CN1533359A - 薄膜以及该薄膜的制造方法 - Google Patents

薄膜以及该薄膜的制造方法 Download PDF

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Publication number
CN1533359A
CN1533359A CNA028143795A CN02814379A CN1533359A CN 1533359 A CN1533359 A CN 1533359A CN A028143795 A CNA028143795 A CN A028143795A CN 02814379 A CN02814379 A CN 02814379A CN 1533359 A CN1533359 A CN 1533359A
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CN
China
Prior art keywords
layer
bonding region
ground floor
weak
weak bonding
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Pending
Application number
CNA028143795A
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English (en)
Chinese (zh)
Inventor
����ˡ�M��������
萨迪克·M·法里斯
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Reveo Inc
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Reveo Inc
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Application filed by Reveo Inc filed Critical Reveo Inc
Publication of CN1533359A publication Critical patent/CN1533359A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/0038—Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Recrystallisation Techniques (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CNA028143795A 2001-05-18 2002-05-20 薄膜以及该薄膜的制造方法 Pending CN1533359A (zh)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US29223701P 2001-05-18 2001-05-18
US60/292,237 2001-05-18
US29928401P 2001-06-19 2001-06-19
US60/299,284 2001-06-19
US31251601P 2001-08-15 2001-08-15
US31265901P 2001-08-15 2001-08-15
US60/312,516 2001-08-15
US60/312,659 2001-08-15
US09/950,909 US7045878B2 (en) 2001-05-18 2001-09-12 Selectively bonded thin film layer and substrate layer for processing of useful devices
US60/950,909 2007-07-20

Publications (1)

Publication Number Publication Date
CN1533359A true CN1533359A (zh) 2004-09-29

Family

ID=27540761

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA028143795A Pending CN1533359A (zh) 2001-05-18 2002-05-20 薄膜以及该薄膜的制造方法

Country Status (8)

Country Link
US (2) US7045878B2 (fr)
EP (1) EP1396022A2 (fr)
JP (1) JP2004527915A (fr)
KR (1) KR20030093359A (fr)
CN (1) CN1533359A (fr)
AU (1) AU2002320033A1 (fr)
TW (1) TW559945B (fr)
WO (1) WO2002095799A2 (fr)

Cited By (3)

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CN101964398A (zh) * 2010-10-11 2011-02-02 福建钧石能源有限公司 柔性薄膜太阳能电池及其制造方法
CN109564891A (zh) * 2016-08-11 2019-04-02 索泰克公司 用于转移有用层的方法
CN110229628A (zh) * 2019-06-26 2019-09-13 武汉华星光电半导体显示技术有限公司 补强板胶层结构及屏幕弯折区结构、显示屏幕

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US9834860B2 (en) * 2009-10-14 2017-12-05 Alta Devices, Inc. Method of high growth rate deposition for group III/V materials
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CN103523738B (zh) * 2012-07-06 2016-07-06 无锡华润上华半导体有限公司 微机电系统薄片及其制备方法
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
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US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
JP2015035453A (ja) * 2013-08-07 2015-02-19 アズビル株式会社 ウエハ
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
KR102353030B1 (ko) 2014-01-27 2022-01-19 코닝 인코포레이티드 얇은 시트와 캐리어의 제어된 결합을 위한 물품 및 방법
US9922956B2 (en) * 2014-09-26 2018-03-20 Qualcomm Incorporated Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration
US11167532B2 (en) 2015-05-19 2021-11-09 Corning Incorporated Articles and methods for bonding sheets with carriers
US11905201B2 (en) 2015-06-26 2024-02-20 Corning Incorporated Methods and articles including a sheet and a carrier
TW202216444A (zh) 2016-08-30 2022-05-01 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI810161B (zh) 2016-08-31 2023-08-01 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
WO2018140211A1 (fr) * 2017-01-25 2018-08-02 Glasspoint Solar, Inc. Structures d'enveloppe en film mince destinées à capter l'énergie solaire, et systèmes et procédés associés
CN107086010B (zh) * 2017-04-19 2019-11-19 京东方科技集团股份有限公司 电子装置制造方法和电子装置
CN111372772A (zh) 2017-08-18 2020-07-03 康宁股份有限公司 使用聚阳离子聚合物的临时结合
WO2019118660A1 (fr) 2017-12-15 2019-06-20 Corning Incorporated Procédés de traitement d'un substrat et procédé de fabrication d'articles à base de feuilles liées
CN111799365B (zh) * 2020-06-29 2022-03-25 上海新硅聚合半导体有限公司 基于同一衬底制备不同厚度薄膜的方法及其结构、及应用器件

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101964398A (zh) * 2010-10-11 2011-02-02 福建钧石能源有限公司 柔性薄膜太阳能电池及其制造方法
CN109564891A (zh) * 2016-08-11 2019-04-02 索泰克公司 用于转移有用层的方法
CN109564891B (zh) * 2016-08-11 2023-08-29 索泰克公司 用于转移有用层的方法
CN110229628A (zh) * 2019-06-26 2019-09-13 武汉华星光电半导体显示技术有限公司 补强板胶层结构及屏幕弯折区结构、显示屏幕
WO2020258597A1 (fr) * 2019-06-26 2020-12-30 武汉华星光电半导体显示技术有限公司 Structure de couche adhésive de plaque de renforcement, structure de zone de courbure d'écran et écran d'affichage

Also Published As

Publication number Publication date
EP1396022A2 (fr) 2004-03-10
WO2002095799A2 (fr) 2002-11-28
US20050059218A1 (en) 2005-03-17
AU2002320033A1 (en) 2002-12-03
JP2004527915A (ja) 2004-09-09
KR20030093359A (ko) 2003-12-06
US7045878B2 (en) 2006-05-16
TW559945B (en) 2003-11-01
WO2002095799A3 (fr) 2003-09-18
US20020171080A1 (en) 2002-11-21

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