CN1564880A - 含有具有特定骨架的季铵化合物和有机硫化合物作为添加剂的铜电解液以及由此制造的电解铜箔 - Google Patents
含有具有特定骨架的季铵化合物和有机硫化合物作为添加剂的铜电解液以及由此制造的电解铜箔 Download PDFInfo
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- CN1564880A CN1564880A CNA038006057A CN03800605A CN1564880A CN 1564880 A CN1564880 A CN 1564880A CN A038006057 A CNA038006057 A CN A038006057A CN 03800605 A CN03800605 A CN 03800605A CN 1564880 A CN1564880 A CN 1564880A
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- copper foil
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 68
- 239000011889 copper foil Substances 0.000 title claims abstract description 37
- 239000010949 copper Substances 0.000 title claims abstract description 32
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 31
- -1 amine compound Chemical class 0.000 title claims abstract description 23
- 150000002898 organic sulfur compounds Chemical class 0.000 title claims abstract description 16
- 239000000654 additive Substances 0.000 title claims abstract description 14
- 239000008151 electrolyte solution Substances 0.000 title abstract description 14
- 150000001875 compounds Chemical class 0.000 claims abstract description 25
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 16
- 125000003118 aryl group Chemical group 0.000 claims abstract description 15
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 9
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims abstract description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 8
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract description 7
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims abstract description 7
- 238000007259 addition reaction Methods 0.000 claims abstract description 5
- 150000003856 quaternary ammonium compounds Chemical class 0.000 claims description 26
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 22
- 239000003792 electrolyte Substances 0.000 claims description 20
- 230000000996 additive effect Effects 0.000 claims description 11
- 239000002585 base Substances 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 239000011734 sodium Substances 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 125000004417 unsaturated alkyl group Chemical group 0.000 claims description 7
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 2
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical group OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 239000005864 Sulphur Substances 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims description 2
- 125000001118 alkylidene group Chemical group 0.000 claims description 2
- 150000003863 ammonium salts Chemical class 0.000 claims description 2
- 229910052728 basic metal Inorganic materials 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000000059 patterning Methods 0.000 abstract description 8
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 125000001033 ether group Chemical group 0.000 abstract description 2
- 150000001879 copper Chemical class 0.000 abstract 1
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 1
- 238000005956 quaternization reaction Methods 0.000 abstract 1
- 230000003746 surface roughness Effects 0.000 abstract 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 13
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000003607 modifier Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 229940073608 benzyl chloride Drugs 0.000 description 5
- 150000002118 epoxides Chemical group 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 3
- 238000005160 1H NMR spectroscopy Methods 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- JYGXADMDTFJGBT-VWUMJDOOSA-N hydrocortisone Chemical compound O=C1CC[C@]2(C)[C@H]3[C@@H](O)C[C@](C)([C@@](CC4)(O)C(=O)CO)[C@@H]4[C@@H]3CCC2=C1 JYGXADMDTFJGBT-VWUMJDOOSA-N 0.000 description 2
- DYUWTXWIYMHBQS-UHFFFAOYSA-N n-prop-2-enylprop-2-en-1-amine Chemical compound C=CCNCC=C DYUWTXWIYMHBQS-UHFFFAOYSA-N 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 125000004343 1-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000006017 1-propenyl group Chemical group 0.000 description 1
- VEPOHXYIFQMVHW-XOZOLZJESA-N 2,3-dihydroxybutanedioic acid (2S,3S)-3,4-dimethyl-2-phenylmorpholine Chemical compound OC(C(O)C(O)=O)C(O)=O.C[C@H]1[C@@H](OCCN1C)c1ccccc1 VEPOHXYIFQMVHW-XOZOLZJESA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- SXBUGKWQJSVJSA-UHFFFAOYSA-N C(C1=CC=CC=C1)Cl.C1(=CC=CC=C1)NC1=CC=CC=C1 Chemical compound C(C1=CC=CC=C1)Cl.C1(=CC=CC=C1)NC1=CC=CC=C1 SXBUGKWQJSVJSA-UHFFFAOYSA-N 0.000 description 1
- DOKMIDSIXOROFQ-UHFFFAOYSA-N C(C1=CC=CC=C1)Cl.N(CCO)CCO Chemical compound C(C1=CC=CC=C1)Cl.N(CCO)CCO DOKMIDSIXOROFQ-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- BWLUMTFWVZZZND-UHFFFAOYSA-N Dibenzylamine Chemical compound C=1C=CC=CC=1CNCC1=CC=CC=C1 BWLUMTFWVZZZND-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- BHELZAPQIKSEDF-UHFFFAOYSA-N allyl bromide Chemical compound BrCC=C BHELZAPQIKSEDF-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229960000890 hydrocortisone Drugs 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N methyl alcohol Substances OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- JZMJDSHXVKJFKW-UHFFFAOYSA-M methyl sulfate(1-) Chemical compound COS([O-])(=O)=O JZMJDSHXVKJFKW-UHFFFAOYSA-M 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- FRTIVUOKBXDGPD-UHFFFAOYSA-M sodium;3-sulfanylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CCCS FRTIVUOKBXDGPD-UHFFFAOYSA-M 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
添加剂A(ppm) | 添加剂B(ppm) | 添加剂C(ppm) | Rz(μm) | 常温伸长率(%) | 高温抗张强度(kgf/mm2) | 常温伸长率(%) | 高温抗张强度(kgf/mm2) | ||||||
C1 | C2 | C3 | C4 | C5 | C6 | ||||||||
实施例1 | 50 | 0 | 50 | 0 | 0 | 0 | 0 | 0 | 1.12 | 8.20 | 33.2 | 14.9 | 22.7 |
实施例2 | 50 | 0 | 0 | 50 | 0 | 0 | 0 | 0 | 1.10 | 6.72 | 31.5 | 17.2 | 22.0 |
实施例3 | 50 | 0 | 0 | 0 | 50 | 0 | 0 | 0 | 0.95 | 8.80 | 30.5 | 17.9 | 20.0 |
实施例4 | 50 | 0 | 0 | 0 | 0 | 50 | 0 | 0 | 1.20 | 8.80 | 36.5 | 12.3 | 20.1 |
实施例5 | 50 | 0 | 0 | 0 | 0 | 0 | 50 | 0 | 1.12 | 7.12 | 33.9 | 11.9 | 21.0 |
实施例6 | 50 | 0 | 0 | 0 | 0 | 0 | 0 | 50 | 0.99 | 6.82 | 30.5 | 16.5 | 21.5 |
实施例7 | 0 | 50 | 50 | 0 | 0 | 0 | 0 | 0 | 1.15 | 8.30 | 33.1 | 15.1 | 19.9 |
实施例8 | 0 | 50 | 0 | 50 | 0 | 0 | 0 | 0 | 1.13 | 6.99 | 30.5 | 16.3 | 23.4 |
实施例9 | 0 | 50 | 0 | 0 | 50 | 0 | 0 | 0 | 0.98 | 9.20 | 35.0 | 18.2 | 23.1 |
实施例10 | 0 | 50 | 0 | 0 | 0 | 50 | 0 | 0 | 1.12 | 8.81 | 37.2 | 13.2 | 23.0 |
实施例11 | 0 | 50 | 0 | 0 | 0 | 0 | 50 | 0 | 1.23 | 7.30 | 36.0 | 12.5 | 21.3 |
实施例12 | 0 | 50 | 0 | 0 | 0 | 0 | 0 | 50 | 0.94 | 6.90 | 32.1 | 16.9 | 21.0 |
比较例1 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 5.8 | 8.90 | 37.9 | 12.6 | 20.7 |
比较例2 | 100 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 5.5 | 0.2 | 10.3 | 1.0 | 15.3 |
比较例3 | 0 | 100 | 0 | 0 | 0 | 0 | 0 | 0 | 6.1 | 0.2 | 11.2 | 1.2 | 14.9 |
比较例4 | 0 | 0 | 100 | 0 | 0 | 0 | 0 | 0 | 5.2 | 0.3 | 11.2 | 1.0 | 15.3 |
比较例5 | 0 | 0 | 0 | 100 | 0 | 0 | 0 | 0 | 5.9 | 0.1 | 11.3 | 1.2 | 16.1 |
比较例6 | 0 | 0 | 0 | 0 | 100 | 0 | 0 | 0 | 5.2 | 0.2 | 12.4 | 1.5 | 15.1 |
比较例7 | 0 | 0 | 0 | 0 | 0 | 100 | 0 | 0 | 5.9 | 0.2 | 12.2 | 1.0 | 14.1 |
比较例8 | 0 | 0 | 0 | 0 | 0 | 0 | 100 | 0 | 5.3 | 0.1 | 12.5 | 1.3 | 16.2 |
比较例9 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 100 | 5.7 | 0.1 | 13.2 | 1.0 | 13.3 |
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002305650A JP4115240B2 (ja) | 2002-10-21 | 2002-10-21 | 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔 |
JP305650/2002 | 2002-10-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1564880A true CN1564880A (zh) | 2005-01-12 |
CN1321225C CN1321225C (zh) | 2007-06-13 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB038006057A Expired - Lifetime CN1321225C (zh) | 2002-10-21 | 2003-08-20 | 含有季铵化合物和有机硫化合物作为添加剂的铜电解液以及由此制造的电解铜箔 |
Country Status (10)
Country | Link |
---|---|
US (2) | US7144491B2 (zh) |
EP (1) | EP1568802B8 (zh) |
JP (1) | JP4115240B2 (zh) |
KR (1) | KR100589901B1 (zh) |
CN (1) | CN1321225C (zh) |
ES (1) | ES2450042T3 (zh) |
HK (1) | HK1068655A1 (zh) |
MY (1) | MY139358A (zh) |
TW (1) | TWI250224B (zh) |
WO (1) | WO2004035874A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111108234A (zh) * | 2018-08-28 | 2020-05-05 | 株式会社杰希优 | 硫酸铜镀液和使用了其的硫酸铜镀敷方法 |
CN112111761A (zh) * | 2020-09-07 | 2020-12-22 | 浙江大学 | 一种高延伸率电解铜箔的电解液及其应用 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4115240B2 (ja) * | 2002-10-21 | 2008-07-09 | 日鉱金属株式会社 | 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔 |
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- 2003-08-20 ES ES03788699T patent/ES2450042T3/es not_active Expired - Lifetime
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Cited By (4)
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CN111108234A (zh) * | 2018-08-28 | 2020-05-05 | 株式会社杰希优 | 硫酸铜镀液和使用了其的硫酸铜镀敷方法 |
CN111108234B (zh) * | 2018-08-28 | 2023-11-17 | 株式会社杰希优 | 硫酸铜镀液和使用了其的硫酸铜镀敷方法 |
CN112111761A (zh) * | 2020-09-07 | 2020-12-22 | 浙江大学 | 一种高延伸率电解铜箔的电解液及其应用 |
CN112111761B (zh) * | 2020-09-07 | 2021-09-21 | 浙江大学 | 一种高延伸率电解铜箔的电解液及其应用 |
Also Published As
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EP1568802B1 (en) | 2014-01-08 |
JP2004137588A (ja) | 2004-05-13 |
CN1321225C (zh) | 2007-06-13 |
KR100589901B1 (ko) | 2006-06-14 |
WO2004035874A1 (ja) | 2004-04-29 |
EP1568802B8 (en) | 2014-03-26 |
US7771835B2 (en) | 2010-08-10 |
US7144491B2 (en) | 2006-12-05 |
ES2450042T3 (es) | 2014-03-21 |
TW200408726A (en) | 2004-06-01 |
US20070042201A1 (en) | 2007-02-22 |
EP1568802A4 (en) | 2007-11-07 |
TWI250224B (en) | 2006-03-01 |
KR20040058010A (ko) | 2004-07-02 |
JP4115240B2 (ja) | 2008-07-09 |
HK1068655A1 (en) | 2005-04-29 |
MY139358A (en) | 2009-09-30 |
US20050173256A1 (en) | 2005-08-11 |
EP1568802A1 (en) | 2005-08-31 |
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