷卻液被加熱 即使作爲熱膨脹，但冷卻液進行流入到膨脹罐（18)之罐 本體（21)內，所以藉由內壓上昇可防止冷卻液循環路（6) -24- 1331270 的破損。進而，在膨脹罐裝置（14)之罐本體（21)的膨 脹突出部（2 2 )內若放入多餘的冷卻液，則即使減少冷卻 液但亦可防止冷卻效率的下降》 對於上述液冷式散熱裝置（1)的製造方法，參考第8圖 及第9圖加以說明》 在下面由具有焊料層（31)之鋁硬焊片而成上鋁板（2) 上來施與沖壓加工，同時用來形成受熱器（5)的焊料流入 防止用膨脹突出部（13)及膨脹罐裝置（14)之連通孔（19)。 在由鋁滾珠材而成下鋁板（3)來施與沖壓加工，同時將受 熱器（5 )之冷卻液通路（7 )、膨脹罐裝置（1 4 )的冷卻 液通路（17)及冷卻液循環路（6)形成爲下方膨脹突出狀， 並且用來形成第1〜第4貫通孔（62) (63) (64) (65)。 在下面由具有焊料層（33)之鋁硬焊片而成圓形板上來施 與沖壓加工，同時用來形成膨脹突出部（22)及下方突出 部（24)，來製作罐本體（21)。進而，在下面由具有焊 料層（33)之鋁硬焊片而成底板（23)上來施與沖壓加工， 並用來形成貫通孔（25) 、擋板（26)及開口（27)。 接著，在受熱器（5)之冷卻液通路（7)內，將2個鋁 壓出形材製扁平管（9)配置成左右方向並列。此時，扁平 管（9)的下面及形成通路之下方膨脹突出部的底面之間， 將比扁平管（9)更短的片狀焊料材（30)，使其兩端位於 比扁平管（9)之兩端更長的內側來加以配置。 之後，使上下鋁板（2) (3)重疊同時將底板（23)及 罐本體（21)配置在板（2) (3)上，並且用來硬焊上下 -25- 1331270 金呂板（2 ) 〇 )彼此之間、上下鋁板（2 ) ( 3 )及扁平管 (9 )、上鋁板（2 )及底板（23 )、以及底板（23 )及罐 本體（21)。此等硬焊，是利用上鋁板（2)之焊料層（31)、 片狀焊料（30)、底板（23)之焊料層（32)及罐本體（21) 之焊料層來進行。這樣一來，使液冷式散熱裝置被製造。 製造液冷式散熱裝置（1)之後，進行氮洩漏試驗。在兩 金屬板（2) (3)間，使冷卻液循環路（6)連通於基板（4) 的外周緣部而發生接合不良的情況下，從基板（2)之外周 緣部朝向氦的外部來檢測洩漏。 又’使冷卻液循環路（6)未連通於基板（4)之外周緣 部’但在冷卻液循環路6產生短接而發生接合不良的情況 下’從貫通孔（6 2 ) ( 6 3 ) ( 6 4 ) ( 6 5 )朝向氦的外測來 檢測洩漏。 當液冷式散熱裝置（1)製造時，在上鋁板（2)來形成 膨脹突出部（1 3 )，以及藉由使扁平管.（9 )及下鋁板（3 ) 比扁平管（9)更短且藉由使兩端位於比扁平管（9)之兩 端更長方向的內側所配置之片狀焊料（30)來硬焊，當硬 焊時，可防止熔融後的焊料流入到扁平管（9)的孔狀通路 (9a )內。 第10圖是顯示受熱器之傳熱構件的變形例圖。 第10圖所示傳熱構件（50)，是由延伸於受熱器本體（8) 之冷卻液通路（7)的長度方向之波頂部及波底部、及用來 連結波頂部及波底部的連結部而成鋁滾珠材製瓦楞紙狀散 熱片所構成。散熱片之波頂部是利用上鋁板（2)的焊料層 並硬焊在上鋁板（2)上，同樣波底部是利用片狀焊料並硬 -26- 1331270 焊在下鋁板（3)上。還有，傳熱構件（50)，亦可在兩面 以具有焊料層之鋁硬焊片所形成，利用其焊料層來硬焊在 兩鋁板（2 ) ( 3 )上。 上述實施形態中，膨脹罐裝置（14)，是受熱器（5)及 冷卻液循環路（6) —起在液冷式散熱裝置（1)之基板（4) 設置成一體，取代這個，僅將膨脹罐裝置與基板（4)各別 加以形成，在膨脹罐裝置的冷卻液通路之兩端，分別與膨 脹罐裝置來連接另一體管等的一端部，並藉由將此等管之 另一端部來連接在基板（4 )的冷卻液循環路（6 )上，亦 可用來形成液冷式散熱裝置。又，將膨脹罐裝置、及上述 ® 構成之受熱器各別來形成，並藉由將膨脹罐裝置的冷卻液 通路及受熱器之冷卻液通路譬如以另一體管等來連接，亦 可用來形成液冷式散熱裝置。 又，上述實施形態中，形成膨脹罐裝置（14)之罐設置 罐底（16)的上鋁板（2)及底板（23)是利用底板（23) 下面之焊料層所硬焊，但取代這個，亦可在上鋁板（2)的 上面來形成焊料層，同時在底板（23)下面不形成焊料層， 利用上鋁板（2)上面的焊料層來硬焊上鋁板（2)及底板 ® (23)。又，罐本體（21)之朝外凸緣（21a)及底板（23) 是利用罐本體（21)下面的焊料層（33)來硬焊，但取代 這個，亦可在底板（23)之上面用來形成焊料層，同時在 罐本體（21)下面未形成焊料層，利用底板（23)上面的 焊料層來硬焊罐本體（21)之朝外凸緣（21a)及底板（23)。 又，上述實施形態中，上鋁板（2)在下面藉由具有焊料 層之鋁硬焊片所形成’並使下鋁板（3)藉由鋁滾珠材所形 -27- 1331270 - 成，但亦可使下鋁板（3)在上面藉由具有焊料層的鋁硬焊 .· 片所形成。這種情況下，受熱器（4 〇 )中，如第〗1圖所示， 含下鋁板（3)中之扁平管（9)的兩端部分，是跨越2個 扁平管（9)之全寬度的合計以上之長度並使膨脹突出於外 ' 方，來形成延伸於左右方向的焊料流入防止用膨脹突出部 . (41)。連接於兩扁平管（9)之下壁中的下鋁板（3)之 部分全體，利用下鋁板（3 )的焊料層並硬焊在下鋁板（3 )。 又，使扁平管（9)之兩端位於膨脹突出部（41)的寬度方 向之中間部。而且，當下鋁板（3)及扁平管（9)利用下 鋁板（3)的焊料層來硬焊時，藉由膨脹突出部（41)之作 用’從下鋁板（3)的焊料層使熔融後之焊料，可防止流入 到扁平管（9 )的孔狀通路（9a )內。 進而’上述實施形態中，上鋁板（2)在下面藉由具有焊 料層之鋁硬焊片所形成’並使下鋁板（3 )藉由鋁滾珠材所 形成’但亦可使兩鋁板（2) (3)由鋁滾珠材所形成。這 種情況下，受熱器（45 )中’如第1 2圖所示，在兩鋁板（2 ) (3 )’不必用來形成焊料流入防止用膨脹突出部，兩扁平 管（9)之上壁亦分別除了其兩端之外利用比扁平管（9) 更短的片狀焊料並硬焊在上鋁板（2)上。而且，當兩鋁板 (2) (3)及扁平管（9)使用片狀焊料進行硬焊時，可防 止熔融後之焊料流入到扁平管（9 )的孔狀通路（9a )內。 〔產業上之利用可能性〕 根據本發明膨脹罐裝置’是個人電腦或伺服器等之I T 機器、或A V機器、或產業機械、或工作機械等由備有發 熱源所產生的熱用來散熱之液冷式散熱裝置所使用，並從 -28- 1331270 循環系統來排除冷卻液中的空氣，同時可用來防止循環系 統之破損，並且可用來防止循環系統內冷卻液的減少。 【圖式之簡單說明】 第1圖是顯示具備依據本發明之受熱器的液冷式散熱裝 置之全體構成斜視圖。 第2圖是顯示具備依據本發明之受熱器的液冷式散熱裝 置之全體構成分解斜視圖》 第3圖是第1圖之A-A線放大剖面圖。 第4圖是第1圖之B-B線放大剖面圖。 第5圖是第1圖之C-C線放大剖面圖。 第6圖是將罐底作爲垂直狀態相當於第5圖之剖面圖。 第7圖是將罐底上下朝向相反相當於第5圖之剖面圖。 第8圖是顯示液冷式散熱裝置之製造方法的受熱器之部 分剖面圖。 第9匱|是顯示液冷式散熱裝置之製造方法的膨脹罐裝置 之部分剖面圖。 第10圖是顯示液冷式散熱裝置之受熱器的傳熱構件之 變形例相當於第2圖一部分的部分斜視圖。 第圖是顯示受熱器之變形例相當於第3圖之圖。 第圖是顯示受熱器之其它變形例相當於第3圖之圖。 【主要元件符號說明〕 1…液冷式散熱裝置 2…上鋁板 3…下鋁板 4…基板 -29- 1331270 5、40、45…受熱器 6···冷卻液循環路 7、17…冷卻液通路 8···受熱器本體 9…扁平管 9a…孔狀通路 1 1…受熱部 12…發熱體 1 3、4 1…焊料流入防止用膨脹突出部 1 5…泵 1 6…罐設置罐底 18…膨脹罐 1 9…連通孔 2 1…罐本體 2 1 a…朝外凸緣 22…膨脹突出部 2 2 a…周圍壁 2 2 b…頂壁 2 3…底板 24…下方突出部 25…貫通孔 26…擋板 2 7…開口 30…片狀焊料 3 1、3 2、3 3…焊料層 -30- 1331270 50…傳熱構件 60…第1部分 61…第2部分 6 1 a…直線狀部分 6 1 b…屈曲部分 62…第1短接防止用貫通孔 63…第2短接防止用貫通孔 64…第3短接防止用貫通孔 65…第4短接防止用貫通孔1331270 - IX. Description of the Invention: [Technical Field] The present invention relates to an expansion tank device, a method for manufacturing an expansion tank device, and a liquid-cooling heat sink having an expansion tank device, such as an IT for a personal computer or a server. A machine, an AV machine, an industrial machine, or a work machine is used for a device that uses heat generated by a heat source to dissipate heat. In the scope of this specification and the patent application, the term "aluminum" means pure aluminum and other aluminum alloys. In addition, the top of the fifth figure is referred to as the upper and lower. [Prior Art] The prior art, for example, a method for dissipating heat generated by a heat source from a personal computer or a server, uses a heat-dissipating substrate made of aluminum having a heating surface on one side, and the other side of the heat-dissipating substrate. The heat sink provided in one body and the heat source on the heat radiating substrate contacts the heat source, and the heat generated by the heat source is discharged from the heat source through the heat sink substrate and the heat sink to the air by blowing the wind from the fan to the heat sink Widely adopted. However, recently, for example, in personal computers or servers, the use of high-speed processing has increased, and one of them has also increased multimedia applications such as music or animation. Therefore, for example, the operating frequency of the central calculation processing device (hereinafter referred to as CPU: central processing unit) is also increased, and the amount of heat generation is also remarkably increased. Also, the quietness of these machines was also required. Therefore, sufficient heat dissipation performance cannot be obtained by the above method, and the required quietness cannot be satisfied. Further, for example, as a method for dissipating heat from a heat source such as an industrial machine or a work machine, a method of discharging heat to the air using a heat pipe of a working liquid of a refrigerant system is widely employed. 1331270 However, from the perspective of global environmental protection, it is required to switch to a cooling mode without using refrigerant. In order to solve such a problem, water as a main body coolant is formed, for example, by a liquid-cooled heat sink using an antifreeze. For example, as a liquid-cooled heat sink for a notebook personal computer, the patent application has a water jacket filled with a coolant and is fixed to both ends of the heat-generating electronic component and connected to the heat sink at both ends. And the coolant circulation pipe for circulating the coolant, and the antifreeze liquid is sealed in the heat receiver and the coolant circulation pipe, and the heat receiver is disposed on the main body portion of the personal computer having the keyboard. The coolant circulation pipe extends to the switch and is conveniently disposed on the personal computer. In the display device of the main body portion, when the display device is opened, a spare tank that communicates with the coolant circulation pipe is provided at a corner portion that is positioned above (refer to Japanese Laid-Open Patent Publication No. 2002-182797). In the liquid-cooled heat sink, the effect of the reserve tank is based on the heat absorbed by the heat source, which absorbs the heat expansion when the coolant is heated, and the shortcoming of the coolant when the coolant is reduced. However, in order to improve the cooling efficiency in the liquid-cooled heat sink, it is necessary to exclude the air in the coolant from the circulation system as much as possible. However, in the liquid-cooled heat sink according to the above publication, when the display device is turned off, the air in the reserve tank is mixed into the coolant circulation pipe, and the air is difficult to return to the reserve tank even if the display device is turned on, so that the cooling effect is lowered. The problem. The object of the present invention is to solve the above problems, and to provide an expansion tank device, a method for manufacturing an expansion tank device, and a liquid cooling heat dissipating device for removing air in a coolant from a circulation system and at the same time preventing the circulation system. Destruction' can be used to prevent the reduction of coolant in the circulation system. 1331270 III. SUMMARY OF THE INVENTION [Disclosure of the Invention] The present invention has the following aspects in order to achieve the above object. The η-type expansion tank device includes: a tank bottom having a coolant passage; and an expansion tank provided on the tank bottom; the tank is provided with a tank bottom having a communication hole passing through the upper surface and the coolant passage An expansion tank having: a can body having an expansion protrusion that is expanded to protrude above and opened below, and a lower end opening that is joined to the lower end of the can body and that blocks the expansion protrusion, and is joined to the bottom plate of the tank bottom a portion corresponding to the communication hole in the bottom plate of the expansion tank for forming a through hole penetrating through the communication hole of the can bottom, and the periphery of the through hole in the bottom plate is inclined upward toward the center of the through hole The baffle on the side of the section is placed across the entire circumference. (2) The expansion tank device according to the above 1), wherein the can bottom is formed by laminating the upper and lower can bottom forming plates, and the lower can bottom forming plate is formed. The expansion protrudes below the upper and lower tank bottom forming plates to form a coolant passage, and the upper tank bottom forming plate opens the communication hole. (3) The expansion tank device according to the above 2), wherein the upper and lower can bottom forming plates are each made of metal, and the upper and lower can bottom forming plates are hard welded. (4) The expansion tank device according to the above 2), wherein the upper and lower can bottom forming plates are each made of aluminum, and at least one of the upper surface of the upper bottom forming plate and the lower bottom of the upper bottom forming plate is formed. One of the solder layers brazes the upper and lower can bottom forming plates. (5) The expansion tank device according to the above 4), wherein the bottom plate is made of aluminum 1331270, and the bottom plate and the upper bottom are formed by using at least one of the solder layers provided on the lower surface of the bottom plate and the upper surface of the upper can bottom forming plate. The plate is brazed. 6) The expansion tank device according to the above 1), wherein the top wall of the expansion projection of the can body is flat, and the opening surrounded by the front end of the shutter in the top wall projects the facing portion downward. 7) The expansion tank device according to the above 1), wherein the tank body and the bottom plate are made of metal, respectively, and the outward flange and the bottom plate around the expansion projection in the can body are brazed. 8) The expansion tank device according to the above 7), wherein the tank body and the bottom plate are each made of aluminum, and the can body is convex outward by a solder layer provided on at least one of the lower surface of the can body and the upper surface of the bottom plate The edge and the bottom plate are brazed. 9) A method for producing an expansion tank device, which is a method for producing the expansion tank device according to the above 1), comprising: a metal bottom plate forming plate having a cooling liquid passage that expands and protrudes downward; a metal upper can bottom forming plate having a through-hole communicating hole; a metal can body having an expansion protruding portion that is expanded to protrude above and open below, and a lower end opening of the expansion protruding portion of the can body a metal base plate; a through hole is formed in the bottom plate, and a peripheral edge of the through hole in the bottom plate is formed so as to be inclined upward on the center portion side of the through hole, and is formed on the lower tank bottom forming plate; The upper bottom forming plate is arranged such that the communication holes overlap the coolant passage; on the upper tank bottom forming plate, the through holes include communication holes to overlap the bottom plate, and on the bottom plate, the can body is brought to the baffle The upper expansion protruding portion overlaps; the upper and lower can bottom forming plates, the upper bottom forming plate and the bottom plate, and the bottom plate and the can body are simultaneously brazed. 1331270 10) The method for producing an expansion tank device according to the above 9), wherein the upper and lower can bottom forming plates, the bottom plate, and the can body are formed of aluminum, and are formed on the lower surface of the upper bottom forming plate and the lower bottom of the can. The solder layer is provided on at least one of the upper surfaces of the plate, and at least one of the lower surface of the can body and the upper surface of the bottom plate is provided with a solder layer, and is further disposed on the lower surface of the bottom plate and the upper surface of the upper bottom plate. At least one of the solder layers is provided, and the solder layers are used for brazing between the upper and lower can bottom forming plates, the upper bottom forming plate and the bottom plate, and the bottom plate and the can body. 11) A liquid-cooling type heat dissipating device comprising: a coolant circulation path that is connected to both ends of a coolant passage in which a can bottom is provided in the expansion tank device described in the above 1), and a coolant circulation path in the coolant circulation path The heat receiver provided on the way, and the pump for circulating the coolant in the coolant passage and the coolant circulation path of the tank bottom. (12) The liquid-cooled heat sink according to the above (11), wherein the amount of the coolant enclosed in the coolant circulation passage and the coolant passage is filled with the coolant circulation passage and the cooling when the expansion tank device is in a vertical state. In the liquid passage, the liquid level of the coolant in the expansion protrusion of the expansion tank is simultaneously positioned above the opening surrounded by the front end of the baffle in the bottom plate of the expansion tank, and is also used when the expansion tank device faces up and down The coolant circulation path and the coolant passage are filled, and the liquid level of the coolant in the expansion protrusion of the expansion tank is positioned at an amount higher than the opening surrounded by the front end of the baffle in the bottom plate of the expansion tank. (13) The liquid-cooling type heat dissipating device according to the above (11), wherein the heat receiver is configured by two high-heat-conducting plates joined in a laminated manner, and both ends are formed between the two high thermal conductive plates. a heat-receiving body of the coolant passage -10- 1331 270 and a heat transfer member composed of a high heat conductive material and disposed in a coolant passage of the heat receiver body, and the heat receiver body has heat to the heat generating body outside thereof Contact the heat receiving part. In the liquid-cooled heat sink according to the above 13), the heat transfer member is formed by a plurality of flat tubes having a plurality of parallel passages extending in the longitudinal direction of the coolant passage of the heat receiver body. 15) The liquid-cooled heat dissipating device described in the above), wherein the two high-heat-conducting plates and the flat tubes are respectively made of aluminum, so that the two high-heat-conducting plates are brazed to each other, and the flat tubes are brazed to two. High thermal conductivity on the board. 16) The liquid-cooled heat sink according to the above 15), wherein the flat tubes are brazed to the two high heat conductive sheets except for the both end portions thereof. 17) The liquid-cooled heat sink according to the above 16), wherein the two high heat conductive plates and the flat tubes are made of aluminum, respectively, and both are brazed by the sheet solder. 18) The liquid-cooled heat sink according to the above 16), wherein one of the high thermal conductive sheets is formed of an aluminum brazing sheet having a solder layer on the inner surface, and the other of the heat conductive plates and the flat tubes are respectively The material is composed of a flat tube having one of the above-mentioned high thermal conductive sheets, which has a length exceeding a full width of the flat tube, so that the expansion protrudes outward, and both ends of the flat tube are positioned at one of the above-mentioned heights. The intermediate portion in the width direction of the expansion protruding portion of the thermally conductive plate is such that one of the high thermal conductive plates and the flat tube is brazed by the solder layer of the aluminum brazing sheet, and the other high thermal conductivity plate and flat are The tube is brazed by a sheet of solder. 19) The liquid-cooled heat dissipating device according to the above 16), wherein the two high thermal conductive plates are respectively formed of aluminum brazing sheets having a solder layer on the inner surface, and the flat -11 - 1331270 flat tubes are made of aluminum balls. The two ends of the flat tubes in the two high thermal conductive plates respectively extend over the full width of the flat tubes to expand and protrude outward, and the two ends of the flat tubes are positioned on the expansion protrusions of the two high thermal conductive sheets. The middle portion in the width direction of the portion is such that the two highly thermally conductive plates and the flat tubes are brazed by the solder layer of the aluminum brazing sheet. [20] The liquid-cooled heat sink according to the above 13), wherein the heat transfer member is a wave top and a wave bottom extending in a longitudinal direction of the coolant passage extending from the heat receiver body, and is used to connect the wave top and the bottom of the wave The corrugated fin is formed by the connecting portion. 21) The liquid-cooling heat dissipating device according to the above 20), wherein the two high thermal conductive plates and the heat dissipating fins are respectively made of aluminum, and the two high thermal conductive plates are brazed to each other, and the heat dissipating fins are at the top of the wave and at the bottom of the wave. Brazed in two high thermal conductivity plates. 22) a liquid-cooling type heat sink in which a heat sink having a coolant passage, an expansion tank device described in the above 1), and a heat sink are provided on a substrate formed by joining two metal sheets in a laminated form A coolant circulation path connecting the coolant passage of the heat receiver and the coolant passage of the expansion tank device, and the tank bottom of the expansion tank device is composed of the above two metal plates. (23) The liquid-cooled heat-dissipating device according to the above-mentioned item (22), wherein at least one of the two metal plates is formed to prevent short-circuiting preventing through holes for preventing short-circuiting of the coolant circulation path Exposed to the outside. [24] The liquid-cooled heat dissipating device according to (22) above, wherein the heat receiver is composed of the two metal plates, and has two openings between the two metal plates. The heat sink body formed by the coolant passage and the heat transfer structure formed by the high heat conductive material and disposed in the coolant passage of the heat receiver body, and the heat receiver body has heat and heat on the outside thereof The heat receiving portion of the body in thermal contact. (25) The liquid-cooling type heat dissipating device according to (24), wherein the heat transfer member is formed by a plurality of flat tubes having a plurality of parallel passages extending in a longitudinal direction of the coolant passage of the heat receiver body. (26) The liquid-cooled heat sink according to the above 25), wherein the two metal plates and the flat tubes are made of aluminum, the two metal plates are brazed to each other, and the flat tubes are brazed to the two metal plates. [27] The liquid-cooled heat sink according to the above 26), wherein the flat tubes are brazed to the two metal sheets except for the both end portions thereof. 28) The liquid-cooled heat sink according to the above 27), wherein the two metal plates and the flat tubes are each made of an aluminum crucible, and both are hard-welded by the sheet-like solder. 29) The liquid-cooled heat sink according to the above 27), wherein one of the metal plates is made of an aluminum brazing sheet having a solder layer on the inner surface, and the other metal plate and the flat tube are made of aluminum coffin According to the configuration, the end portions of the flat tubes in the metal sheet including the one of the flat tubes are expanded beyond the full width of the flat tubes to expand outward, and the ends of the flat tubes are located on one of the two metal plates. The intermediate portion in the width direction of the expanded portion is formed, and the metal plate and the flat tube of one of the above are brazed by the solder layer of the aluminum brazing sheet, so that the other metal plate and the flat tube are made of the sheet solder. Hard soldering. 30) The liquid-cooled heat dissipating device according to the above 27), wherein the two metal plates are respectively formed of an aluminum brazing piece having a solder layer on the inner surface, and the flat tube is made of an aluminum coffin, so that the two metal plates are included The two ends of the flat tube are respectively spanned from -13 to 1331270. The length of the flat tube is greater than the full width so that the expansion protrudes to the outer side' and the two ends of the flat tube are positioned in the width direction of the expansion protrusions of the two metal sheets. In the middle portion, the two metal plates and the flat tubes are brazed by the solder layer of the aluminum brazing sheet. 31) The liquid-cooled heat sink according to the above 24), wherein the heat transfer member is a wave top portion and a wave bottom portion extending in a longitudinal direction of the coolant passage extending from the heat receiver body, and is used to connect the wave top portion and the wave bottom portion The corrugated fin is formed by the connecting portion. 32) The liquid-cooled heat sink according to the above 31), wherein the two metal plates and the heat sink are respectively made of aluminum, the two metal plates are brazed to each other, and the heat sink is brazed at the top of the wave and at the bottom of the wave. Two metal plates. 33) A notebook type personal computer comprising a main body having a keyboard and a display device provided to be freely switchable in the main body portion, and arranging one of the above 11) to 32) in a casing of the main body portion The liquid cooling heat sink described. The tank connected to the expansion tank device of the above 1) is provided at both ends of the coolant passage of the tank bottom to form a coolant circulation path, and a heat receiver is disposed on the way of the coolant circulation path, if the tank bottom is provided in the tank A coolant that circulates the coolant in the coolant passage and the coolant circulation path, and the coolant that is heated by the heat received by the heat receiver from the heat source is provided by the pump through the coolant circulation path and the tank bottom. The coolant passage is cooled back to the heat receiver. And 'the air containing the bubble in the cooling liquid, when the coolant passage of the bottom of the tank is set through the tank, the through hole of the bottom of the tank and the through hole of the bottom plate are inserted into the expansion protrusion of the tank body, and are here Stay. Moreover, by the action of the baffle around the through hole, it is difficult for the air entering the outlet of the expansion protrusion -14-1331270 to flow back to the coolant passage. Therefore, the air is discharged from the coolant in the coolant circulation path to improve the cooling efficiency. Further, by receiving heat from the heat source, the coolant is heated even if it is thermally expanded, but since the coolant flows into the expansion protrusion of the expansion tank, the coolant circulation path can be prevented from being broken by the internal pressure increase. Further, if excess coolant is poured into the body of the expansion tank of the expansion tank device, the cooling efficiency can be prevented from being lowered even if the coolant is reduced. According to the expansion tank device of the above 2) to 4), the upper and lower can bottom forming plates can be produced by a simple processing method, and as a result, the can can be provided with the can bottom to be relatively simple to manufacture. According to the expansion tank device of the above 5), the entire expansion tank device can be manufactured relatively easily. According to the expansion tank device of the above 5), it is difficult for the air 'into the expansion projection of the tank body to flow back toward the inside of the coolant passage in which the tank bottom is provided. According to the expansion tank device of the above 7) and 8), the can body and the bottom plate can be produced in a simple manner, and as a result, the expansion can can be manufactured relatively simply. According to the manufacturing method of the expansion tank device according to the above 9) and 10), the entire expansion tank device can be manufactured relatively easily. According to the liquid-cooled heat sink of the above 11) and 22), the coolant heated by the heat received by the heat source from the heat source is cooled by the pump through the coolant circulation path and the tank bottom. The liquid passage is cooled back to the heat receiver. Further, when the air containing the bubble in the cooling liquid is provided through the tank through the coolant passage of the tank bottom, the through hole of the tank bottom is provided through the through hole -15-1331270 and the through hole of the bottom plate to enter the expansion protrusion of the tank body. And stay here. Moreover, by the action of the baffle around the through hole, it is difficult for air entering the expansion protrusion to flow back to the coolant passage. Therefore, the air is discharged from the coolant in the coolant circulation path to increase the cooling efficiency β g , and the coolant is heated by receiving heat from the heat source, even if it is heated, but the coolant flows into the expansion tank. Since the inside of the protruding portion is expanded, the destruction of the coolant circulation path can be prevented by the increase in the internal pressure. Further, if excess cooling liquid flows into the expansion tank body of the expansion tank device, the cooling efficiency can be prevented from being lowered even if the cooling liquid is reduced. According to the liquid-cooling type heat dissipating device of the above 12), even if the posture of the expansion tank device is in any posture, the air in the expansion protruding portion of the expansion tank can be prevented from flowing back into the coolant passage as much as possible. According to the liquid-cooling type heat dissipating device according to 13), the heat generated by the heat-generating body in the heat receiving portion is directly transmitted from the high-heat-conducting plate to the cooling liquid flowing in the cooling liquid passage, and passes through the high-heat-conducting plate and Since the heat transfer member is transmitted to the coolant flowing in the coolant passage, the heat transfer efficiency can be improved from the heat generator toward the coolant. According to the liquid-cooling type heat sink of 14), the coolant flowing into the fluid passage of the heat receiver body flows away from the hole-like passage of the flat tube, and as a result, the heat transfer area is increased for the coolant. Therefore, when the heat receiving portion of the heat receiver body transfers heat from the heat generating body in thermal contact to the cooling liquid by convection heat transfer, a superior heat transfer rate is formed. According to the liquid-cooling type heat sink of 15), the flat tube is hard-welded to the high-heat-transmissive plate, so that the breaking strength of the internal pressure of the coolant passage of the heat receiver body is increased. -16- 1331270 According to the liquid-cooled heat sink of 16), when the flat tube and the two high-heat conductive plates are brazed, the molten solder can be prevented from flowing into the hole-like passage of the flat tube, and as a result, the hole can be prevented. Blockage of the passage. According to the liquid-cooling heat dissipating device according to 18) and 19), when the flat tube and the two high-heat conductive plates are brazed, the molten solder can be prevented from flowing into the hole-like passage of the flat tube, and as a result, the hole shape can be prevented. Blockage of the passage. According to the liquid-cooling type heat sink of 20), the coolant flowing into the fluid passage of the heat receiver body is separated from the flow path formed between the joint portions adjacent to the heat sink, and the result is an increase in the coolant. The heat transfer area simultaneously makes the flow rate of the coolant flowing in the above flow path high. Therefore, when the heat receiving portion of the heat receiving body receives heat from the heat-generating body which is in thermal contact, and the convective heat transfer reaches the cooling liquid, a superior heat transfer rate is formed. According to the liquid-cooling type heat sink of 21), the wave top and the wave bottom of the heat sink are hard-welded to the two high heat conductive plates, so that the breaking strength of the internal pressure of the coolant passage of the heat receiver body is increased. According to the liquid-cooling type heat sink of 23), after the metal plate is joined, for example, a helium leak test is performed, and the coolant circulation path is prevented from passing through the outer edge portion of the substrate between the metal plates, but is short in the coolant circulation path. When a joint failure occurs and the joint failure occurs, the short-circuit prevention through-hole is detected toward the outside of the crucible, so that the above-described joint failure occurs. Therefore, it can be used to prevent a decrease in heat dissipation performance in which the coolant circulation is routed to a short circuit. When the through hole for shorting prevention is not formed, the coolant circulation path is not provided to the outer edge portion of the substrate between the metal plates, but if the coolant circulation path is short-circuited and a joint failure occurs, even if a leak occurs, The test cannot be used to detect leaks towards the outside of the crucible. Further, if such a joint failure occurs, the coolant is short-circuited in the loop of the -17-1331270, and the coolant cannot flow through the entire coolant circulation path to lower the heat dissipation performance. Further, since any one of the metal plates is formed with a short hole for preventing short-circuiting, the weight of the substrate can be reduced. According to the liquid-cooling heat sink of 24) to 27), the same effect as in the case of the above 1 3) to 16) can be achieved. According to the liquid-cooled heat sink of 29) and 30), the same effects as in the case of the above 18) and 19) can be achieved. According to the liquid-cooling heat sink of 31) and 32), the same effect as in the case of the above 20) to 21) can be achieved. According to the notebook type personal computer of the above 33), it can be effectively used to cool the heat-generating electronic parts such as the CPU. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the arrow X direction shown in Fig. 1 is referred to as the left side, and the opposite direction is referred to as the right side, and the arrow Y direction is also referred to as the front side, and the opposite direction is referred to as the rear side. Fig. 1 and Fig. 2 are views showing the entire configuration of a liquid-cooling type heat dissipating device provided with an expansion tank device according to the present invention, and Figs. 3 to 7 are views showing an essential part of the configuration. Further, Fig. 8 and Fig. 9 show a method of manufacturing a liquid-cooled heat sink. In Fig. 1 and Fig. 2, the liquid-cooling type heat sink (1) is integrally provided with two sheets of high thermal conductivity sheets joined in a stacked manner, such as aluminum sheets (2) (3). a heat exchanger (5) having a coolant passage (7), an expansion tank device (14) having a coolant passage (17), and a coolant passage for connecting the coolant passages in the left and right direction on the rectangular substrate (4) (7) (17) -18- 1331270 coolant circulation circuit (6), and in the two coolant passages (7) (17) and the coolant circulation circuit (6), the non-freezing liquid is used to seal the non-corrosive Sexual coolant. The upper aluminum plate (2) is composed of an aluminum brazing sheet having a solder layer underneath, while the lower aluminum plate (3) is composed of a coffin, and the two aluminum plates (2) (3) are solders using the upper aluminum plate (2) The layers are brazed. As shown in detail in Fig. 3 and Fig. 4, the heat receiver (5) is composed of upper and lower aluminum plates (2) (3) and is formed between the two aluminum plates (2) (3) extending in the front-rear direction. The heat receiver body (8) of the coolant passage (7) and the high-heat conductivity plate disposed in the left-right direction in the coolant passage (7) of the heat receiver body (8), for example, as a material extruded from aluminum Two flat tubes (9) of the heat transfer member. On the upper surface of the aluminum plate (2) for constituting the heat receiver body (8), the heat generator (12) is provided with a heat receiving portion (11) for making thermal contact. On the other hand, the coolant passage (7) of the heat receiver body (8) is formed by expanding the lower aluminum plate (3) downward, and the front end portion is gradually formed to have a narrow width toward the tip end. In the coolant passage (7), the front end is open and the right end of the rear end is also opened. The end portions of the flat tubes (9) included in the aluminum plate (2) for constituting the heat receiver body (8) are spanned over the total width of the two flat tubes (9) and expanded to protrude outward. The solder inflow prevention expansion protrusion (13) extending in the left-right direction is formed. Each of the flat tubes (9) is formed in parallel and has a plurality of hole-shaped passages (9a) extending in the longitudinal direction (front-rear direction) of the coolant passage (7). Both ends of each of the flat tubes (9) are positioned at the intermediate portion in the width direction (front-rear direction) of the expansion projections (13). The entire portion under the aluminum plate (2) on the -19- 1331270 in the upper wall of the two flat tubes (9) is contacted, and the upper aluminum plate (2) is brazed by the solder layer under the upper aluminum plate (2), respectively. Further, the lower walls ' of the two flat tubes (9) are brazed to the lower aluminum sheets (3) by sheet-like solder which is shorter than the flat tubes (9) except for the both end portions thereof. The height of the hole-shaped passage (9a) is 0. 5~2 except for the two ends of the entire hole-shaped passage (9a) positioned in the flat tube (9). 0mm is better, and the width in the left and right direction is 0. 3~1. 5mm is preferred. Moreover, the wall thickness of the upper wall above the flat tube (9) is 0. 2~1. 0mm is preferable, and the wall thickness of the partition wall between the adjacent hole-shaped passages (9a) is 0. 1~0. 5 is better. For example, the height of the hole-shaped passage (9a) is 1. 1mm, the same left and right _ direction width is 〇. 55mm, the wall thickness of the upper and lower walls of the flat tube (9) is 0. 3 mm, the wall thickness of the partition wall between the adjacent hole-like passages (9a) is 〇. 2mm. Further, as the flat tube, instead of the aluminum extrusion material (80), an inner fin may be inserted into the inside of the aluminum electric tube to form a plurality of holes. Further, a panel is provided with a flat wall forming portion which is formed by applying a calendering process to an aluminum brazing sheet having a solder layer on one side, and is connected to each other at a joint portion, and The connecting portion in the flat wall forming portion is formed by a side wall forming portion integrally formed by a side edge on the opposite side in a ridge shape, and a flat portion formed by the two flat walls at a predetermined interval in the width direction of the flat wall forming portion. a plurality of partition wall forming portions formed integrally with each other, wherein the connecting portions are bent into a thin pin shape to braze the side wall forming portions to each other, and the partition wall forming portions are used to form the partition walls, and the partition holes may be used. Pathway. In this case, the side wall forming portion and the partition wall forming portion are formed on the solder surface side of the aluminum brazing sheet. The expansion tank device (14) is disposed on the right end of the substrate (4), behind the expansion tank device (14), in the coolant passage (7) of the radiator (5) '-20- 1331270 coolant circulation circuit (6) The pump passage (15) for circulating the coolant is provided in the coolant passage (17) of the expansion tank device (14). The expansion tank device (14), as shown in detail in Fig. 5, is composed of: upper and lower aluminum plates (2) (3) (upper and lower can bottom forming plates) formed simultaneously between the two aluminum plates (2) (3) The tank extending from the coolant passage (17) in the front-rear direction is provided with a tank bottom (16) and an expansion tank (18) provided on the tank bottom (16). The tank passage (17) of the tank bottom (16) is formed by expanding the lower aluminum plate (3) to protrude below. The upper aluminum plate (2) for constituting the can bottom (16) is formed such that the coolant passage (17) is placed above the can bottom (16) to form a circular communication hole (19). The shape of the communication hole (19) is not limited to a circular shape. The expansion tank (18) is an aluminum can body (21) having an expansion protrusion (22) protruding from above and opening below, and an open end of the closed can body (21) and extending over the can body (21) The rear aluminum base plate (23) is constructed. The can body (21) is formed by a portion other than the peripheral portion of the circular plate formed of the aluminum brazing sheet having the solder layer, and the expansion protruding portion (22) is formed in a truncated cone shape. Its peripheral wall (22a) faces upward and is inclined inward in the diametrical direction. Further, the top wall (22b) of the expansion protruding portion (22) is flat, and a lower protruding portion (24) is formed at a central portion thereof. The outwardly facing flange (21a) around the expansion projection (22) in the can body (21) is such that the lower projection (24) is positioned directly above the communication hole (19), and is brazed by the solder layer Base plate (23). The can body (21) is not limited to being formed by a circular plate, and the expansion projection (22) is also not limited to -21 - 1331270 in a truncated cone shape. The bottom plate (23) is formed in a square shape in the front and rear directions by an aluminum brazing sheet having a solder layer, and is soldered to the upper aluminum plate (2) of the can bottom (16) by the above solder layer. Corresponding to the communication hole (1 9 ) of the aluminum plate ( 2 ) above the bottom plate ( 23 ) is a circular through hole ( 25 ) larger than the communication hole ( 1 9 ), and is connected to the communication hole. Formed concentric. The through hole (25) is not limited to a circular shape. In the peripheral portion of the through hole (25) in the bottom plate (23), the baffle (26) facing upward and inclined inward in the diametrical direction is formed integrally across the entire circumference, surrounding the front end of the baffle (26) and forming an opening (27). Moreover, the lower projection (24) is faced to the opening (27). The pump (15) is attached to the portion protruding from the rear of the tank body (21) in the bottom plate (23) of the expansion tank unit (14). The coolant circulation circuit (6) of the liquid-cooled heat sink (1) is formed by expanding the lower aluminum plate (3) to protrude below, and is oriented toward the upper aluminum plate (2) for forming the can bottom (16). 3) The extension between the left side and the orientation are formed between the extensions of the right side of the upper aluminum plate (2) (3) of the heat receiver body (8). The coolant circulation path (6) is a linear first portion that opens the front end opening of the coolant passage (7) of the heat receiver (5) and the front end opening of the coolant passage (17) of the expansion tank device (14). (60) and a serpentine second portion (61) that opens the right end of the rear end of the coolant passage (7) and the serpentine end of the coolant passage (17). The second part (61) has a linear portion (61a) extending in plural in the front-rear direction, and a bent portion (61b) connecting the adjacent straight portions (61a) in a front-rear direction. Between the adjacent linear portion (61a) (61a) of the second portion (61) of the lower aluminum plate (3), the cooling -22-1331270 liquid passage (7) of the heat receiver (5), and the linear portion of the left end ( 61a) between the linear portion (61a) at the right end and the coolant passage (17) at the right end and the coolant passage (17) of the expansion tank device (14) are respectively formed to extend in the front-rear direction and detect leakage from the coolant circulation path (6) The first to third shorting prevention through holes (62) (63) (64). Further, between the first portion (60) of the lower aluminum plate (3) and the front side buckling portion (61b) of the second portion, a portion that extends in the left-right direction and detects leakage from the coolant circulation path (6) is formed. 4 Short-circuit prevention through hole (6 5 ). Further, a first through hole (6 2 ) and a second through hole (63) formed between the two linear portions (6 1 a ) connected by the bent portion (6 1 b ) in the right side portion and The third through hole (64) is connected to the fourth through hole (65) at the tip end; the coolant passage (7) in the heat receiver (5), the coolant passage (17) of the expansion tank device (4), and The amount of the coolant enclosed in the coolant circulation path (6) is filled with the coolant passage (7) (17) and the coolant circulation path (6) when the substrate (4) is in a vertical state as shown in Fig. 6. At the same time, the liquid level of the coolant in the expansion protrusion (22) of the expansion tank (18) is located at the opening (27) of the front end of the baffle (26) in the bottom plate (23) of the expansion tank (18). Above, and as shown in Fig. 7, when the substrate (4) is turned upside down, the coolant passage (7) (17) and the coolant circulation path (6) are filled, and the expansion protrusion of the expansion tank (18) is simultaneously made. The liquid level of the coolant in (22) is located above the opening (27) at the front end of the baffle (26) in the bottom plate (23) of the expansion tank (18). The above-described liquid-cooled heat sink (1), such as a notebook type personal computer, includes a personal computer main body having a keyboard, and a display device that is arrangably switchable in the main body portion of the personal computer, and is disposed outside the main body of the personal computer. 23- 1331270 Inside the case, the CPU (heat source) is in thermal contact with the heat receiving portion (11) of the heat receiver (5) of the liquid-cooled heat sink (1). When the notebook PC is activated, the coolant (5) is used to circulate the coolant (5) to the coolant passage (7), the coolant passage (I7) of the expansion tank unit (I4), and the refrigerant circulation path (6). ) Inside. The heat generated from the CPU is transmitted to the coolant flowing through the upper aluminum plate (2) into the hole-like passage (9a) of the flat tube (9) disposed in the coolant passage (7) of the heat receiver (5). . Further, the coolant passes through the coolant passage (6) and the coolant passage (17) of the expansion tank unit (14) between the coolant passages (7) returning to the heat receiver (5), and the heat of the coolant The coolant is cooled by being radiated to the outside via the upper and lower aluminum plates (2) (3). Repeating such an action is dissipated from the heat generated by the CPU. Further, in the case where the amount of heat generated by the CPU is large, the heat sink (5) in the substrate (4) is used to dispose the heat sink having the heat sink (not shown) in the separated crucible, which is outputted from the previous case. It is smaller and can be blown off by a cooling fan (not shown) on the heat sink of the heat sink. The coolant contains air in a bubble state, and when the coolant passage (17) passing through the expansion tank device (14) is passed, the through hole (19) of the tank bottom (16) and the through hole of the bottom plate (23) are provided through the can. (25) and enter into the expansion protrusion (22) of the can body (21) where it stays. Moreover, by the action of the baffle (26) around the through hole (25), it is difficult to flow back into the coolant passage (17) once the air entering the expansion projection (22). Therefore, the cooling liquid is discharged from the coolant in the coolant circulation path (6) to improve the cooling efficiency. Further, since the coolant is heated by the heat received by the CPU, even if it is thermally expanded, the coolant flows into the tank body (21) of the expansion tank (18), so that the coolant circulation path can be prevented by the internal pressure rising. (6) Damage to -24- 1331270. Further, if excess cooling liquid is placed in the expansion protruding portion (2 2 ) of the can body (21) of the expansion tank device (14), the cooling efficiency can be prevented even if the cooling liquid is reduced. The method for manufacturing the heat sink (1) is described with reference to Figs. 8 and 9. In the following, the aluminum plate (2) is formed by an aluminum brazing sheet having a solder layer (31), and is applied by press working. The connection hole (19) of the solder inflow prevention expansion protrusion (13) and the expansion tank device (14) of the heat receiver (5) is formed. The aluminum plate (3) is formed of an aluminum ball material to be subjected to press working, and the coolant passage (7) of the heat receiver (5), the coolant passage (17) of the expansion tank device (14), and the coolant are simultaneously applied. The circulation path (6) is formed in a downwardly expanding projection shape, and is used to form first to fourth through holes (62) (63) (64) (65). The can body (21) is formed by pressing a circular plate formed of an aluminum brazing sheet having a solder layer (33) below, and simultaneously forming an expansion protrusion (22) and a lower protrusion (24). . Further, press forming is performed on the bottom plate (23) of the aluminum brazing sheet having the solder layer (33), and the through holes (25), the baffles (26) and the openings (27) are formed. Next, in the coolant passage (7) of the heat receiver (5), two aluminum flat tubes (9) made of extruded material are arranged side by side in the left-right direction. At this time, between the lower surface of the flat tube (9) and the bottom surface of the expansion protruding portion below the passage, a sheet-like solder material (30) shorter than the flat tube (9) is placed at both ends of the flat tube ( 9) The longer ends of the ends are configured. Thereafter, the upper and lower aluminum plates (2) and (3) are overlapped while the bottom plate (23) and the can body (21) are disposed on the plates (2) and (3), and are used for brazing the upper and lower-25- 1331270 gold plates (2). 〇) between each other, the upper and lower aluminum plates (2) (3) and the flat tubes (9), the upper aluminum plates (2) and the bottom plate (23), and the bottom plate (23) and the can body (21). These brazing is performed by using the solder layer (31) of the upper aluminum plate (2), the sheet solder (30), the solder layer (32) of the bottom plate (23), and the solder layer of the can body (21). In this way, a liquid-cooled heat sink is manufactured. After the liquid-cooled heat sink (1) was fabricated, a nitrogen leak test was performed. When the coolant circulation path (6) communicates with the outer peripheral edge portion of the substrate (4) between the two metal plates (2) and (3), a joint failure occurs, and the outer peripheral portion of the substrate (2) faces the crucible. External to detect leaks. Further, 'the cooling liquid circulation path (6) is not communicated with the outer peripheral portion of the substrate (4), but when the coolant circulation path 6 is short-circuited and a joint failure occurs, 'from the through hole (6 2 ) (6 3 ) ( 6 4 ) ( 6 5 ) The leak is detected toward the external measurement of 氦. When the liquid-cooled heat sink (1) is manufactured, the upper aluminum plate (2) is formed to form the expansion protrusion (13), and by making the flat tube. (9) and the lower aluminum plate (3) are shorter than the flat tube (9) and brazed by the sheet solder (30) disposed at the inner side in the longer direction than the both ends of the flat tube (9) When brazing, it is possible to prevent the molten solder from flowing into the hole-like passage (9a) of the flat tube (9). Fig. 10 is a view showing a modification of the heat transfer member of the heat receiver. The heat transfer member (50) shown in Fig. 10 is a wave top and a wave bottom extending in the longitudinal direction of the coolant passage (7) extending from the heat receiver body (8), and a connection for connecting the top of the wave and the bottom of the wave. It is made up of corrugated paper fins made of aluminum ball. The top of the wave of the heat sink is made of the solder layer of the upper aluminum plate (2) and brazed to the upper aluminum plate (2). The bottom of the wave is soldered to the lower aluminum plate (3) by using a piece of solder and hard -26-1331270. Further, the heat transfer member (50) may be formed of an aluminum brazing sheet having a solder layer on both sides, and is brazed to the two aluminum plates (2) (3) by a solder layer thereof. In the above embodiment, the expansion tank device (14) is integrally provided with the heat exchanger (5) and the coolant circulation path (6) in the substrate (4) of the liquid cooling type heat sink (1), instead of this, only The expansion tank device and the substrate (4) are separately formed, and one end portion of the other tube or the like is connected to the expansion tank device at both ends of the coolant passage of the expansion tank device, and the other tube is connected One end portion is connected to the coolant circulation path (6) of the substrate (4), and can also be used to form a liquid-cooled heat sink. Further, the expansion tank device and the heat sink having the above-mentioned ® are formed separately, and the coolant passage of the expansion tank device and the coolant passage of the heat receiver can be connected by another tube or the like, and can also be used to form. Liquid cooled heat sink. Further, in the above embodiment, the upper aluminum plate (2) and the bottom plate (23) which form the can bottom (16) of the expansion tank device (14) are brazed by the solder layer under the bottom plate (23), but this is replaced by The solder layer may also be formed on the upper aluminum plate (2) while the solder layer is not formed under the bottom plate (23), and the aluminum plate (2) and the bottom plate® are brazed by the solder layer on the upper aluminum plate (2) ( twenty three). Moreover, the outward flange (21a) and the bottom plate (23) of the can body (21) are brazed by the solder layer (33) under the can body (21), but instead of this, the bottom plate (23) may be used. The upper layer is used to form a solder layer, and a solder layer is not formed under the can body (21), and the solder layer on the bottom plate (23) is used to hard solder the outer flange (21a) and the bottom plate (23) of the can body (21). . Further, in the above embodiment, the upper aluminum plate (2) is formed by the aluminum brazing sheet having the solder layer on the lower side, and the lower aluminum plate (3) is formed by the aluminum ball material -27-1331270, but The lower aluminum plate (3) can be brazed on top by aluminum with a solder layer. · The film is formed. In this case, in the heat receiver (4 〇), as shown in Fig. 1, the both ends of the flat tube (9) in the lower aluminum plate (3) are spanned by two flat tubes (9). The length of the width is equal to or greater than the total length, and the expansion is protruded from the outer side to form a solder inflow prevention expansion protrusion extending in the left-right direction. (41). A part of the lower aluminum plate (3) connected to the lower wall of the two flat tubes (9) is soldered to the lower aluminum plate (3) by the solder layer of the lower aluminum plate (3). Further, both ends of the flat tube (9) are located at the intermediate portion in the width direction of the expansion projection (41). Further, when the aluminum plate (3) and the flat tube (9) are brazed by the solder layer of the lower aluminum plate (3), the molten layer from the lower aluminum plate (3) is melted by the action of the expansion protrusion (41). The solder prevents the flow into the hole-like passage (9a) of the flat tube (9). Further, in the above embodiment, the upper aluminum plate (2) is formed by an aluminum brazing sheet having a solder layer underneath and the lower aluminum plate (3) is formed by an aluminum ball material, but two aluminum plates can also be used (2) (3) It is formed of aluminum ball material. In this case, in the heat receiver (45), as shown in Fig. 2, the two aluminum plates (2) (3)' are not necessarily used to form the solder inflow prevention expansion protrusions, above the two flat tubes (9). The walls are also made of a shorter piece of solder than the flat tubes (9) except for their ends and brazed to the upper aluminum plate (2). Further, when the two aluminum plates (2) (3) and the flat tubes (9) are brazed using the sheet solder, the molten solder can be prevented from flowing into the hole-like passage (9a) of the flat tube (9). [Industrial Applicability] According to the present invention, the expansion tank device is an IT device such as a personal computer or a server, or an AV device, an industrial machine, or a work machine, which is heated by a heat source. The liquid-cooled heat sink is used to remove air from the coolant from the -28-1331270 circulatory system. It can also be used to prevent damage to the circulatory system and can be used to prevent coolant reduction in the circulatory system. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the overall configuration of a liquid-cooling type heat sink having a heat receiver according to the present invention. Fig. 2 is an exploded perspective view showing the entire configuration of a liquid-cooling type heat sink having a heat receiver according to the present invention. Fig. 3 is an enlarged cross-sectional view taken along line A-A of Fig. 1. Fig. 4 is an enlarged cross-sectional view taken along line B-B of Fig. 1. Fig. 5 is an enlarged cross-sectional view taken along line C-C of Fig. 1. Fig. 6 is a cross-sectional view corresponding to Fig. 5 with the bottom of the can as a vertical state. Fig. 7 is a cross-sectional view corresponding to Fig. 5 with the bottom of the tank facing up and down. Fig. 8 is a partial cross-sectional view showing the heat receiver of the method of manufacturing the liquid-cooled heat sink. Fig. 9 is a partial cross-sectional view showing the expansion tank device showing the method of manufacturing the liquid cooling type heat sink. Fig. 10 is a partial perspective view showing a modification of the heat transfer member of the heat receiver of the liquid-cooling type heat sink, which corresponds to a part of Fig. 2. The figure is a diagram showing a modification of the heat receiver corresponding to Fig. 3. The figure is a diagram showing another modification of the heat receiver corresponding to Fig. 3. [Main component symbol description] 1... Liquid-cooled heat sink 2... Upper aluminum plate 3... Lower aluminum plate 4... Substrate -29- 1331270 5, 40, 45... Heater 6··· Coolant circulation circuit 7, 17... Coolant Passage 8···heater body 9...flat tube 9a...hole-shaped passage 1 1...heat-receiving unit 12...heat-generating body 1 3,4 1...solder inflow prevention expansion protrusion 1 5...pump 1 6...canister set tank bottom 18...expansion tank 1 9...communication hole 2 1...tank body 2 1 a...outward flange 22...expansion projection 2 2 a...surrounding wall 2 2 b...top wall 2 3...bottom plate 24...lower projection 25... Through hole 26...Baffle 2 7...Opening 30...Flake solder 3 1 , 3 2, 3 3... Solder layer -30- 1331270 50... Heat transfer member 60...Part 1 61...Part 2 6 1 a...Line The first short-circuit prevention through-holes 63...the third short-circuit prevention through-holes 64...the third short-circuit prevention through-holes 65...the fourth short-circuit prevention through-holes
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