CN1305004C - Ic卡及其制造方法 - Google Patents

Ic卡及其制造方法 Download PDF

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CN1305004C
CN1305004C CNB031427200A CN03142720A CN1305004C CN 1305004 C CN1305004 C CN 1305004C CN B031427200 A CNB031427200 A CN B031427200A CN 03142720 A CN03142720 A CN 03142720A CN 1305004 C CN1305004 C CN 1305004C
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circuit pattern
card
antenna circuit
chip
antenna
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CN1467685A (zh
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金德兴
金昌圭
李升燮
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Hanwha Techwin Co Ltd
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Samsung Techwin Co Ltd
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    • G—PHYSICS
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Abstract

本发明涉及一种IC卡，包括形成在绝缘膜上并且具有线形的天线部分、与复合芯片的芯片隆起相应的部分，和外部触点焊盘附着的附着部分的天线电路图形。复合芯片附着在与天线电路图形上的复合芯片模块的芯片隆起相应的部分上。至少一个介电层附着在天线电路图形上。外部触点焊盘插入在形成于部分介电层中的孔中且附着在该孔上，并具有形成在基片的外表面和内表面上且相互连接的端子。内表面上的端子与设在天线电路图形上的附着部分接触。

Description

IC卡及其制造方法
本申请要求2002年6月11日向韩国知识产权局提交的韩国专利申请2002-32517的优先权，其公开全部在本文中引作参考。
技术领域
本发明涉及IC卡及其制造方法，更具体地，涉及一种IC卡及其制造方法，其中设在IC卡中的复合芯片的天线电路板和触点电路板直接连接，从而降低电阻。
背景技术
IC卡指其上安装IC芯片的卡，并且可以通过向IC芯片输入各种信息用作电子ID卡、执照卡、电子钱币及信用卡。例如，通过在IC芯片中输入诸如地址、姓名、公民登记号(或ID号码)信息、驾照号码、医疗保险号码之类的个人信息，可以把IC卡用作电子ID卡。在另一个例子中，可以通过向芯片输入银行储蓄信息把IC卡用作电子钱币，从而可以不使用现金而只检验银行储蓄信息并且从银行储蓄中扣除购物款额在商店付款。在又一个例子中，把一定量的钱支付成电子钱币，并且从该电子线币数额中扣除地铁费或者电气火车费。
按照IC卡和端子之间的通信方法，IC卡可以分类为接触型和非接触型。接触型的IC卡在IC卡上形成的接触端子与端子上的接触端子接触时完成预定的操作。在非接触型的IC卡中，IC卡和端子之间的通信用射频(RF)进行。非接触型IC卡用高频或低频的RF通信。
同时，复合型的IC卡具有低频RF芯片模块和复合芯片模块。复合芯片模块可以用接触式方法或者用高频RF通信。从而复合型IC卡可以用接触式方法或者使用低或高频RF进行通信。
图1是截面图，示出典型的复合型IC卡。参见该图，复合型IC卡包括低频芯片模块21和复合芯片模块16。低频芯片模块21安排在卡的中心，而复合芯片模块16安排在卡的一面。低频芯片模块21和复合芯片模块16分别嵌入相互连接的第一和第二介电层11和12中。在第一介电层11的上表面上和第二介电层12的下表面上分别设有上和下保护层13和14。覆盖层15附着在下保护层14的表面上。还有可以在上保护层13表面一侧附着全息图片23。
设在低频芯片模块21上的低频天线图形24安排在支承低频芯片模块21的膜21a上并且嵌入在第一和第二介电层11和12中。低频芯片模块21安排在卡的中心。从而，低频天线图形24呈环形安排在卡的中心。
设在复合芯片模块16中的高频天线图形18在复合芯片模块16插入第一和第二介电层11和12之前形成。当复合芯片模块16插入到铣销工序中在第一和第二介电层11和12中形成的孔(未示出)内时，高频天线图形18经导电膏(未示出)电连接到复合芯片模块16的天线连接焊盘(未示出)上。高频天线图形18安排在卡的周边。
图2A至图2E是截面图，示出图1所示的IC卡的制造步骤。参见图2A，提供第一和第二介电层11和12、嵌入在第一和第二介电层11和12之间的低频芯片模块21，及上和下保护层13和14。事先在第一介电层11中形成低频芯片模块21插入其中的孔11a。低频芯片模块21设在一个其中低频天线24支承在支承膜25上的模块中。
还有，可以看出高频天线18安排在上保护膜13与第一介电层11之间。就是说在提供复合模块之前，在卡中提供连接到复合芯片模块上的高频天线18。
参见图2B，可以看到，在图2A所示的所有元件都安装了。低频芯片模块21的芯片(未示出)插入在第一介电层11的孔11a中时，低频芯片模块21嵌在第一和第二介电层11和12之间。还有，低频天线24嵌在第一和第二介电层11和12之间。高频天线18嵌在第一介电层11和上保护层13之间。
参见图2C，全息图片23附着在上保护膜13的上表面的一侧。
参见图2D，形成复合芯片模块插入其中的孔27。通过铣削上保护层13、第一介电层11和第二介电层12形成孔27。通过形成在上保护层13中孔27的区域大于在第一介电层11和第二介电层12中的孔27的区域露出部分高频天线18。
参见图2E，在高频天线18的被露出的部分上涂覆导电膏28。
图2F示出复合芯片模块16。
参见图2G，通过插入孔27内，组装图2F中所示的复合芯片模块16。复合芯片模块16本身经胶合剂部分29附着在卡上。设在复合芯片模块16中的天线触点焊盘(未示出)经导电的焊盘28电连接到高频天线18上。
在上述的IC卡中，由于高频天线18和复合芯片模块16的天线触点焊盘用导电膏电连接，导电膏的电阻加大。就是说，由于导电膏包括导电成分和胶合剂，由于导电成分的密度低所以电阻加大。电阻还随着胶合剂的高分子化合物的反应减少导电成分的体积而进一步增加。还有，由于所述焊盘受的胶合剂的氧化，焊盘电阻增加。结果，识别高频信号的长度缩短。导电膏是呈现高硬度的塑料成分和不呈现胶合性的导电颗粒的混合物，从而导电膏在诸如弯曲等机械形变时脆弱，或者产生断裂或短路。而且，由于在有限厚度的卡中布置芯片或者芯片模块和外部触点焊盘，难于制造超耐用性的触点焊盘和芯片模块。还有，还需要制造以及附着芯片模块的其它步骤。
发明内容
为了解决上述问题和其它问题，本发明提出一种IC卡，其中通过直接连接天线和复合芯片使电阻最小化。
还有本发明提供一种制造其中天线和复合芯片直接连接的IC卡的方法。
根据本发明的一个方面，IC卡包括：设置在绝缘膜上的天线电路图形，该天线电路图形包括环形天线部分、连接部分和附着部分，该连接部分和附着部分在绝缘膜上彼此横向错开；包括芯片隆起的复合芯片，该复合芯片通过芯片隆起安装在天线电路图形的连接部分上，由此允许复合芯片和天线电路图形的连接部分之间的电连接；至少一个介电层，其在与天线电路图形的附着部分相对应的位置处包括一个通孔，该介电层附着在天线电路图形上；以及外部触点焊盘，容纳在介电层中的通孔中，该外部触点焊盘具有形成在基片的上表面和下表面中的端子，上表面中的端子电连接到下表面中的相应端子，下表面上的端子电连接到天线电路图形上的附着部分，由此允许复合芯片、外部触点焊盘的端子、和天线电路图形的环形天线部分之间的电连接。
复合芯片和外部触点焊盘附着在天线电路图形的不同表面上。
天线电路图形的天线部分呈环形沿IC卡的外周边部分分布。
IC卡还包括安装在所述膜的后表面上的桥接器以把复合芯片电连接到呈环形形成在天线电路图形中的高频用的线形天线部分的外端部。
复合芯片和外部触点焊盘通过附着膏附着在天线电路图形上。
用形成在基片的外和内表面上的接触端子通过穿过基片冲出的孔的内表面中形成的镀层相互连接的方式，制备外部触点焊盘。
根据本发明的另一个方面，制造IC卡的方法包括步骤：在绝缘膜上形成天线电路图形，在该天线电路图形上形成线形天线部分、与复合芯片的芯片隆起对应的连接部分、和要附着外部触点焊盘的附着部分，所述连接部分和附着部分在绝缘膜上彼此横向错开；把复合芯片附着到天线电路图形上的与复合芯片的芯片隆起对应的部分上；把介电层附着到天线电路图形上；在与天线电路图形上的附着部分对应的介电层中形成一个孔；把外部触点焊盘插入在形成于介电层中的孔内，从而附着在附着部分上。
附图说明
通过参照附图对优选实施例进行的详细说明中可以更加清楚本发明的上述特征，在附图中：
图1是截面图，示出典型的IC卡；
图2A至图2G是截面图，示出图1所示的IC卡的制造步骤；
图3A至图3L是截面图，示出根据本发明的优选实施例的IC卡的制造步骤；
图4是截面图，示出根据本发明的优选实施例的IC卡；
图5是平面图，示出天线图形的天线部分。
具体实施方式
参见图3A，在膜32上形成铜制的覆层31。覆层31设成导电层以形成高频天线图形和用于连接接触端子(未示出)的图形。
参见图3B，在膜32上形成要做成预定的天线电路图形31’的覆层31。可以用典型的方法形成天线电路图形31’。例如在覆层31上涂覆光致抗蚀剂，然后用光掩模覆盖。在此状态下曝光光致抗蚀剂并且显影，然后蚀刻覆层31。然后通过除去光致抗蚀剂形成天线图形。天线电路图形包括呈环形形成的线形天线部分31a、与复合芯片的芯片隆起(未示出)对应的部分31b，和图3K所示外部触点焊盘45附着的附着部分31c。
线形天线部分31a具有与现有技术形状相似的平面的形状，其中天线的线呈线沿卡的外周边部分分布。就是说，如现有技术的天线，线沿卡的外周边部分分布，优选地把线形天线部分31a分布得使薄而长的线型的图形沿卡的外周边部分绕多圈。
与后续的步骤中安装的图3F的复合芯片35的图3F的芯片隆起35a对应的焊盘图形(未示出)形成在与芯片隆起对应的部分31b处。还有，用于附着外部触点焊盘45(见图3K)的附着部分31c形成在另一侧，这是用于在后续的步骤中附着外部触点焊盘45的图形。
参见图3C和3D，桥接器33在膜32的下表面的一侧安装。桥接器33把呈环形形成的线形天线部分31a的一个端部连接在另一个部分上以形成闭合电路。就是说，桥接器33把放置在线形天线部分31a的最外部的线型天线图形的端部与放置在卡的中心部分的复合芯片35电连接。
图5示意地示出怎样形成天线部分31a和桥接器33。在图5中，图形不是实际的图形，所以没有示出与复合芯片35的芯片隆起对应的部分31b和用于附着外部触点焊盘45的附着部分31c。
参见该图，线形天线部分31a在卡的表面57上沿外周边分布成环状图形。在线形天线部分31a的一侧形成连接到复合芯片35上的两个端口51和52。有通过桥接器33连接从而形成连接的天线的另外两个端口53和54。因为端口53和54由在不形成覆层的膜32的另一表面上的桥接器33连接，如图3C所示，所以形成环式天线。在图中未示的另一个实施中，桥接器33可以安排在膜32的表面上的线形天线部分31a上而不是安排在膜32的另一个表面上。在此情况下，在位于要连接的两个端口之间的天线部分的上表面上施加绝缘膏或者绝缘片，然后把导电膏或导电片制造的桥接器附着在端口之间。
参见图3E，提供用于附着的膏34以安装复合芯片35。用于附着的膏34可以是导电的也可以是不导电的。但是优选用不导电的膏以把电阻做得最小。
参见图3F和3G，复合芯片35安装在天线电路图形31’上。复合芯片35的芯片隆起35a通过用于附着的膏34安装在天线电路图形31’的部分31b上。
参见图3H，安排了要附着在天线电路图形31’上的卡的主体，所述卡的主体包括在另一个步骤中嵌入低频芯片模块36的第一介电层39、第二介电层40，和形成在第二介电层40的下表面上的保护层41。其中插入复合芯片35的孔42形成在第一和第二介电层39和40及保护层41中。还有，依次在卡的主体的上表面上和上方布置附着层37a、印刷层37b，和覆盖层37c。依次在卡的主体的下表面上和下方布置附着层38a、印刷层38b，和覆盖层38c。
另外，当附着复合芯片35的天线电路图形31’附着至介电层时，可以通过颠倒膜32把复合芯片35附着在向下的表面上。在此情况下，不把孔形成在第一和第二介电层39和40及保护层41中，而应当把孔形成在附着层38a、印刷层38b，和覆盖层38c中。以这样的安排，把要在后续工序中附着的复合芯片35和外部触点焊盘布置在天线电路图形31’的对侧，其结构不同于图3K中所示。然后，进一步把复合芯片35与接触外侧的外部触点焊盘45分开，从而可得到对外部干扰稳定的结构。还有，可以用薄膜的形式制造外部触点焊盘45。还有，因为外部触点焊盘插入处的介电层的厚度可以降低，可以通过铣削或者事先通过冲制或者在某些情况下蚀刻介电层方便地形成所述孔。这里可以有选择地提供低频芯片模块36。
图3I示出图3H所示的全部部件都安装的状态。
参见图3J，用铣削机43形成孔44。对应于线形部分31a和外部触点焊盘45的附着部分31c形成孔44。
参见图3K，外部触点焊盘45插入在孔44内并且附着于其上。如图所示，用形成在基片47的外和内表面上形成要接触端子的镀层48，并且镀层48经过形成在基片47中的孔延伸使得在基片的外和内表面中形成的接触端子相互连接的方式制备外部触点焊盘45。
外部触点焊盘45通过附着膏46直接附着到天线电路图形31’上的附着部分31c上。附着膏46可以是导电的膏也可以是不导电的膏。当附着膏46是不导电的膏时，形成在触点焊盘45上的内表面上的接触端子直接地接触线形天线部分31a和接触端子图形31’。
在附图中未示出的另一个实施中，外部触点焊盘45可以附着在不包括复合芯片35的天线电路图形31’的另一个表面上的天线电路图形31’上。例如复合芯片35附着在天线电路图形31’的上表面上，而外部触点焊盘46附着在天线电路图形31’的下表面上。为了使外部触点焊盘46附着在除复合芯片35的天线图形32’的另一个表面上，借助于适当的工具，譬如铣刀，在与部分31c对应的位置上形成穿过膜32的孔，从而外部触点焊盘45的触点焊盘可以接触天线电路图形31’。
图3L示出全息图片50附着在IC卡的上表面上一侧的状态。附着全息图片50是为了防止复制IC卡或者鉴别IC卡是否已被复制。可以附着其它的鉴别标志取代全息图片50。可以有选择地提供全息图片。
图4是根据本发明的完整的IC卡的截面图。参见该图，在该IC卡中嵌入低频芯片模块36和复合芯片35。低频芯片模块36的低频天线36a形成为线并且嵌在介电层39和40之间。就是说，如示出根据现有技术的IC芯片的制造步骤的图2A所示，形成为线的低频天线36嵌在介电层中。
如上所述，复合芯片模块35的工作通过卡端口与端子的端口的直接接触和用高频RF通信进行。接收高频RF的高频天线在天线电路图形31’上形成为线形天线部分31a。线形天线部分31a通过天线电路图形31’上的图形连接到复合芯片35。还有，通过外部接触端子43从外部端子(未示出)接收信号，并且通过天线电路图形31’输送到复合芯片35上。
在根据本发明的IC卡中，因为用铜材料把高频天线做成图形并且直接连接到复合芯片模块上，可以降低电阻。从而可以把识别高频信号的范围最大化。还有，因为不仅可以把低频芯片模块包括在卡中，还可以把复合芯片模块包括在卡中，可以提高卡的稳定性。而且用于电连接外部触点焊盘的图形可以同时形成在用于形成高频天线的图形上是有利的。
尽管具体地图示并且参照其优选实施例说明了本发明，本领域内普通技术人员应当理解，可以在形式和细节上进行各种改变而不偏离所附权利要求书所定义的本发明的精神和范畴。

Claims (11)

1.一种集成电路卡、即IC卡，包括：
设置在绝缘膜上的天线电路图形，该天线电路图形包括环形天线部分、连接部分和附着部分，该连接部分和附着部分在绝缘膜上彼此横向错开；
包括芯片隆起的复合芯片，该复合芯片通过芯片隆起安装在天线电路图形的连接部分上，由此允许复合芯片和天线电路图形的连接部分之间的电连接；
至少一个介电层，其在与天线电路图形的附着部分相对应的位置处包括一个通孔，该介电层附着在天线电路图形上；以及
外部触点焊盘，容纳在介电层中的通孔中，该外部触点焊盘具有形成在基片的上表面和下表面中的端子，上表面中的端子电连接到下表面中的相应端子，下表面上的端子电连接到天线电路图形的附着部分，由此允许复合芯片、外部触点焊盘的端子、和天线电路图形的环形天线部分之间的电连接。
2.如权利要求1所述的IC卡，其特征在于，所述复合芯片和所述外部触点焊盘被安装到天线电路图形上的沿IC卡的长度方向彼此错开的位置上。
3.如权利要求1所述的IC卡，其特征在于，还包括安装在膜的后表面上的桥接器，用以把天线电路图形的环形天线部分的端部电连接到复合芯片上。
4.如权利要求1所述的IC卡，其特征在于，复合芯片和外部触点焊盘通过附着膏安装在天线电路图形的同一表面上。
5.如权利要求1所述的IC卡，其特征在于，复合芯片和外部触点焊盘通过附着膏安装在天线电路图形的相对表面上。
6.如权利要求1所述的IC卡，其特征在于，用使形成在基片的上和下表面上的端子通过在穿过基片形成的孔的内表面上形成的镀层相互连接的方式，制备外部触点焊盘。
7.如权利要求1所述的IC卡，其特征在于，天线电路图形的环形天线部分用于进行高频信号的通信。
8.如权利要求7所述的IC卡，还包括设置在其中的低频芯片模块。
9.如权利要求8所述的IC卡，其特征在于，所述低频芯片模块嵌入在所述介电层中。
10.一种制造IC卡的方法，包括步骤：
在绝缘膜上形成天线电路图形，在该天线电路图形上形成线形天线部分、与复合芯片的芯片隆起对应的连接部分、和要附着外部触点焊盘的附着部分，所述连接部分和附着部分在绝缘膜上彼此横向错开；
把复合芯片附着到天线电路图形上的与复合芯片的芯片隆起对应的部分上；
把介电层附着到天线电路图形上；
在与天线电路图形上的附着部分对应的介电层中形成一个孔；以及
把外部触点焊盘插入在形成于介电层中的孔内，从而附着在附着部分上。
11.如权利要求10所述的方法，其特征在于，还包括在所述膜的后表面上安装桥接器用以把形成在天线电路图形上的线形天线部分的外端部电连接到复合芯片上的步骤。
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