CN1655348A - 电子部件安装用衬底、电子部件和半导体器件 - Google Patents
电子部件安装用衬底、电子部件和半导体器件 Download PDFInfo
- Publication number
- CN1655348A CN1655348A CNA2004100619342A CN200410061934A CN1655348A CN 1655348 A CN1655348 A CN 1655348A CN A2004100619342 A CNA2004100619342 A CN A2004100619342A CN 200410061934 A CN200410061934 A CN 200410061934A CN 1655348 A CN1655348 A CN 1655348A
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- conductor portion
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Images
Classifications
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- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H—ELECTRICITY
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/114—Pad being close to via, but not surrounding the via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP034709/2004 | 2004-02-12 | ||
JP2004034709A JP3804803B2 (ja) | 2004-02-12 | 2004-02-12 | 電子部品搭載用基板及び半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1655348A true CN1655348A (zh) | 2005-08-17 |
CN100459110C CN100459110C (zh) | 2009-02-04 |
Family
ID=34836186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100619342A Expired - Fee Related CN100459110C (zh) | 2004-02-12 | 2004-06-29 | 电子部件安装用衬底和半导体器件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6936769B1 (zh) |
JP (1) | JP3804803B2 (zh) |
KR (1) | KR101128308B1 (zh) |
CN (1) | CN100459110C (zh) |
TW (1) | TWI326482B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102800585A (zh) * | 2012-07-09 | 2012-11-28 | 厦门飞德利照明科技有限公司 | 一种发光二极管的电铸制造方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006310530A (ja) * | 2005-04-28 | 2006-11-09 | Sanyo Electric Co Ltd | 回路装置およびその製造方法 |
US20080205057A1 (en) * | 2007-02-23 | 2008-08-28 | Frontend Analog And Digital Technology Corporation | Light source device assembly |
EP2009968A4 (en) * | 2007-03-30 | 2012-12-05 | Panasonic Corp | CIRCUIT BOARD |
US8604435B2 (en) * | 2009-02-26 | 2013-12-10 | Texas Instruments Incorporated | Infrared sensor structure and method |
JP2012023283A (ja) * | 2010-07-16 | 2012-02-02 | Siix Corp | 放熱基板およびその製造方法 |
US20120286416A1 (en) * | 2011-05-11 | 2012-11-15 | Tessera Research Llc | Semiconductor chip package assembly and method for making same |
US9706639B2 (en) * | 2015-06-18 | 2017-07-11 | Samsung Electro-Mechanics Co., Ltd. | Circuit board and method of manufacturing the same |
EP3357308A1 (en) * | 2015-10-01 | 2018-08-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic component carrier for carrying and cooling a heat generating electronic component |
US10420255B2 (en) * | 2016-09-14 | 2019-09-17 | Jtekt Corporation | Electronic control device |
WO2019102601A1 (ja) * | 2017-11-27 | 2019-05-31 | 三菱電機株式会社 | 半導体装置 |
DE102018101264A1 (de) * | 2018-01-22 | 2019-07-25 | HELLA GmbH & Co. KGaA | Leiterplatten- Kühlkörper- Aufbau und Verfahren hierzu |
JP7406973B2 (ja) * | 2019-12-11 | 2023-12-28 | ローム株式会社 | 半導体装置 |
JP2022160336A (ja) * | 2021-04-06 | 2022-10-19 | 日本電産エレシス株式会社 | 回路基板 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61137349A (ja) * | 1984-12-10 | 1986-06-25 | Toshiba Corp | 半導体装置 |
US5561322A (en) * | 1994-11-09 | 1996-10-01 | International Business Machines Corporation | Semiconductor chip package with enhanced thermal conductivity |
JP2982713B2 (ja) | 1996-10-23 | 1999-11-29 | 日本電気株式会社 | 半導体素子の放熱構造 |
CN1265691C (zh) * | 1996-12-19 | 2006-07-19 | 揖斐电株式会社 | 多层印刷布线板及其制造方法 |
JP3633252B2 (ja) * | 1997-01-10 | 2005-03-30 | イビデン株式会社 | プリント配線板及びその製造方法 |
JPH10279845A (ja) | 1997-03-31 | 1998-10-20 | Nippon Paint Co Ltd | 遠赤外線輻射塗料 |
JPH1167998A (ja) | 1997-08-19 | 1999-03-09 | Matsushita Electric Ind Co Ltd | Cspとbgaと半導体装置 |
US6555762B2 (en) * | 1999-07-01 | 2003-04-29 | International Business Machines Corporation | Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition |
KR100660830B1 (ko) * | 2001-02-13 | 2006-12-26 | 삼성전자주식회사 | 반도체 소자의 스토리지 전극 형성방법 |
JP4923336B2 (ja) * | 2001-04-10 | 2012-04-25 | 日本電気株式会社 | 回路基板及び該回路基板を用いた電子機器 |
TW579665B (en) * | 2003-04-23 | 2004-03-11 | Via Tech Inc | Vertical routing structure |
-
2004
- 2004-02-12 JP JP2004034709A patent/JP3804803B2/ja not_active Expired - Fee Related
- 2004-06-17 TW TW093117450A patent/TWI326482B/zh not_active IP Right Cessation
- 2004-06-25 KR KR1020040048053A patent/KR101128308B1/ko active IP Right Grant
- 2004-06-29 CN CNB2004100619342A patent/CN100459110C/zh not_active Expired - Fee Related
- 2004-10-08 US US10/960,721 patent/US6936769B1/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102800585A (zh) * | 2012-07-09 | 2012-11-28 | 厦门飞德利照明科技有限公司 | 一种发光二极管的电铸制造方法 |
CN102800585B (zh) * | 2012-07-09 | 2015-09-09 | 厦门飞德利照明科技有限公司 | 一种发光二极管的电铸制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2005228860A (ja) | 2005-08-25 |
US20050178574A1 (en) | 2005-08-18 |
KR101128308B1 (ko) | 2012-03-26 |
KR20050081829A (ko) | 2005-08-19 |
CN100459110C (zh) | 2009-02-04 |
US6936769B1 (en) | 2005-08-30 |
JP3804803B2 (ja) | 2006-08-02 |
TW200527617A (en) | 2005-08-16 |
TWI326482B (en) | 2010-06-21 |
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