CN1422413A - 薄片智能卡制造方法 - Google Patents

薄片智能卡制造方法 Download PDF

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CN1422413A
CN1422413A CN01807813A CN01807813A CN1422413A CN 1422413 A CN1422413 A CN 1422413A CN 01807813 A CN01807813 A CN 01807813A CN 01807813 A CN01807813 A CN 01807813A CN 1422413 A CN1422413 A CN 1422413A
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CN1184595C (zh
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E·海恩曼恩
F·佩斯奇纳
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Infineon Technologies AG
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Abstract

本智能卡至少由两层(1、2)纸或薄膜作为衬底材料叠压而成，其中一层嵌入有半导体芯片(6)，第二层具有连接触点(3)以及导电通路或外部连接面(4)。半导体芯片的触点经过导电(7)连接到第二层的连接触点(3)。该智能卡生产不需要芯片模块。带有IC和触点的衬底材料能够以连续轧辊形式进行轧制，与纸张生产形式相同。

Description

薄片智能卡制造方法
所属技术领域
本发明涉及智能卡的一种成本极为低廉的制造方法，该卡是由纸张或薄膜叠压而成。
背景技术
如今的智能卡仍然只限于使用某一段时间或者使用的次数有限。电话充值卡就是其中一个例子，其中只能存储一定的电话使用时间。因此，在这一类应用中，单独的智能卡本身用处不大，它只带有一个便宜的存储体。从经济角度考虑，智能卡本身必须在总售价中占一小部分，以使总售价较低。要根据使智能卡制造成本尽可能低的原则，来选用卡片材料、卡片构造和制造方法。
WO95/21423中描述了一种智能卡，它能够以纸张为材料，智能卡模块被叠压在纸层中。智能卡模块中至少包括一个带有集成电路的半导体芯片，及其符合智能卡标准的电气连接。在非接触式智能卡中，作为天线的导体通路嵌入在智能卡中，并能将电流传导到半导体芯片中。薄片的制造采用了纸张生产的传统技术。多个层被粘合在一起，并同时受轧制；在纸片上要剪切的部分作出标记或者轧上花边，该部分用于装填智能卡模块。智能卡模块，包括连接触点和半导体芯片的衬底，与纸薄片层是分别制造的。
WO97/18531中描述了一种智能卡，其中IC芯片连接到一个作为绝缘层的塑料层，IC芯片轧制在塑料层中，塑料层两侧印制有导体，作为衬底，从而IC芯片的连线能够将电传导到绝缘层中正对它的导体中。
EP 0 706 152 A2中描述了一种智能卡和一种制造方法，其中利用倒装芯片技术将芯片安装在薄膜中的导体上，而不需要任何模块，并且在其背面，嵌入一层内薄膜和一层外薄膜。且穿过薄膜能与外部接触。
WO97/27564中描述了一种智能卡，其中有一个内嵌的芯片模块，它是通过能够加热的薄片轧辊对制造的。
发明内容
本发明的目标之一是确定一种制造方法，使能够大匹量低成本生产智能卡。
要实现该目标，要采用具有权利要求1中特征的方法。在相应的权利要求中可以找到改进方法。
根据本发明所制造的智能卡，至少是由两层薄片衬底材料，如纸张和薄膜，压制而成，其中一层适合于放置用于智能卡的半导体芯片，第二层带有连接触点和导体通路或外部连接面，以用于信号和电流传输。半导体芯片嵌入到一个层中，其触点面向另一层。层与层相互连接，从而半导体芯片的触点导电连接到另一层的触点。在提供有外部连接面的情形下，与半导体芯片相连的连接触点与外部连接面，被设置为在一个层的相反的两侧。在它们之间，通过该层衬底材料的剪切部分或孔径，有导电连接。从而智能卡的制造不需要使用智能卡模块，尤其是衬底材料能从滚筒上以带状或卷筒纸形式抽出并能提供给某种设备用于生产薄片时，这在纸张生产原理中可得知。
下列文本中有根据本发明的制造方法实施例的更详细地描述，参照图1和图2。
图1显示用于生产带有外部连接面的智能卡的装置的原理图。
图2显示生产无接触的智能卡的原理图。
图1显示在生产该智能卡装置的侧视图中的衬底材料1、2，它们提供至少两个层。在第一衬底材料1(用于智能卡的第一层)中，插入了一个半导体芯片6。在更好的生产方法中，从一条或一卷衬底材料中能够生产大量的智能卡，并且这些智能卡仅当衬底材料1、2被连接好以后才分离开。为了简单起见，图1中从横截面显示在衬底材料1中只含有一个半导体芯片6的装置。可以设想在该半导体芯片6的左边或右边邻近处可以有其他的半导体芯片，并有可能位于该图中的层面上，用于更高级的智能卡。每个半导体芯片6被设置在衬底材料1中，最好是插入到剪切部位。该剪切部位可以完全穿过薄衬底材料1，或者可能只有一个凹进处，它不损伤第一衬底材料1的背面11。从背面覆盖半导体芯片的其他层，可利用该背面11，或者在最后的生产工序中利用背面11。
连接触点3嵌入到第二衬底材料2的侧面中或其上，与半导体芯片6相对，在薄片生产过程中通过该连接触点3经由导电连接7(比如所谓的由软焊料如NiAu所组成的凸起)可以连接半导体芯片6的触点。在如图1所显示的具体实施例中，在智能卡与例如终端连接触点之间建立电连接的连接面4位于第二衬底材料2的外表面11上，与半导体芯片6相背离。对于导电连接5，导电材料位于孔径中，孔径在第二材料2中先于施加用以连接触点与连接表面4的导电材料而制成。一旦智能卡被分离开，第一衬底材料1形成第一层，其中嵌入有半导体芯片6，而第二衬底材料2形成第2层，其中具有用于电气连接的连接触点3、在孔径中的导电连接5以及外部连接面4。
在图1显示的装置中，衬底材料1、2从轧辊12上展开，这与采用所谓连续轧辊形式生产纸张或卡片相同。在图1中相互连接的衬底材料通过轧辊13进行后面的传送，在传送的过程中，轧辊加压于薄片(它由多层组成)，优选在设备中沿衬底材料带的多个点设置轧辊。这些轧辊可以设有加热装置，用来加热衬底材料，以使在衬底材料之间进行粘合，比如形成一个粘合层，以提供更好的粘合。加热也可以通过一个外部的加热部分来实现，这种情形下仍然优选同时采用加热轧辊，以便于在半导体芯片6的触点和连接触点3之间产生导电连接7。
根据本发明制造的智能卡是由至少两个层面组成，多个层面的改进也在本发明范围之内。本例中的关键特性是半导体芯片直接集成在一个层中，作为IC芯片。用于连接的电导体嵌入在另一层中或其上。连续轧辊形式的纸张或者薄膜尤其适合和/或作为衬底材料。第二层上的连接触点和/或连接表面优选采用连续丝网印制的方法制成，通过这种方法，比如可以在一个薄层中施加导电膏，并且在此过程中形成。IC的触点以一种方式连接到第二层的连接触点，这种方式本质上类似于用倒装法安装半导体芯片。
为了改进导电连接7，它带有接触垫片或者软焊料块，填料8(未填满)位于半导体芯片6和第二层之间，第二层是由第二衬底材料2组成，该填料8(未填满)优选由各向异性的导电材料组成。该材料按某种方式排列，以使得在需要导电连接7的方向上具有最大的导电性能，而该方向的横截方向，也就是说在衬底材料1、2的连接面上，导电性能尽可能低，目的是避免在不同的触点之间短路。也可以采用各向同性的导电或者绝缘填料8，这种情形下如果这些填料在采用之后并且在衬底材料连接之后至少会有轻微的收缩，从而导电连接7被压在半导体芯片6的触点以及在第二层2的连接触点3上，以这种方式可得到具有足够硬度的、压力适度的导电连接7。
根据本发明，可以生产一种没有触点的智能卡，方式与本示例装置类似。这时候，不采用嵌入在第二衬底材料2上的连接面4，而是采用导体通路10(参见图2)，并且将导电通路构造在内表面，该表面具有连接触点3。这种导体通路10可以是螺旋形线圈的形式，可用作信号传输及电流传输的天线。如图2显示的这种智能卡的其他成分和生产方法与参照图1中所描述的智能卡相符。第二衬底材料2最好采用只在侧面的导电结构，与半导体芯片6相对。在所描述的实施例中，薄片可能是由多于两个层所组成。但是在原理上，可以将图1和图2相互结合起来，作出改进，以满足诸如下述场合的需要，即智能卡可既通过电连接与外部连接，也可以采用无触点与外部连接。

Claims (4)

1.一种制造智能卡的方法，其中第一步，第一衬底材料(1)带有至少一个半导体芯片(6)，以用于每个智能卡，半导体芯片中包括一个集成电路并至少有一个触点，第二衬底材料(2)带有至少一个连接触点(3)，以用于每个智能卡，其中纸质或者薄膜条或带被用作衬底材料，以用于多个智能卡；并且
在第二步中，衬底材料(1、2)相互之间通过接触压力和/或粘合持久连接，其中半导体芯片的触点被导电连接到连接触点；并且
在第三步中，通过切割或冲压，各智能卡被分离。
2.根据权利要求1所述的方法，其中衬底材料通过轧辊(12)或者轧辊(13)进行制造和传送。
3.根据权利要求1或者2所述的方法，其中在第一步之前，第二衬底材料(2)带有孔径，并且
在第一步，第二衬底材料(2)的两个侧面按预先要求的结构覆盖有导电材料，以便形成用于各个智能卡的至少一个连接触点(3)，并且至少有一个连接面(4)，该连接面设置在第二衬底材料的另一侧，并且在各自的连接触点(3)和各自的连接面(4)之间通过孔径产生导电连接(5)。
4.根据权利要求1到3中任一项所述的方法，其中，在第一步中，第二衬底材料(2)按预先要求的结构覆盖有导电材料，以便形成用于各个智能卡的至少一个连接触点(3)，并且至少有一个导电通路(10)连接到该第二衬底材料。
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