CN103262102A - 具有外部连接器的电子卡 - Google Patents
具有外部连接器的电子卡 Download PDFInfo
- Publication number
- CN103262102A CN103262102A CN2011800589491A CN201180058949A CN103262102A CN 103262102 A CN103262102 A CN 103262102A CN 2011800589491 A CN2011800589491 A CN 2011800589491A CN 201180058949 A CN201180058949 A CN 201180058949A CN 103262102 A CN103262102 A CN 103262102A
- Authority
- CN
- China
- Prior art keywords
- contact pad
- hole
- pad designed
- insulation
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims abstract description 93
- 229910052751 metal Inorganic materials 0.000 claims abstract description 93
- 229910000679 solder Inorganic materials 0.000 claims abstract description 87
- 239000000463 material Substances 0.000 claims description 62
- 238000009413 insulation Methods 0.000 claims description 59
- 238000001465 metallisation Methods 0.000 claims description 24
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 24
- 125000006850 spacer group Chemical group 0.000 description 20
- 238000003466 welding Methods 0.000 description 19
- 239000002313 adhesive film Substances 0.000 description 12
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000007767 bonding agent Substances 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 238000005219 brazing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 238000007731 hot pressing Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 208000034189 Sclerosis Diseases 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910000635 Spelter Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
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- 230000009977 dual effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Credit Cards Or The Like (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10194068A EP2463809A1 (fr) | 2010-12-07 | 2010-12-07 | Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne |
EP10194068.2 | 2010-12-07 | ||
PCT/EP2011/072138 WO2012076627A2 (fr) | 2010-12-07 | 2011-12-07 | Carte électronique ayant un connecteur externe |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103262102A true CN103262102A (zh) | 2013-08-21 |
CN103262102B CN103262102B (zh) | 2016-10-12 |
Family
ID=43920265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180058949.1A Expired - Fee Related CN103262102B (zh) | 2010-12-07 | 2011-12-07 | 具有外部连接器的电子卡 |
Country Status (17)
Country | Link |
---|---|
US (2) | US9247643B2 (zh) |
EP (2) | EP2463809A1 (zh) |
JP (1) | JP2014501975A (zh) |
KR (1) | KR101628447B1 (zh) |
CN (1) | CN103262102B (zh) |
AU (1) | AU2011340524B2 (zh) |
BR (1) | BR112013014251A2 (zh) |
CA (1) | CA2821060C (zh) |
ES (1) | ES2602635T3 (zh) |
IL (1) | IL226445A (zh) |
MA (1) | MA34678B1 (zh) |
MX (1) | MX336669B (zh) |
MY (1) | MY166129A (zh) |
RU (1) | RU2575988C2 (zh) |
SG (2) | SG192012A1 (zh) |
TN (1) | TN2013000214A1 (zh) |
WO (1) | WO2012076627A2 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105684001A (zh) * | 2013-11-04 | 2016-06-15 | 德国捷德有限公司 | 用于不同连接技术的集成电路模块 |
CN112042055A (zh) * | 2018-05-04 | 2020-12-04 | 瑞典爱立信有限公司 | 背腔式天线单元和阵列天线装置 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102779286B (zh) * | 2012-06-29 | 2014-11-12 | 北京豹驰智能科技有限公司 | 一种多层布线式双界面ic卡天线模块 |
DE102012211546B4 (de) * | 2012-07-03 | 2017-02-16 | Morpho Cards Gmbh | Chipkarte mit bei Raumtemperatur pastenförmiger oder flüssiger Kontaktierung |
TW201545614A (zh) * | 2014-05-02 | 2015-12-01 | R&D Circuits Inc | 製備殼體以接收用於嵌入式元件印刷電路板之元件的結構和方法 |
CN104899637B (zh) * | 2015-06-11 | 2018-04-03 | 深圳市科信通信技术股份有限公司 | 一种智能电子标签的生产工艺 |
US10275699B2 (en) * | 2015-06-11 | 2019-04-30 | Feitian Technologies Co., Ltd. | Smart card and method for manufacturing same |
SG11201807340SA (en) * | 2016-03-01 | 2018-09-27 | Cardlab Aps | A circuit layer for an integrated circuit card |
GB2548638A (en) * | 2016-03-24 | 2017-09-27 | Zwipe As | Method of manufacturing a smartcard |
JP6718837B2 (ja) * | 2016-04-01 | 2020-07-08 | スカイワークスフィルターソリューションズジャパン株式会社 | 電子部品とその製造方法、及び電子装置とその製造方法 |
SE541653C2 (en) * | 2017-11-03 | 2019-11-19 | Stora Enso Oyj | Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna |
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
FR3088515B1 (fr) * | 2018-11-08 | 2022-01-28 | Smart Packaging Solutions | Module electronique pour carte a puce |
JP7457107B2 (ja) * | 2019-09-30 | 2024-03-27 | オエティカ エヌワイ インク | 無線周波数識別流体継ぎ手 |
CN117377963A (zh) | 2021-05-21 | 2024-01-09 | 兰克森控股公司 | 用于集成到智能卡的卡本体中的模块、智能卡、以及将模块植入智能卡的卡本体中的方法 |
Citations (4)
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WO1997034247A2 (de) * | 1996-03-14 | 1997-09-18 | Pav Card Gmbh | Chipkarte, verbindungsanordnung und verfahren zum herstellen einer chipkarte |
WO2003017196A1 (de) * | 2001-08-10 | 2003-02-27 | Infineon Technologies Ag | Kontaktierung von halbleiterchips in chipkarten |
CN1422413A (zh) * | 2000-04-04 | 2003-06-04 | 因芬尼昂技术股份公司 | 薄片智能卡制造方法 |
CN1305004C (zh) * | 2002-06-11 | 2007-03-14 | 三星Techwin株式会社 | Ic卡及其制造方法 |
Family Cites Families (28)
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JPH045844A (ja) * | 1990-04-23 | 1992-01-09 | Nippon Mektron Ltd | Ic搭載用多層回路基板及びその製造法 |
FR2724477B1 (fr) * | 1994-09-13 | 1997-01-10 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
CA2192076C (en) * | 1995-04-13 | 2000-01-18 | Masao Gogami | Ic card and ic module |
FR2743649B1 (fr) * | 1996-01-17 | 1998-04-03 | Gemplus Card Int | Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication |
JP3610999B2 (ja) * | 1996-06-07 | 2005-01-19 | 松下電器産業株式会社 | 半導体素子の実装方法 |
EP0818752A2 (de) | 1996-07-08 | 1998-01-14 | Fela Holding AG | Leiterplatte (Inlet) für Chip-Karten |
FR2761497B1 (fr) * | 1997-03-27 | 1999-06-18 | Gemplus Card Int | Procede de fabrication d'une carte a puce ou analogue |
DE19732645A1 (de) * | 1997-07-29 | 1998-09-10 | Siemens Ag | Verfahren zur Herstellung einer Combi-Chipkarte |
DE19809073A1 (de) | 1998-03-04 | 1999-09-16 | Orga Kartensysteme Gmbh | Chipmodul und Verfahren zur Herstellung einer Chipkarte |
GB2371264A (en) * | 2001-01-18 | 2002-07-24 | Pioneer Oriental Engineering L | Smart card with embedded antenna |
JP3939504B2 (ja) * | 2001-04-17 | 2007-07-04 | カシオ計算機株式会社 | 半導体装置並びにその製造方法および実装構造 |
CN1383197A (zh) * | 2001-04-25 | 2002-12-04 | 松下电器产业株式会社 | 半导体装置的制造方法及半导体装置 |
DE10126655A1 (de) * | 2001-06-01 | 2002-12-05 | Endress & Hauser Gmbh & Co Kg | Leiterplatte mit mindestens einem elektronischen Bauteil |
RU2193260C1 (ru) * | 2001-10-31 | 2002-11-20 | Сасов Юрий Дмитриевич | Способ изготовления многокомпонентного трехмерного электронного модуля |
US6586843B2 (en) * | 2001-11-08 | 2003-07-01 | Intel Corporation | Integrated circuit device with covalently bonded connection structure |
US20050150682A1 (en) * | 2004-01-12 | 2005-07-14 | Agere Systems Inc. | Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material |
US20050285253A1 (en) * | 2004-06-24 | 2005-12-29 | Kumamoto Takashi | Forming buried via hole substrates |
US7629559B2 (en) * | 2005-12-19 | 2009-12-08 | Endicott Interconnect Technologies, Inc. | Method of improving electrical connections in circuitized substrates |
US20090059550A1 (en) | 2006-03-30 | 2009-03-05 | Yukiharu Miyamura | Display unit |
US20080206516A1 (en) * | 2007-02-22 | 2008-08-28 | Yoshihiko Matsushima | Surface mount circuit board, method for manufacturing surface mount circuit board, and method for mounting surface mount electronic devices |
TWI320680B (en) * | 2007-03-07 | 2010-02-11 | Phoenix Prec Technology Corp | Circuit board structure and fabrication method thereof |
EP2001077A1 (fr) * | 2007-05-21 | 2008-12-10 | Gemplus | Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu |
JP2009182212A (ja) | 2008-01-31 | 2009-08-13 | Toppan Printing Co Ltd | Icカード用外部接続端子基板、デュアルインターフェイス型icカード及びその製造方法 |
US8273995B2 (en) * | 2008-06-27 | 2012-09-25 | Qualcomm Incorporated | Concentric vias in electronic substrate |
JP2010097459A (ja) * | 2008-10-17 | 2010-04-30 | Toppan Printing Co Ltd | Icカード |
EP2296109B8 (en) | 2009-09-04 | 2014-08-27 | STMicroelectronics International N.V. | Dual interface IC card and method for producing such a card |
JP2011107865A (ja) * | 2009-11-16 | 2011-06-02 | Toppan Printing Co Ltd | デュアルインターフェイス型icカードおよびその製造方法 |
KR20120048991A (ko) | 2010-11-08 | 2012-05-16 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
-
2010
- 2010-12-07 EP EP10194068A patent/EP2463809A1/fr not_active Withdrawn
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2011
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- 2011-12-07 MX MX2013006272A patent/MX336669B/es unknown
- 2011-12-07 EP EP11794474.4A patent/EP2649566B1/fr not_active Not-in-force
- 2011-12-07 SG SG2013054705A patent/SG192012A1/en unknown
- 2011-12-07 MY MYPI2013002051A patent/MY166129A/en unknown
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- 2011-12-07 ES ES11794474.4T patent/ES2602635T3/es active Active
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- 2011-12-07 KR KR1020137017681A patent/KR101628447B1/ko active IP Right Grant
- 2011-12-07 JP JP2013542533A patent/JP2014501975A/ja active Pending
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2013
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- 2013-05-23 MA MA35930A patent/MA34678B1/fr unknown
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2015
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105684001A (zh) * | 2013-11-04 | 2016-06-15 | 德国捷德有限公司 | 用于不同连接技术的集成电路模块 |
US9990579B2 (en) | 2013-11-04 | 2018-06-05 | Giesecke+Devrient Mobile Security Gmbh | IC module for different connection technologies |
CN105684001B (zh) * | 2013-11-04 | 2019-03-12 | 捷德移动安全有限责任公司 | 用于不同连接技术的集成电路模块 |
CN112042055A (zh) * | 2018-05-04 | 2020-12-04 | 瑞典爱立信有限公司 | 背腔式天线单元和阵列天线装置 |
US11552411B2 (en) | 2018-05-04 | 2023-01-10 | Telefonaktiebolaget Lm Ericsson (Publ) | Cavity-backed antenna element and array antenna arrangement |
Also Published As
Publication number | Publication date |
---|---|
KR20130095825A (ko) | 2013-08-28 |
WO2012076627A3 (fr) | 2012-08-23 |
ES2602635T3 (es) | 2017-02-21 |
MX336669B (es) | 2016-01-27 |
MX2013006272A (es) | 2013-07-15 |
RU2013131114A (ru) | 2015-01-20 |
RU2575988C2 (ru) | 2016-02-27 |
CA2821060C (en) | 2017-03-28 |
CA2821060A1 (en) | 2012-06-14 |
WO2012076627A2 (fr) | 2012-06-14 |
KR101628447B1 (ko) | 2016-06-21 |
TN2013000214A1 (fr) | 2014-11-10 |
EP2649566A2 (fr) | 2013-10-16 |
SG190953A1 (en) | 2013-07-31 |
US9247643B2 (en) | 2016-01-26 |
IL226445A (en) | 2017-04-30 |
US20130286611A1 (en) | 2013-10-31 |
MA34678B1 (fr) | 2013-11-02 |
US20160098628A1 (en) | 2016-04-07 |
JP2014501975A (ja) | 2014-01-23 |
IL226445A0 (en) | 2013-07-31 |
CN103262102B (zh) | 2016-10-12 |
AU2011340524A1 (en) | 2013-06-20 |
EP2649566B1 (fr) | 2016-09-14 |
SG192012A1 (en) | 2013-08-30 |
BR112013014251A2 (pt) | 2016-09-20 |
MY166129A (en) | 2018-05-24 |
US9684863B2 (en) | 2017-06-20 |
AU2011340524B2 (en) | 2015-11-26 |
EP2463809A1 (fr) | 2012-06-13 |
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