CN1596469A - 可编程电子处理器件的装配 - Google Patents

可编程电子处理器件的装配 Download PDF

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CN1596469A
CN1596469A CNA038000326A CN03800032A CN1596469A CN 1596469 A CN1596469 A CN 1596469A CN A038000326 A CNA038000326 A CN A038000326A CN 03800032 A CN03800032 A CN 03800032A CN 1596469 A CN1596469 A CN 1596469A
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CN100364088C (zh
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海伯勒·克劳斯
西本·乌尔里希
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TDK Micronas GmbH
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MEIKENAS CO
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Abstract

本发明公开了用于可编程电子处理器件的装配。它至少分成第一功能单元(7)和第二功能单元(8)，它们代表独立的——尤其是单片集成的——元件。第一功能单元(7)关于它们的电学性能确定处理器件的所有输入和输出接口。第二功能单元(8)的所有来自外界的基本连接都只通过第一功能单元(7)进行。为此，第一功能单元(7)包含用于电调节第二功能单元(8)与外部条件的连接匹配电路。

Description

可编程电子处理器件的装配
本发明涉及可编程电子处理器件的封装或外壳或承载器件的装配。通常，这样的处理器件构成包含至少一个单片集成电路的处理器。视应用的不同，可处理模拟和逻辑信号或数据。相对较小的电子模块使这些处理器可以与其它电路——例如存储器——一起安装在相对较小的封装中。因其小的封装尺寸，也称之为“微处理器”。如果在一个装配中至少含有两个独立结构，这也被称作“混合电路”，以便将其与只有单个单片集成电路的情形区分开。
微处理器的使用在各个技术领域都得到了发展，因为有了它们的帮助，控制过程能够得以优化。额外的成本和复杂性相对较低，并且可以分别解决。一个很宽的应用领域是在机械工程中，尤其是在汽车领域，为了优化车辆在各点的性能，这一领域对这种微处理器的需求越来越大。
然而，在许多可使用这种处理器的情形中，在实际中又产生了这样一个基本问题：对处理器的厂商和用户来说周期差别太大。当在技术系统中采用这样的处理器时，产品必需尽可能统一，以利于制造以及在整个研发、规划、生产和相关系统的操作时间中进行替换。
如果发生技术改变，除了电连接参数的改变之外，还必需考虑对过电压、极性颠倒和电磁干扰的敏感度变化。此外，还有，例如，作为电磁干扰信号在相对较长的线路中传播的陡峭的时钟脉冲和数据沿对其它电路的干扰效应的改变。
半导体技术的发展通常总是超前于用户规定的时限，因为它必需跟踪当前的技术改变以便能够实现日益复杂的电路。对过时技术的持续使用包括对通常并不经济的并行生产线的使用，因为还没有充分利用生产能力。
因此本发明的一个目的——在权利要求1中描述了其特征——是给出对上述问题的合适的解决方案，使得半导体厂商一方面能够使用第一流的半导体工艺，而另一方面能向用户提供产品能长时间使用的担保。
这一目的由权利要求1的特征描述部分所提出的教导来得到。根据本发明的装配和处理器件并不能认为是独立的部分，而是给装配指定处理器件的第一功能单元，它基本确定了处理器件的外部电学条件。严格意义上的处理(processing proper)发生在第二功能单元中，其基本连接通常与外界只通过第一功能单元的外部连接而连接。此处所用的术语“基本连接”包括那些从外部看来，因其容差很严格或者因其有源的或无源的扰动性能必需考虑在内，因而就其电学参数而言很关键的那些连接。不关键的连接——例如置位或复位输入——也可包括在内，但是并不一定要经由第一功能单元，即使在长时间使用时，从所用技术的可预见发展的角度来看，这样做更为安全。在装配中包含第一和第二功能单元的安排类似于混合电路，但是却用于完全不同的目的。第一功能单元——它还可由不止一个单片集成电路组成——主要只用于确定外部条件并为第二功能单元提供合适的匹配电路。这样，从外界看来，包含在第二功能单元中并且也可由不止一个单片集成电路组成的严格意义上的处理器件(processing deviceproper)被“屏蔽”了。除了单纯的匹配电路之外，第一功能单元可包含执行更多通用功能的分支电路，例如振荡器、电源电压调整电路、缓冲电路、保护电路，等等。电源电压调整电路允许具有未调整或过高电源电压的供电系统中的微处理器的自主工作。这对于第二功能单元的工作来说尤其重要，如果有必要，其电压必需适合所用技术，然而在另一方面，对于其它电子电路或测量器件，必需保持最初的电源电压。因为，一般，处理器件还包含存储器件，后者的写入和擦除电压也最好在第一功能单元中产生或调节(adapt)。
分成第一和第二功能单元的做法使得该严格意义上的处理器件能有进一步的技术发展，且保留第一功能单元的技术，而并不一定非得从外界来考虑它。技术的进一步发展通常与更高的处理速率和更低的电压电平相关。在相对较长的引脚上，处理速率增大了要考虑的干扰电位。另一方面，更高的处理速率使得对于许多处理来说，可进行顺序处理，而无需像以前所必须的那样因为较低的处理速度而使用并行处理。并行处理通常需要并行的数据输入和输出，由此接触焊垫的数量以及所需的芯片总面积增大了。这样，尽管处理器的功能增强了，但是也必需不让接触焊垫的数量随其成比例增加，而是必需限制接触焊垫的数量。因此，在第二功能单元中需要使用串联输入和输出。然而，这需要在第一功能单元中具有合适的转换器件。
如果匹配电路不是固定的，而是可编程的，则适应性当然更大，因为这样的话将可通过程序来进行调节(adaptation)。如果处理器的输入和输出电平因为使用新技术而发生了改变，则将能通过程序来调节匹配电路的电压电平。
现在将参考附图更详细地描述本发明和有益的发展，其中：
图1为用于单片集成电路的根据现有技术的典型装配的示意性俯视图；
图2为用于混合电路的根据现有技术的典型装配的示意性俯视图；
图3为用于第一和第二功能单元横向排列的根据本发明的装配的示意性俯视图；
图4为用于第一和第二功能单元堆叠排列的根据本发明的装配的示意性俯视图；
图5为用于堆叠排列和横向排列组合的根据本发明的装配的示意性俯视图；
图6为根据本发明的装配的示意性俯视图，其中第一和第二功能单元的所有接触都首先与一个无源承载相连；以及
图7为大致根据图6的装配的示意性剖面图，由一阵列焊垫确定外部连接端。
参看图1，示出单片集成电路1的典型排列的示意性俯视图，它处于根据现有技术的装配中。装配通常是模制塑料封装，其轮廓由线2表示。一般，单片集成电路1的承载为平面金属冲压件3，即所谓的框架，它一方面为单片集成电路的焊垫提供通过塑料封装的直通连接，另一方面容纳用于承受单片集成电路1的平台。一般，该平台与外部地针相连。单片集成电路1的连接焊垫通过焊线与框架3的相关内部引脚相连。单片集成电路1的所有外部引脚通过框架3引出。
图2示出现有技术混合电路的示意性俯视图。混合电路由两个单片集成电路5、6组成。如果承载还是带有平台4的框架3，则这两个单片集成电路并排安置在该平台上。通过线焊对单片集成电路5、6制作接触，它们引向框架3上相关的引脚或直接从电路引向电路。在某些情形中，使用堆叠结构，其中较小的电路结合在较大的电路上。较小的电路通常是存储电路或具有特定元件——例如电容、线圈、滤波器等——的电路。
通常在具有不同基本功能的分支电路——例如逻辑电路和数字电路，可能还有不同的存储类型——相互作用的情形下要用到混合电路。这样，对于每个电路可用到最佳技术。如此，还有可能组合不同厂商的产品。用于混合电路的装配也可以是整个印刷电路板，其连接也通常由线焊来制作。然后用塑料外壳保护板上的各个电路和线焊。
图3为根据本发明的装配的示意性俯视图，第一和第二功能单元7、8横向排列。两个单片集成功能单元7、8的横向排列与图2的两个单片集成电路5、6的并行排列较为类似。不同之处在于，在图3中，所有外部连接只与第一功能单元7相连，而第二功能单元8只与第一功能单元7相连。通过平台4的公共接地是一个例外。图3已经以图示示出，如果使用框架3，则该装配局限于相对较少的外部引脚，因为焊线只允许有限的焊接形状，内部框架引脚所带来的补偿只能部分实现。图4所示的堆叠排列示出一种补救措施。
在图4的框架平台4上包含两个或多个分支电路的示意性堆叠排列中，保留了与图1大致类似的中心排列，从而通过焊线可以很容易地从第一功能单元7的边缘到达框架3的所有内部接触。因为堆叠排列，第一功能单元7还得具有承载第二功能单元8的功能。当然，这就要求第一功能单元7的芯片面积充分大于第二功能单元8的芯片面积。塑料外壳的封装轮廓或边界由线2表示。
图5示意性示出框架平台4上堆叠排列和横向排列的组合的实施方案。堆叠排列大致相应于图4，横向排列大致相应于图3。第一功能单元7支撑第二功能单元8，并从横向与置于公共框架平台上的另一第二功能单元或辅助单元9相连。所有与外界的连接都只通过第一功能单元7进行。例如，单元9可以是存储模块。它与第二功能单元8的连接是直接通过焊线进行还是间接通过第一功能单元7进行主要取决于空间条件。塑料外壳的封装轮廓或边界由线2表示。
图6为装配的一个实施方案的示意性俯视图，其中通过第一和第二功能单元7、8的横向排列解决了从第一功能单元7到外部连接30的不充分可达性的问题。由例如陶瓷体组成并在其表面上沉积互连板11的绝缘承载10支撑第一和第二功能单元7、8。互联板11可由几层互相隔离的布线组成，形成所有互连12、13、14、15、16、17和相关的接触区20。借助于线焊40，制作了从第一和第二功能单元7、8到互连的接触区20的连接。互连之间以及互连和表面之间互相隔离，因此可任意交叉或从下面穿过第一或第二功能单元7、8；与例如从第二功能单元8之下穿过的互连15和16以及互连17的交叉相比。以此方式，从第一功能单元7可容易地到达装配30的所有外部连接端。承载10还与外部连接端30相连，或者后者在其制造过程中已内嵌于承载中。整个结构被塑料外壳包围，其轮廓由点划线2表示。
图7示出包含承载10以及第一和第二功能单元7、8的横向排列的又一装配的剖面图。排列大致与图6类似。它与图6的不同之处在于外部连接端由一阵列焊垫35确定。该排列将用于外部连接端太多从而沿边缘直线排列连接端时间隔将变得太小的情形中。焊垫35中的每一个都与通孔36相连，提供与互连板11的电连接。在图7的侧视图中，可清楚地看到从第一和第二功能单元7、8连向互连板11的线焊40。
利用分成第一和第二功能单元，本发明当然不局限于单片集成电路的使用。如果合适，对于各个分支电路可使用其它制造过程。重要的是从外界保证处理器件电学性能的稳定，这通过利用具有恒定电学参数的第一功能单元屏蔽严格意义上的处理器件来实现。

Claims (11)

1.一种装配，含有可编程电子处理器件、尤其是微处理器，它至少分成第一功能单元(7)和第二功能单元(8)，它们代表独立的、尤其是单片集成的元件，
其特征在于：
第一功能单元(7)相对于它们的电学性能确定处理器件的所有输入和输出接口，
第二功能单元(8)的所有基本连接都只通过第一功能单元(7)而可从外部访问，直接访问是通常状态，以及
第一功能单元(7)包含匹配电路，该电路用于电调节第二功能单元(8)与外部条件的连接。
2.根据权利要求1的装配，其特征在于，首先该装配是裸露的或仅含有可编程电子处理器件的一部分，还在于如此设计该装配使得能够在以后并入处理器件的一个或多个剩余部分。
3.根据权利要求2的装配，其特征在于包含在装配中的部分被看作第一功能单元(7)的形成部分。
4.根据权利要求1至3中任何一个的装配，其特征在于在至少一个匹配电路中发生电压电平的改变。
5.根据权利要求4的装配，其特征在于第二功能单元(8)的至少一个电源端通过第一功能单元(7)馈电，在此情形中匹配电路包括电压调节器。
6.根据权利要求1至3中任何一个的装配，其特征在于在至少一个匹配电路中发生电流电平的改变。
7.根据权利要求1至3中任何一个的装配，其特征在于在至少一个匹配电路中，发生从串行数据流向并行数据流的转换或从并行数据流向串行数据流的转换。
8.根据权利要求1至3中任何一个的装配，其特征在于在至少一个匹配电路中，输入或传出数据被暂时存储。
9.根据权利要求1至3中任何一个的装配，其特征在于至少一个匹配电路就其电学特性来说是可编程的。
10.根据权利要求9的装配，其特征在于对于至少一个匹配电路，测量模式是可编程的。
11.根据权利要求10的装配，其特征在于在至少一个匹配电路的测量模式中，通过编程的方法，从装配的外部连接到第二功能单元(8)的连接的直接信号路径能够被切换，而经由匹配电路的间接信号通路被关闭。
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