CN1658744B - 液冷系统和电子装置 - Google Patents
液冷系统和电子装置 Download PDFInfo
- Publication number
- CN1658744B CN1658744B CN2004101048381A CN200410104838A CN1658744B CN 1658744 B CN1658744 B CN 1658744B CN 2004101048381 A CN2004101048381 A CN 2004101048381A CN 200410104838 A CN200410104838 A CN 200410104838A CN 1658744 B CN1658744 B CN 1658744B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- radiator
- cooling fluid
- stream
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 50
- 238000001816 cooling Methods 0.000 title claims abstract description 39
- 239000012809 cooling fluid Substances 0.000 claims description 76
- 239000000758 substrate Substances 0.000 claims description 58
- 230000005855 radiation Effects 0.000 claims description 47
- 238000009434 installation Methods 0.000 claims description 16
- 238000010276 construction Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 239000002826 coolant Substances 0.000 abstract description 12
- 239000000178 monomer Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 230000002093 peripheral effect Effects 0.000 description 12
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- 230000015556 catabolic process Effects 0.000 description 6
- 238000006731 degradation reaction Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000009193 crawling Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 230000009183 running Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP038180/2004 | 2004-02-16 | ||
JP2004038180A JP4234621B2 (ja) | 2004-02-16 | 2004-02-16 | 液冷システムおよび電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1658744A CN1658744A (zh) | 2005-08-24 |
CN1658744B true CN1658744B (zh) | 2010-07-21 |
Family
ID=34697952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004101048381A Expired - Fee Related CN1658744B (zh) | 2004-02-16 | 2004-12-29 | 液冷系统和电子装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7624789B2 (zh) |
EP (1) | EP1564626B1 (zh) |
JP (1) | JP4234621B2 (zh) |
KR (1) | KR100618482B1 (zh) |
CN (1) | CN1658744B (zh) |
DE (1) | DE602004030756D1 (zh) |
TW (1) | TWI272892B (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7086452B1 (en) * | 2000-06-30 | 2006-08-08 | Intel Corporation | Method and an apparatus for cooling a computer |
TWI417604B (zh) * | 2005-12-28 | 2013-12-01 | Semiconductor Energy Lab | 顯示裝置 |
JP5283836B2 (ja) * | 2006-07-25 | 2013-09-04 | 富士通株式会社 | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
JP2008027374A (ja) | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
US7978474B2 (en) * | 2007-05-22 | 2011-07-12 | Apple Inc. | Liquid-cooled portable computer |
TWI422313B (zh) * | 2007-12-04 | 2014-01-01 | Asia Vital Components Co Ltd | Radiative fin manufacturing method |
JP5065202B2 (ja) * | 2008-08-28 | 2012-10-31 | トヨタ自動車株式会社 | 半導体装置 |
JP5161757B2 (ja) * | 2008-12-26 | 2013-03-13 | パナソニック株式会社 | 画像表示装置 |
CN102819303A (zh) * | 2011-06-09 | 2012-12-12 | 鸿富锦精密工业(深圳)有限公司 | 计算机机箱 |
CN103179837A (zh) * | 2011-12-20 | 2013-06-26 | 研能科技股份有限公司 | 应用于可携式电子装置的冷却系统 |
US20130255281A1 (en) * | 2012-03-29 | 2013-10-03 | General Electric Company | System and method for cooling electrical components |
US9472487B2 (en) * | 2012-04-02 | 2016-10-18 | Raytheon Company | Flexible electronic package integrated heat exchanger with cold plate and risers |
US9801310B2 (en) | 2013-04-03 | 2017-10-24 | International Business Machines Corporation | Server cooling system without the use of vapor compression refrigeration |
US9970687B2 (en) * | 2013-06-26 | 2018-05-15 | Tai-Her Yang | Heat-dissipating structure having embedded support tube to form internally recycling heat transfer fluid and application apparatus |
WO2015199726A1 (en) * | 2014-06-27 | 2015-12-30 | Hewlett-Packard Development Company, L. P. | Heat distribution of computing devices |
US10355356B2 (en) | 2014-07-14 | 2019-07-16 | Palo Alto Research Center Incorporated | Metamaterial-based phase shifting element and phased array |
CN204084274U (zh) * | 2014-07-30 | 2015-01-07 | 深圳Tcl新技术有限公司 | 散热器、背光模组及显示模组 |
US10060686B2 (en) * | 2015-06-15 | 2018-08-28 | Palo Alto Research Center Incorporated | Passive radiative dry cooling module/system using metamaterials |
CN107175813A (zh) * | 2017-06-30 | 2017-09-19 | 北京金达雷科技有限公司 | 冷却基板、冷却组件、显示组件、树脂池组件、3d打印机 |
CN109426049B (zh) * | 2017-08-21 | 2021-03-05 | 深圳光峰科技股份有限公司 | 液冷循环散热装置、液冷循环散热系统及光学投影系统 |
DE102018129983A1 (de) * | 2018-11-27 | 2020-05-28 | Bayerische Motoren Werke Aktiengesellschaft | Stator mit einem Kühlmantel, elektrische Maschine sowie Kraftfahrzeug |
EP3842726A1 (en) * | 2019-12-25 | 2021-06-30 | Showa Denko Packaging Co., Ltd. | Heat exchanger and inner fin thereof |
CN112762732A (zh) * | 2020-12-28 | 2021-05-07 | 深圳市宝晟互联信息技术有限公司 | 散热装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5535818A (en) * | 1992-10-12 | 1996-07-16 | Fujitsu Limited | Cooling system for electronic device |
CN1193762A (zh) * | 1996-12-31 | 1998-09-23 | 康帕克电脑公司 | 计算机特殊器件的液体冷却装置 |
CN2496065Y (zh) * | 2001-08-17 | 2002-06-19 | 创微国际开发股份有限公司 | 微环路热管 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3327776A (en) * | 1965-10-24 | 1967-06-27 | Trane Co | Heat exchanger |
US4155402A (en) * | 1977-01-03 | 1979-05-22 | Sperry Rand Corporation | Compliant mat cooling |
US5132873A (en) * | 1988-09-30 | 1992-07-21 | Microelectronics And Computer Technology Corporation | Diaphragm sealing apparatus |
US5381510A (en) * | 1991-03-15 | 1995-01-10 | In-Touch Products Co. | In-line fluid heating apparatus with gradation of heat energy from inlet to outlet |
US5245693A (en) * | 1991-03-15 | 1993-09-14 | In-Touch Products Co. | Parenteral fluid warmer apparatus and disposable cassette utilizing thin, flexible heat-exchange membrane |
US5205348A (en) * | 1991-05-31 | 1993-04-27 | Minnesota Mining And Manufacturing Company | Semi-rigid heat transfer devices |
US5485671A (en) * | 1993-09-10 | 1996-01-23 | Aavid Laboratories, Inc. | Method of making a two-phase thermal bag component cooler |
US5731954A (en) * | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
CA2276795A1 (en) * | 1998-07-01 | 2000-01-01 | Keiichiro Ohta | Heat sink device for electronic devices |
JP4055323B2 (ja) | 1999-12-13 | 2008-03-05 | 松下電器産業株式会社 | 放熱体およびこれを用いた冷却装置およびこの冷却装置を備えた電子機器 |
US6808015B2 (en) * | 2000-03-24 | 2004-10-26 | Denso Corporation | Boiling cooler for cooling heating element by heat transfer with boiling |
JP2002098454A (ja) * | 2000-07-21 | 2002-04-05 | Mitsubishi Materials Corp | 液冷ヒートシンク及びその製造方法 |
US6367543B1 (en) * | 2000-12-11 | 2002-04-09 | Thermal Corp. | Liquid-cooled heat sink with thermal jacket |
US6587336B2 (en) * | 2001-06-27 | 2003-07-01 | International Business Machines Corporation | Cooling system for portable electronic and computer devices |
JP3636118B2 (ja) * | 2001-09-04 | 2005-04-06 | 株式会社日立製作所 | 電子装置用の水冷装置 |
JP3961844B2 (ja) * | 2002-02-08 | 2007-08-22 | 株式会社日立製作所 | 冷却液タンク |
TWI234063B (en) * | 2002-05-15 | 2005-06-11 | Matsushita Electric Ind Co Ltd | Cooling apparatus for electronic equipment |
JP2004047843A (ja) * | 2002-07-15 | 2004-02-12 | Hitachi Ltd | 電子装置 |
-
2004
- 2004-02-16 JP JP2004038180A patent/JP4234621B2/ja not_active Expired - Fee Related
- 2004-11-12 TW TW093134706A patent/TWI272892B/zh not_active IP Right Cessation
- 2004-12-29 KR KR1020040114552A patent/KR100618482B1/ko active IP Right Grant
- 2004-12-29 US US11/023,431 patent/US7624789B2/en active Active
- 2004-12-29 CN CN2004101048381A patent/CN1658744B/zh not_active Expired - Fee Related
- 2004-12-30 DE DE602004030756T patent/DE602004030756D1/de active Active
- 2004-12-30 EP EP04031063A patent/EP1564626B1/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5535818A (en) * | 1992-10-12 | 1996-07-16 | Fujitsu Limited | Cooling system for electronic device |
CN1193762A (zh) * | 1996-12-31 | 1998-09-23 | 康帕克电脑公司 | 计算机特殊器件的液体冷却装置 |
CN2496065Y (zh) * | 2001-08-17 | 2002-06-19 | 创微国际开发股份有限公司 | 微环路热管 |
Non-Patent Citations (1)
Title |
---|
全文. |
Also Published As
Publication number | Publication date |
---|---|
CN1658744A (zh) | 2005-08-24 |
EP1564626B1 (en) | 2010-12-29 |
US20050178533A1 (en) | 2005-08-18 |
JP2005229036A (ja) | 2005-08-25 |
KR20050081867A (ko) | 2005-08-19 |
JP4234621B2 (ja) | 2009-03-04 |
US7624789B2 (en) | 2009-12-01 |
TWI272892B (en) | 2007-02-01 |
EP1564626A1 (en) | 2005-08-17 |
TW200529735A (en) | 2005-09-01 |
DE602004030756D1 (de) | 2011-02-10 |
KR100618482B1 (ko) | 2006-08-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI LTD. Free format text: FORMER OWNER: HITACHI,LTD. Effective date: 20130723 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130723 Address after: Tokyo, Japan Patentee after: HITACHI CONSUMER ELECTRONICS Co.,Ltd. Address before: Tokyo, Japan Patentee before: Hitachi, Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: HITACHI MAXELL LTD. Free format text: FORMER OWNER: HITACHI LTD. Effective date: 20150401 |
|
TR01 | Transfer of patent right |
Effective date of registration: 20150401 Address after: Osaka, Japan Patentee after: Hitachi Maxell, Ltd. Address before: Tokyo, Japan Patentee before: Hitachi Consumer Electronics Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20171213 Address after: Kyoto Japan Patentee after: MAXELL, Ltd. Address before: Osaka, Japan Patentee before: Hitachi Maxell, Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100721 Termination date: 20211229 |
|
CF01 | Termination of patent right due to non-payment of annual fee |