CA2432701C - Electrically conductive connection between a chip and a coupling element, and security element, security paper and document of value with such a connection - Google Patents

Electrically conductive connection between a chip and a coupling element, and security element, security paper and document of value with such a connection Download PDF

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Publication number
CA2432701C
CA2432701C CA002432701A CA2432701A CA2432701C CA 2432701 C CA2432701 C CA 2432701C CA 002432701 A CA002432701 A CA 002432701A CA 2432701 A CA2432701 A CA 2432701A CA 2432701 C CA2432701 C CA 2432701C
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CA
Canada
Prior art keywords
chip
coupling element
value
document
electrically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002432701A
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French (fr)
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CA2432701A1 (en
Inventor
Lars Hoffmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient GmbH
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Giesecke and Devrient GmbH
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Publication of CA2432701A1 publication Critical patent/CA2432701A1/en
Application granted granted Critical
Publication of CA2432701C publication Critical patent/CA2432701C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/305—Associated digital information
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/355—Security threads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H21/00—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties
    • D21H21/14—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties characterised by function or properties in or on the paper
    • D21H21/40—Agents facilitating proof of genuineness or preventing fraudulent alteration, e.g. for security paper
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H21/00—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties
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    • D21H21/40—Agents facilitating proof of genuineness or preventing fraudulent alteration, e.g. for security paper
    • D21H21/42—Ribbons or strips
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H21/00—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties
    • D21H21/14—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties characterised by function or properties in or on the paper
    • D21H21/40—Agents facilitating proof of genuineness or preventing fraudulent alteration, e.g. for security paper
    • D21H21/44—Latent security elements, i.e. detectable or becoming apparent only by use of special verification or tampering devices or methods
    • D21H21/48—Elements suited for physical verification, e.g. by irradiation
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    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
    • G07D7/00—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
    • G07D7/01—Testing electronic circuits therein
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A document of value has a chip and is connected to a coupling element for the transmission of data and/or energy from and/or to the chip via an adhesive.
According to a first embodiment, the adhesive contains electrically conductive particles which are smaller than the distance between the contact surfaces 5 of the chip 3 and the coupling element 2. According to a second embodiment, the conductive adhesive contains electrically conductive particles which are soft at an elevated temperature at which the chip 3 is applied to the coupling element 2. According to a third embodiment, it is possible to dispense with the electrically conductive particles in the adhesive.
Instead, the transmission of data/energy is carried out via an alternating field coupled in capacitively at high frequencies of about 2 GHz.

Description

Electrically conductive connection between a chip and a coupling element, and security element, security paper and document of value with such a connection The invention relates to an electrically conductive connection between an integrated circuit, formed as a chip, and a coupling element for transmitting data and/or energy from and/or to the chip. The invention likewise relates to documents of value, in particular banknotes, and security papers for the production of these documents of value, and security elements to be applied to or incorporated in the security paper, which in each case have such an electrically conductive connection between chip and associated coupling element. Finally, the invention also relates to a method for the capacitive transmission of data and/or energy between connected chip and coupling element.

The documents of value in the sense of the present invention can be banknotes, certificates or else credit cards and the like. The invention is particularly suitable for use in thin, papery documents of value such as banknotes, but can also be used in conjunction with other documents of value.
The application of integrated circuits in form of chips in or on a banknote is proposed, for example, in EP 0 905 657 Al, in order to increase the security of banknotes against forgeries by means of information stored in the chip. The chip is a transponder chip with which, therefore, contact is not made directly by external data processing devices, but in which the data interchange is carried out via a coupling element formed as an open or closed dipole antenna, for which purpose, for example, the security thread contained in the banknote or a closed coil provided separately in the banknote can be used.

_ 2 -The production of an electrically conductive connection between the chip and the coupling element is subject to certain restrictions, because of the low paper layer thickness and because of the low thickness of the chip.
A connection by means of final (gold) wires in the wire bonding technique is ruled out because of these limiting conditions. Instead, the flip-chip technique, known from smart card technology, is suitable, in which the chip with its contact elements is immersed in an electrically conductive compound applied to the coupling element. The use of an electrically conductive adhesive is mentioned, for example, in DE 44 16 997 Al.

In order to ensure that the adhesive used does not lead to a short-circuit link, in particular in the case of closely adjacent chip contact elements, in connection with smart cards it is proposed in EP-A-512 546 and DE
199 57 609 Al to use anisotropic conductive adhesives, which are therefore conductive in only one direction, specifically between chip and contact element. Such an anisotropic adhesive layer can cover all the contact elements together without this leading to the formation of a short circuit. For this purpose, DE 199 57 609 Al proposes the provision of spherical, possibly resilient, conductive bodies beside one another and spaced apart from one another in a compressible heat-seal adhesive layer which can be handled. In the case in which the chip is applied to the coupling element using the hot punching technique, the application of pressure and temperature means that the spherical conductive bodies form an electrically conductive connection between the contact elements of the chip and the coupling element, but the conductive bodies not being connected to one another, so that the formation of a short circuit is avoided. Practical statements relating to the resilient conductive bodies are not contained in DE 199 57 609 Al.

The aforementioned proposals cannot readily be transferred from smart card technology to the technology of documents of value, which is attributed in particular to the extremely low material thickness of the documents of value and chips. The risk of chip fracture during the application of the extremely thin chip to the coupling element has proven to be a particular problem.

It is therefore an object of the present invention to propose an electrically conductive connection with which, in particular in conjunction with documents of value, chips and associated coupling elements can be connected reliably to one another.
Further objects of the invention consist in proposing corresponding security elements for document of value, documents of value as such and security papers for the production of such documents of value, and also a method for the transmission of data and/or energy.

According to the invention, these objects are in each case achieved by the features of the dependent secondary claims. In claims dependent on these, advantageous refinements and developments of the invention are specified.

The solutions according to the invention are based on the finding that the electrically conductive connection between the chip and coupling element is to produce as few mechanical stresses as possible in the frangible chip, in particular at the time of chip application.
According to a first embodiment of the invention, this finding is implemented, in order to achieve the aforementioned object, by the adhesive that connects the chip and coupling element being an anisotropic conductive adhesive which contains electrically conductive particles whose maximum size is less than the distance between the chip and the coupling element, preferably less than one m. These particles are preferably oriented in the adhesive, for example in a magnetic field, such that they conduct only in the direction between chip and coupling element and are otherwise insulated from one another by the adhesive material. Given an adhesive layer thickness of about 2 m, it is thus ensured that the particles can exert no mechanical stresses on the chip, because of their small size.
According to a second embodiment of the invention, an anisotropic adhesive with electrically conductive particles is likewise used, but consists of a solder material which is soft at an elevated temperature at which the chip is connected to the coupling element. After it has been cooled down, the solder material solidifies in its form assumed during the application of the chip. It is thus ensured that, in particular during the application of the chip, no mechanical stresses are exerted on the chip by the electrically conductive particles. The solder material particles are arranged beside one another and spaced apart from one another in a suitable adhesive matrix in such a way that they are also still spaced apart from one another following application of the chip. Examples for the manner in which the chip and the anisotropic adhesive are applied to the coupling element, and also the possible alternatives for the configuration of the specific anisotropic adhesive layer comprising particles or conductive bodies spaced apart from one another, can be found in the prior art literature, for example, in DE 199 57 609 Al.
Instead of the use of an electrically conductive adhesive for making non-reactive contact between chip and contact element, a third embodiment of the invention provides capacitive coupling. This embodiment is suitable for use with high frequency automating currents of, for example, about 2 GHz. Any conductive particles in the adhesive layer which promote mechanical stresses can be dispensed with.
Instead, the adhesive layer forms a thin, dielectric layer between the chip contact surfaces and the coupling element. The supply of energy for the chip is provided by an alternating field coupled capacitively into the chip, and the chip comprises a rectifier and a capacitor for storing energy.
In the following text, the invention will be explained by way of example using the appended figures, in which:
Figure 1 shows an electrically conductive connection with anisotropic adhesive according to the first embodiment of the invention, Figure 2 shows an electrically conductive connection with anisotropic adhesive according to the second embodiment of the invention, and Figure 3 shows an electrically conductive connection with capacitive coupling according to the third embodiment of the invention.
Figure 1 shows a substrate 1 comprising a coupling element 2 and an integrated circuit 3 electrically conductively connected to the coupling element 2 via an adhesive 4.
The substrate 1 can be a document of value, in particular a banknote, but also a preproduct of such a document of value, specifically a security paper which is only later further processed to form a document of value. However, the substrate 1 can also be other documents of value, for example a smart card. In particular, the substrate 1 can also be a security element, for example an optically variable element (OVD) or a security thread which is only later connected to a document of value or security paper. In the case of an OVD, the security element has preferably been applied to the document of value in such a way that the object of the variable side of the OVD points outward and the OVD hides the view of the integrated circuit 3. If the optically variable element is designed as a hologram, the coupling element 2 can at the same time serve as a reflective layer in order to reflect light passing through the optically variable element.

The invention is preferably used in a document of value such as banknotes. The substrate 1 and the coupling element 2 preferably form a security thread therein, the substrate 1 being, for example, a transparent plastic thread, on which the coupling element 2 is present as an aluminum coating. The coupling element 2 then represents an open dipole, via which data and/or energy can be transmitted without contact to the integrated circuit 3 from an external device. Instead of a security thread, the chip 3 can also be applied to another substrate or security element and connected to the banknote, it then being possible, depending on the available area, to form the coupling element 2 as a closed dipole or as a coil. Furthermore, a laminating film, which is not illustrated in the figure, can also be arranged, at least in the region of the integrated circuit 3.

Before its application, the integrated circuit is present as a chip which can be handled. This can be, for example, a pure memory chip (ROM), a rewritable chip (EPROM, EEPROM) or else a microprocessor chip.
The chips used have a thickness of 5 m to 50 m, preferably 10 m, and an edge length of about 0.1 mm to 3 mm, preferably 0.6 mm. On the chip 3 there are preferably 2 to 4 contact surfaces 5.

The adhesive 4, by means of which the chip 3 and the coupling element 2 are firmly connected to each other, contains electrically conductive particles 6.

According to the embodiment according to Figure 1, the maximum size of these particles 6 is substantially less than the distance between the contact surfaces five and the coupling element 2. This ensures that, when the chip 3 is applied to the coupling element 2, no mechanical stresses occur in the chip 3 on account of particles 6 lying in between. The distance between the contact surfaces 5 and the coupling element 2 is preferably about 2 gm and the maximum particle size is therefore less than about 1 m, preferably about 0.5 gm.

In order to achieve the situation in which the particles 6 within the adhesive 4 are electrically conductive only in the direction from and to the contact surfaces 5 lying closest to the coupling element 2, the particles 6 are oriented before the adhesive 4 has been cross-linked to such an extent that the particles 6 are largely fixed in their oriented position. The orientation of the particles 6 can be carried out, for example, in a magnetic field, so the adjacent particles 6 repel one another and form lines in the preferential electrical direction.

A material that has proven to be suitable for the conductive particles 6 is the conductive powder marketed by DuPont under the trade name "ZELEC ECP-3010XC". Likewise suitable is silver nanopowder with a particle size of preferably about 0.5 m.

The selection of the adhesive is not unimportant either. It must be protected against mechanical overstressing and therefore be flexible within limits.
With a layer thickness of 2 gm, the non-reactive volume resistance should be about 5 ohms. Furthermore, it must be ensured that adequate contact is made with the small contact surfaces 5 of the chip 3, with a size of in each case about 70 m x 70 m. In particular, making contact with aluminum layers with an oxide covering must be ensured, since the contact between the coupling element 2 and air causes natural oxidation of the aluminum. Finally, it must be ensured that the electrical conductivity of the adhesive in the high frequency field in the direction opposite to the preferential direction reaches no more than 100 m.
100 m is approximately the distance between adjacent contact regions of the coupling element 2.

According to a second embodiment, which is illustrated in figure 2, the electrically conductive particles 6 of the anisotropic adhesive 4 consist of a solder material, for example tin-bismuth. The chip 3 is normally placed on the coupling element 2 using the hot punching technique, the temperature introduced leading to softening and cross-linking of the adhesive 4 and the slight pressure leading to contact between the chip 3 and the connecting regions of the coupling element 2.
The temperature of the hot punching and the softening temperature of the solder material are matched to each other in such a way that the solder material also softens during the application of the chip 3 and, in accordance with the pressure of the hot punching, is matched faithfully to the contact surfaces 5. During the application of the chip 3 to the coupling element 2, the electrically conductive solder material particles thus do not exert any substantial stresses on the chip 3, instead are deformed plastically, but ensure an electrically conductive connection between the contact surfaces 5 of the chip 3 and the coupling element 2. The solder particles 6 are distributed in the adhesive 4 in the manner of a matrix, so that they are not transversely connected to one another, even after the application of the chip, as described in DE
199 57 509 Al.

In conjunction with the solder material particles, the adhesive marketed under the designation "Loctite 3440"
has proven to be a suitable adhesive.
According to a third embodiment, which is illustrated in Figure 3, use is made of an adhesive 4 which does not necessarily contain electrically conductive particles. The transmission of data and/or energy is carried out capacitively between the coupling element 2 and the contact surfaces 5 of the chip 3. This type of transmission is particularly suitable at high frequencies of, for example, 2 GHz for the transmission of energy, the data stream being modulated on, for example at a frequency of about 400 MHz. In this case, the slight distance between the contact surfaces 5 and the respectively immediately adjacent sections of the coupling element 2 acts as a short circuit. It is possible to dispense with making non-reactive contact.
The chip has a capacitor and a voltage rectifier, in order to charge up the capacitor with energy via an alternating field coupled in capacitively. The adhesive 4 acts as a dielectric between the coupling element 2 and the contact terminals 5. For the capacitive coupling, it is also necessary to. enlarge the connecting areas of the integrated circuit.

Claims (16)

What is claimed:
1. A document of value having an integrated circuit and a coupling element, the electrically conductive connection between the integrated circuit, formed as a chip, and the coupling element for the transmission of data and/or energy from and/or to the chip comprising an anisotropic conductive adhesive which contains electrically conductive particles, wherein the maximum size of the particles is less than the distance between the coupling element and the chip.
2. The document of value as claimed in claim 1, wherein the maximum size of the particles is less than one µm.
3. The document of value as claimed in claim 1 or 2, wherein the particles have a direction of orientation which is the same as the direction of the connection.
4. The document of value as claimed in one of claims 1 to 3, wherein the electrically conductive connection is formed by the anisotropic conductive adhesive with a layer thickness of 2 µm.
5. The document of value as claimed in one of claims 1 to 4, wherein the particles have a size of 0.5 µm.
6. The document of value as claimed in one of claims 1 to 5, wherein the particles consist of silver nanopowder.
7. A document of value having an integrated circuit and a coupling element, the electrically conductive connection between the integrated circuit, formed as a chip, and the coupling element for the transmission of data and/or energy from and/or to the chip comprising an anisotropic conductive adhesive which contains electrically conductive particles, wherein the particles consist of a solder material which is soft at an elevated temperature at which the chip is connected to the coupling element.
8. The document of value as claimed in claim 7, wherein the solder material comprises tin-bismuth.
9. The document of value as claimed in claim 7 or 8, wherein the particles in the conductive adhesive are arranged beside one another in the manner of a matrix and spaced apart from one another.
10. A document of value having an integrated circuit and a coupling element, the electrically conductive connection between the integrated circuit, formed as a chip, and the coupling element for the transmission of data and/or energy from and/or to the chip, an adhesive layer being provided between the chip and the coupling element, wherein the adhesive layer forms a dielectric between the coupling element and a contact terminal of the chip, and wherein the chip comprises a voltage rectifier and a capacitor.
11. The document of value as claimed in one of claims 1 - 10, wherein the document of value is a banknote.
12. A security element for a document of value, comprising an integrated circuit and a coupling element, the electrically conductive connection between the integrated circuit, formed as a chip, and the coupling element for transmission of data and/or energy from and/or to the chip comprising an anisotropic conductive adhesive which contains electrically conductive particles, wherein the maximum size of the particles is less than the distance between the coupling element and the chip, and wherein the coupling element is a constituent part of the security element.
13. A security element for a document of value, comprising an integrated circuit and a coupling element, the electrically conductive connection between the integrated circuit, formed as a chip, and the coupling element for transmission of data and/or energy from and/or to the chip comprising an anisotropic conductive adhesive which contains electrically conductive particles, wherein the particles consist of a solder material which is soft at an elevated temperature at which the chip is connected to the coupling element, and wherein the coupling element is a constituent part of the security element.
14. The security element as claimed in claim 12 or 13, wherein the security element is a security thread.
15. The security element as claimed in one of claims 12 to 14, the security element being a transfer film, for example an optically variable element.
16. A security paper for producing a paper of value, comprising a security element according to one of claims 12 to 15.
CA002432701A 2000-12-21 2001-12-19 Electrically conductive connection between a chip and a coupling element, and security element, security paper and document of value with such a connection Expired - Fee Related CA2432701C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10064411A DE10064411A1 (en) 2000-12-21 2000-12-21 Electrically conductive connection between a chip and a coupling element as well as security element, security paper and document of value with such a connection
DE10064411.2 2000-12-21
PCT/EP2001/015018 WO2002050890A2 (en) 2000-12-21 2001-12-19 Electroconductive connection between a chip and a coupling element in addition to a security element containing a connection of said type

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CA2432701A1 CA2432701A1 (en) 2002-06-27
CA2432701C true CA2432701C (en) 2008-08-26

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10206818A1 (en) * 2002-02-18 2003-08-28 Infineon Technologies Ag Electronic component used as a semiconductor chip comprises an electrically conducting adhesive layer between the metallic surfaces of components of the electronic component
DE10235771A1 (en) * 2002-08-05 2004-02-26 Texas Instruments Deutschland Gmbh Encapsulated chip and production process for smart labels has baseplate with conductive surrounding layer and cover plate with conductive surfaces
DE102004001661A1 (en) * 2004-01-12 2005-08-11 Infineon Technologies Ag Method for electrically connecting an electrical conductor to an electronic component and device
FR2893163B1 (en) 2005-11-08 2008-02-01 Oberthur Card Syst Sa METHOD FOR MANUFACTURING A MICROCIRCUIT CARD AND A MICROCIRCUIT CARD, IN PARTICULAR A MAGNETIC ANTENNA.
FR2894714B1 (en) * 2005-12-13 2008-02-29 K Sa As METHOD FOR CONNECTING AN ELECTRONIC CHIP TO A RADIOFREQUENCY IDENTIFICATION DEVICE
US9047548B2 (en) 2006-06-07 2015-06-02 Nxp B.V. Semiconductor chip, transponder and method of manufacturing a transponder
FR2904723B1 (en) * 2006-08-01 2008-12-19 Arjowiggins Security Soc Par A SECURITY STRUCTURE, IN PARTICULAR FOR A DOCUMENT OF SECURITY AND / OR VALUE
EP1923822A1 (en) * 2006-11-09 2008-05-21 Gemplus Method of manufacturing an element of a secure electric or electronic circuit, element obtained and support integrating said element
FR2917534B1 (en) * 2007-06-15 2009-10-02 Ask Sa METHOD FOR CONNECTING AN ELECTRONIC CHIP TO A RADIO FREQUENCY IDENTIFICATION DEVICE

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2902002A1 (en) * 1979-01-19 1980-07-31 Gerhard Krause Three=dimensional integrated circuits - mfd. by joining wafer stack with contacts through conductive adhesive
EP0265077A3 (en) * 1986-09-25 1989-03-08 Sheldahl, Inc. An anisotropic adhesive for bonding electrical components
US4902857A (en) * 1988-12-27 1990-02-20 American Telephone And Telegraph Company, At&T Bell Laboratories Polymer interconnect structure
JPH04332404A (en) * 1991-05-07 1992-11-19 Nec Corp Anisotropic conductive material and connection of integrated circuit element using it
AT399274B (en) 1993-05-14 1995-04-25 Kainz Johann EXTENDABLE SAUNA CABIN
JPH10502677A (en) * 1994-06-29 1998-03-10 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Anisotropic conductive adhesive and method for producing anisotropic conductive adhesive
DE19601358C2 (en) * 1995-01-20 2000-01-27 Fraunhofer Ges Forschung Integrated circuit paper
JPH08202844A (en) * 1995-01-25 1996-08-09 Nippon Retsuku Kk Electronic unit and its manufacture
JP3150575B2 (en) * 1995-07-18 2001-03-26 沖電気工業株式会社 Tag device and manufacturing method thereof
US5661042A (en) * 1995-08-28 1997-08-26 Motorola, Inc. Process for electrically connecting electrical devices using a conductive anisotropic material
DE19636813C1 (en) * 1996-09-11 1998-01-29 Bosch Gmbh Robert Method of mounting piezoelectric elements on metal surface e.g. in sensor systems
DE19640192A1 (en) * 1996-09-30 1998-04-02 Bosch Gmbh Robert Process for flip chip assembly
EP0905657B1 (en) * 1997-09-23 2003-05-28 STMicroelectronics S.r.l. Currency note comprising an integrated circuit
EP1048483B1 (en) * 1997-12-22 2007-07-11 Hitachi, Ltd. Card-like semiconductor device
NL1008929C2 (en) * 1998-04-20 1999-10-21 Vhp Ugchelen Bv Substrate made of paper provided with an integrated circuit.
DE19826568A1 (en) * 1998-06-15 1999-12-16 Sihl Gmbh Duplicate form set for transported material, esp. for freight items/packages/wallet envelopes, with several sheets and a transponder integrated into one sheet with a connected antenna enables wireless transfer of re-readable data
TW484101B (en) * 1998-12-17 2002-04-21 Hitachi Ltd Semiconductor device and its manufacturing method
DE19957609A1 (en) 1998-12-30 2000-07-06 Giesecke & Devrient Gmbh Making electrically conducting adhesive connection between module and electronic component e.g. for chip card, involves first introducing conducting body arranged in compressible fixing structure between them

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WO2002050890A2 (en) 2002-06-27
EP1362369A2 (en) 2003-11-19
EP3179508A1 (en) 2017-06-14
CA2432701A1 (en) 2002-06-27
DE10064411A1 (en) 2002-06-27
EP3179505A1 (en) 2017-06-14
WO2002050890A3 (en) 2003-09-12

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