CN1530911A - 电路板组件和扁平线圈 - Google Patents
电路板组件和扁平线圈 Download PDFInfo
- Publication number
- CN1530911A CN1530911A CNA2004100039991A CN200410003999A CN1530911A CN 1530911 A CN1530911 A CN 1530911A CN A2004100039991 A CNA2004100039991 A CN A2004100039991A CN 200410003999 A CN200410003999 A CN 200410003999A CN 1530911 A CN1530911 A CN 1530911A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pancake coil
- coiler part
- coil element
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012771 pancakes Nutrition 0.000 claims description 92
- 230000000712 assembly Effects 0.000 claims description 37
- 238000000429 assembly Methods 0.000 claims description 37
- 238000010438 heat treatment Methods 0.000 claims description 28
- 238000009434 installation Methods 0.000 claims description 11
- 239000003990 capacitor Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D9/00—Bookmarkers; Spot indicators; Devices for holding books open; Leaf turners
- B42D9/001—Devices for indicating a page in a book, e.g. bookmarkers
- B42D9/002—Devices for indicating a page in a book, e.g. bookmarkers permanently attached to the book
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10462—Flat component oriented parallel to the PCB surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP065391/2003 | 2003-03-11 | ||
JP2003065391A JP4205457B6 (ja) | 2003-03-11 | 回路基板組立体及び平面コイル |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100018575A Division CN1980526B (zh) | 2003-03-11 | 2004-02-12 | 电路板组件和扁平线圈 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1530911A true CN1530911A (zh) | 2004-09-22 |
CN1327747C CN1327747C (zh) | 2007-07-18 |
Family
ID=32767913
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100039991A Expired - Fee Related CN1327747C (zh) | 2003-03-11 | 2004-02-12 | 电路板组件 |
CN2007100018575A Expired - Fee Related CN1980526B (zh) | 2003-03-11 | 2004-02-12 | 电路板组件和扁平线圈 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100018575A Expired - Fee Related CN1980526B (zh) | 2003-03-11 | 2004-02-12 | 电路板组件和扁平线圈 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7061361B2 (zh) |
EP (1) | EP1458226A3 (zh) |
KR (1) | KR20040080949A (zh) |
CN (2) | CN1327747C (zh) |
TW (1) | TWI295146B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101356862B (zh) * | 2005-11-11 | 2010-11-17 | 欧陆汽车有限责任公司 | 电子电路装置和制造电子电路装置的方法 |
CN103329186A (zh) * | 2011-07-01 | 2013-09-25 | 松下电器产业株式会社 | 散热板、电路基板、以及图像显示装置 |
CN108154992A (zh) * | 2017-12-27 | 2018-06-12 | 上海传英信息技术有限公司 | 电感组件及电路板 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4789348B2 (ja) * | 2001-05-31 | 2011-10-12 | リンテック株式会社 | 面状コイル部品、面状コイル部品の特性調整方法、idタグ、及び、idタグの共振周波数の調整方法 |
KR100708844B1 (ko) * | 2005-04-18 | 2007-04-17 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
JP2005331945A (ja) | 2004-05-18 | 2005-12-02 | Samsung Sdi Co Ltd | プラズマ表示装置 |
KR100647651B1 (ko) * | 2004-11-15 | 2006-11-23 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100683757B1 (ko) * | 2005-02-02 | 2007-02-20 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 모듈 |
DE102005008521A1 (de) * | 2005-02-24 | 2006-08-31 | OCé PRINTING SYSTEMS GMBH | Anordnung und Verfahren zum Kühlen eines Leistungshalbleiters |
KR100719726B1 (ko) * | 2005-05-14 | 2007-05-17 | 삼성에스디아이 주식회사 | 플라즈마 표시장치 |
KR20060124289A (ko) * | 2005-05-31 | 2006-12-05 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 모듈 |
JP5172287B2 (ja) * | 2007-11-19 | 2013-03-27 | 株式会社東芝 | 集積回路装置 |
KR101890752B1 (ko) | 2012-11-01 | 2018-08-22 | 삼성전자 주식회사 | 균일한 병렬 스위치 특성을 갖는 파워모듈용 기판 및 이를 포함하는 파워모듈 |
TW201421211A (zh) * | 2012-11-16 | 2014-06-01 | Primax Electronics Ltd | 無線充電裝置 |
JP6084147B2 (ja) * | 2013-03-15 | 2017-02-22 | オムロンオートモーティブエレクトロニクス株式会社 | コイル一体型プリント基板、磁気デバイス |
EP3407477A1 (de) * | 2017-05-26 | 2018-11-28 | Siemens Aktiengesellschaft | Vorrichtung zum entladen von einem gleichspannungszwischenkreiskondensator |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05304764A (ja) * | 1992-02-25 | 1993-11-16 | Nippon Steel Corp | カード型dc−dcコンバータ |
US5929733A (en) * | 1993-07-21 | 1999-07-27 | Nagano Japan Radio Co., Ltd. | Multi-layer printed substrate |
JPH09293944A (ja) * | 1996-02-29 | 1997-11-11 | Murata Mfg Co Ltd | 回路装置 |
JP3672669B2 (ja) | 1996-05-31 | 2005-07-20 | 富士通株式会社 | 平面表示装置の駆動装置 |
FI962803A0 (fi) * | 1996-07-10 | 1996-07-10 | Nokia Telecommunications Oy | Planartransformator |
JP3077056B2 (ja) * | 1996-09-12 | 2000-08-14 | 株式会社村田製作所 | 積層型電子部品 |
EP0985218B1 (de) * | 1997-05-27 | 2001-10-04 | Power-One AG | Vorrichtung und verfahren zum kühlen einer planarinduktivität |
US5973923A (en) * | 1998-05-28 | 1999-10-26 | Jitaru; Ionel | Packaging power converters |
US6175500B1 (en) * | 1998-09-22 | 2001-01-16 | Lucent Technologies Inc. | Surface mount thermal connections |
JP3822390B2 (ja) * | 1998-09-30 | 2006-09-20 | 太陽誘電株式会社 | 混成集積回路装置 |
US6084775A (en) * | 1998-12-09 | 2000-07-04 | International Business Machines Corporation | Heatsink and package structures with fusible release layer |
US6518868B1 (en) * | 2000-08-15 | 2003-02-11 | Galaxy Power, Inc. | Thermally conducting inductors |
JP3488868B2 (ja) * | 2001-03-05 | 2004-01-19 | Tdk株式会社 | 平面コイルおよび平面トランス |
WO2002071422A1 (fr) | 2001-03-05 | 2002-09-12 | Tdk Corporation | Bobine plane et transformateur plan |
JP3488869B2 (ja) * | 2001-03-16 | 2004-01-19 | Tdk株式会社 | 平面コイルおよび平面トランス |
JP3680758B2 (ja) * | 2001-04-20 | 2005-08-10 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
-
2004
- 2004-01-29 EP EP04250498A patent/EP1458226A3/en not_active Withdrawn
- 2004-01-30 KR KR1020040005921A patent/KR20040080949A/ko not_active Application Discontinuation
- 2004-02-02 US US10/768,066 patent/US7061361B2/en not_active Expired - Fee Related
- 2004-02-09 TW TW093102943A patent/TWI295146B/zh not_active IP Right Cessation
- 2004-02-12 CN CNB2004100039991A patent/CN1327747C/zh not_active Expired - Fee Related
- 2004-02-12 CN CN2007100018575A patent/CN1980526B/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101356862B (zh) * | 2005-11-11 | 2010-11-17 | 欧陆汽车有限责任公司 | 电子电路装置和制造电子电路装置的方法 |
CN103329186A (zh) * | 2011-07-01 | 2013-09-25 | 松下电器产业株式会社 | 散热板、电路基板、以及图像显示装置 |
CN108154992A (zh) * | 2017-12-27 | 2018-06-12 | 上海传英信息技术有限公司 | 电感组件及电路板 |
Also Published As
Publication number | Publication date |
---|---|
TWI295146B (en) | 2008-03-21 |
CN1327747C (zh) | 2007-07-18 |
EP1458226A3 (en) | 2006-06-28 |
JP2004273937A (ja) | 2004-09-30 |
US20040178876A1 (en) | 2004-09-16 |
EP1458226A2 (en) | 2004-09-15 |
JP4205457B2 (ja) | 2009-01-07 |
US7061361B2 (en) | 2006-06-13 |
CN1980526B (zh) | 2010-05-19 |
TW200421950A (en) | 2004-10-16 |
KR20040080949A (ko) | 2004-09-20 |
CN1980526A (zh) | 2007-06-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: Kanagawa Patentee after: Hitachi Plasma Display Co., Ltd. Address before: Kanagawa Patentee before: Fuji Hitachi Plasma Display Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: HITACHI, LTD. Free format text: FORMER OWNER: HITACHI PLASMA DISPLAY CO., LTD. Effective date: 20120605 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120605 Address after: Tokyo, Japan Patentee after: Hitachi Ltd. Address before: Kanagawa Patentee before: Hitachi Plasma Display Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070718 Termination date: 20140212 |