CN1331820A - 制造无触点芯片卡的方法 - Google Patents
制造无触点芯片卡的方法 Download PDFInfo
- Publication number
- CN1331820A CN1331820A CN99814850A CN99814850A CN1331820A CN 1331820 A CN1331820 A CN 1331820A CN 99814850 A CN99814850 A CN 99814850A CN 99814850 A CN99814850 A CN 99814850A CN 1331820 A CN1331820 A CN 1331820A
- Authority
- CN
- China
- Prior art keywords
- antenna
- module
- insulative bridge
- link
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09772—Conductors directly under a component but not electrically connected to the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/922—Active solid-state devices, e.g. transistors, solid-state diodes with means to prevent inspection of or tampering with an integrated circuit, e.g. "smart card", anti-tamper
Abstract
本发明涉及制造包括电子模块(600)和与之相连接的天线(200)的无接触芯片卡。本发明的方法包括步骤:在第一支撑片(100)上产生天线(200),所述天线(200)为螺旋形,在其端头上有连接端(250);产生一个绝缘桥(300),部分地覆盖天线圈(200),连接端(250)的至少一部分除外;将填充材料(500)滴沉积在绝缘桥上;对着绝缘桥(300)使微电路(600)变形,并建立从微电路到天线(200)的连接端(250)的电连接。
Description
本发明涉及诸如无触点芯片卡的便携产品领域,该芯片卡具有卡体、电子模块和与所述模块相连接的天线。本发明具体涉及制造此种卡的方法。
此种卡是用于诸如银行、电话或不同的身份识别方面。它们可以特别地用于远程交易,当靠近一个端子时,他们就可从远处获得一定量的借项,并在此处他们也可被从远处再次被收费。
这些操作是由卡上的电子元件与接收装置或读出器之间的远距电磁耦合(一般为感应型)来实现的。这种耦合发生在读模式或在读/写模式,且数据的传输是以射频或超高频进行的。
无论有或没有触点的芯片卡,都是以标准尺寸来生产的。一个标准尺寸为ISO 7810,与标准格式对应,为85mm长,54mm宽和0.76mm厚,本发明并不局限于此。
用冷压技术生产无触点芯片卡的方法是已知的。这种方法如图1A所示。在这种情况下,由与电子模块7相连接的绕线制成的天线5构成的电子组件,也称作询答机就布置在第一塑料片1上。将诸如聚亚安酯的液态树脂8涂在其上以将电子组件埋起来。最后的步骤包括:以上层塑料片6盖住树脂8,然后进行冷压,以使树脂8与下层片1和上层片6熔接起来。
在图1B的变化方案中,电子组件可由包括天线31的印刷电路型薄片30和与所述天线31相连接的芯片或模块40构成,并通过冷压、交叠、蚀刻或丝网印来制成。
在这些情况下,模块与天线的连接可通过诸如锡/铅焊剂、超声波焊接、垫压或导电胶来实现。
这些方法,不管如何变化都有缺点。第一个缺点是电子组件不能完全不动地附到卡的外层片上。结果,有时电子组件的分度就会相对于外层片而有移位。当所述的片之前未被切割时,这种位移会导致在按卡的规格切割片时,会切割到电子组件并将之损坏。此外,需要处理三个独立的元素:两个外层片1和6,及电子组件。
此外,当涂液态树脂时,会在电子组件的周围形成气泡。这些气泡会使卡的表面产生缺陷。这些表面缺陷不仅难看而且在对卡进行装饰和个性化的印制时也会造成困难。这是因为表面缺陷产生了凹窝,它局部地妨碍了材料的流动性,结果,难于在卡的整个表面上获得优质的印制图形。在所述卡经历了温度变化后,随着卡的老化,其表面缺陷有扩大的趋势。
图2示出本发明人所提出的制造无触点芯片卡的另一方法。这种方法包括在两个外层片10之一的表面上产生天线11然后将芯片20与天线相连接的步骤。天线11由诸如丝网印、冷压或导线交叠来产生。它呈螺旋形,其端头上有连接端15。芯片20的非有效的后面由绝缘胶25直接粘到天线上。电连接是由导电树脂27实现的,它涂在两个连接端15和接触焊盘21上。随后在电子组件上涂液态树脂18,并借助于冷压将上层片16熔接在第一片10上。在此情况下,要控制的独立元素数被减到两个。这些元素是第一外层片10不可动地附着在电子组件上,及第二外层片16与电子组件之间的附合。
但此方法也有缺点。非常明显它不能使模块在良好状态下工作,但仅可使芯片能在良好状态下工作。这是因为,如果用模块,带有接触区的金属格栅会朝着天线的迹线取向。用绝缘胶将模块固定在天线的迹线上,同时避免此天线与模块的金属格栅间的短路。模块的金属格栅的接触区直接与天线的连接端相连接。但在此情况下,非常难于控制天线的迹线之间的绝缘和天线与模块的金属格栅之间的绝缘。
最后用于固定模块和将其与天线圈电绝缘的绝缘胶并不总是较好地分布在天线的迹线之间,这样就会在模块周围形成气泡。气泡会在卡的表面产生缺陷,这种缺陷很不美观,在对卡进行印制和个性化时会有困难。
本发明的一个目标包括制造无触点芯片卡,它具有与天线相连的电子模块,生产这种卡仅需要控制两个独立的元素,并可以克服与已有技术的方法有关的缺点。
本发明更具体的目的是提供一种制造无触点的芯片支撑体的方法,该芯片支撑体包括电子组件,该电子组件具有一个天线和与该天线相连接的至少一个微电路,所述电子组件埋在由冷压片层构成的支撑体内,其特征在于包括下述步骤:
在第一支撑片上产生天线,所述天线为螺旋形,在其端头上有连接端;
产生一个绝缘桥,部分地覆盖天线圈,连接端的至少一部分除外;
将填充材料滴沉积在绝缘桥上;
对着绝缘桥和填充材料使微电路变形,并建立从微电路到天线的连接端的电连接。
根据另一特征,该方法包括步骤:
对着先前形成的电子组件使第二片变形并进行所述第一和第二片的冷压。
根据本发明的方法,仅剩两个元素要加操控,即两个外层片。由于电子组件是不可动地附到外层片之一上的,就不存在地址会改变的问题。绝缘桥用于在天线迹线与模块的金属格栅之间提供电绝缘。它还可将天线迹线之间的残余空气排掉。填充材料填在模块与绝缘桥之间的空间中并可将模块周围的残余空气排掉。随着残余空气被排除,就可避免出现气泡和表面缺陷。
填充材料可以为氰基丙烯酸酯基胶。
根据本发明的另一特征,绝缘桥基本上为矩形,并在两个给定位置有两个凹口,以使天线的连接端暴露出来。
绝缘桥最好是用液态树脂经丝网印刷制成的,并在紫外线下进行聚合反应。
绝缘桥的厚度最好为15-60μm。
根据本发明的另一特征,由沉积在天线的连接端上的导电胶来实现模块与天线间的电连接。
根据本发明的另一特征,由集成电路芯片来代替电子模块。
根据本发明的另一特征,微电路是安置在电子模块上的,这样,金属接触区就对着绝缘桥和填充材料安置。
本发明的另一目的还涉及一种无接触芯片卡,具有由电子模块和与所述模块相连的天线构成的电子组件,所述电子模块埋在卡体内,其特征在于电子组件固定在第一支撑片上,在所述第一支撑片上产生天线,模块被转移,这样,其金属接触区面向天线圈;由填充材料覆盖的绝缘桥置于模块和天线圈之间,所述绝缘桥的几何尺寸使其不能覆盖天线的连接端,以建立与电子模块的电连接。
图1A和1B是已描述过的根据已有技术的已知方法的两个变种生产的两个无触点芯片卡的两个纵向剖面图;
图2为已描述过的根据另一方法的另一无触点芯片卡的纵向剖面图;
图3A和3B分别为根据本发明的方法制造的第一步骤期间无触点芯片卡的纵剖面图和顶视图;
图4为在制造的另一阶段图3A和3B的无触点芯片卡的纵剖面图;
图5A-5D为顶视图,示出生产天线上的绝缘桥的步骤;
图6为在制造的最后阶段图3A至4的无触点芯片卡的纵剖面图;
图7为在制造的最后阶段按另一实施例的另一芯片卡的纵剖面图。
根据本发明的制造方法的第一步包括在衬层100上生产天线200(图3A和3B)。衬层100可由PVC的塑料制成。它可以为任何支撑体,它可以呈条带方式或大张的方式存在。在此情况下,不管用什么方法制造的任何一个阶段都可按卡的格式对其进行切割。在一个变型中,它可预先按卡的格式来切割。在图3A和3B所示的实例中,该衬层早已被按卡的格式在生产天线之前就切割了,并且呈片状。其厚度在100至200μm间。与支撑天线200的相对的面110用作卡体的外表面。
天线200是由诸如银墨水的导电墨进行丝网印而制成的。随后这种墨水在60℃下干燥约2-15分钟。在改变的实施例中,天线也可以按诸如叠合导线或蚀刻铜或铝膜的其它已知技术来生产。它为螺旋形且包括至少两圈。通常,天线的导电迹线的宽度在0.15至3mm之间,且彼此相隔0.15-2mm。
天线的厚度在10-40μm间。天线200在其端头上具有两个连接端250,用于与电子模块的电连接。这些连接端250间的空隙最好为2-15mm。此外,天线为螺旋形,这样,天线圈就在连接端之间通过。
图4所示的根据本发明的制造无触点芯片卡的方法的下一步包括生产一个绝缘桥300,部分地覆盖天线圈200,除了连接端250。绝缘桥300是由诸如液态树脂的介电材料制成的,如杜邦公司标为CB018的树脂。这种绝缘桥300在通过此天线的连接端250之间的天线200的迹线之间提供电绝缘。此外,在转移所述电子模块时可以避免天线和电子模块间产生的短路。此绝缘桥的角色和优点将在参照电子模块转移步骤的描述而更加清楚。
此绝缘桥300的厚度是以完好地覆盖天线圈。因此,其整个厚度最好在15-60μm,以使天线圈被覆盖5-20μm厚。
绝缘桥300是由液体树脂丝网印而生产出来的。此丝网印可沉积出良好的几何体,并将在天线的迹线之间的空间填满,在这些空间中的空气随后由树脂将其排空。在进行丝网印之后,在紫外线照射下进行绝缘桥固化的聚合反应。在变型实施例中,也可以通过喷洒液态树脂而获得绝缘桥。
图5A-5D示出此绝缘桥300的优化几何尺寸,以及天线圈200的沉积。此绝缘桥300基本为矩形并有两个凹口350。这两个凹口350位于绝缘桥的侧面,在叠放于天线200的连接端250上的区域。
因此,绝缘桥300可覆盖位于连接端250之间的天线圈200的区域,同时由凹口350使所述连接端250的至少一部分暴露出来。
此方法的下一步包括在天线200的连接端250上沉积导电材料400,以在电子模块和天线之间产生电连接。此导电材料400由诸如含有导电银颗粒的胶构成。
另外直径约1-3mm的一滴填充材料500就加在绝缘桥300的中心,该材料可包括基于氰基丙烯酸酯的绝缘胶。填充材料必须能涂布开,并在所述模块在下述步骤被转移时能填充绝缘桥300与模块间的空隙。对此空隙的填弃可避免气泡的出现而导致的表面缺陷。在变型实施例中,此填弃材料500可以直线形式沉积。最好在填充导电材料400之后填充填充材料。
电子模块600随后被放在覆盖天线圈200(见图6)的绝缘桥300的顶部。所用的模块600为一种常规的模块,它包括集成电路芯片,其接触焊盘通过导线与覆镍和覆金的铜制成的金属格栅610的接触区相连接。该芯片和导线进而由包封树脂620保护起来。模块600被转移,这样,具有其接触区的金属格栅610被面向绝缘桥300和填充材料500。模块600的尺寸是可变的,其长度在3-20mm而宽度也在3-20mm。它有至少两个单独的位于面向天线的连接端250的模块的相对端头的接触区。接触区可以本身已知的方式放在支撑膜上。
用压力将模块600放在其预定的位置上。在加压的影响下,诸如氰基丙烯酸基的填充材料500在模块600下流动和扩散。通过扩散,可将绝缘桥和模块间引起表面缺陷的残余空气挤出。这种绝缘填充材料可通过其粘性(并非必须)将模块固定;其主要作用实际上是避免模块下出现空隙,也就是说避免出现任何残存空气。
模块在天线上的机械紧固的主要部分是由连接材料400提供的。在此例中,此连接材料400是由导电胶构成的。导电材料400的扩散是受控的,并由特定尺寸的绝缘桥和凹口350粘住。这些凹口实际上避免了导电材料在绝缘桥300的表面的扩散并在其变形时避免模块接触区之间的短路。导电胶在约60℃下聚合反应约8小时。这种聚合反应可将组件熔接并建立良好的电连接。在一个变型中,也可由锡/铅焊剂实现模块与天线之间的电连接。
在一个变型实施例中,模块也可由集成电路芯片来代替。此变型如图7所示。在此实例中,芯片800被转移,这样其无作用的后面就抵住绝缘桥300和填充材料500。导电树脂900的沉积可实现芯片800的接触焊盘810与天线200的连接端250之间的电连接。
由与天线200相连的模块600(或芯片800)构成的电子组件就完全做好并直接固定到支撑片100上。这样就可紧固地附到支撑片100上。
根据本发明的方法的最终步骤包括以第二塑料片700覆盖电子组件并进行冷压。在冷压时,诸如聚亚安酯型的液态树脂被挤出以使构成卡体的两个塑料片100和700被熔接在一起。随着残余空气从电子组件周围排空,对空余空间填充的结果,使气泡不能再在此制造阶段形成。
根据本发明的方法,独立元素数被减为两个。这些独立元素是:支撑电子组件的第一片100和第二片700。
绝缘桥300在穿过此天线的连接端250之间的天线200的迹线之间,以及模块600的金属格栅上提供电绝缘。在设有绝缘桥时,此模块的金属接触区将与天线的迹线直接接触并会产生短路以破坏电子组件的正常工作。绝缘桥也可使天线迹线之间的残余空气排空,从而避免形成气泡和表面缺陷。
Claims (11)
1.一种制造无触点的芯片支撑体的方法,该芯片支撑体包括电子组件,该电子组件具有一个天线(200)和与该天线相连接的至少一个微电路(600),所述电子组件埋在由冷压片层构成的支撑体内,其特征在于包括下述步骤:
在第一支撑片(100)上产生天线(200),所述天线为螺旋形,在其端头上有连接端(250);
产生一个绝缘桥(300),部分地覆盖天线圈(200),连接端(250)的至少一部分除外;
将填充材料(500)滴沉积在绝缘桥上;
对着绝缘桥(300)和填充材料(500)使微电路(600)变形,并建立从微电路到天线(200)的连接端(250)的电连接。
2.如权利要求1的制造无触点芯片支撑体的方法,其特征在于包括步骤:
对着先前形成的电子组件使第二片(700)变形并进行所述第一和第二片的冷压。
3.如权利要求1或2的方法,其特征在于填充材料(500)是氰基丙烯酸酯基胶。
4.如前述任一权利要求的方法,其特征在于绝缘桥基本上为矩形,并在两个给定位置有两个凹口(350),以使天线(200)的连接端(250)暴露出来。
5.如前述任一权利要求的方法,其特征在于绝缘桥(300)是用液态树脂经丝网印刷制成的,并在紫外线下进行聚合反应。
6.如前述任一权利要求的方法,其特征在于绝缘桥(300)的厚度为15-60μm。
7.如前述任一权利要求的方法,其特征在于由沉积在天线(200)的连接端(250)上的导电胶来实现模块(600)与天线(200)间的电连接。
8.如前述任一权利要求的方法,其特征在于天线(200)的厚度为10-40μm。
9.如前述任一权利要求的方法,其特征在于由集成电路芯片来代替电子模块。
10.如如前述任一权利要求的方法,其特征在于微电路是安置在电子模块上的,这样,金属接触区就对着绝缘桥和填充材料安置。
11.一种无接触芯片卡,具有由电子模块(600)和与所述模块相连的天线(200)构成的电子组件,所述电子模块埋在卡体内,其特征在于电子组件固定在第一支撑片(100)上,在所述第一支撑片(100)上产生天线(200),模块(600)被转移,这样,其金属接触区(610)面向天线圈;由填充材料(500)覆盖的绝缘桥(300)置于模块(600)和天线圈(200)之间,所述绝缘桥(300)的几何尺寸使其不能覆盖天线的连接端(250),以建立与电子模块(600)的电连接。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR98/16140 | 1998-12-21 | ||
FR9816140A FR2787609B1 (fr) | 1998-12-21 | 1998-12-21 | Procede de fabrication de carte a puce sans contact |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1331820A true CN1331820A (zh) | 2002-01-16 |
CN1214346C CN1214346C (zh) | 2005-08-10 |
Family
ID=9534244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB998148504A Expired - Fee Related CN1214346C (zh) | 1998-12-21 | 1999-11-29 | 无触点芯片卡,无触点支撑体及其制造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6617676B1 (zh) |
EP (1) | EP1141887B1 (zh) |
CN (1) | CN1214346C (zh) |
AT (1) | ATE232324T1 (zh) |
AU (1) | AU1391300A (zh) |
DE (1) | DE69905288T2 (zh) |
FR (1) | FR2787609B1 (zh) |
WO (1) | WO2000038111A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1305004C (zh) * | 2002-06-11 | 2007-03-14 | 三星Techwin株式会社 | Ic卡及其制造方法 |
CN101073296B (zh) * | 2004-12-03 | 2011-07-06 | 哈里斯股份有限公司 | 内插器接合装置 |
CN112216622A (zh) * | 2019-07-10 | 2021-01-12 | 广东精毅科技股份有限公司 | 一种用冷胶粘贴芯片的装置及其工作方法 |
CN114361048A (zh) * | 2022-03-18 | 2022-04-15 | 深圳源明杰科技股份有限公司 | 金属裸线中料制备方法及金属裸线中料 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2743649B1 (fr) * | 1996-01-17 | 1998-04-03 | Gemplus Card Int | Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication |
FR2769390B1 (fr) * | 1997-10-08 | 2003-02-14 | Gemplus Card Int | Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact |
FR2850490A1 (fr) * | 2003-01-24 | 2004-07-30 | Framatome Connectors Int | Antenne et procede de fabrication |
FR2916558B1 (fr) * | 2007-05-21 | 2010-03-12 | Fasver | Vignette adhesive souple de securite dotee d'au moins un microcircuit sans contact pour document officiel |
FR2922342B1 (fr) * | 2007-10-11 | 2010-07-30 | Ask Sa | Support de dispositif d'identification radiofrequence renforce et son procede de fabrication |
FR2938954B1 (fr) * | 2008-11-24 | 2011-06-24 | Rfideal | Procede de fabrication d'objets portatifs sans contact avec pont dielectrique. |
US8534752B2 (en) | 2010-06-02 | 2013-09-17 | Steelcase Inc. | Reconfigurable table assemblies |
US8667908B2 (en) | 2010-06-02 | 2014-03-11 | Steelcase Inc. | Frame type table assemblies |
US9185974B2 (en) | 2010-06-02 | 2015-11-17 | Steelcase Inc. | Frame type workstation configurations |
US9210999B2 (en) | 2010-06-02 | 2015-12-15 | Steelcase Inc. | Frame type table assemblies |
TWI552435B (zh) * | 2015-08-17 | 2016-10-01 | 啟碁科技股份有限公司 | 天線結構及其製造方法 |
JP6686517B2 (ja) * | 2016-02-22 | 2020-04-22 | セイコーエプソン株式会社 | 電子機器および送り量補正方法 |
WO2017197395A1 (en) | 2016-05-13 | 2017-11-16 | Steelcase Inc. | Multi-tiered workstation assembly |
US10517392B2 (en) | 2016-05-13 | 2019-12-31 | Steelcase Inc. | Multi-tiered workstation assembly |
CN108671970B (zh) * | 2018-04-11 | 2020-07-14 | 华南师范大学 | 一种基于微流控芯片的双尺寸微液滴的产生方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
DE4416697A1 (de) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
JP2814477B2 (ja) * | 1995-04-13 | 1998-10-22 | ソニーケミカル株式会社 | 非接触式icカード及びその製造方法 |
FR2743649B1 (fr) * | 1996-01-17 | 1998-04-03 | Gemplus Card Int | Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication |
DE19633923A1 (de) * | 1996-08-22 | 1998-02-26 | Siemens Ag | Chipkarte mit einer Induktionsspule und Verfahren zu ihrer Herstellung |
-
1998
- 1998-12-21 FR FR9816140A patent/FR2787609B1/fr not_active Expired - Fee Related
-
1999
- 1999-11-29 US US09/868,570 patent/US6617676B1/en not_active Expired - Fee Related
- 1999-11-29 CN CNB998148504A patent/CN1214346C/zh not_active Expired - Fee Related
- 1999-11-29 WO PCT/FR1999/002942 patent/WO2000038111A1/fr active IP Right Grant
- 1999-11-29 DE DE69905288T patent/DE69905288T2/de not_active Expired - Lifetime
- 1999-11-29 AU AU13913/00A patent/AU1391300A/en not_active Abandoned
- 1999-11-29 AT AT99973502T patent/ATE232324T1/de not_active IP Right Cessation
- 1999-11-29 EP EP99973502A patent/EP1141887B1/fr not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1305004C (zh) * | 2002-06-11 | 2007-03-14 | 三星Techwin株式会社 | Ic卡及其制造方法 |
CN101073296B (zh) * | 2004-12-03 | 2011-07-06 | 哈里斯股份有限公司 | 内插器接合装置 |
CN101383022B (zh) * | 2004-12-03 | 2012-08-22 | 哈里斯股份有限公司 | 电子部件 |
CN112216622A (zh) * | 2019-07-10 | 2021-01-12 | 广东精毅科技股份有限公司 | 一种用冷胶粘贴芯片的装置及其工作方法 |
CN112216622B (zh) * | 2019-07-10 | 2022-09-30 | 广东精毅科技股份有限公司 | 一种用冷胶粘贴芯片的装置及其工作方法 |
CN114361048A (zh) * | 2022-03-18 | 2022-04-15 | 深圳源明杰科技股份有限公司 | 金属裸线中料制备方法及金属裸线中料 |
Also Published As
Publication number | Publication date |
---|---|
EP1141887B1 (fr) | 2003-02-05 |
AU1391300A (en) | 2000-07-12 |
CN1214346C (zh) | 2005-08-10 |
WO2000038111A1 (fr) | 2000-06-29 |
DE69905288D1 (de) | 2003-03-13 |
US6617676B1 (en) | 2003-09-09 |
FR2787609B1 (fr) | 2001-02-09 |
FR2787609A1 (fr) | 2000-06-23 |
EP1141887A1 (fr) | 2001-10-10 |
DE69905288T2 (de) | 2003-10-09 |
ATE232324T1 (de) | 2003-02-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1214346C (zh) | 无触点芯片卡,无触点支撑体及其制造方法 | |
US5671525A (en) | Method of manufacturing a hybrid chip card | |
US5598032A (en) | Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module | |
JP3430339B2 (ja) | チップカードまたは類似の電子デバイスの製造方法 | |
US6910636B2 (en) | IC card and manufacturing method thereof | |
RU2412483C2 (ru) | Электронный модуль с двойным интерфейсом связи, в частности, для пластиковой карты с микрочипом | |
US6794727B2 (en) | Single receiving side contactless electronic module continuous manufacturing process | |
US20110011939A1 (en) | Contact-less and dual interface inlays and methods for producing the same | |
RU2464635C2 (ru) | Способ изготовления микроэлектронного устройства бесконтактного действия, в частности, для электронного паспорта | |
CN1365084A (zh) | 一种制造双接口ic卡的方法以及用这种方法制造的ic卡 | |
CN101385402B (zh) | 卡片型存储媒介物及其制造方法 | |
US20060027668A1 (en) | Method for making contactless cards | |
CN101095220A (zh) | 用于混合式智能卡的双面电子模块 | |
CN103119616A (zh) | 聚碳酸酯制射频识别设备及其制造方法 | |
AU6504198A (en) | Method for making contactless cards with coiled antenna | |
CN1183486C (zh) | 用于芯片卡的电子组件 | |
JP2001522107A (ja) | コンタクトレスチップカードを製造する方法およびコンタクトレスチップカード | |
US20060255157A1 (en) | Method for production of a card with a double interface and microcircuit card obtained thus | |
EP1190377B1 (fr) | Procede de fabrication de dispositif electronique portable a circuit integre comportant un dielectrique bas cout | |
US20080191029A1 (en) | Method For Manufacturing a Smart Card, a Thus Manufactured Smart Card, and a Method For Manufacturing a Wired Antenna | |
CA2432701C (en) | Electrically conductive connection between a chip and a coupling element, and security element, security paper and document of value with such a connection | |
CN1309796A (zh) | 制造包括至少一个集成电路芯片的便携式电子装置的方法 | |
US20020110955A1 (en) | Electronic device including at least one chip fixed to a support and a method for manufacturing such a device | |
CN103999098A (zh) | 智能卡的制造方法 | |
US20050110112A1 (en) | Encapsulated chip and procedure for its manufacture |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
C10 | Entry into substantive examination | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050810 Termination date: 20111129 |